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Suga Tadatomo  須賀 唯知

… Alternative Names

SUGA Tadatomo  須賀 唯知

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Researcher Number 40175401
Other IDs
  • ORCIDhttps://orcid.org/0000-0002-1029-0326
External Links
Affiliation (Current) 2022: 明星大学, 連携研究センター, 客員教授
Affiliation (based on the past Project Information) *help 2012 – 2016: 東京大学, 工学(系)研究科(研究院), 教授
2011: 東京大学, 大学院・工学系研究科, 教授
2007: 国立大学法人東京大学, 工学系研究科, 教授
2005 – 2007: 東京大学, 工学系研究科, 教授
2006: 東京大学, 大学院工学系研究科, 教授 … More
2003 – 2006: 東京大学, 大学院・工学系研究科, 教授
2004: 国立大学法人東京大学, 大学院・工学系研究科, 教授
2003: 東京大学, 先端科学研究センター, 教授
2003: 東京大学, 大学院・工学研究科, 教授
2000 – 2002: 東京大学, 先端科学技術研究センター, 教授
2001: 東京大学, 先端科学研究センター, 教授
1994 – 1997: Reserch Center for Advanced Science and Technology, The University of Tokyo, Professor, 先端科学技術研究センター, 教授
1993: 東京大学, 工学部, 教授
1992: University of Tokyo, Research Center for Advanced Science and Technology, Associ, 先端研, 助教授
1990 – 1992: 東京大学, 先端科学技術研究センター, 助教授
1991: 東京大学, 先端科学技術センター, 教授
1990 – 1991: 東京大学, 先端科学研究センター, 助教授
1990: 東京大学, 先端科学技術センター, 助教授
1990: 東京大学, 工学部・機械学科, 助教授
1987 – 1990: 東京大学, 工学部, 助教授
1986: 東大, 工学部, 教授 Less
Review Section/Research Field
Principal Investigator
機械材料工学 / Material processing/treatments / 機械力学・制御工学 / Science and Engineering / Material processing/treatments / Composite materials/Surface and interface engineering / 金属材料(含表面処理・腐食防食) / Applied physics, general / Microdevices/Nanodevices / 金属加工(含鋳造) … More
Except Principal Investigator
… More Nanomaterials/Nanobioscience / 金属材料(含表面処理・腐食防食) / Material processing/treatments / 機械工作・生産工学 / Physical properties of metals / Environmental impact assessment/Environmental policy Less
Keywords
Principal Investigator
表面活性化 / 常温接合 / 接合 / セラミックス / イオン衝撃 / 低温接合 / 超高真空 / 界面 / メカノケミカルポリシング / ウエハ接合 … More / 水素ラジカル / 実装 / 集積化 / 接合界面 / 電子顕微鏡 / Ultrahigh Vacuum / Surface Activation / Direct Bonding / 鏡面加工 / 加工変質層 / 表面分析 / 透過電子顕微鏡 / 窒化ケイ素 / 酸化クロム / 高温酸化物超伝導体 / 界面抵抗 / YB_2CuO / AFM / 微小力センサ- / 圧電膜 / 原子間力 / マイクロマシ-ニング / ZnO / PZT膜 / 異方性エッチング / FEM / 接触解析 / 接合面積 / バンプ / 接触率 / マイクロシステム / 異種半導体接合 / ギ酸 / 直接接合 / 還元 / 活性化接合 / 銅ー銅接合 / ぎ酸 / プラチナ触媒 / ハイブリッド接合 / ナノ密着層 / 銅直接接合 / 酸化膜還元 / 固相接合 / 界面き裂 / き裂モデル / 界面構造 / 原子レベルの接合 / Room Temperture Bonding / microstructure of Interface / インタ-コネクション / 機能性材料 / 高分解能電子顕微鏡 / 高分解能電子顕微鏡観察 / Room Temperature Bonding / Microstructure of Interface / ディンプラ / 透過電子顕微鏡観察 / 表面損傷 / 脆性材料 / マイクロクラック / 粒界破壊 / ディンプラ- / メカノケミカルポリッシング / Dimpler / Transmission electron microscopy / Surface damage / Brittle material / Ceramics / Micro crack / Intergranular fracture / Mechanochemical polishing / 圧電材料 / 陽極接合 / シリコン / ラジカルビーム / 吸着層 / Piezo-electric materials / Low temperature bonding / Room temperature bonding / Anodic bonding / Silicon / Ion bomberdment / Radical beam / Surface activation bonding / マイクロマシン / アセンブリ / 微小接合 / マニピュレータ / マイクロアセンブリ / 微小位置決め / 半導体チップ / はんだバンプ / Micromachine / Assembly / Microbonding / Surface Activated Bonding / Micromanipulation / SiC-Al界面 / 第一原理分子動力学 / 電子構造 / 凝着エネルギー / 変形 / セラミックス-金属界面 / サファイア-Al界面 / 原子間力顕微鏡 / 原子構造 / バンド計算 / カーボンナノチューブ / SiC-Al interface / first-principle molecular dynamics method / electronic structure / adhesive energy / electron microscopy / deformation / ceramic-metal interfaces / sapphire-Al interface / 分離 / 水素 / 水素吸蔵合金 / 可逆的インターコネクション / 環境 / リサイクル / インターコネクション / bonding / surface activated bonding / separation, / interface / Al / stainless steel / environment / hydrogen / プラズマ活性化 / シリコン直接接合 / 窒素ラジカル / 酸素プラズマ / タンタル酸リチウム / シリコン接合 / サファイア接合 / 酸素ラジカル / 表件活性化 / ガラス接合 / 気密封止 / plasma activation / low temperature bonding / room temperature bonding / surfaace activation / wafer bonding / silicon direct bonding / ion irradiation / nitrogen radical / 超音波接合 / 超高波接合 / 超高真空常温接合 / 金属とセラミックスの接合 / Vltrasonic Bonding / Bonding of Metals to Ceramics … More
Except Principal Investigator
高分解能電子顕微鏡 / 分子動力学 / Si_3N_4 / 金属ーセラミック接合 / 界面 / 濡れ性 / ろう材 / フラーレンナノウィスカー / フラーレンナノチューブ / フラーレン / 界面構造 / Interface Structure / LCA / C / AgーCuーTi合金 / メカニカルポリシング / Nb / Al_2O_3接合体 / Al_2O_3 / Nb接合体 / Si_3N_4TiC複合体 / マルチプルフラクチャー試験 / 3点曲げ静疲労試験 / セラミックス用高温繰返し応力試験 / セラミックス用高温クリープ試験 / 高強度、超塑性の原理 / 新材料創製 / 新材料(複合材料)力学・物性評価法 / 接合境界面の力学・物性 / 複合材料界面の力学・物性 / 破壊の新しいクライテリオンの創出 / ろう付け / 破壊靱性 / 濡れ / 繊維強化,複合材料 / Debonding / 界面挙動 / ZrO_2系セラミックス / Mo被覆接合強度 / 高温脆性材料のクリ-プ寿命 / 高温クリ-プき裂成長速度 / 転位群の動力学 / 脆性・延性遷移 / 熱サイクル / 高温超伝導体 / 静疲労 / 界面き裂 / C_<60> / C_<70> / C_<60>誘導体 / フラーレンカプセル / フラーレンシェルチューブ / ナノウィスカー / フラーレン誘導体 / C_60 / C_70 / 触媒 / ナノファイバー / 単結晶 / 金属-セラミックス接合 / セラミックス / メタライズ / 接合界面 / 残留応力 / 接合反応 / AlN(窒化アルミニウム) / Si(けい素) / Al_2O_3(アルミナ) / 金属ーセラミックス接合 / Si_3N_4(窒化けい素) / SiC(炭化けい素) / ろう材接合 / TiB_2(ほう化チタン) / 窒化けい素 / 炭化けい素 / アルミナ / Metal-Ceramic Joining / Ceramics / Metallization / Joined Interface / Residual Stress / Wettability / Joining Reaction / 金属・セラミック接合 / 無反応相界面 / 非平衡組成 / 高温塑性 / 熱応力緩和 / 超伝導特性 / ニッケル・窒化ケイ素接合 / 銀・ビスマス系超伝導体接合 / 金属・セラミックス接合界面構造 / 高分解能電子顕微鏡観察 / 金属・セラミックス無反応相界面 / 拡散層 / 金属セラミック接合体 / Metal / Ceramic Joining / Reaction Product Free Interface / Nonequilibrium Composition / High Temperature Plasticity / Stress Relaxation / Superconductivity / High Resolution Electron Microscopy / インバース・マニュファクチャリング / ライフサイクル設計 / Soft Artifacts / 環境問題 / Green Browser / マイクロ・ディスアセンブリ / 閉ループ型ライフサイクルシステム / Life Cycle Product Modeling / 閉ループ型ライフサイクル・システム / INVERSE MANUFACTURING / LIFE-CYCLE DESIGN / SOFT ARTIFACTS / ENVIRONMENTAL ISSUES / GREEN BROWSER / MICRO DISASSEMBLY / CLOSED-LOOP LIFE-CYCLE SYSTEM / 凝着 / 原子間力顕微鏡 / 超高真空 / 結合状態 / 電子分光 / 表面分析 / 無加圧 / 接合 / 拡散 / adhesion / atomic force microscope / ultra high vacuum / molecular dynamics / chemical bond / interface / electronic spectroscopy / surface analysis / 内部損傷 / 超音波 / AE / 非破壊評価 / 微視割れ / C複合材料 / SiC 粒子分散ガラス / Si-Ti-C-Oセラミックス / SiC粒子分散ガラス / ヒステリシスループ / Internal Damage / Ultrasonic / Acoustic Emission / Non-Destructive Evaluation / Microcrack / C Composites / SiC Reinforced glass / Si-Ti-C-O Ceramics / レーザーガン / 量子効果原子剥離 / 無損傷超薄片 / 紫外域レーザー / 完全平滑表面 / 電子顕微鏡観察用超薄片 / 原子構造評価技術 / 同調照射 / 平滑表面 / 波長同調照射 / SiC超薄片 / ダイヤモンド超薄片 / quantum-process thinning / damage free super thin foil / laser gun / ultra violet laser / damage free surface / thin foil for TEM observation / atomic structure analyzing system / tuned irradiation / リサイクル / リユース / 廃棄 / アジア / エコデザイン / パーソナルコンピュータ / 家電製品 / 多重システム / アジア地域 / 資源循環 / リサイクルコストモデル / 環境汚染 / 循環シミュレータ / IT機器 / 家電リサイクル / recycling / reuse / disposal / Asia / Eco-design / Personal computer / home appliances / multilateral system / カーボン60 / 液-液界面析出法 / ラマン / 液-液法 / リチウムイオン電池 / 燃料電池 / ナノチューブ / 常温合成 / 電極 / Fullerene nanowhisker / Fullerene nanotube / Fullerene / Carbon C_<60> / Liauid-liauid interfacial precipitation method Less
  • Research Projects

