MATSUDA Tomoki 松田朋己

… Alternative Names

Matsuda Tomoki 松田朋己

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Researcher Number	30756333
Other IDs	https://orcid.org/0000-0002-3978-0118
Affiliation (Current)	2025: 大阪大学, 大学院工学研究科, 助教
Affiliation (based on the past Project Information) *help	2022 – 2025: 大阪大学, 大学院工学研究科, 助教 2016 – 2020: 大阪大学, 工学研究科, 助教 2015 – 2016: 大阪大学, 工学(系)研究科(研究院), 助教
Review Section/Research Field	Principal Investigator Basic Section 26050:Material processing and microstructure control-related Except Principal Investigator Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields / Production engineering/Processing studies / Composite materials/Surface and interface engineering
Keywords	Principal Investigator 破壊誘導 / 異相界面 / 焼結 / 銀 / 再接合 / 分離 / 階層構造化 / セラミックス / 焼結接合 / 接合制御 … More / 破壊制御 / ナノ構造 / マイクロ力学試験 / その場観察 / 電界支援 / マイクロ力学 / 界面制御 / シリコン系材料 / 界面・層制御 / ハイブリッド粒子 / 酸化銀 / ナノ粒子 / 接合 / 界面構造 / 炭化ケイ素 / シリコン / 銀生成 / 分解反応 / ナノ焼結 … More Except Principal Investigator 衝撃塑性 / 超短パルスレーザ / フェムト秒レーザー駆動衝撃波 / ドライレーザピーニング / アルミニウム合金 / レーザピーニング / フェムト秒レーザ / フェムト秒レーザ駆動衝撃波 / 機械特性向上 / フェムト秒レーザピーニング / 信頼性 / 酸化物還元 / 分子動力学シミュレーション / 酸化還元 / セラミックス / ナノ粒子 / 還元反応 / 酸化銀 / 焼結 / 接合 Less

階層的破壊誘導機構に基づく強靭かつ分離・再接合可能な異種材料接合体の創製Principal Investigator
- Principal Investigator
  
  松田朋己
- Project Period (FY)
  2025 – 2027
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  The University of Osaka
塑性の起源の探索：超短パルスレーザ衝撃塑性発現機構の解明と新加工法への展開
- Principal Investigator
  
  佐野智一
- Project Period (FY)
  2024 – 2025
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields
- Research Institution
  Osaka University
Highly reliable sinter bonding based on guidelines for strengthening dissimilar joint by using interfacial fracture controlPrincipal Investigator
- Principal Investigator
  
  松田朋己
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Osaka University
Formation mechanism of interface between metal and silicon-based materials via decomposition of silver oxide and its applicationPrincipal Investigator
- Principal Investigator
  
  Matsuda Tomoki
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Osaka University
Development of femtosecond laser peening technique for improving mechanical properties
- Principal Investigator
  
  Sano Tomokazu
- Project Period (FY)
  2016 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Production engineering/Processing studies
- Research Institution
  Osaka University
Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide
- Principal Investigator
  
  HIROSE Akio
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University

All 2024 2023 2022 2021 2020 2019 2018 2017 2016

All Journal Article Presentation Patent

[Journal Article] Ag-カルボン酸間の反応を利用したAg/Si直接接合2024
- Author(s)
  岡本拓也, 松田朋己, 神原淳
- Journal Title
  
  第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2024) 論文集
  
  Volume: 30 Pages: 79-80
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] 通電による組織制御を活用したSiC/Ag焼結接合の高信頼化2024
- Author(s)
  松田哲大, 松田朋己, 神原淳
- Journal Title
  
  第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2024) 論文集
  
  Volume: 30 Pages: 77-78
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Crack initiation and propagation behavior of dissimilar interface with intermetallic compound layer in Al/steel joint using coupled multiscale mechanical testing2023
- Author(s)
  Matsuda Tomoki、Hayashi Kotaro、Iwamoto Chihiro、Nozawa Takashi、Ohata Mitsuru、Hirose Akio
- Journal Title
  
  Materials & Design
  
  Volume: 235 Pages: 112420-112420
- DOI
  10.1016/j.matdes.2023.112420
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Highly strong interface in Ag/Si sintered joints obtained through Ag2O-Ag composite paste2023
- Author(s)
  Matsuda Tomoki、Seo Ryotaro、Hirose Akio
- Journal Title
  
