IKEDA Toru 池田徹

Researcher Number	40243894
Other IDs
External Links
Affiliation (Current)	2025: 鹿児島大学, 理工学域工学系, 教授
Affiliation (based on the past Project Information) *help	2015 – 2019: 鹿児島大学, 理工学域工学系, 教授 2012 – 2014: 鹿児島大学, 理工学研究科, 教授 2011: 京都大学, 工学(系)研究科(研究院), 准教授 2011: 京都大学, 工学研究科, 准教授 2009: 京都大学, 大学院・工学研究科, 准教授 … More 2007 – 2009: Kyoto University, School of Engineering, Associate Professor 2004 – 2006: 京都大学, 工学研究科, 助教授 2000 – 2003: 九州大学, 大学院・工学研究院, 助教授 1999: 九州大学, 大学院・工学研究科, 助教授 1996 – 1997: 九州大学, 工学部, 助教授 1992 – 1995: 九州大学, 工学部, 助手 Less
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials / Materials/Mechanics of materials Except Principal Investigator Materials/Mechanics of materials / Materials/Mechanics of materials / 材料力学
Keywords	Principal Investigator 応力拡大係数 / 界面 / 破壊力学 / Electronic Packaging / Interface / 接合 / 電子実装 / Stress Intensity Factor / エレクトロニクス実装 / 異方性 … More / 分子静力学 / はく離 / ミスフィット転位 / き裂 / 破壊 / 分子シミュレーション / ナノ材料 / 超薄膜 / 界面応力 / エピタキシャル成長薄膜 / 双晶 / 異方性弾性論 / 分子動力学 / ミスフット転位 / 限界薄膜厚さ / ひずみシリコン / 異方性異種材界面角部 / 特異応力場 / Digital Image Correlation Method / H-integral / Interfacial Corner / Anisotropic / Microstructure / 微小構造物 / デジタル相関法 / H積分 / 接合角部 / マイクロ構造物 / Delamination / Conductive Resin / Anisotropic Conductive Film / Relfow Sensitivity Test / 加速試験 / チップサイズパッケージ / 残留応力 / 破壊力 / 接着剤 / 吸湿 / 信頼性評価 / 電子デバイス / 信頼性設計 / 異種材界面 / 導電樹脂 / 異方性導電樹脂 / はんだリフロー / Virtual Crack Extension Method / Anisotropy / Thermal Stress / Crack / Fracture Mechanics / 有限要素法 / 異種材 / 界面き裂 / 仮想き裂進展法 / 熱応力 / 固有値解析 / ナノスケール界面 / 破壊靭性値 / パワーデバイス / ナノ薄膜 / 信頼性 / パワーモジュール / 移動度 / デバイスシミュレーション / 電子移動度 / シリコン / pMOSFET / nMOSFET / 電気特性変動 / トランジスタ / 応力 / 半導体 / ひずみ効果 / 評価 / 物性 / プロセス / 材料設計 / 損傷 / 接着 … More Except Principal Investigator 有限要素法 / 転位密度 / 熱応力 / Finite Element Method / CZ法 / Crystal Anisotropy / Dislocation Density / Single Crystal Growth / 結晶異方性 / 単結晶育成 / 半導体 / HAASEN-SUMINO MODEL / FINITE ELEMENT METHOD / THERMAL STRESS / DISLOCATION DENSITY / CZOCHRALSKI METHOD / Haasen-Suminoモデル / 単結晶 / Cracking / Thermal Stress / 割れ / 分子動力学法 / 分子動力学 / Haasen-Alexander-Sumino Model / Manufacturing Devices / Ingot Annealing / Single Crystal / HASモデル / Haasen-Alexander-Suminoモデル / デバイス作成 / インゴットアニール / Oxide / Semiconductor / 可視化 / 転位密度評価 / 熱応力解析 / 伝熱解析 / 転位 / 機能性単結晶 / 酸化物 / CRITICAL RESOLVED SHEAR STRESS / MOLECULAR DYNAMICS METHOD / SILICON SINGLE CRYSTAL / 物性値 / シリコン / 臨界分解せん断応力 / シリコン単結晶 / QUALITY OF CRYSTAL / SINGLE CRYSTAL / OPTICAL DEVICES / ELECTRONIC / 結晶品質 / 光学デバイス / 電子 / Anisotropy / Elastic constants / Thermal Expansion Coefficient / Czochralski Growth / Oxide Single Crystal / 異片性 / 異方性 / 弾性係数 / 線膨張係数 / チョクラルスキー法 / 酸化物単結晶 / デバイス設計・製造プロセス / 機械材料・材料力学 / 実験力学 / エレクトロニクス実装 / 電子デバイス・機器 / デジタル画像相関法 / 異方性異種材き裂 / 破壊力学 / ひずみ計測 / 先端デバイス / はく離強度 / 陽極接合 / MEMS / 応力拡大係数 / 異種材界面き裂 / 異方性弾性論 Less

Experimental and numerical studies of interfacial stress between dissimilar materials in a nano-scale areaPrincipal Investigator
- Principal Investigator
  
  Ikeda Toru
- Project Period (FY)
  2017 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kagoshima University
Strength evaluation of an interfacial corner of jointed dissimilar materials considering the multi-scale effectPrincipal Investigator
- Principal Investigator
  
  Ikeda Toru
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kagoshima University
Nano-mechanical investigation of the effects of mechanical strain on semiconductor devicesPrincipal Investigator
- Principal Investigator
  
  IKEDA Toru
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kagoshima University
  Kyoto University
A new method of nondestructive strain measurement for electronic packages using x-ray images
- Principal Investigator
  
  KOGANEMARU Masaaki
- Project Period (FY)
  2009 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Fukuoka Industrial Technology Center
Analytical and Experimental Study on the Mechanical Strength Evaluation of Advanced Devices
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  2006 – 2009
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyoto University
Evaluation technigue of bonding strength for microstructures and anisotropic materialsPrincipal Investigator
- Principal Investigator
  
  IKEDA Toru
- Project Period (FY)
  2005 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyoto University
異方性異種材料接合界面の信頼性評価のためのマルチスケール手法の開発
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyoto University
Development of Integrated Analysis System for manufacturing high quality devices
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  2003 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyoto University
  Kyushu University
Reliability Design of Conductive Adhesive Connection in Electronic PackagesPrincipal Investigator
- Principal Investigator
  
  IKEDA Toru
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyushu University
Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal StressPrincipal Investigator
- Principal Investigator
  
  IKEDA Toru
- Project Period (FY)
  2000 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyushu University
Development of Virtual Experiment System for Growth Process of Functional Crystals
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  1999 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyushu University
接着構造物中のき裂の破壊靭性値におよぼす被着材の拘束効果の研究Principal Investigator
- Principal Investigator
  
  池田徹
- Project Period (FY)
  1996
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Kyushu University
THERMAL STRESS ESTIMATION FOR LARGE DIAMETER SILICON SINGLE CRYSTAL USING MATERIAL PROPERTIES OBTAINED FROM MOLECULAR DYNAMICS METHOD
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  1996 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  KYUSHU UNIVERSITY
MATERIAL STRENGTH STUDY ON GROWTH OF HIGH QUALITY BULK SINGLE CRYSTALS FOR ELECTRONIC/OPTICAL DEVICES
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  1994 – 1995
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  KYUSHU UNIVERSITY
Material strength study on cracking of oxide bulk single crystals for optelectronic use
- Principal Investigator
  