    (30 results)
  • Research Products

    (175 results)
  • Co-Researchers

    (78 People)
  •  Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt CatalystPrincipal Investigator

    • Principal Investigator
      Suga Tadatomo
    • Project Period (FY)
      2014 – 2016
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Composite materials/Surface and interface engineering
    • Research Institution
      The University of Tokyo
  •  New Method for Room Temperature Bonding at Ambient GasPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      2011 – 2013
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Material processing/treatments
    • Research Institution
      The University of Tokyo
  •  Characterization and electrode application of the room-temperature synthesized fullerene nanotubes

    • Principal Investigator
      KUN'ICHI Miyazawa
    • Project Period (FY)
      2005 – 2007
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Nanomaterials/Nanobioscience
    • Research Institution
      National Institute for Materials Science
  •  EcoDesign of Multilateral Recycling Systems in Asia

    • Principal Investigator
      FUJIMOTO Jun
    • Project Period (FY)
      2004 – 2006
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Environmental impact assessment/Environmental policy
    • Research Institution
      The University of Tokyo
  •  Wafer-scale MEMS Package by means of room temperature bondingPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      2004 – 2006
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Microdevices/Nanodevices
    • Research Institution
      The University of Tokyo
  •  フラーレン単結晶ナノ細線及びその誘導体の形成と物性評価

    • Principal Investigator
      MIYAZAWA Kun-ichi
    • Project Period (FY)
      2003 – 2004
    • Research Category
      Grant-in-Aid for Exploratory Research
    • Research Field
      Nanomaterials/Nanobioscience
    • Research Institution
      National Institute for Materials Science
  •  常温接合によるマイクロシステムインテグレーションPrincipal Investigator

    • Principal Investigator
      須賀 唯知
    • Project Period (FY)
      2001 – 2003
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Review Section
      Science and Engineering
    • Research Institution
      The University of Tokyo
  •  Development of a new specimen thinning technique based on the quantum process.

    • Principal Investigator
      ICHINOSE Hideki
    • Project Period (FY)
      2000 – 2003
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Physical properties of metals
    • Research Institution
      HOkkaido University
      The University of Tokyo
  •  Development of Sysem for Three Dimensional Cracks and Damage

    • Principal Investigator
      ENOKI Manabu, 金 炳男, 岸 輝雄
    • Project Period (FY)
      1996 – 1998
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Material processing/treatments
    • Research Institution
      Research Center for Advanced Science and Technology, The University of Tokyo
  •  インバース・マニュファクチャリング実現のための基礎研究

    • Principal Investigator
      KIMURA Fumihiko
    • Project Period (FY)
      1995 – 1996
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      機械工作・生産工学
    • Research Institution
      THE UNIVERSITY OF TOKYO
  •  Widening of the joined interface by the procedure without heating and pressing

    • Principal Investigator
      ONZAWA Tadao
    • Project Period (FY)
      1995 – 1996
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Material processing/treatments
    • Research Institution
      Tokyo Institute of Technology
  •  reversible interconnectionPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1995 – 1996
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Material processing/treatments
    • Research Institution
      The University of Tokyo
  •  Atomic and Electronic Design ob Ceramic/Metal InterfacesPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo, 石田 洋一
    • Project Period (FY)
      1994 – 1996
    • Research Category
      Grant-in-Aid for international Scientific Research
    • Research Institution
      University of Tokyo
  •  Study for low temperature bonding and itsapplication for piezo-electric materials.Principal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1993 – 1994
    • Research Category
      Grant-in-Aid for General Scientific Research (B)
    • Research Field
      Material processing/treatments
    • Research Institution
      The University of Tokyo
  •  A Novel Approach to Assembly and Interconnection for Micromachines.Principal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1993 – 1994
    • Research Category
      Grant-in-Aid for Developmental Scientific Research (B)
    • Research Field
      Applied physics, general
    • Research Institution
      The University of Tokyo
  •  接合部および先端複合材料の界面挙動の力学・物性

    • Principal Investigator
      岩本 信也
    • Project Period (FY)
      1991
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      Osaka University
  •  圧電膜を利用した原子間力の計測Principal Investigator

    • Principal Investigator
      須賀 唯知
    • Project Period (FY)
      1991
    • Research Category
      Grant-in-Aid for General Scientific Research (C)
    • Research Field
      機械力学・制御工学
    • Research Institution
      The University of Tokyo
  •  接合部および先端複合材料の界面挙動の力学・物性

    • Principal Investigator
      岩本 信也
    • Project Period (FY)
      1990
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      Osaka University
  •  高温酸化物超伝導体と金属の常温接合Principal Investigator

    • Principal Investigator
      須賀 唯知
    • Project Period (FY)
      1990 – 1991
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      The University of Tokyo
  •  Interconnection of Functional Materials by Means of a Surface Activation Method in Ultrahigh VacuumPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1990 – 1991
    • Research Category
      Grant-in-Aid for international Scientific Research
    • Research Institution
      University of Tokyo
  •  Mechanisms of and Affecting Factors on the Metal-Ceramic Joining

    • Principal Investigator
      MOROZUMI Shotaro
    • Project Period (FY)
      1990 – 1992
    • Research Category
      Grant-in-Aid for Co-operative Research (A)
    • Research Field
      金属材料(含表面処理・腐食防食)
    • Research Institution
      Tohoku University
  •  High Temerature Plasticity of Metal/Ceramic Interface Free of Reaction Product Layer and Enhanced by Nonstoichiometry

    • Principal Investigator
      ISHIDA Yoichi
    • Project Period (FY)
      1990 – 1992
    • Research Category
      Grant-in-Aid for General Scientific Research (B)
    • Research Field
      金属材料(含表面処理・腐食防食)
    • Research Institution
      University of Tokyo
  •  Development of the 'Super-Dimpler' for preparation of a thin specimen for TEM observations of the machined surfaces.Principal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1990 – 1991
    • Research Category
      Grant-in-Aid for Developmental Scientific Research (B)
    • Research Field
      機械材料工学
    • Research Institution
      The University of Tokyo
  •  ファインセラミックス加工極表面の微視的構造に関する研究Principal Investigator

