Matsuda Tomoki 松田朋己

… Alternative Names

松田朋己マツダトモキ

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Researcher Number	30756333
Other IDs	https://orcid.org/0000-0002-3978-0118
Affiliation (Current)	2022: 大阪大学, 大学院工学研究科, 助教
Affiliation (based on the past Project Information) *help	2022: 大阪大学, 工学研究科, 助教 2016 – 2020: 大阪大学, 工学研究科, 助教 2015 – 2016: 大阪大学, 工学(系)研究科(研究院), 助教
Review Section/Research Field	Principal Investigator Basic Section 26050:Material processing and microstructure control-related Except Principal Investigator Composite materials/Surface and interface engineering / Production engineering/Processing studies
Keywords	Principal Investigator 銀 / ナノ焼結 / 分解反応 / 銀生成 / シリコン / 炭化ケイ素 / 界面構造 / 接合 / ナノ粒子 / 焼結 … More / 酸化銀 / ハイブリッド粒子 / 界面・層制御 / シリコン系材料 / 界面制御 / 異相界面 / 焼結接合 / セラミックス / 破壊制御 … More Except Principal Investigator 接合 / 焼結 / 酸化銀 / 還元反応 / ナノ粒子 / セラミックス / 酸化還元 / 分子動力学シミュレーション / 酸化物還元 / 信頼性 / フェムト秒レーザピーニング / 機械特性向上 / フェムト秒レーザ駆動衝撃波 / フェムト秒レーザ / レーザピーニング / アルミニウム合金 / ドライレーザピーニング / フェムト秒レーザー駆動衝撃波 Less

界面破壊制御を用いた異相接合部強化指針に基づく高信頼焼結接合法の確立Principal Investigator
- Principal Investigator
  
  松田朋己
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Osaka University
Formation mechanism of interface between metal and silicon-based materials via decomposition of silver oxide and its applicationPrincipal Investigator
- Principal Investigator
  
  Matsuda Tomoki
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Osaka University
Development of femtosecond laser peening technique for improving mechanical properties
- Principal Investigator
  
  Sano Tomokazu
- Project Period (FY)
  2016 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Production engineering/Processing studies
- Research Institution
  Osaka University
Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide
- Principal Investigator
  
  HIROSE Akio
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University

All 2021 2020 2019 2018 2017 2016

All Journal Article Presentation

[Journal Article] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021
- Author(s)
  川端　玲、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Journal Title
  
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集
  
  Volume: 27 Pages: 221-226
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Ag/Cu複合焼結層に及ぼす熱時効の影響2021
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Journal Title
  
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集
  
  Volume: 27 Pages: 215-220
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications2020
- Author(s)
  Watanabe Tomofumi、Takesue Masafumi、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Materials Science: Materials in Electronics
  
  Volume: 31 Pages: 17173-17182
- DOI
  10.1007/s10854-020-04265-y
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition2020
- Author(s)
  Inami Kota、Matsuda Tomoki、Kawabata Rei、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Materials Science: Materials in Electronics
  
  Volume: 31 Pages: 16511-16518
- DOI
  10.1007/s10854-020-04205-w
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019
- Author(s)
  松田　朋己、伊波　康太、本山　啓太、佐野　智一、廣瀬　明夫
- Journal Title
  
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019) 論文集
  
  Volume: 25 Pages: 353-358
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O2019
- Author(s)
  MATSUDA Tomoki、INAMI Kota、MOTOYAMA Keita、SANO Tomokazu、HIROSE Akio
- Journal Title
  
  Journal of Smart Processing
  
  Volume: 8 Pages: 177-183
- DOI
  10.7791/jspmee.8.177
- NAID
  130007719755
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] Silver oxide decomposition mediated direct bonding of silicon-based materials2018
- Author(s)
  Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Scientific Reports
  
  Volume: 8 Pages: 1-10
- DOI
  10.1038/s41598-018-28788-x
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O2018
- Author(s)
  Motoyama Keita、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 47 Pages: 5780-5787
- DOI
  10.1007/s11664-018-6504-2
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K14028
[Journal Article] elf-heating bonding of A5056 aluminum alloys using exothermic heat of combustion synthesis2017
- Author(s)
  Tomoki Matsuda, Takaaki Maruko, Tomo Ogura, Tomokazu Sano, Akio Hirose
- Journal Title
  