  MIYAZAKI Noriyuki
- Project Period (FY)
  1992 – 1993
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  材料力学
- Research Institution
  KYUSHU UNIVERSITY

[Book] 電子材料・実装技術における熱応力の解析・制御とトラブル対策2005
- Author(s)
  池田徹(分担執筆)
- Total Pages
  449
- Publisher
  技術情報協会
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] パワーデバイス用高耐熱樹脂の低サイクル疲労強度評価2020
- Author(s)
  池田　徹，長尾　元気，小金丸　正明，畑尾　卓也，加々良　剛志
- Journal Title
  
  日本機械学会　RC278研究分科会　研究報告書
  
  Volume: - Pages: 191-212
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] 印刷有機薄膜トランジスタの電気特性における機械的応力効果2020
- Author(s)
  小金丸　正明，中城　朋也，池田　徹，宍戸　信之，関根　智仁，神谷　庄司
- Journal Title
  
  日本機械学会　RC278研究分科会　研究報告書
  
  Volume: - Pages: 329-340
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] 熱応力下にある三次元異種材接合角部の応力拡大係数解析2020
- Author(s)
  池田　徹，木之瀬　優孝，古賀　裕二，鐙　優太，小金丸　正明
- Journal Title
  
  日本機械学会　RC278研究分科会　研究報告書
  
  Volume: - Pages: 261-286
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] SOI-MOSデバイスの電気特性における機械的応力効果2020
- Author(s)
  小金丸　正明，日高　和也，塩塚　航生，池田　徹，松本　聡，宮崎　則幸
- Journal Title
  
  日本機械学会　RC278研究分科会　研究報告書
  
  Volume: - Pages: 319-328
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method2019
- Author(s)
  小金丸　正明，長戸　翔，内野　正和，池田　徹
- Journal Title
  
  Journal of The Japan Institute of Electronics Packaging
  
  Volume: 22 Issue: 1 Pages: 95-102
- DOI
  10.5104/jiep.22.95
- NAID
  130007542198
- ISSN
  1343-9677, 1884-121X
- Year and Date
  2019-01-01
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] Fatigue crack propagation rate of CFRP/aluminum adhesively bonded DCB joints with acrylic and epoxy adhesives2018
- Author(s)
  Makoto Imanaka, Kiyoshi Ishii, Keisuke Hara, Toru Ikeda and Yosuke Kouno
- Journal Title
  
  International Journal of Adhesion and Adhesives
  
  Volume: 85 Pages: 149-156
- DOI
  10.1016/j.ijadhadh.2018.06.003
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle Test2018
- Author(s)
  川下隼介，七藏司優斗，池田徹，小金丸正明，外薗洋昭，浅井竜彦
- Journal Title
  
  Journal of Smart Processing
  
  Volume: 7 Issue: 4 Pages: 146-153
- DOI
  10.7791/jspmee.7.146
- NAID
  130007604980
- ISSN
  2186-702X, 2187-1337
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17K06059
[Journal Article] Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials under several boundary conditions on the corner surfaces2017
- Author(s)
  Mitsutoshi Abe, Toru Ikeda, Masaaki Koganemaru, Noriyuki Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics
  
  Volume: 171 Pages: 860-864
- DOI
  10.1016/j.engfracmech.2016.12.009
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420022
[Journal Article] Development of the singular stress analyses for three-dimensional interfacial corners2017
- Author(s)
  古賀裕二，田口陽介，小金丸正明，池田徹，宮崎則幸
- Journal Title
  
  Transactions of the JSME (in Japanese)
  
  Volume: 83 Issue: 845 Pages: 16-00382-16-00382
- DOI
  10.1299/transjsme.16-00382
- NAID
  130005303919
- ISSN
  2187-9761
- Language
  Japanese
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-26420022
[Journal Article] Warpage hysteresis estimation of an electronic package during a thermal cycle2015
- Author(s)
  Toru Ikeda, Akiko Ozaki, Takuya Hatao and Noriyuki Miyazaki
- Journal Title
  
  InterPACK/ICNMM2015-48168
  
  Volume: 1 Pages: 1-8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420022
[Journal Article] Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History2015
- Author(s)
  尾崎秋子，池田徹，河原真哉，宮崎則幸，畑尾卓也，中井戸宙，小金丸正明
- Journal Title
  
  Journal of The Japan Institute of Electronics Packaging
  
  Volume: 18 Issue: 7 Pages: 486-494
- DOI
  10.5104/jiep.18.486
- NAID
  130005122233
- ISSN
  1343-9677, 1884-121X
- Language
  Japanese
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420022
[Journal Article] Examination of Residual Stress Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method and X-Ray Images2014
- Author(s)
  Masaaki Koganemaru, Masakazu Uchino, Akihiro Ikeda, and Tanemasa Asano
- Journal Title
  
  Electronics System-Integration Technology Conference (ESTC), 2014
  
  Pages: 1-5
- DOI
  10.1109/estc.2014.6962827
- Data Source
  KAKENHI-PROJECT-21560109
[Journal Article] Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM2013
- Author(s)
  Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki
- Journal Title
  
  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
  
  Volume: Proceedings
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Hygromechanical analysis of liquid crystal display panels, Journal of Electronic Packaging2013
- Author(s)
  Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
- Journal Title
  
  Journal of Electronic Packaging, Trans. ASME
  
  Volume: Vol. 135, No. 4 Pages: 41005-41005
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善2013
- Author(s)
  岡大智，池田徹，宮崎則幸，田中宏之，畑尾卓也，松本圭司，小原さゆり，折井靖光，山田文明，嘉田守宏
- Journal Title
  
  電子情報通信学会論文誌
  
  Volume: Vol. J96-C，No.11 Pages: 352-360
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善2013
- Author(s)
  岡大智, 池田徹, 宮崎則幸, 田中宏之, 畑尾卓也, 松本圭司, 小原さゆり, 折井靖光, 山田文明, 嘉田守宏
- Journal Title
  
  電子情報通信学会論文誌
  
  Volume: Vol.J96-C, No.11 Pages: 352-360
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] 樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法2013
- Author(s)
  松田和敏, 池田徹, 小金丸　正明，宮崎則幸
- Journal Title
  
  日本機械学会論文集 (A編)
  
  Volume: 第79巻, 第797号 Pages: 74-88
- NAID
  130003374587
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013
- Author(s)
  Toru IKEDA, Masatoshi OKA, Noriyuki MIYAZAKI, Kenji MATSUMOTO, Sayuri KOHARA, Yasumitsu ORII, Fumiaki YAMADA and Morihiro KADA
- Journal Title
  
  Proceedings of 13th International Symposium on Electronics Packaging (ICEP 2013)
  
  Volume: Proceedings Pages: 22-25
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] 樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法2013
- Author(s)
  松田和敏, 池田徹, 小金丸正明, 宮崎則幸
- Journal Title
  
  日本機械学会論文集(A編)
  
  Volume: 第79巻,第797号 Pages: 74-88
- NAID
  130003374587
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density2013
- Author(s)
  Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
- Journal Title
  
  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
  
  Volume: Proceedings
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFET の電気特性変動評価手法2012
- Author(s)
  小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
- Journal Title
  
  エレクトロニクス実装学会誌
  
  Volume: 第15巻, 第6号 Pages: 483-491
- NAID
  10030878367
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFETの電気特性変動評価手法2012
- Author(s)
  小金丸正明，吉田圭佑，多田直弘，池田徹，宮崎則幸，友景肇
- Journal Title
  