    • Principal Investigator
      須賀 唯知
    • Project Period (FY)
      1989
    • Research Category
      Grant-in-Aid for General Scientific Research (C)
    • Research Field
      機械材料工学
    • Research Institution
      The University of Tokyo
  •  接合部および先端複合材料の界面挙動の力学・物性

    • Principal Investigator
      岩本 信也
    • Project Period (FY)
      1989
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      Osaka University
  •  無機系先端材料強度の向上と評価

    • Principal Investigator
      横掘 武夫
    • Project Period (FY)
      1989 – 1991
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      Teikyo University
  •  無機系先端材料強度の向上と評価

    • Principal Investigator
      横堀 武夫
    • Project Period (FY)
      1989 – 1991
    • Research Category
      Grant-in-Aid for Scientific Research on Priority Areas
    • Research Institution
      Teikyo University
  •  INTERCONNECTION OF FUNCTIONAL MATERIALS BY MEANS OF A SURFACE ACTIVATION METHOD IN ULTRAHIGH VACUUMPrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1989
    • Research Category
      Grant-in-Aid for international Scientific Research
    • Research Institution
      University of Tokyo
  •  Ultra-high Vacuum Bonding at Room Temperature Aided by Ultrasonic WavePrincipal Investigator

    • Principal Investigator
      SUGA Tadatomo
    • Project Period (FY)
      1987 – 1988
    • Research Category
      Grant-in-Aid for General Scientific Research (B)
    • Research Field
      金属加工(含鋳造)
    • Research Institution
      Department of Precision Machinery Engineering, Faculty of Engineering, The University of Tokyo
  •  金属-セラミック接合境界における界面破壊の素過程Principal Investigator

    • Principal Investigator
      須賀 唯知
    • Project Period (FY)
      1985 – 1986
    • Research Category
      Grant-in-Aid for General Scientific Research (C)
    • Research Field
      金属材料(含表面処理・腐食防食)
    • Research Institution
      The University of Tokyo

All 2017 2016 2015 2014 2013 2012 2011 2007 2006 2005 2004 Other

All Journal Article Presentation Book Patent

  • [Book] Microelectronics Reliability, Volume 52, Issue 5, ISSN : 0026-27142012

    • Author(s)
      Tadatomo Suga (Editor)
    • Total Pages
      260
    • Publisher
      Elsevier B.V.
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Book] Microelectronics Reliability- Low Temperature Processing for Microelectronics and Microsystems Packaging2012

    • Author(s)
      Suga, Tadatomo; Song, Jenn-Ming; Lai, Yi-Shao
    • Total Pages
      160
    • Publisher
      Elsevier limited
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid2017

    • Author(s)
      Masahisa Fujino, Masatake Akaike, Naoya Matsuoka, and Tadatomo Suga
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 56 Issue: 4S Pages: 04CC01-04CC01

    • DOI

      10.7567/jjap.56.04cc01

    • NAID

      210000147553

    • ISSN
      0021-4922, 1347-4065
    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] The study of Cu-Cu low temperature bonding using formic acid treatment with/without Pt catalyst2016

    • Author(s)
      Wenhua Yang, Yangting Lu, Tadatomo Suga
    • Journal Title

      International Conference on Electronic Packaging Technology

      Volume: 17 Pages: 784-787

    • DOI

      10.1109/icept.2016.7583247

    • Peer Reviewed / Open Access / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Combined surface-activated bonding technique for low-temperature Cu/SiO2 hybrid bonding2015

    • Author(s)
      R. He, M. Fujino, A. Yamauchi, and T. Suga
    • Journal Title

      ECS Transactions

      Volume: 69 Pages: 79-88

    • DOI

      10.1149/06906.0079ecst

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Advances in Low-Temperature Bonding Technologies for 3D Integration2015

    • Author(s)
      T. Suga, N. Shigekawa, E. Higurashi, H. Takagi, and K. Shimomura
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 54 Issue: 3 Pages: 030200-030200

    • DOI

      10.7567/jjap.54.030200

    • ISSN
      0021-4922, 1347-4065
    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Direct bonding for dissimilar metals assisted by carboxylic acid vapor2015

    • Author(s)
      J.-M. Song, S.-K. Huang, M. Akaike, and T. Suga
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 54 Issue: 3 Pages: 030217-030217

    • DOI

      10.7567/jjap.54.030217

    • NAID

      210000144828

    • ISSN
      0021-4922, 1347-4065
    • Peer Reviewed / Open Access / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Effect of Formic Acid Vapor In Situ Treatment Process on Cu Low-Temperature Bonding2014

    • Author(s)
      Wenhua Yang, Masatake Akaike, Tadatomo Suga
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: 6 Pages: 951-956

    • DOI

      10.1109/tcpmt.2014.2315761

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Miniaturized polarization sensors integrated with wire-grid polarizers2014

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Journal Title

      Proceeding of 2014 International Conference on Electronics Packaging (ICEP)

      Volume: なし Pages: 376-379

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Surface Activated Bonding of Laser Diode Chips Using N2 Atmospheric-Pressure Plasma2013

    • Author(s)
      Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
    • Journal Title

      Proceedings of International Conference on Electronics Packaging (ICEP 2013)

      Volume: なし Pages: 60-63

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 大気圧プラズマで活性化したAuスタッドバンプによる半導体光素子の低温接合と光マイクロセンサ応用2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Journal Title

      Proceedings of 19th Symposium on “Microjoining and Assembly Technology in electronics”

      Volume: なし Pages: 425-430

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] シリコン/ゲルマニウム常温接合界面の特性評価2013

    • Author(s)
      佐々木優太・日暮栄治・須賀唯知
    • Journal Title

      2013年度精密工学春季大会学術講演会講演論文集

      Volume: なし Pages: 159-160

    • NAID

      130005031647

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 低温接合技術で作製したワイヤグリッド偏光子集積型偏光センサ2013

    • Author(s)
      池田颯、日暮栄治、須賀唯知、小口寿明
    • Journal Title

      第28回エレクトロニクス実装学会春季講演大会講演論文集

      Volume: なし Pages: 277-278

    • NAID

      130007430015

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers2013

    • Author(s)
      Eiji Higurashi, Kaori Nakasuji, and Tadatomo Suga
    • Journal Title

      Proceedings of International Conference on Electronics Packaging (ICEP 2013)

      Volume: なし Pages: 350-354

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] ワイヤグリッド偏光子を集積した小型偏光センサ2013

    • Author(s)
      山本道貴、日暮栄治、北島和典、須賀唯知、小口寿明
    • Journal Title

      第23回マイクロエレクトロニクスシンポジウム(MES 2013)

      Volume: なし Pages: 65-68

    • NAID

      130007887274

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] N2大気圧プラズマによる表面活性化を用いた光素子の低温接合2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Journal Title

      2013年度精密工学春季大会学術講演会講演論文集

      Volume: なし Pages: 161-162

    • NAID

      130005031648

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 大気圧プラズマを用いた低温固相接合による偏光検出器の開発2013

    • Author(s)
      日暮栄治、北島和典、山本道貴、須賀唯知、小口寿明
    • Journal Title

      2013年度精密工学秋季大会学術講演会講演論文集

      Volume: なし Pages: 515-516

    • NAID

      130004661274

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 高機能光マイクロシステム・センサを実現する低温接合技術2013

    • Author(s)
      日暮栄治、須賀唯知、澤田廉士
    • Journal Title

      精密工学会誌

      Volume: 79 Pages: 719-724

    • NAID

      130003385019

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 低温接合技術に基づく異種材料集積技術と三次元構造光マイクロシステムへの応用2013

    • Author(s)
      日暮栄治、澤田廉士、須賀唯知
    • Journal Title

      光技術コンタクト

      Volume: 51 Pages: 24-31

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 窒素大気圧プラズで活性化したAuバンプによる半導体レーザ素子の低温接合2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Journal Title

      第5回「集積化MEMSシンポジウム」(応用物理学会集積化MEMS技術研究会主催)

      Volume: なし Pages: 1-4

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] GaAs/SiC常温直接ウェハ接合を用いた高出力レーザの高放熱構造に関する研究2013

    • Author(s)
      中筋香織、日暮栄治、須賀唯知
    • Journal Title

      第27回エレクトロニクス実装学会春季講演大会論文集

      Volume: なし Pages: 252-253

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article]2012

    • Author(s)
      S.Yamamoto, E.Higurashi, T.Suga, and R.Sawada, J.Micromech
    • Journal Title