  Materials Science and Engineering: A
  
  Volume: 865 Pages: 144647-144647
- DOI
  10.1016/j.msea.2023.144647
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Ag Sinter Bonding to Si Substrate via Temporal Formation and Decomposition of Ag Carboxylate2023
- Author(s)
  Matsuda Tomoki、Kawabata Rei、Okamoto Takuya、Hirose Akio
- Journal Title
  
  Nanomaterials
  
  Volume: 13 Issue: 16 Pages: 2292-2292
- DOI
  10.3390/nano13162292
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] 酸化銀還元接合法による複合構造化を利用したアルミニウムの接合2023
- Author(s)
  碓井脩斗，松田朋己，藤野純司，加柴良裕，神原淳，廣瀬明夫
- Journal Title
  
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023) 論文集
  
  Volume: 29 Pages: 79-82
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol2023
- Author(s)
  Matsuda Tomoki、Yamada Seigo、Okubo Shio、Hirose Akio
- Journal Title
  
  Journal of Materials Science
  
  Volume: 58 Issue: 40 Pages: 15617-15633
- DOI
  10.1007/s10853-023-08976-5
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] 高温信頼性向上のためのSi/Ag界面特性に着眼した銀焼結組織制御2023
- Author(s)
  脊尾凌太朗，松田朋己，神原淳，廣瀬明夫
- Journal Title
  
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023) 論文集
  
  Volume: 29 Pages: 99-104
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Cu2O粒子の形態制御に着目した還元焼結接合の検討2023
- Author(s)
  大久保志緒，松田朋己，山田晴悟，神原淳，廣瀬明夫
- Journal Title
  
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023) 論文集
  
  Volume: 29 Pages: 105-106
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] Evaluation of Heat Resistance of Ag-Cu Hybrid Sintering to Cu Substrate2022
- Author(s)
  Matsuda Tomoki、Yamada Seigo、Hirose Akio
- Journal Title
  
  Journal of Smart Processing
  
  Volume: 11 Issue: 6 Pages: 294-300
- DOI
  10.7791/jspmee.11.294
- ISSN
  2186-702X, 2187-1337
- Year and Date
  2022-11-10
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23K23100
[Journal Article] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021
- Author(s)
  川端　玲、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Journal Title
  
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集
  
  Volume: 27 Pages: 221-226
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Ag/Cu複合焼結層に及ぼす熱時効の影響2021
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Journal Title
  
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集
  
  Volume: 27 Pages: 215-220
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications2020
- Author(s)
  Watanabe Tomofumi、Takesue Masafumi、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Materials Science: Materials in Electronics
  
  Volume: 31 Issue: 20 Pages: 17173-17182
- DOI
  10.1007/s10854-020-04265-y
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition2020
- Author(s)
  Inami Kota、Matsuda Tomoki、Kawabata Rei、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Materials Science: Materials in Electronics
  
  Volume: 31 Issue: 19 Pages: 16511-16518
- DOI
  10.1007/s10854-020-04205-w
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019
- Author(s)
  松田　朋己、伊波　康太、本山　啓太、佐野　智一、廣瀬　明夫
- Journal Title
  
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019) 論文集
  
  Volume: 25 Pages: 353-358
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O2019
- Author(s)
  MATSUDA Tomoki、INAMI Kota、MOTOYAMA Keita、SANO Tomokazu、HIROSE Akio
- Journal Title
  
  Journal of Smart Processing
  
  Volume: 8 Issue: 5 Pages: 177-183
- DOI
  10.7791/jspmee.8.177
- NAID
  130007719755
- ISSN
  2186-702X, 2187-1337
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Silver oxide decomposition mediated direct bonding of silicon-based materials2018
- Author(s)
  Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Scientific Reports
  
  Volume: 8 Issue: 1 Pages: 1-10
- DOI
  10.1038/s41598-018-28788-x
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O2018
- Author(s)
  Motoyama Keita、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 47 Issue: 10 Pages: 5780-5787
- DOI
  10.1007/s11664-018-6504-2
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] elf-heating bonding of A5056 aluminum alloys using exothermic heat of combustion synthesis2017
- Author(s)
  Tomoki Matsuda, Takaaki Maruko, Tomo Ogura, Tomokazu Sano, Akio Hirose
- Journal Title
  