  エレクトロニクス実装学会誌
  
  Volume: Vol. 15, No. 6 Pages: 483-491
- NAID
  10030878367
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] 機械学会における電子実装の信頼性と熱制御に関する研究分科会活動について2012
- Author(s)
  池田徹
- Journal Title
  
  エレクトニクス実装学会誌
  
  Volume: 第15巻第5号 Pages: 323-326
- NAID
  10030506718
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors2011
- Author(s)
  Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, u IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Journal Title
  
  Proceedings of The ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS (InterPACK 2011)
  
  Volume: IPACK2011-52150 Pages: 1-8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Strain Measurement in Micro-electronic Packages Using Digital Image Correlation Method2011
- Author(s)
  Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao
- Journal Title
  
  Welding International
  
  Volume: Vol.25,No.11 Pages: 844-850
- NAID
  10026555765
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stess on n-Type Silicon Semiconductor2011
- Author(s)
  Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Journal Title
  
  IEEE Transactions on Electron Devices
  
  Volume: Vol.58,No.8 Pages: 2525-2536
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stress on n-Type Silicon Semiconductor Devices2011
- Author(s)
  Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Journal Title
  
  IEEE Trans. on Electron Devices
  
  Volume: Vol. 58, No.8 Pages: 2525-2536
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23656083
[Journal Article] 固体状ゴム粒子変成エポキシ樹脂接着剤層中のき裂の破壊靱性値とき裂先端ひずみ分布に対する接着剤層厚さの影響2009
- Author(s)
  上田真広, 宍戸信之, 池田徹, 宮崎則幸
- Journal Title
  
  日本機械学会論文集(A編) 75巻
  
  Pages: 1516-1525
- NAID
  110007482701
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] ドリフト拡散デバイスシミュレーションを用いた実装応力に起因するnMOSFETのDC特性変動評価2009
- Author(s)
  小金丸正明, 池田徹, 宮崎則幸, 友景肇
- Journal Title
  
  エレクトロニクス実装学会誌 12巻
  
  Pages: 208-220
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Stress Intensity Factor Analysis at on Interfacial Corner between Anisotropic Bimaterials under Thermal Stress2009
- Author(s)
  Y. Nomura, T. Ikeda, N. Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics Vol.76,No.2
  
  Pages: 221-233
- NAID
  120001750033
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Strain Measurment in a Microstructure Using Digital Image Correlation for a Laser-Sccnning Microscopic Image2008
- Author(s)
  N. Shishido, T. Ikeda, N. Miyazaki
- Journal Title
  
  CMES-Computer Modeling in Engineering & Sciences Vol.35,No.1
  
  Pages: 1-19
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Residual Stress Evaluation in Resin-Molded IC Chips Using Finite Element Analysis and Piezoresistive Gauges2008
- Author(s)
  M. KOGANEMARU, T. IKEDA, N. MIYAZAKI,
- Journal Title
  
  Microelectronic Reliability Vol.48, No.6
  
  Pages: 923-932
- NAID
  120001750034
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Residual Stress Evaluation in Resin-Molded IC Chips Using Finite Element Analysis and Piezoresistive Gauges2008
- Author(s)
  M. Koganematu, T. Ikeda, N. Miyazaki
- Journal Title
  
  Microelectronic Reliability 48
  
  Pages: 923-932
- NAID
  120001750034
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Strain Measurment in a Microstructure Using Digital Image Correlation for a Laser-Scanning Microscopic Image2008
- Author(s)
  N. SHISHIDO, T. IKEDA, N. MIYAZAKI
- Journal Title
  
  CMES (Computer Modeling in Engineering & Sciences) Vol.35, No.1
  
  Pages: 1-19
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] デジタル画像相関法を用いた電子実装部の熱ひずみ分布計測2008
- Author(s)
  宍戸信之, 池田徹, 宮崎則幸, 中村健太郎, 宮崎政志, 猿渡達郎
- Journal Title
  
  材料 57
  
  Pages: 83-89
- NAID
  130002085782
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Residual Stress Evaluation in Resin-Molded IC Chips Using Finite Element Analysis and Piezoresistive Gauges2008
- Author(s)
  M. Kogonemaru, T. Ikeda, N. Miyazaki
- Journal Title
  
  Microelectronic Reliability Vol.48,No.6
  
  Pages: 923-932
- NAID
  120001750034
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Full-field Displacement Measurement Using Digital Image Correlation Method for a Laser Scanning Microscopic Image2008
- Author(s)
  N. Shishido, T. Ikeda, N. Miyazaki
- Journal Title
  
  Computer Modeling in Engineering & Sciences 35
  
  Pages: 1-19
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] 熱応力下の異方性異種材界面接合端部の特異応力場解析2008
- Author(s)
  野村吉昭, 池田徹, 宮崎則幸
- Journal Title
  
  日本機械学会論文集(A編) 74-237
  
  Pages: 37-44
- NAID
  110006571942
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method2008
- Author(s)
  Nobuyuki, Shishido, Toru, Ikeda, Noriyuki, Miyazaki, Kentaro, Nakamura, Masashi, Miyazaki, Tatsuro, Sawatari
- Journal Title
  
  Journal of the Society of Materials Science Japan Vol.57 No.1
  
  Pages: 83-89
- NAID
  130002085782
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] デジタル画像相関法を用いた電子実装部の熱ひずみ分布計測2008
- Author(s)
  宍戸信之, 池田徹, 宮崎則幸, 中村健太郎, 宮崎政志, 猿渡達郎
- Journal Title
  
  材料 57-1
  
  Pages: 83-89
- NAID
  130002085782
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress Singularity Analysis at an Interfacial Corner between Anisotropic Bimaterials under Thermal Stress2008
- Author(s)
  Yoshiaki, Nomura, Toni, Ikeda, Noriyuki, Miyazaki
- Journal Title
  
  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese) Vol.74 No.737
  
  Pages: 37-44
- NAID
  110006571942
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress intensity factor analysis of a three-dimensional interface crack between dissimilar anisotropic materials2007
- Author(s)
  Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics 74-16
  
  Pages: 2481-2497
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] 実験とデバイスシミュレーションによるnMOSFETの応力に起因したDC特性変動評価2007
- Author(s)
  小金丸正明, 池田徹, 宮崎則幸, 友景肇
- Journal Title
  
  電子情報通信学会論文誌 C Vol.J90-C,No.4
  
  Pages: 351-362
- NAID
  110007379892
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress intensity factor analysis of a three-dimensional interface crack between dissimilar anisotropic materials2007
- Author(s)
  Masaki, Nagai, Toru, Ikeda, Noriyuki, Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics Vol.74 Issue16
  
  Pages: 2481-2497
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress Intensity Factor Analysis of a Three-dimensional Interface Crack between Dissimilar Anisotropic Materials2007
- Author(s)
  M. Nagai, T. Ikeda, N. Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics Vol.74,No.16(有)
  
  Pages: 2481-2497
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Stress Intensity Factor Analysis of a Three-dimensional Interface Crack between Dissimilar Anisotropic Materials2007
- Author(s)
  M. Nagai, T. Ikeda N. Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics 74
  
  Pages: 2481-2497
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Stress intensity factor analysis of a three-dimensional interfacecrack between dissimilar anisotropic materials2007
- Author(s)
  Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics 74-16
  