      Microeng

      Volume: vol.22, no.5 Pages: 55026-55026

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] 大気圧プラズマで活性化したAuスタッドバンプによる半導体レーザ素子の低温接合2012

    • Author(s)
      山本道貴,佐藤丈史,日暮栄治,須賀唯知,澤田廉士
    • Journal Title

      2012年度精密工学秋季大会学術講演会講演論文集

      Volume: なし Pages: 759-760

    • NAID

      130004660912

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article]2012

    • Author(s)
      E.Higurashi, T.Fukunaga, and T.Suga
    • Journal Title

      IEEE Journal of Quantum Electronics

      Volume: vol.48, no.2 Pages: 182-186

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Investigation of Fluorine Containing Plasma Activation for Room-Temperature Bonding of Si-based Materials2012

    • Author(s)
      Chenxi Wang, Tadatomo Suga
    • Journal Title

      Microelectronics Reliability

      Volume: 52 Pages: 347-351

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Low-temperature bonding of GaN on Si using a nonalloyed metal Ohmic contact layer for GaN based heterogeneous devices2012

    • Author(s)
      Eiji Higurashi, Toru Fukunaga, Tadatomo Suga
    • Journal Title

      IEEE Journal of Quantum Electronics

      Volume: 48 Pages: 182-186

    • DOI

      10.1109/jqe.2011.2170211

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Low-Temperature Direct Bonding of Glass Nanofluidic Chips Using a Two-step Plasma Surface Activation2012

    • Author(s)
      Yan,Xu, Chenxi Wang, Yiyang Dong, Lixiao Li, Kihoon Jang, Kazuma Mawatari, Yo Tanaka, Tadatomo Suga, Takehiko Kitamori
    • Journal Title

      Analytical and Bioanalytical Chemistry

      Volume: 402 Pages: 1011-1018

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding2012

    • Author(s)
      Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga
    • Journal Title

      Microelectronics Reliability

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150 degrees C and Atmospheric Pressure2012

    • Author(s)
      Shigetou, Akitsu; Suga, Tadatomo
    • Journal Title

      Journal of Electronic Materials

      Volume: Volume: 41 Issue: 8 Pages: 2274-2280

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials2012

    • Author(s)
      Wang, Chenxi; Suga, Tadatomo
    • Journal Title

      Microelectronics Reliability

      Volume: Volume: 52 Issue: 2 Pages: 347-351

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Low-temperature hermetic packaging for microsystems using Au-Au surface-activated bonding at atmospheric pressure environment2012

    • Author(s)
      Shin-ichi Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada
    • Journal Title

      Journal of Micromechanics and Microengineering

      Volume: 22

    • DOI

      10.1088/0960-1317/22/5/055026

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces2012

    • Author(s)
      Michitaka Yamamoto, Takeshi Sato, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
    • Journal Title

      Proceedings of IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan

      Volume: なし Pages: 35-38

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Room Temperature Direct Bonding Using Fluorine Containing Plasma Activation2011

    • Author(s)
      C.Wang and T.Suga
    • Journal Title

      Journal of The Electrochemical Society

      Volume: vol.158 Pages: 525-529

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Si nanoadhesion layer for enhanced SiO2-SiN wafer bonding2011

    • Author(s)
      R.Kondou, T.Suga
    • Journal Title

      Scripta Materialia

      Volume: vol.65 Pages: 320-322

    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation2011

    • Author(s)
      Chenxi Wang, Tadatomo Suga
    • Journal Title

      Journal of The Electrochemical Society

      Volume: 158

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Si nanoadhesion layer for enhanced SiO2-SiN wafer bonding2011

    • Author(s)
      Ryuichi Kondou, Tadatomo Suga
    • Journal Title

      Scripta Materialia

      Volume: 65 Pages: 320-322

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Journal Article] Surface Activated Bonding Method for Flexible Lamination2007

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007), 6th

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Structural investigation of heat-treated fullerene nanotubes and nanowhiskers2006

    • Author(s)
      K. Miyazawa, J. Minato. M. Fujino, T. Suga
    • Journal Title

      Diamond and Related Materials 15

      Pages: 1143-1146

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

    • Author(s)
      M. M. R. Howlader, T. Suga
    • Journal Title

      IEEE, Electronic Components & Technology Conf.(ECTC), 56th. Proceedings. May 31

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Structural characterization of room-temperature synthesized fullerene nanowhiskers2006

    • Author(s)
      K.Miyazawa,J.Minato,T.Mashino,S.Nakamura,M.Fujino and T.Suga
    • Journal Title

      NUKLEONIKA 51(Supplement 1)

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] Structural characterization of room-temperature synthesized fullerene nanowhiskers2006

    • Author(s)
      K.Miyazawa, J.Minato, T.Mashino, S.Nakamura, M.Fujino, T.Suga
    • Journal Title

      NUKLEONIKA (印刷中)

    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      IEEE, Electronic Components & Technology Conf.(ECTC), 56th.Proceedings May31

      Pages: 552-558

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      Int. Conf. on Electronics Packaging (ICEP2006), Proceedings. Apr. 19-21

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Structural charactrization of room-temperature synthesized fullerene nanowhiskers2006

    • Author(s)
      K. Miyazawa, J. Minato, T. Mashino, S. Nakamura, M. Fujino, T. Suga
    • Journal Title

      NUKLEONIKA 51 Supplement 1

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] Room temperature wafer level glass-glass bonding2006

    • Author(s)
      M.M.R.Howlader, S.Suehara, T.Suga
    • Journal Title

      Sensors and Actuators A127

      Pages: 31-36

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      Int.Conf.on Electronics Packaging (ICEP2006), Proceedings Apr.19-21

      Pages: 342-347

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      IEEE, Electronic Components & Technology Conf. (ECTC), 56th., Proceedings. May 31

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Structural investigation of heat-treated fullerene nanotubes and nanowhiskers2006

    • Author(s)
      K.Miyazawa,J.Minato,M.Fujino and T.Suga
    • Journal Title

      Diamond and Related Materials 15

      Pages: 1143-1146

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] Structural investigation of heat-treated fullerene nanotubes and nanowhiskers2006

    • Author(s)
      K.Miyazawa, J.Minato, M.Fujino, T.Suga
    • Journal Title

      Diamond and Related Materials (印刷中)

    • Data Source
      KAKENHI-PROJECT-17201027
  • [Journal Article] Room temperature wafer level glass-glass bonding2006

    • Author(s)
      M. M. R. Howlader, S. Suehara, T. Suga
    • Journal Title

      Sensors and Actuators A127

      Pages: 31-31

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005

    • Author(s)
      M. M. R. Howlader, S. Suehara, H. Takagi, T. H. Kim, R. Maeda, T. Suga
    • Journal Title

      IEEE Transactions on Advanced Packaging

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Bonding Processes and Mechanisms for Ionic and Piezoelectric Wafers2005

    • Author(s)
      M. M. R. Howlader, T. Suga
    • Journal Title

      Proc. International Conference on Electronics Packaging ICEP 13-15/4

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] アジア循環の経済的視点からの評価2005

    • Author(s)
      桑谷雅之, 藤本淳, 梅田靖, 李志東, 近藤伸亮, 中村一彦, 須賀唯知
    • Journal Title

      2005年度 精密工学会秋季大会 学術講演論文集

      Pages: 655-656

    • Data Source
      KAKENHI-PROJECT-16201007
  • [Journal Article] Room temperature wafer level glass/glass bonding2005

    • Author(s)
      M.M.R.Howlader, S.Suehara, T.Suga
    • Journal Title

      Sensors and Actuators A

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surface activated bonding for MEMS and microfluidics2005

    • Author(s)
      M. M. R. Howlader, S. Suehara, H. Takagi, R. Maeda, and T. Suga
    • Journal Title

      Proc. Int. Symposium on Wafer Bonding 8

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005

    • Author(s)
      H.Itoh, M.M.R.Howlader, H.Li, T.Suga, M.J.Kim
    • Journal Title

      Proc.International Conference on Electronics Packaging ICEP

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005

    • Author(s)
      H.Itoh, M.M.R.Howlader, H.Li, T.Suga, M.J.Kim
    • Journal Title