  Materials & Design
  
  Volume: 113 Pages: 109-115
- DOI
  10.1016/j.matdes.2016.10.017
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289248
[Journal Article] FEMTOSECOND LASER PEENING OF 2024 ALUMINUM ALLOY WITHOUT A SACRIFICIAL OVERLAY UNDER ATMOSPHERIC CONDITIONS2017
- Author(s)
  Tomokazu Sano, Takayuki Eimura, Ryota Kashiwabara, Tomoki Matsuda, Yutaro Isshiki, Akio Hirose, Seiichiro Tsutsumi, Kazuto Arakawa, Tadafumi Hashimoto, Kiyotaka Masaki, and Yuji Sano
- Journal Title
  
  Journal of Laser Applications
  
  Volume: 29 Issue: 1 Pages: 1-7
- DOI
  10.2351/1.4967013
- NAID
  120006352342
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16K06761, KAKENHI-PROJECT-16K14417, KAKENHI-PROJECT-15H04244, KAKENHI-PROJECT-16H04247
[Journal Article] CuO還元反応を用いたCu-Cu接合2017
- Author(s)
  八尾　崇史，松田　朋己，石井　克典，佐野　智一，森川　千晶，大渕　敦司，屋代　亘，廣瀬　明夫
- Journal Title
  