  Pages: 2481-2497
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress intensity factor analyses of interface cracks between dissimilar anisotropic materials using the finite element method2006
- Author(s)
  Toru Ikeda, Masaki Nagai, Koh Yamanaga, Noriyuki Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics Vol.73
  
  Pages: 2067-2079
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] 三次元異方性異種材界面き裂の応力拡大係数解析2006
- Author(s)
  永井政貴, 池田徹, 宮崎則幸
- Journal Title
  
  日本機械学会論文集(A編) 第72巻,第724号
  
  Pages: 1992-1999
- NAID
  110006153373
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress Intensity Factor Analyses of Interface Cracks between Dissimilar Anisotropic Materials Using the Finite Element Methods2006
- Author(s)
  T.Ikeda, M.Nagai, K.Yamanaga, N.Miyazaki
- Journal Title
  
  Engineering Fracture Mechanics 73・14
  
  Pages: 2067-2079
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] ピエゾ抵抗テストチップと有限要素法解析を用いた樹脂封止に起因する半導体チップ表面の残留応力評価2006
- Author(s)
  小金丸正明, 池田徹, 宮崎則幸
- Journal Title
  
  エレクトロニクス実装学会誌 Vol.9,No.3
  
  Pages: 186-194
- NAID
  110004724982
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] 延性接着剤を用いた接着継手の破壊靱性値2006
- Author(s)
  池田徹, 宮崎則幸
- Journal Title
  
  日本接着学会誌 Vol.42,No.9
  
  Pages: 372-379
- NAID
  10018428627
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] 界面破壊力学の異方性材料への展開2006
- Author(s)
  池田徹
- Journal Title
  
  材料第55巻・第2号
  
  Pages: 183-193
- NAID
  110006570895
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Evaluation of the Delamination in a flip Chip Using Anisotropic Conductive Adhesive Films under Moisture/Reflow Sensitivity Test2006
- Author(s)
  T.Ikeda, W.K.Kim, N.Miyazaki
- Journal Title
  
  IEEE Transactions on Components and Packaging Technology 29・3
  
  Pages: 551-559
- Data Source
  KAKENHI-PROJECT-18206015
[Journal Article] Evaluation of the Delamination in a flip chip using anisotropic conductive adhesive films under moisture/reflow sensitivity test2006
- Author(s)
  Torn Ikeda, Won-Keun Kim, Noriyuki Miyazaki
- Journal Title
  
  IEEE Transactions on components and packaging technologies Vol.29,No.3
  
  Pages: 551-559
- Data Source
  KAKENHI-PROJECT-17360050
[Journal Article] Stress Intensity Factors Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress2004
- Author(s)
  T.IKEDA, N.MIYAZAKI, M.NAGAI, K.YAMANAGA
- Journal Title
  
  Proceedings of the 4th European Congress on Computational Methods in Applied Science and Engineering (ECCOMAS 2004)
  