      Proc.International Conference on Electronics Packaging ICEP 13-15/4

      Pages: 94-99

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature2005

    • Author(s)
      M.M.R.Howlader, S.Suehara, T.H.Kim, T.Suga
    • Journal Title

      Proc.Electronic Component and Technology Conference 55

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005

    • Author(s)
      H. Itoh, M. M. R. Howlader, H. Li, T. Suga, M. J. Kim
    • Journal Title

      Proc. International Conference on Electronics Packaging ICEP 13-15/4

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surface activated bonding for MEMS and microfluidics2005

    • Author(s)
      M.M.R.Howlader, S.Suehara, H.Takagi, R.Maeda, T.Suga
    • Journal Title

      Proc.Int.Symposium on Wafer Bonding 8

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Structural characterization of the fullerene nanotubes prepared by the liquid-liquid interfacial precipitation method2005

    • Author(s)
      K.Miyazawa, J.Minato, T.Yoshii, M.Fujino, T.Suga
    • Journal Title

      Journal of Materials Research 20(3)

      Pages: 688-695

    • Data Source
      KAKENHI-PROJECT-15651063
  • [Journal Article] Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature2005

    • Author(s)
      M. M. R. Howlader, S. Suehara, T. H. Kim, T. Suga
    • Journal Title

      Proc. Electronic Component and Technology Conference 55

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005

    • Author(s)
      M.M.R.Howlader, S.Suehara, H.Takagi, T.H.Kim, R.Maeda, T.Suga
    • Journal Title

      IEEE Transactions on Advanced Packaging

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] アジア循環システムのエコデザインと実現化ロードマップ作成2005

    • Author(s)
      藤本淳, 梅田靖, 李志東, 近藤伸亮, 中村一彦, 桑谷雅之, 須賀唯知
    • Journal Title

      2005年度 精密工学会春季大会 学術講演論文集

      Pages: 257-257

    • Data Source
      KAKENHI-PROJECT-16201007
  • [Journal Article] Characterization of high-pressure sintered C_<60> nanowhiskers and C_<60> powder2005

    • Author(s)
      J.Minato, K.Miyazawa, T.Suga, H.Kanda, M.Akaishi, K.Yamaura
    • Journal Title

      Journal of Materials Research 20(3)

      Pages: 742-746

    • Data Source
      KAKENHI-PROJECT-15651063
  • [Journal Article] Room temperature microfiuidics packaging using sequential plasma activation process2005

    • Author(s)
      M.M.R.Howlader, S.Suehara, H.Takagi, T.H.Kim, R.Maeda, and T.Suga
    • Journal Title

      IEEE Transactions on Advanced Packaging

      Pages: 446-456

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Sequential activation process for silicon direct bonding2004

    • Author(s)
      T. H. Kim, M. M. R. Howlader, T. Suga
    • Journal Title

      The 4th International Conference on Alternative Substrate Technology 21-25/3

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Wafer level and chip size direct wafer bondingat room temperature2004

    • Author(s)
      M.M.R.Howlader, T.Suga, Moon J Kim
    • Journal Title

      206th Electrochemical Society Meeting

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Wafer level and chip size direct wafer bondingat room temperature2004

    • Author(s)
      M.M.R.Howlader, T.Suga, Moon J Kim
    • Journal Title

      206th Electrochemical Society Meeting 3-8/10

      Pages: 150-160

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surface activated bonding for microelectronics and MEMSpackaging2004

    • Author(s)
      M.M.R.Howlader, T.Suga
    • Journal Title

      The Electrochemical Society International Semiconductor Technology Conference

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004

    • Author(s)
      M. M. R. Howlader, H.Okada, T. H. Kim, T. Itoh, T. Suga
    • Journal Title

      Journal of Electrochemical Society 151

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Wafer level andchip size direct wafer bondingat room temperature2004

    • Author(s)
      M. M. R. Howlader, T. Suga, Moon J Kirn
    • Journal Title

      206th Electrochemical Society Meeting 3-8/10

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Lamination and de-laminationprocesses for Cu/LCP for electronic packaging2004

    • Author(s)
      M.M.R.Howlader, K.Nanbu, T.Saizou, T.Suga
    • Journal Title

      The Eleventh International Conference on Intergranular and Inetrphase Boundaries.

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surface activated bonding for wafer scale glass/glass integration2004

    • Author(s)
      T. Suehara, M. M. R. Howlader, T. H. Kim, T. Suga
    • Journal Title

      ECS, Int. Semiconductor Technology Conf., 3rd.,(ISTC20O4) 15-17/9(Proceedings)

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] MEMS packagingusing room temperature wafer bonding2004

    • Author(s)
      M. M. R. Howlader, T. H. Kim, T. Suga
    • Journal Title

      The 4th International Conference on Alternative Substrate Technology 21-25/3

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Transmission electron microscopy investigation of fullerene nanowhiskers and needle-like precipitates formed by using C_<60> and (η^2-C_<60>)Pt(PPh_3)_22004

    • Author(s)
      K.Miyazawa, T.Suga
    • Journal Title

      Journal of Materials Research 19(8)

      Pages: 2410-2414

    • Data Source
      KAKENHI-PROJECT-15651063
  • [Journal Article] Surface activated bonding for wafer scale glass/glass integration2004

    • Author(s)
      T.Suehara, M.M.R.Howlader, T.H.Kim.T.Suga
    • Journal Title

      ECS, Int.Semiconductor Technology Conf., 3rd., (ISTC2004), Proceedings 15-17/9

      Pages: 424-431

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004

    • Author(s)
      M.M.R.Howlader, H.Okada, T.H.Kim, T.Itoh, and T.Suga
    • Journal Title

      Journal of Electrochemical Society 151

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surface activated bonding formicroelectronics and MEMSpackaging2004

    • Author(s)
      M. M. R. Howlader, T. Suga
    • Journal Title

      ECS, Int. Semiconductor Technology Conf. 3rd.(ISTC2004) 15-17/9(Proceedings)

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Oxidation behavior of leadfree solder bumps and their bonding characteristics2004

    • Author(s)
      H.Oaawa, M.M.R.Howlader, M.Satou, H.Ozaki, T.Suga
    • Journal Title

      14th Micro Electronics Symposium(MES)of Japan, Institute for Electronics Packaging

      Pages: 129-132

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Oxidation behavior of leadfree solder bumps and their bonding characteristics2004

    • Author(s)
      H. Ozawa, M. M. R. Howlader, M. Satou, H. Ozaki, T. Suga
    • Journal Title

      14th Micro Electronics Symposium(MES) of Japan, Institute for Electronics Packaging

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Transmission electron microscopy investigation of tubular and capsular needlelikecrystals of C_<60> produced by the liquid-liquid interfacial precipitation method2004

    • Author(s)
      K.Miyazawa, T.Suga
    • Journal Title

      Journal of Materials Research 19(11)

      Pages: 3145-3148

    • Data Source
      KAKENHI-PROJECT-15651063
  • [Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004

    • Author(s)
      M.M.R.Howlader, H.Okada, T.H.Kim, T.Itoh, T.Suga
    • Journal Title

      Journal of Electrochemical Society 151

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] Surfaceactivated bonding for Sn-Ag and their oxidation mechanism2004

    • Author(s)
      Y.Wang, M.M.R.Howlader, N.Hosoda.K, Okamoto, T.Suga.M.
    • Journal Title

      The Electrochemical Society International Semiconductor Technology Conference

    • Data Source
      KAKENHI-PROJECT-16201028
  • [Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature

    • Author(s)
      M. M. R. Howlader, T. Suga
    • Journal Title

      Int. Conf. on Electronics Packaging(ICEP2006), Proceedings. Aor 2006

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-16201028
  • [Patent] 接合装置、接合方法、半導体デバイスおよびMEMSデバイス2012

    • Inventor(s)
      須賀・山内
    • Industrial Property Rights Holder
      須賀・ボンドテック
    • Industrial Property Number
      2012-004710
    • Filing Date
      2012-01-13
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Patent] フラーレン細線とその集合体2007

    • Inventor(s)
      宮澤 薫一、藤野 真、須賀 唯知
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Industrial Property Number
      2007-228737
    • Filing Date
      2007-09-04
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 特許権2007

    • Inventor(s)
      宮澤薫一,藤野真久,須賀唯知
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Industrial Property Number
      2007-228737
    • Filing Date
      2007-09-04
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 特許権2006

    • Inventor(s)
      宮澤薫一,森利之,西村睦,須賀唯知
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Filing Date
      2006-04-03
    • Description
      「研究成果報告書概要(和文)」より
    • Overseas
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 物質担持フラーレンチューブとその製造方法2006