  第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2017) 論文集
  
  Volume: 23 Pages: 53-56
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289248
[Patent] パワー半導体モジュール，電力変換装置及びパワー半導体モジュールの製造方法2024
- Inventor(s)
  松田朋己, 廣瀬明夫, 神原淳, 松田哲大, 藤野純司
- Industrial Property Rights Holder
  松田朋己, 廣瀬明夫, 神原淳, 松田哲大, 藤野純司
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2024-006878
- Filing Date
  2024
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Ag-カルボン酸間の反応を利用したAg/Si直接接合2024
- Author(s)
  岡本拓也, 松田朋己, 神原淳
- Organizer
  第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2024)
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 熱プラズマを用いた銅粒子形態制御に基づく低加圧銅焼結接合の耐熱性評価2024
- Author(s)
  大場美和, 松田朋己, 大久保志緒, 神原淳
- Organizer
  第38回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 電界支援焼結過程を用いた半導体/銀低温焼結接合2024
- Author(s)
  松田朋己, 松田哲大, 神原淳
- Organizer
  第38回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 通電による組織制御を活用したSiC/Ag焼結接合の高信頼化2024
- Author(s)
  松田哲大, 松田朋己, 神原淳
- Organizer
  第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2024)
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Fracture behavior of Ag/Si interface formed by Ag sintering through microscale mechanical testing2023
- Author(s)
  Tomoki Matsuda, Akio Hirose
- Organizer
  International Conference on Processing & Manufacturing of Advanced Materials (Thermec'2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Ag-Cu複合焼結層の耐熱性評価2023
- Author(s)
  松田朋己, 山田晴悟, 廣瀬明夫
- Organizer
  スマートプロセス学会2023年度学術講演会
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Cu2O粒子の形態制御に着目した還元焼結接合の検討2023
- Author(s)
  大久保志緒，松田朋己，山田晴悟，神原淳，廣瀬明夫
- Organizer
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023)
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 高温信頼性向上のためのSi/Ag界面特性に着眼した銀焼結組織制御2023
- Author(s)
  碓井脩斗，松田朋己，藤野純司，加柴良裕，神原淳，廣瀬明夫
- Organizer
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023)
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Characterization of microscale mechanical property and fracture behavior of sintered Ag/semiconductor material interface2023
- Author(s)
  Tomoki Matsuda , Ryotaro Seo, Makoto Kambara, Akio Hirose
- Organizer
  5th International Conference on Nanojoining and Microjoining (NMJ2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 高温信頼性向上のためのSi/Ag界面特性に着眼した銀焼結組織制御2023
- Author(s)
  脊尾凌太朗，松田朋己，神原淳，廣瀬明夫
- Organizer
  第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2023)
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Oxidation Resistance in The Reduction Sintering Bonding Focused on Morphology Control of Cu2O Particles2023
- Author(s)
  Shio Okubo, Tomoki Matsuda, Seigo Yamada, Makoto Kambara, Akio Hirose
- Organizer
  The 11th Pacific Rim International Conference on Advanced Materials and Processing (PRICM 11)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Improving durability of copper sinter bonding under thermal aging using redox reaction between cuprous oxide nanoparticles and polyethylene glycol2023
- Author(s)
  Tomoki Matsuda, Shio Okubo, Seigo Yamada, Makoto Kambara, Akio Hirose
- Organizer
  MRM2023/IUMRS-ICA2023
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] マイクロ力学試験を用いた焼結銀/シリコン直接接合界面の破壊挙動評価2023
- Author(s)
  松田朋己，廣瀬明夫
- Organizer
  エレクトロニクス実装学会第37回春季講演大会
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] Formation of oxidationless Cu sinter joints using Cu2O-glycol paste2022
- Author(s)
  Tomoki Matsuda， Seigo Yamada，Shio Okubo，Akio Hirose
- Organizer
  The 75th IIW Annual Assembly and International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K23100
[Presentation] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021
- Author(s)
  川端　玲、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Ag/Cu複合焼結層に及ぼす熱時効の影響2021
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元反応を用いた銀-シリコン基板接合プロセスの低温化2020
- Author(s)
  川端玲、松田朋己、佐野智一、廣瀬明夫
- Organizer
  第30回マイクロエレクトロニクスシンポジウム(MES2020)秋季大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 高温放置試験におけるAg/Cu 複合層の焼結挙動に及ぼす金属基板の影響2020
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  溶接学会 2020年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Formation process of interfacial structure in Ag/Si joint during Ag2O decomposition2020
- Author(s)
  Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
- Organizer
  The 73rd IIW Annual Assembly and International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元反応を利用した金属‐窒化ケイ素基板の接合2019
- Author(s)
  川端玲、松田朋己、佐野智一、廣瀬明夫
- Organizer
  溶接学会 2019年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Silicon-silver direct joining process using in-situ generation of silver nanoparticles derived from the decomposition of silver oxide microparticles2019
- Author(s)
  Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
- Organizer
  European Congress and Exhibition on Advanced Materials and Process (EUROMAT) 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Low-temperature metal-to-silicon joining using silver oxide decomposition without the metallized layer of substrate2019
- Author(s)
  Tomoki Matsuda, Kota Inami, Tomokazu Sano, Akio Hirose
- Organizer
  The 72nd IIW Annual Assembly and International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Femtosecond laser peening of pure iron2019
- Author(s)
  Itsuki Nishibata, Tomokazu Sano, Tomoki Matsuda, Akio Hirose
- Organizer
  2nd European Workshop on Laser Peening and Related Phenomena (LSP Days 2019), Hamburg, Germany
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019
- Author(s)
  松田　朋己、伊波　康太、本山　啓太、佐野　智一、廣瀬　明夫
- Organizer
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銅還元反応を利用した焼結接合法における酸化銅形態が接合性に及ぼす影響2019
- Author(s)
  五十嵐友也、松田朋己、佐野智一、廣瀬明夫
- Organizer
  溶接学会 2019年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元焼結による-シリコン基板直接合2019
- Author(s)
  松田朋己、伊波康太、佐野智一、廣瀬明夫
- Organizer
  第29回マイクロエレクトロニクスシンポジウム秋季大会 (MES2019)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Silver Oxide Decomposition Assisted Direct Bonding of Silicon Carbide2018
- Author(s)
  Tomoki Matsuda, Keita Motoyama, Tomokazu Sano, Akio Hirose
- Organizer
  Materials Science & Technology 2018 (MS&T18)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] SiC direct joining using silver oxide decomposition2018
- Author(s)
  Tomoki Matsuda, Keita Motoyama, Kota Inami, Tomokazu Sano, Akio Hirose
- Organizer
  4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] CuO還元反応を用いたCu-Cu接合2017
- Author(s)
  八尾崇史, 松田朋己, 石井克典, 佐野智一, 廣瀬明夫, 森川千晶, 大渕敦司, 屋代恒
- Organizer
  第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Place of Presentation
  パシフィコ横浜 (神奈川県横浜市）
- Year and Date
  2017-01-31
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Femtosecond laser peening of 2024 aluminum alloy without sacrificial overlay under atmospheric conditions2016
- Author(s)
  T. Sano, T. Eimura, R. Kashiwabara, T. Matsuda, A. Hirose, S. Tsutsumi, K. Arakawa, K. Masaki, and Y. Sano
- Organizer
  The Second Smart Laser Processing Conference (SLPC) 2016
- Place of Presentation
  パシフィコ横浜
- Year and Date
  2016-05-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] フェムト秒レーザピーニングによる2024アルミニウム合金の疲労特性向上2016
- Author(s)
  詠村嵩之, 松田朋己, 佐野智一, 廣瀬明夫, 堤成一郎, 菖蒲敬久, 城鮎美, 荒河一渡, 政木清孝, 佐野雄二
- Organizer
  溶接学会平成28年度秋季全国大会
- Place of Presentation
  伊香保温泉HOTEL天坊
- Year and Date
  2016-09-14
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] AlN-to-metal Direct Bonding Utilizing Sintering of In-situ Generated Ag Nanoparticles through Redox Reaction2016
- Author(s)
  Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose
- Organizer
  International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
- Place of Presentation
  Hotel Hankyu Expo Park, Suita, Osaka, Japan
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction Behavior of CuO Paste during Cu-to-Cu Bonding2016
- Author(s)
  Takafumi Yao, Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  MATERIALS SCIENCE & TECHNOLOGY 2016 Conference and Exhibition (MS&T16)
- Place of Presentation
  Salt Lake City, USA
- Year and Date
  2016-10-23
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction behavior of CuO particles during Cu-to-Cu bonding2016
- Author(s)
  Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  International Conference on Nanojoining and Microjoining 2016 (NMJ2016)
- Place of Presentation
  Niagara Falls, Canada
- Year and Date
  2016-09-25
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction Process of CuO in Cu-to-Cu Bonding Using CuO Paste2016
- Author(s)
  Takafumi Yao, Tomoki. Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)
- Place of Presentation
  Kyoto International Conference Center, Kyoto, Japan
- Year and Date
  2016-08-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] 酸化銀還元によりその場生成した銀ナノ粒子の焼結を利用した金属-AlN接合2016
- Author(s)
  本山啓太, 松田朋己, 佐野智一, 廣瀬明夫
- Organizer
  溶接学会平成28年度秋季全国大会
- Place of Presentation
  伊香保温泉ホテル天坊（群馬県渋川市）
- Year and Date
  2016-09-14
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Clarification of Reduction Process of CuO in Cu-to-Cu Bonding using CuO Paste2016
- Author(s)
  Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
- Place of Presentation
  Hotel Hankyu Expo Park, Suita, Osaka, Japan
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248