  Pages: 544-544
- Data Source
  KAKENHI-PROJECT-16656043
[Patent] 撮影画像におけるゆがみの構成方法2006
- Inventor(s)
  宍戸信之、池田徹、宮崎則幸
- Industrial Property Rights Holder
  宍戸信之、池田徹、宮崎則幸
- Patent Publication Number
  2007-299219
- Filing Date
  2006-04-28
- Data Source
  KAKENHI-PROJECT-18206015
[Patent] 撮影画像におけるゆがみの較正方法2006
- Inventor(s)
  宍戸信之, 池田徹, 宮崎則幸
- Industrial Property Rights Holder
  京都大学, 福岡県
- Industrial Property Number
  2006-126874
- Filing Date
  2006-04-28
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] 分子静力学法を用いた異方性異種材界面角部の等価き裂強度の推定2019
- Author(s)
  鐙優太, 木之瀬優考, 小金丸正明, 池田徹
- Organizer
  日本機械学会M&M2019 材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] 接着継ぎ手強度に与える，接着剤厚さの影響について2019
- Author(s)
  池田　徹
- Organizer
  日本接着学会　研究会合同シンポジウム
- Invited
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] パワーモジュール中における熱サイクル疲労と機械的疲労下での封止樹脂ー金属基板界面き裂の進展挙動2019
- Author(s)
  長尾元気, 池田徹, 小金丸正明, 加々良剛志, 中井戸宙, 畑尾卓也
- Organizer
  日本機械学会第32回計算力学講演会（CMD2019）
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] SOI-MOS デバイスの寄生バイポーラ領域における機械的応力効果のデバイスシミュレーション2019
- Author(s)
  塩塚航生, 日高和也, 小金丸正明, 松本聡, 池田徹, 宮崎則幸
- Organizer
  日本機械学会第32回計算力学講演会（CMD2019）
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] パワーモジュール用ワイヤボンド部の熱疲労寿命評価指標の検討2019
- Author(s)
  大迫徹, 瀬戸口慶樹, 宍戸信之, 小金丸正明, 池田徹, 葉山裕, 宮崎則幸
- Organizer
  日本機械学会第32回計算力学講演会（CMD2019）
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] 微小スズ試験片の結晶粒中のひずみ計測と結晶塑性理論による解析2019
- Author(s)
  池田徹，佐々木　拓海，小金丸　正明，柳瀬　篤志，奥村　大，苅谷　義治
- Organizer
  日本機械学会年次大会
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] パワーデバイス用封止樹脂の熱サイクル試験におけるはく離信頼性評価解析2019
- Author(s)
  加々良剛志, 中井戸宙, 畑尾卓也, 長尾元気, 小金丸正明, 池田徹
- Organizer
  日本機械学会第32回計算力学講演会（CMD2019）
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] パワーモジュールにおける熱サイクル試験時の封止樹脂のはく離予測評価2019
- Author(s)
  池田　徹，川下　隼介，七蔵司　優斗，小金丸　正明，外薗　洋昭，浅井　竜彦
- Organizer
  スマートプロセス学会，令和元年度学術講演会
- Invited
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] Strain distribution in a small solder specimen with few crystal grains2019
- Author(s)
  Toru Ikeda, Takumi Sasaki, Atsushi Yanase, Dai Okumura, Yoshiharu Kariya, Masaaki Koganemaru
- Organizer
  ASME 2019 InterPACK
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] ナノスケールにおける異種材界面上のミスフィット転位周りの応力場評価2019
- Author(s)
  中島倫太郎, 城ノ下航, 定松直, 小金丸正明, 池田徹
- Organizer
  日本機械学会M&M2019 材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] Analyses of Unified Fracture Parameters Describing the Singular Stress Around a Jointed Sharp 3D Interfacial Corner between Dissimilar Anisotropic Materials under Mechanical and Thermal Stress2019
- Author(s)
  Toru Ikeda, Yutaka Kinose, Yuji Koga and Masaaki Koganemaru
- Organizer
  APCOM 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] ナノスケールにおけるミスフィット転位が存在する異種材界面近傍の応力場評価2018
- Author(s)
  城ノ下航，定松直，小金丸正明，池田徹
- Organizer
  日本機械学会M&M2018材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] 三次元異方性異種材界面角部と二次元異方性異種材界面角部における特異性応力場の互換性の検証2018
- Author(s)
  木之瀬優孝，池田徹，小金丸正明
- Organizer
  日本機械学会M&M2018材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] Evaluation of Interfacial Fracture in Electronic Packages2017
- Author(s)
  Toru Ikeda
- Organizer
  19th International Conference on Electronics Materials and Packaging (EMAP2017)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] ナノスケールにおける Si-Ge 界面近傍のひずみ・応力場評価2017
- Author(s)
  城ノ下航，芝健太，定松直，小金丸正明，池田徹
- Organizer
  日本機械学会　M＆M2017材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] 原子スケールにおける異種材界面の応力場・ひずみ場評価2017
- Author(s)
  芝健太，定松直，小金丸正明，池田徹
- Organizer
  日本機械学会九州支部第70期総会講演会
- Place of Presentation
  佐賀大学（佐賀県・佐賀市）
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] H-integral による熱応力下の三次元接合角部のスカラーパラメーター解析2017
- Author(s)
  木之瀬優孝，古賀裕二，池田徹，小金丸正明
- Organizer
  日本機械学会　M＆M2017材料力学講演会
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] パワーモジュールにおける封止樹脂のはく離強度設計2017
- Author(s)
  池田徹，川下隼介，七蔵司優斗，小金丸正明，外薗洋昭，浅井竜彦
- Organizer
  第23回シンポジウム「エレクトロニクスにおけるマイクロ接合・実装技術」
- Place of Presentation
  パシフィコ横浜（神奈川県・横浜市）
- Year and Date
  2017-01-31
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Evaluation of scalar parameters of asymptotic solution of the singular stress field around a 3D interfacial corner between dissimilar materials2017
- Author(s)
  Toru Ikeda, Yuji Koga, Yusuke　Taguchi, Masaaki Koganemaru
- Organizer
  14th International Conference on Fracture (ICF14)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K06059
[Presentation] H-integralによる三次元接合角部のスカラーパラメーター解析2017
- Author(s)
  古賀裕二，小金丸正明，池田徹
- Organizer
  日本機械学会九州支部第70期総会講演会
- Place of Presentation
  佐賀大学（佐賀県・佐賀市）
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーモジュール中の銅基板と封止樹脂のはく離強度評価2016
- Author(s)
  七藏司優斗, 池田徹, 小金丸正明
- Organizer
  日本機械学会第29回計算力学講演会
- Place of Presentation
  名古屋大学（愛知県・名古屋市）
- Year and Date
  2016-09-22
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーモジュール中の熱応力による封止樹脂のはく離解析2016
- Author(s)
  川下隼介, 池田徹, 小金丸正明
- Organizer
  日本機械学会第29回計算力学講演会
- Place of Presentation
  名古屋大学（愛知県・名古屋市）
- Year and Date
  2016-09-22
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイス用高耐熱樹脂のはく離強度評価技術2016
- Author(s)
  池田　徹
- Organizer
  日本機械学会2016年度年次大会
- Place of Presentation
  九州大学（福岡県・福岡市）
- Year and Date
  2016-09-12
- Invited
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 電子部品における高耐熱樹脂のはく離信頼性評価解析2016
- Author(s)
  畑尾卓也, 中井戸宙, 中元亜耶, 池田徹, 尾崎秋子
- Organizer
  日本機械学会第29回計算力学講演会
- Place of Presentation
  名古屋大学（愛知県・名古屋市）
- Year and Date
  2016-09-22
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 三次元接合角部の特異性応力場解析手法の開発2016
- Author(s)
  古賀裕二，池田徹
- Organizer
  日本機械学会九州支部第69期総会講演会
- Place of Presentation
  熊本市　熊本大学
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 異方性弾性論と分子静力学を用いたミスフィット転位が存在する異種材界面の応力場解析2016
- Author(s)
  芝健太，池田徹，小金丸正明
- Organizer
  日本機械学会M&M2016 材料力学カンファレンス
- Place of Presentation
  神戸大学（兵庫県・神戸市）
- Year and Date
  2016-10-08
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 数結晶粒よりなる微細スズ試験片の変形挙動解析2016
- Author(s)
  柳瀬篤志，池田徹
- Organizer
  日本機械学会九州支部第69期総会講演会
- Place of Presentation
  熊本市　熊本大学
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイスにおける封止樹脂と基板のはく離強度評価2016
- Author(s)
  池田　徹，井上　航太朗，小金丸　正明，畑尾　卓也，中井戸　宙
- Organizer
  MES2016
- Place of Presentation
  中京大学（愛知県・名古屋市）
- Year and Date
  2016-09-08
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 高耐熱パワーデバイス用封止樹脂の密着強度評価2016
- Author(s)
  池田徹, 尾崎秋子, 小金丸正明, 中井戸宙, 畑尾卓也
- Organizer
  日本機械学会2016年度年次大会
- Place of Presentation
  九州大学（福岡県・福岡市）
- Year and Date
  2016-09-12
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイスの非線形応力解析2016
- Author(s)
  川下隼介，池田徹
- Organizer
  日本機械学会九州支部第47回卒業研究発表講演会
- Place of Presentation
  霧島市　鹿児島工業高等専門学校
- Year and Date
  2016-03-04
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイス中の封止樹脂のはく離強度評価2016
- Author(s)
  井上航太朗, 池田徹, 小金丸正明, 畑尾卓也, 中井戸宙
- Organizer
  日本機械学会第29回計算力学講演会
- Place of Presentation
  名古屋大学（愛知県・名古屋市）
- Year and Date
  2016-09-22
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Delamination toughness between encapsulation resin and substrate for power devices at high temperature2016
- Author(s)
  Toru Ikeda, Akiko Ozaki, Masaaki Koganemaru, Hiroshi Nakaido and Takuya Hatao
- Organizer
  The 37th IEMT and the 18th EMAP
- Place of Presentation
  ペナン島市（マレーシア）
- Year and Date
  2016-09-20
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Scalar parameter analysis of three-dimensional interfacial corner of jointed dissimilar anisotropic materials2016
- Author(s)
  Toru Ikeda, Yuji Koga
- Organizer
  ECCOMAS Congress 2016
- Place of Presentation
  イラクリオン県クレタ島（ギリシャ）
- Year and Date
  2016-06-05
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] H-integral による三次元接合角部のスカラーパラメーター解析2016
- Author(s)
  古賀裕二，池田徹，小金丸正明
- Organizer