    • Inventor(s)
      宮澤 薫一, 湊 淳一, 須賀 唯知
    • Industrial Property Rights Holder
      物質・材料研究機構
    • Industrial Property Number
      2006-041634
    • Filing Date
      2006-02-17
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 特許権2006

    • Inventor(s)
      宮澤薫一、湊淳一、須賀唯知
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Industrial Property Number
      2006-041634
    • Filing Date
      2006-02-17
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] C60フラーレンチユーブとその製造方法2005

    • Inventor(s)
      湊 淳一, 宮澤 薫一, 須賀 唯知
    • Industrial Property Rights Holder
      物質・材料研究機構
    • Industrial Property Number
      2005-184723
    • Filing Date
      2005-06-24
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] フラーレンチューブの処理方法2005

    • Inventor(s)
      宮澤 薫一, 須賀 唯知, 湊 淳一, 藤野 真久, 吉井 哲朗
    • Industrial Property Rights Holder
      物質・材料研究機構
    • Industrial Property Number
      2005-261321
    • Filing Date
      2005-09-08
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 特許権2005

    • Inventor(s)
      湊 淳一、宮澤薫一、須賀唯知
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Industrial Property Number
      2005-184723
    • Filing Date
      2005-06-24
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Patent] 特許権2005

    • Inventor(s)
      宮澤薫一,須賀唯知,湊淳一,藤野真久,吉井哲朗
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構
    • Industrial Property Number
      2005-261321
    • Filing Date
      2005-09-08
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] 銅のギ酸還元反応に関する研究2016

    • Author(s)
      藤野真久、松岡直也、赤池正剛、佐藤健太、須賀唯知
    • Organizer
      エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京工業大学(東京都目黒区)
    • Year and Date
      2016-03-22
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding2015

    • Author(s)
      N. Matsuoka, M. Fujino, M. Akaike, and T. Suga
    • Organizer
      ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
    • Place of Presentation
      Taipei(台湾)
    • Year and Date
      2015-10-21
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] 水素ラジカル処理したSnAgCuはんだのフラックスレス低温固相接合技術2014

    • Author(s)
      川合紘夢、日暮栄治、須賀唯知、岡田咲枝、萩原泰三
    • Organizer
      第28回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      拓殖大学  文京キャンパス 東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 低温接合技術で作製したワイヤグリッド偏光子集積型偏光センサ2014

    • Author(s)
      池田颯、日暮栄治、須賀唯知、小口寿明
    • Organizer
      第28回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      拓殖大学  文京キャンパス 東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Miniaturized polarization sensors integrated with wire-grid polarizers2014

    • Author(s)
      So Ikeda, Eiji Higurashi, Tadatomo Suga, Toshiaki Oguchi
    • Organizer
      2014 International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      富山国際会場 富山
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 大気圧プラズマによる表面活性化を用いたAu-Au常温接合2014

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Organizer
      2014年度精密工学春季大会学術講演会
    • Place of Presentation
      東京大学本郷キャンパス 東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 高分子材料における生体適合性向上を目的としたドライプロセスの効果の比較検討2014

    • Author(s)
      中本茉里,藤野真久,須賀唯知
    • Organizer
      エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      拓殖大学(文京キャンパス) 東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 生体適合性向上を目的とした高分子材料表面へのイオンビームおよびプラズマ照射 の比較検討2014

    • Author(s)
      中本茉里,藤野真久,須賀唯知
    • Organizer
      精密工学会春季大会
    • Place of Presentation
      東京大学(本郷キャンパス) 東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 表面活性化接合法における垂直配向カーボンナノチューブと金属薄膜の接触抵抗に 関する考察2013

    • Author(s)
      Masahisa Fujino, Hidenori Terasaka, Tadatomo Suga, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, and Taisuke Iwai
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] abrication and evaluation of vertically aligned carbon nanotubes for vias for flexible substrates2013

    • Author(s)
      Hidenori Terasaka, Masahisa Fujino, Tadatomo Suga, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, and Taisuke Iwai
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Direct Bonding of PEN at Room Temperature by Means of Surface Activated Bonding method using Nano-adhesion Layer2013

    • Author(s)
      Takashi Matsumae, Masahisa Fujino, and Tadatomo Suga
    • Organizer
      International Conference of Science Japan 2013 (ICSJ 2013)
    • Place of Presentation
      京都大学 京都
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Surface Activated Bonding of Laser Diode Chips Using N2 Atmospheric-Pressure Plasma2013

    • Author(s)
      Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
    • Organizer
      International Conference on Electronics Packaging (ICEP 2013)
    • Place of Presentation
      大阪国際会議場 大阪
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] ワイヤグリッド偏光子を集積した小型偏光センサ2013

    • Author(s)
      山本道貴、日暮栄治、北島和典、須賀唯知、小口寿明
    • Organizer
      第23回マイクロエレクトロニクスシンポジウム(MES 2013)
    • Place of Presentation
      大阪大学 吹田キャンパス、 大阪
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] N2大気圧プラズマによる表面活性化を用いた光素子の低温接合2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Organizer
      2013年度精密工学春季大会学術講演会
    • Place of Presentation
      東京工業大学 東京都
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Room Temperature Bonding of Polymer/Polymer and Polymer/Glass using modified Surface Activated Bonding Method2013

    • Author(s)
      Takashi Matsumae, Masahisa Fujino, Akitsu Shigetou, Yoshiie Matsumoto, and Tadatomo Suga.
    • Organizer
      International Conference on Electronics Packaging 2013 (ICEP 2013)
    • Place of Presentation
      大阪国際会議場 大阪
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] GaAs/SiC常温直接ウェハ接合を用いた高出力レーザの高放熱構造に関する研究2013

    • Author(s)
      中筋香織、日暮栄治、須賀唯知
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学 川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Fe ナノ密着層の 接合機構に関する研究2013

    • Author(s)
      Yuki Mizuno, Masahisa Fujino, and Tadatomo Suga
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 大気圧プラズマを用いた低温固相接合による偏光検出器の開発2013

    • Author(s)
      日暮栄治、北島和典、山本道貴、須賀唯知、小口寿明
    • Organizer
      2013年度精密工学秋季大会学術講演会
    • Place of Presentation
      関西大学千里山キャンパス 大阪
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Takashi Matsumae, Masahisa Fujino, Akitsu Shigetou, Yoshiie Matsumoto, and Tadatomo Suga2013

    • Author(s)
      Takashi Matsumae, Masahisa Fujino, Akitsu Shigetou, Yoshiie Matsumoto, and Tadatomo Suga
    • Organizer
      WaferBond'13
    • Place of Presentation
      Shockholm, Sweden
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers2013

    • Author(s)
      Eiji Higurashi, Kaori Nakasuji, and Tadatomo Suga
    • Organizer
      International Conference on Electronics Packaging (ICEP 2013)
    • Place of Presentation
      大阪国際会議場 大阪
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 窒素大気圧プラズで活性化したAuバンプによる半導体レーザ素子の低温接合2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Organizer
      第5回「集積化MEMSシンポジウム」(応用物理学会集積化MEMS技術研究会主催)
    • Place of Presentation
      仙台国際センター 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] ナノ構造を持つめっき表面の低温接合2013

    • Author(s)
      Yasutaka Eida, Wenjing Zhang, Masahisa Fujino, Yinghui Wang, Ming Li, and Tadatomo Suga
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 大気圧プラズマで活性化したAuスタッドバンプによる半導体光素子の低温接合と光マイクロセンサ応用2013

    • Author(s)
      山本道貴、日暮栄治、須賀唯知、澤田廉士
    • Organizer
      19回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム (Mate 2013)
    • Place of Presentation
      パシフィコ横浜 神奈川県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Alスパッタ中間層をもちいた表面活性化手法によるポリマー常温接合2013

    • Author(s)
      松前貴司,藤野真久,須賀唯知
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学川内北キャンパス 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low-temperature solid-state solder bonding process using hydrogen radicals for MEMS packaging application2013

    • Author(s)
      Hiromu Kawai, Eiji Higurashi, and Tadatomo Suga
    • Organizer
      The 4th Japan-China-Korea Joint Conference on MEMS/NEMS (JCK MEMS/NEMS 2013)
    • Place of Presentation
      東北大学 宮城県
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 垂直配向カーボンナノチューブの圧縮における挙動と摩擦の関係2012