  Materials & Design
  
  Volume: 113 Pages: 109-115
- DOI
  10.1016/j.matdes.2016.10.017
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289248
[Journal Article] Femtosecond laser peening of 2024 aluminum alloy without a sacrificial overlay under atmospheric conditions2017
- Author(s)
  Tomokazu Sano, Takayuki Eimura, Ryota Kashiwabara, Tomoki Matsuda, Yutaro Isshiki, Akio Hirose, Seiichiro Tsutsumi, Kazuto Arakawa, Tadafumi Hashimoto, Kiyotaka Masaki, and Yuji Sano
- Journal Title
  
  J. Laser Appl.
  
  Volume: 29 Pages: 1-7
- DOI
  10.2351/1.4967013
- NAID
  120006352342
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16K06761, KAKENHI-PROJECT-16K14417, KAKENHI-PROJECT-15H04244, KAKENHI-PROJECT-16H04247
[Journal Article] CuO還元反応を用いたCu-Cu接合2017
- Author(s)
  八尾　崇史，松田　朋己，石井　克典，佐野　智一，森川　千晶，大渕　敦司，屋代　亘，廣瀬　明夫
- Journal Title
  
  第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2017) 論文集
  
  Volume: 23 Pages: 53-56
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021
- Author(s)
  川端　玲、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Ag/Cu複合焼結層に及ぼす熱時効の影響2021
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元反応を用いた銀-シリコン基板接合プロセスの低温化2020
- Author(s)
  川端玲、松田朋己、佐野智一、廣瀬明夫
- Organizer
  第30回マイクロエレクトロニクスシンポジウム(MES2020)秋季大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 高温放置試験におけるAg/Cu 複合層の焼結挙動に及ぼす金属基板の影響2020
- Author(s)
  山田　晴悟、松田　朋己、小椋　智、佐野　智一、廣瀬　明夫
- Organizer
  溶接学会 2020年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Formation process of interfacial structure in Ag/Si joint during Ag2O decomposition2020
- Author(s)
  Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
- Organizer
  The 73rd IIW Annual Assembly and International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元反応を利用した金属‐窒化ケイ素基板の接合2019
- Author(s)
  川端玲、松田朋己、佐野智一、廣瀬明夫
- Organizer
  溶接学会 2019年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Silicon-silver direct joining process using in-situ generation of silver nanoparticles derived from the decomposition of silver oxide microparticles2019
- Author(s)
  Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
- Organizer
  European Congress and Exhibition on Advanced Materials and Process (EUROMAT) 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Low-temperature metal-to-silicon joining using silver oxide decomposition without the metallized layer of substrate2019
- Author(s)
  Tomoki Matsuda, Kota Inami, Tomokazu Sano, Akio Hirose
- Organizer
  The 72nd IIW Annual Assembly and International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Femtosecond laser peening of pure iron2019
- Author(s)
  Itsuki Nishibata, Tomokazu Sano, Tomoki Matsuda, Akio Hirose
- Organizer
  2nd European Workshop on Laser Peening and Related Phenomena (LSP Days 2019), Hamburg, Germany
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019
- Author(s)
  松田　朋己、伊波　康太、本山　啓太、佐野　智一、廣瀬　明夫
- Organizer
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銅還元反応を利用した焼結接合法における酸化銅形態が接合性に及ぼす影響2019
- Author(s)
  五十嵐友也、松田朋己、佐野智一、廣瀬明夫
- Organizer
  溶接学会 2019年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] 酸化銀還元焼結による-シリコン基板直接合2019
- Author(s)
  松田朋己、伊波康太、佐野智一、廣瀬明夫
- Organizer
  第29回マイクロエレクトロニクスシンポジウム秋季大会 (MES2019)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] Silver Oxide Decomposition Assisted Direct Bonding of Silicon Carbide2018
- Author(s)
  Tomoki Matsuda, Keita Motoyama, Tomokazu Sano, Akio Hirose
- Organizer
  Materials Science & Technology 2018 (MS&T18)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] SiC direct joining using silver oxide decomposition2018
- Author(s)
  Tomoki Matsuda, Keita Motoyama, Kota Inami, Tomokazu Sano, Akio Hirose
- Organizer
  4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018)
- Data Source
  KAKENHI-PROJECT-18K14028
[Presentation] CuO還元反応を用いたCu-Cu接合2017
- Author(s)
  八尾崇史, 松田朋己, 石井克典, 佐野智一, 廣瀬明夫, 森川千晶, 大渕敦司, 屋代恒
- Organizer
  第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Place of Presentation
  パシフィコ横浜 (神奈川県横浜市）
- Year and Date
  2017-01-31
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Femtosecond laser peening of 2024 aluminum alloy without sacrificial overlay under atmospheric conditions2016
- Author(s)
  T. Sano, T. Eimura, R. Kashiwabara, T. Matsuda, A. Hirose, S. Tsutsumi, K. Arakawa, K. Masaki, and Y. Sano
- Organizer
  The Second Smart Laser Processing Conference (SLPC) 2016
- Place of Presentation
  パシフィコ横浜
- Year and Date
  2016-05-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] フェムト秒レーザピーニングによる2024アルミニウム合金の疲労特性向上2016
- Author(s)
  詠村嵩之, 松田朋己, 佐野智一, 廣瀬明夫, 堤成一郎, 菖蒲敬久, 城鮎美, 荒河一渡, 政木清孝, 佐野雄二
- Organizer
  溶接学会平成28年度秋季全国大会
- Place of Presentation
  伊香保温泉HOTEL天坊
- Year and Date
  2016-09-14
- Data Source
  KAKENHI-PROJECT-16H04247
[Presentation] AlN-to-metal Direct Bonding Utilizing Sintering of In-situ Generated Ag Nanoparticles through Redox Reaction2016
- Author(s)
  Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose
- Organizer
  International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
- Place of Presentation
  Hotel Hankyu Expo Park, Suita, Osaka, Japan
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction Behavior of CuO Paste during Cu-to-Cu Bonding2016
- Author(s)
  Takafumi Yao, Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  MATERIALS SCIENCE & TECHNOLOGY 2016 Conference and Exhibition (MS&T16)
- Place of Presentation
  Salt Lake City, USA
- Year and Date
  2016-10-23
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction behavior of CuO particles during Cu-to-Cu bonding2016
- Author(s)
  Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  International Conference on Nanojoining and Microjoining 2016 (NMJ2016)
- Place of Presentation
  Niagara Falls, Canada
- Year and Date
  2016-09-25
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Reduction Process of CuO in Cu-to-Cu Bonding Using CuO Paste2016
- Author(s)
  Takafumi Yao, Tomoki. Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)
- Place of Presentation
  Kyoto International Conference Center, Kyoto, Japan
- Year and Date
  2016-08-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] 酸化銀還元によりその場生成した銀ナノ粒子の焼結を利用した金属-AlN接合2016
- Author(s)
  本山啓太, 松田朋己, 佐野智一, 廣瀬明夫
- Organizer
  溶接学会平成28年度秋季全国大会
- Place of Presentation
  伊香保温泉ホテル天坊（群馬県渋川市）
- Year and Date
  2016-09-14
- Data Source
  KAKENHI-PROJECT-26289248
[Presentation] Clarification of Reduction Process of CuO in Cu-to-Cu Bonding using CuO Paste2016
- Author(s)
  Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
- Organizer
  International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
- Place of Presentation
  Hotel Hankyu Expo Park, Suita, Osaka, Japan
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289248