  日本機械学会M&M2016 材料力学カンファレンス
- Place of Presentation
  神戸大学（兵庫県・神戸市）
- Year and Date
  2016-10-08
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイス用樹脂と金属基板のはく離強度評価2015
- Author(s)
  尾崎秋子，池田徹，中井戸宙，畑尾卓也
- Organizer
  日本機械学会第28回計算力学講演会
- Place of Presentation
  横浜市　横浜国立大学
- Year and Date
  2015-10-10
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 数結晶よりなるスズ微細試験片内のひずみ測定2015
- Author(s)
  柳瀬篤志，池田徹，苅谷義治
- Organizer
  日本機械学会第28回計算力学講演会
- Place of Presentation
  横浜市　横浜国立大学
- Year and Date
  2015-10-10
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 圧縮応力場におけるはんだ接合部の変形挙動の測定2015
- Author(s)
  新谷寛，池田徹，広佐古晃，谷江尚史
- Organizer
  M&M2015 材料力学カンファレンス
- Place of Presentation
  横浜市　慶応義塾大学
- Year and Date
  2015-11-21
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Simulation of the warpage hysteresis of a layered electronic package during a thermal cycle2015
- Author(s)
  Toru Ikeda and Akiko Ozaki
- Organizer
  Bio4Apps 2015
- Place of Presentation
  福岡市　九州大学
- Year and Date
  2015-12-09
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] ワイヤボンディング強度に及ぼすアルミパッドの特性評価2015
- Author(s)
  芝健太，池田徹，中野景介，草間竜一
- Organizer
  日本機械学会第28回計算力学講演会
- Place of Presentation
  横浜市　横浜国立大学
- Year and Date
  2015-10-10
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 三次元接合角部のスカラーパラメーター解析手法の精度改善2015
- Author(s)
  古賀裕二，池田徹
- Organizer
  M&M2015 材料力学カンファレンス
- Place of Presentation
  横浜市　慶応義塾大学
- Year and Date
  2015-11-21
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Evaluation of the reliable material properties of Al pads that have strong delamination toughness of Au/Al wire bonding2015
- Author(s)
  Toru Ikeda, Kenta Shiba, Keisuke Nakano and Ryuichi Kusama
- Organizer
  EMAP2015
- Place of Presentation
  アメリカ合衆国　Portland
- Year and Date
  2015-09-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 数結晶よりなる錫微小試験片の変形機構の解明2015
- Author(s)
  池田　徹，柳瀬　篤志，宮崎　則幸
- Organizer
  日本機械学会2015年度年次大会
- Place of Presentation
  札幌市　北海道大学
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs : The inpaacts of stress-induced change of intrinsic carriear density2013
- Author(s)
  Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
- Organizer
  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
- Place of Presentation
  Burlingame, CA, USA
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013
- Author(s)
  Toru Ikeda, Masatashi Oka, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada
- Organizer
  International Conference on Electronics Packaging (ICEP2013)
- Place of Presentation
  大阪
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM2013
- Author(s)
  Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki
- Organizer
  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
- Place of Presentation
  Burlingame, CA, USA
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density2013
- Author(s)
  Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
- Organizer
  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
- Place of Presentation
  Burlingame, CA, USA
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Warpage Analyses of a Stacked Package Considering the Change of Visco-elastic Material Properties of Resin during Thermal History2013
- Author(s)
  Toru Ikeda, Shinya Kawahara, Noriyuki Miyazaki, Takuya Hatao
- Organizer
  The 15th International Conference on Electronic Materials and Packaging / The 12th International Symposium on Microelectronics and Packaging (EMAP/ISMP 2013)
- Place of Presentation
  Seoul Korea
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013
- Author(s)
  Toru Ikeda, Masatashi Oka, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada
- Organizer
  International Conference on Electronics Packaging in Osaka, ICEP2013 Proceedings
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Improvement of the Accuracy of Nonlinear Finite Element Analysis for a 3D SIC Package Using SEM and DICM2012
- Author(s)
  Masatoshi Oka, Shinya Kawahara, Toru Ikeda, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao
- Organizer
  International Computational Mechanics Symposium 2012 (ICMS2012)
- Place of Presentation
  Kobe Japan
- Year and Date
  2012-10-11
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] SEMとデジタル画像相関法によるひずみ計測を利用した三次元積層チップの非線形有限要素解析の精度向上2012
- Author(s)
  岡大智, 河原真哉, 池田徹, 宮崎則幸, 松本圭二, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘
- Organizer
  第22回マイクロエレクトロニクスシンポジウム (MES2012)
- Place of Presentation
  堺市
- Year and Date
  2012-09-13
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Device Simulation of Stress Effect on Electrical Performances of Semiconductor Devices : Impact of Mechanical Stress in the Region of High Current Density in the Devices2012
- Author(s)
  Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  10th World Congress on Computational Mechanics
- Place of Presentation
  Sao Paulo, Brazil
- Year and Date
  2012-07-12
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デジタル画像相関法によるひずみ計測を用いた三次元積層チップの微細接合部のひずみ評価2012
- Author(s)
  岡大智, 池田徹, 宮崎則幸
- Organizer
  第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate 2012)
- Place of Presentation
  横浜市
- Year and Date
  2012-01-31
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デバイス内部の応力集中と真性キャリア濃度変化を考慮したnMOSFET の電気特性変動でバイスシミュレーション2012
- Author(s)
  多田直弘, 小金丸正明, 池田徹, 宮崎則幸, 友景肇
- Organizer
  第22回マイクロエレクトロニクスシンポジウム (MES2012)
- Place of Presentation
  堺市
- Year and Date
  2012-09-13
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] SEMを用いたデジタル画像相関法による熱ひずみ計測を用いた三次元積層チップの非線形有限要素解析精度評価2012
- Author(s)
  岡大智, 池田徹, 宮崎則幸, 松本圭司, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘
- Organizer
  日本機械学会M&M2012材料力学カンファレンス
- Place of Presentation
  松山市
- Year and Date
  2012-09-24
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Evaluation of Correlation between Stress Concentration and Electronic Characteristics on nMOSFETs2012
- Author(s)
  Naohiro Tada, Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  International Computational Mechanics Symposium 2012 (ICMS2012)
- Place of Presentation
  Kobe Japan
- Year and Date
  2012-10-11
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デバイス内部の応力集中と真性キャリア濃度変化を考慮したnMOSFETの電気特性変動でバイスシミュレーション2012
- Author(s)
  多田直弘, 小金丸正明, 池田　徹, 宮崎則幸, 友景　肇
- Organizer
  第22回マイクロエレクトロニクスシンポジウム (MES2012)
- Place of Presentation
  堺市大阪府立大学
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Combination between the Nonlinear Finite Element Analyses and the Strain Measurement Using the Digital Image Correlation for a New 3D SIC Package2012
- Author(s)
  Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyukiu Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Famada Yamada and Morihiro Kada and M. Kada
- Organizer
  IEEE International 3D System Integration Conference (IEEE 3DIC 2011)
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Device Simulation of Stress Effect on Electrical Performances of Semiconductor Devices : Impact of Mechanical Stress in the Region of High Current Density in the Devices2012
- Author(s)
  Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  10th World Congress on Computational Mechanics
- Place of Presentation
  サンパウロ
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices2012
- Author(s)
  Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  4th Electronics System Integration technologies Conference (ESTC 2012)
- Place of Presentation
  アムステルダム
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices2012
- Author(s)
  Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  4th Electronics System Integration technologies Conference (ESTC 2012)
- Place of Presentation
  Amsterdam, The Netherlands
- Year and Date
  2012-09-19