    • Author(s)
      寺坂英矩, 藤野真久, 須賀唯知, 曽我育夫, 近藤大雄, 石月義克, 岩井大介
    • Organizer
      第26回エレクトロニクス実装学術講演会
    • Place of Presentation
      東京・中央大学後楽園キャンパス
    • Year and Date
      2012-03-07
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Direct Bonding of Polymer to Glass Wafers using Surface Activated Bonding (SAB) Method at Room Temperature2012

    • Author(s)
      Tadatomo Suga, Takashi Matsumae, Yoshiie Matsumoto and Masashi Nakano.
    • Organizer
      2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京大学農学部、東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 大気圧プラズマで活性化したAuスタッドバンプによる半導体レーザ素子の低温接合2012

    • Author(s)
      山本道貴,佐藤丈史,日暮栄治,須賀唯知,澤田廉士
    • Organizer
      2012年度精密工学秋季大会学術講演会
    • Place of Presentation
      九州工業大学 北九州市
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 表面活性化接合のためのパワースペクトル密度関数を用いた表面形状評価と接合性の関係2012

    • Author(s)
      近村学、塚本圭、須賀唯知
    • Organizer
      第26回エレクトロニクス実装学会春季講演大会プログラム
    • Place of Presentation
      東京(中央大学)
    • Year and Date
      2012-03-07
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces2012

    • Author(s)
      Michitaka Yamamoto, Takeshi Sato, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
    • Organizer
      IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan
    • Place of Presentation
      都メッセ、 京都
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 表面活性化接合の現状と展望2012

    • Author(s)
      須賀唯知
    • Organizer
      日本溶射学会第94回(2011年度秋季)全国講演大会
    • Place of Presentation
      名古屋(招待講演)
    • Year and Date
      2012-11-14
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 大気圧Au-Au表面活性化接合を用いた光マイクロシステムの低温気密パッケージング2012

    • Author(s)
      山本真一、日暮栄治、須賀唯知、澤田廉士
    • Organizer
      第28回「センサ・マイクロマシンと応用システム」シンポジウム
    • Place of Presentation
      東京・タワーホール船堀
    • Year and Date
      2012-09-27
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low temperature Cu/Cu direct bonding using formic gas in-situ treatment2012

    • Author(s)
      Yang, Wenhua; Akaike, Masatake; Suga, Tadatomo
    • Organizer
      Low Temperature Bonding for 3D Integration (LTB-3D), 3rd IEEE International Workshop on
    • Place of Presentation
      東京大学農学部、東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low temperature bonding for 3D interconnects2012

    • Author(s)
      T.Suga, R.Kondou
    • Organizer
      IEEE International 3D System Integration Conference 2011-3DIC2011
    • Place of Presentation
      大阪
    • Year and Date
      2012-01-31
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Auスパッタ膜を介した表面活性化接合を用いた垂直配向カーボンナノチューブとAu薄膜の接合と転写2012

    • Author(s)
      藤野真久, 寺坂英矩, 須賀唯知, 曽我育夫, 近藤大雄, 石月義克, 岩井大介
    • Organizer
      第26回エレクトロニクス実装学術講演会
    • Place of Presentation
      東京・中央大学後楽園キャンパス
    • Year and Date
      2012-03-07
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Room Temperature Bonding of Polymer to Glass Wafers using Surface Activated Bonding (SAB) Method2012

    • Author(s)
      Takashi Matsumae, Masashi Nakano, Yoshiie Matsumoto, Ryuichi Kondo, and Tadatomo Suga.
    • Organizer
      Pacific Rim Meeting on Electrochemical and Solid-State Science 2012 (PRiME 2012)
    • Place of Presentation
      ホノルル ハワイ USA
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces2012

    • Author(s)
      Michitaka Yamamoto, Takeshi Sato, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
    • Organizer
      IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan
    • Place of Presentation
      都メッセ、京都
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Siナノ中間層を用いた表面活性化接合による室温でのInP-Si接合2012

    • Author(s)
      松前貴司、須賀唯知
    • Organizer
      第26回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京・中央大学後楽園キャンパス
    • Year and Date
      2012-03-07
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low temperature bonding for 3D integration―A review of the surface activated bonding (SAB)2012

    • Author(s)
      Suga, Tadatomo
    • Organizer
      Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
    • Place of Presentation
      東京大学農学部、東京
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Surface Activated Bonding As Nano-Packaging Technology2011

    • Author(s)
      T.Suga, M.Fujino, R.Kondoh
    • Organizer
      Proc.11th International Conference on Nanotechnology IEEE NANO 2011
    • Place of Presentation
      Portland, USA
    • Year and Date
      2011-08-16
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 表面活性化接合による異種基板の低温直接接合2011

    • Author(s)
      須賀唯知、近藤龍一
    • Organizer
      電磁情報通信学会2011ソサイエティ大会講演論文集
    • Place of Presentation
      札幌(北大)(招待講演)
    • Year and Date
      2011-09-15
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] A Novel Biocompatible Direct Bonding for Glass Microdevices2011

    • Author(s)
      Chenxi Wang, Yan Xu, Yiyang Dong, Kazuma Mawatari, Takehiko Kitamori, Tadatomo Suga
    • Organizer
      International Conference on Electronics Packaging 2011 (ICEP2011)
    • Place of Presentation
      奈良・奈良県新公会堂
    • Year and Date
      2011-04-13
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 低温接合による異種材料集積技術と光マイクロセンサへの応用2011

    • Author(s)
      日暮栄治、須賀唯知、澤田廉士
    • Organizer
      2011年電子情報通信学会エレクトロニクスソサイエティ大会
    • Place of Presentation
      北海道大学(北海道札幌市)
    • Year and Date
      2011-09-15
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Reduction of non-uniformity in stress distribution on the bonded interface caused by solid state bonding2011

    • Author(s)
      Keisuke Goto, Masahisa Fujino, Yinghni Wang, Tadatomo Suga
    • Organizer
      ECO-MATES 2011-International Symposium on Material Science-Eco-materials and Eco-innovation for Global Sustainability-
    • Place of Presentation
      大阪・ホテル阪急エキスポパーク
    • Year and Date
      2011-11-29
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Nanoprecison Aligned Wafer Bonding and Its Outlook2011

    • Author(s)
      Chenxi Wang, Tadatomo Suga
    • Organizer
      12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011)
    • Place of Presentation
      中国・上海
    • Year and Date
      2011-08-08
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] SURFACE ACTIVATED BONDING VIA NANO-ADHESION LAYER2011

    • Author(s)
      T.Suga, R.Kondou
    • Organizer
      The International Conference on Wafer Bonding WaferBond '11
    • Place of Presentation
      Chemnitz、Germany
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] A New Approach Towards Nano-packaging Technology2011

    • Author(s)
      Tadatomo Suga
    • Organizer
      Proc.2011 Int.Conf.on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011)
    • Place of Presentation
      上海、中国(招待講演)
    • Year and Date
      2011-08-09
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] 低温接合からみた環境対応技術2011

    • Author(s)
      須賀唯知
    • Organizer
      第21回マイクロエレクトロニクスシンポジウム(MES2011)
    • Place of Presentation
      大阪(関西大学)(招待講演)
    • Year and Date
      2011-09-08
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Low temperature Cu/Cu direct bonding using formic acid vapor treatment2011

    • Author(s)
      Wenhua Yang, M.Akaike, T.Suga
    • Organizer
      ECO-MATES 2011-International Symposium on Material Science-ECO-materials and Eco-innovation for Global Sustainability-
    • Place of Presentation
      大阪・ホテル阪急エキスポパーク
    • Year and Date
      2011-11-29
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Room temperature SiO2 wafer bonding by adhesion layer method2011

    • Author(s)
      Ryuichi Kondou, Tadatomo Suga
    • Organizer
      2011 IEEE 61st Electronic Components and Technology Conference ECTC
    • Place of Presentation
      アメリカ合衆国・フロリダ州
    • Year and Date
      2011-06-03
    • Data Source
      KAKENHI-PROJECT-23246125
  • [Presentation] Room-temperature synthesis and properties of fullerene nanowhiskers and fullerene nanotubes2006

    • Author(s)
      K. Miyazawa, J. Minato, R. Kato, K. Asaka, T. Kizuka, T. Mashino, S. Nakamura, M. Tachibana, T. Suga
    • Organizer
      The Papers of Technical Meeting on Physical Sensor, IEE Japan
    • Place of Presentation
      Tokyo University, Tokyo, Japan
    • Year and Date
      2006-05-15
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] フラーレンナノウィスカー・フラーレンナノチューブの常温合成と物性2006