1. HIROSE Akio (70144433)

# of Collaborated Projects: 2 results

# of Collaborated Products: 13 results
2. Sano Tomokazu (30314371)

# of Collaborated Projects: 2 results

# of Collaborated Products: 14 results
3. 小椋智 (90505984)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
4. MASAKI Kiyotaka

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
5. SANO yuji

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
6. Arakawa Kazuto

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results

Matsuda Tomoki 松田 朋己

松田 朋己 マツダ トモキ

Research Projects

Research Products

Co-Researchers

界面破壊制御を用いた異相接合部強化指針に基づく高信頼焼結接合法の確立Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Formation mechanism of interface between metal and silicon-based materials via decomposition of silver oxide and its applicationPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of femtosecond laser peening technique for improving mechanical properties

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021

Author(s)

Journal Title

Data Source

[Journal Article] Ag/Cu複合焼結層に及ぼす熱時効の影響2021

Author(s)

Journal Title

Data Source

[Journal Article] Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications2020

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition2020

Author(s)

Journal Title

DOI

Data Source

[Journal Article] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019

Author(s)

Journal Title

Data Source

[Journal Article] Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O2019

Author(s)

Journal Title

DOI

NAID

Data Source

[Journal Article] Silver oxide decomposition mediated direct bonding of silicon-based materials2018

Author(s)

Journal Title

DOI

Data Source

[Journal Article] AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O2018

Author(s)

Journal Title

DOI

Data Source

[Journal Article] elf-heating bonding of A5056 aluminum alloys using exothermic heat of combustion synthesis2017

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Femtosecond laser peening of 2024 aluminum alloy without a sacrificial overlay under atmospheric conditions2017

Author(s)

Journal Title

DOI

NAID

Data Source

[Journal Article] CuO還元反応を用いたCu-Cu接合2017

Author(s)

Matsuda Tomoki 松田朋己

松田朋己マツダトモキ