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] SEM-DICM を用いた3D-SIC 模擬チップのひずみ計測と有限要素解析精度の向上2012
- Author(s)
  池田徹, 岡大智, 宮崎則幸, 田中宏之, 畑尾卓也
- Organizer
  日本機械学会第25回計算力学講演会講演論文集
- Place of Presentation
  神戸市
- Year and Date
  2012-10-06
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デジタル画像相関法を用いたひずみ計測による微細電子実装部の非線形有限要素法の精度改善2012
- Author(s)
  池田徹
- Organizer
  Marc Users Meeting 2012 in Fukuoka
- Place of Presentation
  福岡
- Year and Date
  2012-11-22
- Invited
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Improvement of Nonlinear Finite Element Analyses of Electronic Packaging Using the Strain Measurement with the Digital Image Correlation2012
- Author(s)
  Noriyuki Miyazaki, Toru Ikeda and Masatoshi Oka
- Organizer
  10th World Congress on Computational Mechanics
- Place of Presentation
  Sao Paulo, Brazil
- Year and Date
  2012-07-12
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] nMOSFET 内部の応力分布と電気特性との相関に関するデバイスシミュレーション2012
- Author(s)
  小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
- Organizer
  日本機械学会第25回計算力学講演会
- Place of Presentation
  神戸市
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Takuya Hatao Reliability Evaluation of a New 3D SIC Package by FEM and Thermal -Strain Measurement with Digital Image Correlation Using SEM2012
- Author(s)
  Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki, Hiroyuki Tanaka
- Organizer
  The 14th International Conference on Electronic Meterials and Packaging (EMAP 2012)
- Place of Presentation
  Hong Kong
- Year and Date
  2012-09-15
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] nMOSFET 内部の応力分布と電気特性との相関に関するデバイスシミュレーション2012
- Author(s)
  小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
- Organizer
  日本機械学会第25回計算力学講演会講演論文集
- Place of Presentation
  神戸市
- Year and Date
  2012-10-06
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Evaluation of Correlation between Stress Concentration and Electronic Characteristics on nMOSFETs2012
- Author(s)
  Naohiro TADA, Masaaki KOGANEMARU, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  International Computational Mechanics Symposium 2012 (ICMS2012)
- Place of Presentation
  神戸市
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デジタル画像相関法による熱ひずみ計測を用いた次世代三次元積層チップの非線形有限要素解析精度の改善2011
- Author(s)
  岡大智, 河原真哉, 池田徹, 宮崎則幸
- Organizer
  日本機械学会M&M2010材料力学カンファレンス
- Place of Presentation
  北九州市
- Year and Date
  2011-07-16
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Study on Impact of Uniaxial Stress on n-type Silicon MOS Devices2011
- Author(s)
  Masaaki Koganemau, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  The13th International Conference on Electronics Materials and Packaging (EMAP2011)
- Place of Presentation
  Kyoto Japan
- Year and Date
  2011-12-14
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors2011
- Author(s)
  Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
- Place of Presentation
  ポートランド
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] The ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems2011
- Author(s)
  Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  MEMS and NEMS (InterPACK 2011)
- Place of Presentation
  Portland, USA
- Year and Date
  2011-07-06
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デジタル画像相関法による次世代三次元積層チップ断面のひずみ計測を用いた非線形有限要素法解析精度の向上2011
- Author(s)
  岡大智, 河原真哉, 池田徹, 宮崎則幸
- Organizer
  日本機械学会第24回計算力学講演会
- Place of Presentation
  岡山市
- Year and Date
  2011-10-08
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] nMOSFETにおける１軸応力の影響評価2011
- Author(s)
  小金丸正明，多田直弘，池田　徹，宮崎則幸，友景　肇
- Organizer
  第21回マイクロエレクトロニクスシンポジウム (MES2011)
- Place of Presentation
  大阪府吹田市
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] nMOSFETにおける1軸応力の影響評価2011
- Author(s)
  小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
- Organizer
  第21回マイクロエレクトロニクスシンポジウム (MES2011)
- Place of Presentation
  吹田市
- Year and Date
  2011-09-08
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Improvement of the Accuracy of the Nonlinear Finite Element Analyses for a New 3D SIC Package Using the Thermal Strain Measurement with the Digital Image Correlation2011
- Author(s)
  Masatoshi Oka, Shinya Kawahara, Toru Ikeda and Noriyuki Miyazaki
- Organizer
  The13th International Conference on Electronics Materials and Packaging (EMAP2011)
- Place of Presentation
  Kyoto Japan
- Year and Date
  2011-12-14
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] デバイスシミュレーションによるnMOSFETへの一軸応力負荷の影響評価2011
- Author(s)
  多田直弘, 小金丸正明, 池田徹, 宮崎則幸, 友景肇
- Organizer
  日本機械学会第24回計算力学講演会
- Place of Presentation
  岡山市
- Year and Date
  2011-10-08
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Evaluation of Uniaxial-Stress Effects on DC Characteristics of n-type Metal Oxide Semiconductor Field Effect Transistors2011
- Author(s)
  Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  International Conference on Advanced Technology in Experimental Mechanics (ATEM’11)(招待講演)
- Place of Presentation
  神戸市
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Evaluation of Uniaxial-Stress Effects on DC Characteristics of n-type Metal Oxide Semiconductor Field Effect Transistors2011
- Author(s)
  Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
- Organizer
  International Conference on Advanced Technology in Experimental Mechanics (ATEM'11)
- Place of Presentation
  Kobe, Japan
- Year and Date
  2011-09-21
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Improvement of the Nonlinear Finite Element Analyses for a 3D SIC using the Strain Measurement by the Digital Image Correlation2011
- Author(s)
  Toru Ikeda, Shinya Kawahara, Masatoshi Oka, Noriyuki Miyazaki
- Organizer
  International Conference on Materials and Reliability 2011 (ICMR2011)
- Place of Presentation
  Busan, Korea
- Year and Date
  2011-11-22
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Numerical Study on Impact of Uniaxial Stress on n-type Silicon MOS Devices2011
- Author(s)
  Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
- Organizer
  The13th International Conference on Electronics Materials and Packaging (EMAP2011)
- Place of Presentation
  京都市
- Data Source
  KAKENHI-PROJECT-23656083
[Presentation] Measurement of Strain in Microeiectronic Package Using the Digital Image Correlation Method for Reliable Numerical Analysis2009
- Author(s)
  T.Ikeda, T.Kanno, N.Shishido, N.Miyazaki, H.Tanaka, T.Hatano
- Organizer
  The 11th International Conference on Electronic Materials and Packaging
- Place of Presentation
  Penang, Malaysia
- Year and Date
  2009-12-03
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Device Simulations of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs2009
- Author(s)
  K. Yoshida, T. Ikeda, N. Miyazaki, H. Tomokage
- Organizer
  ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-06-20
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Reliability Evaluation of Flip Chip Packages Using the Digital Image Correlation Method and the FEM Analyses, International Conference on Electronics Packaging 20092009
- Author(s)
  T.Kanno, T.Ikeda, N.Miyazaki, H.Tanaka, T.Hatano
- Organizer
  International Conference on Electronics Packaging 2009
- Place of Presentation
  京都国際会館(京都市)
- Year and Date
  2009-04-15
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Measurement of Three-dimensional Surface Displacement Using the Digital Image Correlation with AFM Image2009
- Author(s)
  N.Shishida, T.Ikeda, N.Miyazaki
- Organizer
  International Conference on Electronics Packaging 2009
- Place of Presentation
  京都国際会館(京都市)
- Year and Date
  2009-04-15
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Reliability Evaluation of Flip Chip Pachages Using the Digital Image Correlation Method and the FEM Analyses2009