1. Sano Tomokazu (30314371)

# of Collaborated Projects: 3 results

# of Collaborated Products: 13 results
2. HIROSE Akio (70144433)

# of Collaborated Projects: 2 results

# of Collaborated Products: 12 results
3. 小椋智 (90505984)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
4. MASAKI Kiyotaka

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
5. SANO yuji

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

MATSUDA Tomoki 松田 朋己

Matsuda Tomoki 松田 朋己

Research Projects

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Co-Researchers

階層的破壊誘導機構に基づく強靭かつ分離・再接合可能な異種材料接合体の創製Principal Investigator

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塑性の起源の探索：超短パルスレーザ衝撃塑性発現機構の解明と新加工法への展開

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Highly reliable sinter bonding based on guidelines for strengthening dissimilar joint by using interfacial fracture controlPrincipal Investigator

Principal Investigator

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Formation mechanism of interface between metal and silicon-based materials via decomposition of silver oxide and its applicationPrincipal Investigator

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Development of femtosecond laser peening technique for improving mechanical properties

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Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide

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[Journal Article] Ag-カルボン酸間の反応を利用したAg/Si直接接合2024

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[Journal Article] 通電による組織制御を活用したSiC/Ag焼結接合の高信頼化2024

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[Journal Article] Crack initiation and propagation behavior of dissimilar interface with intermetallic compound layer in Al/steel joint using coupled multiscale mechanical testing2023

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[Journal Article] Highly strong interface in Ag/Si sintered joints obtained through Ag2O-Ag composite paste2023

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[Journal Article] Ag Sinter Bonding to Si Substrate via Temporal Formation and Decomposition of Ag Carboxylate2023

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[Journal Article] 酸化銀還元接合法による複合構造化を利用したアルミニウムの接合2023

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[Journal Article] Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol2023

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[Journal Article] 高温信頼性向上のためのSi/Ag界面特性に着眼した銀焼結組織制御2023

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[Journal Article] Cu2O粒子の形態制御に着目した還元焼結接合の検討2023

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MATSUDA Tomoki 松田朋己

Matsuda Tomoki 松田朋己