    • Author(s)
      宮澤薫一,湊淳一,加藤良栄,安坂幸師,木塚徳志,増野匡彦,中村成夫,橘勝,須賀唯知
    • Organizer
      フィジカルセンサ研究会資料
    • Place of Presentation
      東京大学生産技術研究所
    • Year and Date
      2006-05-15
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Raman spectroscopy analysis of fullerene nanowhiskers and fullerene nanotubes2006

    • Author(s)
      K. Miyazawa, T. Mshino, S. Nakamura, T.Suga
    • Organizer
      Meeting of Physical society of Japan
    • Place of Presentation
      Ehime University & Matsuyama University
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] フラーレンナノチューブのTEM及びラマン分光解析2006

    • Author(s)
      宮澤薫一,須賀唯知
    • Organizer
      日本金属学会2006年春期(第138回)大会
    • Place of Presentation
      早稲田大学大久保キャンパス
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] TEM and Raman spectroscopy analyses of fullerene nanotubes2006

    • Author(s)
      K. Miyazawa, T.Suga
    • Place of Presentation
      Waseda University, Tokyo
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Raman spectroscopic analyses of fullerene nanotubes and nanowhiskers2006

    • Author(s)
      K.Miyazawa,T.Mashino,S.Nakamura,M.Tachibana,K.Nakamura,T.Suga
    • Organizer
      7th International Conference on The Science and Application of Nanotubes
    • Place of Presentation
      Nagano,Japan
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Raman spectroscopic analyses of fullerene nanotubes and nanowhiskers2006

    • Author(s)
      K. Miyazawa, T. Mashino, S.Nakamura, M.Tachibana, K. Nakamura, T. Suga
    • Organizer
      7th International Conference on The Science and Application of Nanotubes
    • Place of Presentation
      Nagano, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] フラーレンナノウィスカー・ナノチューブのラマン分析2006

    • Author(s)
      宮澤薫一,増野匡彦,中村成夫,須賀唯知
    • Organizer
      日本物理学会
    • Place of Presentation
      愛媛大学・松山大学
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Structure of room-temperature synthesized fullerene nanotubes2005

    • Author(s)
      K. Miyazawa, J. Minato, T. Yoshii, T. Suga
    • Organizer
      The61st The Japanese Society of Microscopy, Tsukuba International Congress Center
    • Place of Presentation
      Tsukuba, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Characterization of the Liquid-Phase Synthesized Fullerene Nanotubes and Nanowhiskers2005

    • Author(s)
      K. Miyazawa, J. Minato, T. Mashino, T. Yoshii, T. Kizuka, R. Kato, M. Tachibana and T. Suga
    • Organizer
      M&P2005
    • Place of Presentation
      Seattle, Washington, USA
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] 常温液相合成したフラーレンナノチューブの構造2005

    • Author(s)
      宮澤薫一,湊淳一,吉井哲朗,須賀唯知
    • Organizer
      日本顕微鏡学会第61回学術講演会
    • Place of Presentation
      つくば国際会議場(エポカルつくば)
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Structural investigation of heat-treated fullerene nanotubes and nanowhiskers2005

    • Author(s)
      K. Miyazawa, J. Minato, M. Fujino, T.Suga
    • Organizer
      DIAMOND 2005
    • Place of Presentation
      Toulouse, France
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] C_<60>誘導体を添加したC_<60>ナノウィスカーの構造2005

    • Author(s)
      宮澤薫一,増野匡彦,中村成夫,須賀唯知
    • Organizer
      日本金属学会2005年秋期(第137回)大会
    • Place of Presentation
      広島大学東広島キャンパス
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Preparation and characterization of short fullerene nanowhiskers2005

    • Author(s)
      K.Miyazawa and T.Suga
    • Organizer
      The 10th International Conference on New Diamond Science and Technology
    • Place of Presentation
      AIST,Tsukuba,Japan
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] 常温合成したフラーレンナノチューブ・ナノウィスカーの構造2005

    • Author(s)
      宮澤薫一,湊淳一,藤野真久,須賀唯知
    • Organizer
      日本金属学会2005年秋期(第137回)大会
    • Place of Presentation
      広島大学東広島キャンパス
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Preparation and characterization of short fullerene nanowhiskers2005

    • Author(s)
      K. Miyazawa, J. Minato, T.Suga
    • Organizer
      4th International conference on Materials processing for Properties and Performance(MP3-IV)
    • Place of Presentation
      Tsukuba, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Structural investigation of heat-treated fullerene nanotubes and nanowhiskers2005

    • Author(s)
      K.Miyazawa,J.Minato,M.Fujino and T.Suga
    • Organizer
      DIAMOND 2005
    • Place of Presentation
      Toulouse,France
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Structure of room-temperature synthesized fullerene nanowhiskers and fullerene nanotubes2005

    • Author(s)
      K. Miyazawa, J. Minato, M. Fujino, T.Suga
    • Organizer
      Autumn meeting of the Japan Institute of Metals
    • Place of Presentation
      Hiroshima University, Hiroshima, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] 常温合成したフラーレンナノチューブの構造と物質の内包2005

    • Author(s)
      宮澤薫一,湊淳一,須賀唯知
    • Organizer
      日本物理学会2005年秋季大会
    • Place of Presentation
      同志社大学京田辺キャンパス
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Characterization of the Liquid-Phase Synthesized Fullerene Nanotubes and Nanowhiskers2005

    • Author(s)
      K.Miyazawa,J.Minato,T.Mashino,T.Yoshii,T.Kizuka,R.Kato,M.Tachibana and T.Suga
    • Organizer
      M&P2005
    • Place of Presentation
      Seattle,Washington,USA
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Preparation and characterization of short fullerene nanowhiskers2005

    • Author(s)
      K. Miyazawa and T. Suga
    • Organizer
      The 10th International Conference on New Diamond Science and Technology
    • Place of Presentation
      AIST, Tsukuba, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Preparation and characterization of short fullerene nanowhiskers2005

    • Author(s)
      K.Miyazawa,J.Minato and T.Suga
    • Organizer
      4th International Conference on Materials Processing for Properties and Performance(MP^3-IV)
    • Place of Presentation
      Tsukuba,Japan
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature

    • Author(s)
      T. Suga
    • Organizer
      Thirteenth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
    • Place of Presentation
      Cancun, Mexico
    • Year and Date
      2014-10-05 – 2014-10-10
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct and Hybrid Bonding at Low Temperature

    • Author(s)
      Tadatomo Suga, Masakate Akaike, Wenhua Yang
    • Organizer
      The 64th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] 白金触媒を用いたギ酸処理による銅の直接接合のプロセスパラメータ

    • Author(s)
      松岡直弥, 赤池正剛, 須賀唯知
    • Organizer
      第29回 エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学、東京都
    • Year and Date
      2015-03-16 – 2015-03-18
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] Structure of C_<60> nanowhiskers added with fullerene derivatives

    • Author(s)
      K. Miyazawa, T. Mashino, S. Nakamura, T. Suga
    • Organizer
      Autumn meeting of the Japan Institute of Metals
    • Place of Presentation
      Hiroshima University, Hiroshima, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Structure and material's incorporation of room-temperature synthesized fullerene nanotubes

    • Author(s)
      K. Miyazawa, J. Minato, T. Suga
    • Organizer
      Autumn meeting of the Physical Society of Japan
    • Place of Presentation
      Doshisha University, Kyotanabe, Japan
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-17201027
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature

    • Author(s)
      Tadatomo Suga, Masakate Akaike, Naoya Matsuoka
    • Organizer
      International Conferenceon Electronics Packaging (ICEP2014)
    • Place of Presentation
      富山国際会議場、富山県
    • Year and Date
      2014-04-23 – 2014-04-25
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] Plasma Assisted Bonding of Bulk Copper and Silver Substrates

    • Author(s)
      Masahisa Fujino, Kentaro Abe, Tadatomo Suga
    • Organizer
      International Conferenceon Electronics Packaging  (ICEP2014)
    • Place of Presentation
      富山国際会議場、富山県
    • Year and Date
      2014-04-23 – 2014-04-25
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] ボイドフリー親水化接合のための拡張表面活性化接合プロセス

    • Author(s)
      Ran He, Masahisa Fujino, Akira Yamauch, Tadatomo Suga
    • Organizer
      第24回マイクロエレクトロニクスシンポジウム
    • Place of Presentation
      大阪大学、大阪府
    • Year and Date
      2014-09-04 – 2014-09-05
    • Data Source
      KAKENHI-PROJECT-26289247
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