- Author(s)
  T. Kanno, T. Ikeda, N. Miyazaki, H. Tonaka, T. Hatano
- Organizer
  International Conference on Electronics Packaging 2009 (ICEP2009)
- Place of Presentation
  Kyoto, Japan
- Year and Date
  2009-04-15
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Device Simulations of Mechanical Stress Effecs on Electrical Characteristics of n-MOSFETs : Impact of Local Stress in nMOSFETs2009
- Author(s)
  K.Yoshida, Ikeda, N.Miyazaki, H.Tomokage
- Organizer
  ASME/Pacific Rim Technical Confercnce and Exhibition on Packaging and Integration of Electronic and Photonic
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-07-20
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Stress Intensity Factors Analyses of a Three-Dimensional Interface Corner between Dissimilar Anisotropic Materials under Thermal Stress2008
- Author(s)
  T. IKEDA, Y. NOMURA, N. MIYAZAKI
- Organizer
  8th World Congress on Computational Mechanics (WCCM8) in Conjunction with 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008)
- Place of Presentation
  Venice, Italy
- Year and Date
  2008-07-02
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Stress Intensity Factors Analyses of a Three- Dimensional Interface Corner between Dissimilor Anisotropic Materials under Thermal Stress2008
- Author(s)
  T. Ikeda, Y. Nomura N. Miyazaki
- Organizer
  8th World Congress on Computational Mechanics (WCCM8) in Conjunction with 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008)
- Place of Presentation
  Venice, Italy
- Year and Date
  2008-07-02
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Full Field Displacement Measurement Using Digital Image Correlation mathod for Laser Scanning Confocal Microscopic Image2008
- Author(s)
  N. Shishido, T. Ikeda, N. Miyazaki
- Organizer
  Internationd Conference on Computational and Experimental Engineering and Science (ICCES'08)
- Place of Presentation
  Honolulu, USA
- Year and Date
  2008-03-20
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Delamination in a Stacked BGA Package under the Solder Reflow Process2007
- Author(s)
  Toni, Ikeda, Manabu, Hamada, Noriyuki, Miyazaki, Hiroyuki, Tanaka, Takashi, Numata
- Organizer
  Third Asia-Pacific Congress on Computational Mechanics (APCOM'07)
- Place of Presentation
  in Kyoto
- Year and Date
  2007-12-03
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Thermo-Mechanical and-Hygrb-Mechanical Stress Analyses of an Organic Multilayer Sheet2007
- Author(s)
  T. Ikeda, T. Mizutani, N. Miyazaki
- Organizer
  InterPACK'07
- Place of Presentation
  Vancouver, Canada
- Year and Date
  2007-07-11
- Data Source
  KAKENHI-PROJECT-18206015
[Presentation] Three dimensional stress intensity factors analyses of interface cracks between dissimilar anisotropic materials under thermal stress2007
- Author(s)
  Toru Ikeda, Masaki Nagai, Noriyuki Miyazaki
- Organizer
  The 7th International Conference on Fracture and Strength of Solids
- Place of Presentation
  ウルムチ
- Year and Date
  2007-08-29
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet2007
- Author(s)
  Toru Ikeda, Tomonori Mizutani and Noriyuki Miyazaki
- Organizer
  ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Photonic Systems, MEMS, and HEMS(Inter PACK'07)
- Place of Presentation
  バンクーバー
- Year and Date
  2007-07-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet2007
- Author(s)
  Toru Ikeda, Tomonori Mizutani and Noriyuki Miyazaki
- Organizer
  InterPACK' 07
- Place of Presentation
  バンクーバー
- Year and Date
  2007-07-11
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Delamination in a Stacked BGA Package under the Solder Reflow Process2007
- Author(s)
  Toru Ikeda, Manabu Hamada, Noriyuki Miyazaki, Hiroyuki Tanaka, Takashi Numata
- Organizer
  Third Asia-Pacific Congress on Computational Mechanics(APCOM'07)
- Place of Presentation
  京都
- Year and Date
  2007-12-03
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet2007
- Author(s)
  Toru, Ikeda, Tomonori, Mizutani, Noriyuki, Miyazaki
- Organizer
  ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Photonic Systems, MEMS, and NEMS (InterPACK'07)
- Place of Presentation
  in Vancouver
- Year and Date
  2007-07-11
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Three dimensional stress intensity factors analyses of interface cracks between dissimilar anisotropic materials under thermal stress2007
- Author(s)
  Ton, Ikeda, Masaki, Nagai, Noriyuki, Miyazaki
- Organizer
  The 7th International Conference on Fracture and Strength of Solids
- Place of Presentation
  in Urumqi
- Year and Date
  2007-08-29
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360050
[Presentation] Stress singularity analysis of three-dimensional interfacial corner of jointed dissimilar materials
- Author(s)
  Toru Ikeda, Yosuke Taguchi and Noriyuki Miyazaki
- Organizer
  Computational engineering and science for safety and environmental problems (COMPSAFE2014)
- Place of Presentation
  宮城県仙台市　仙台国際センター
- Year and Date
  2014-04-13 – 2014-04-16
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 熱履歴による物性変化を考慮した模擬PoPパッケージの反りヒステリシス解析
- Author(s)
  尾崎秋子, 池田徹, 畑尾卓也, 中井戸宙
- Organizer
  日本機械学会第27回計算力学講演会
- Place of Presentation
  岩手県盛岡市　岩手大学
- Year and Date
  2014-11-22 – 2014-11-24
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイスにおける封止樹脂と基板の界面はく離強度評価
- Author(s)
  池田徹, 尾崎秋子, 寺元祐貴, 宮崎則幸, 畑尾卓也
- Organizer
  日本機械学会第27回計算力学講演会
- Place of Presentation
  岩手県盛岡市　岩手大学
- Year and Date
  2014-11-22 – 2014-11-24
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] パワーデバイスにおける封止樹脂のはく離評価
- Author(s)
  池田　徹，尾崎秋子，寺元祐貴，宮崎則幸, 畑尾卓也
- Organizer
  日本機械学会2014年度年次大会
- Place of Presentation
  東京都　東京電機大学
- Year and Date
  2014-09-07 – 2014-09-10
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 異種材界面における高耐熱樹脂のはく離評価解析
- Author(s)
  中井戸宙, 畑尾卓也, 山下勝志, 尾崎佑衣, 池田徹, 尾崎秋子
- Organizer
  日本機械学会第27回計算力学講演会
- Place of Presentation
  岩手県盛岡市　岩手大学
- Year and Date
  2014-11-22 – 2014-11-24
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Singular stress analysis of sharp three-dimensional interfacial corner of jointed dissimilar materials using H-integral
- Author(s)
  Toru Ikeda, Takashi Tokuda, Yosuke Taguchi and Noriyuki Miyazaki
- Organizer
  11th World Congress on Computational Mechanics (WCCM XI)
- Place of Presentation
  Barcelona, Spain
- Year and Date
  2014-07-20 – 2014-07-25
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] 粘弾性物性の熱履歴を考慮した電子パッケージの反りヒステリシス解析
- Author(s)
  池田徹，尾崎秋子，畑尾卓也，中井戸宙
- Organizer
  エレクトロニクス実装学会 MES2014
- Place of Presentation
  大阪府大阪市　大阪大学
- Year and Date
  2014-09-04 – 2014-09-05
- Data Source
  KAKENHI-PROJECT-26420022
[Presentation] Warpage analyses of a package on package considering the change of visco-elastic material properties of resin during thermal history
- Author(s)
  Toru Ikeda, Akiko Ozaki, Hiroshi Nakaido, Takuya Hatao and Noriyuki Miyazaki
- Organizer
  EMAP2014
- Place of Presentation
  Taipai, Taiwan
- Year and Date
  2014-10-22 – 2014-10-24
- Data Source
  KAKENHI-PROJECT-26420022

1. MIYAZAKI Noriyuki (10166150)

# of Collaborated Projects: 9 results

# of Collaborated Products: 45 results
2. MATSUMOTO Ryosuke (80363414)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. KOGANEMARU Masaaki (20416506)

# of Collaborated Projects: 2 results

# of Collaborated Products: 29 results
4. UCHINO Masakazu (30416507)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
5. ITOHIRA Keiichi (90463497)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. ASANO Tanemasa (50126306)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
7. MUNAKATA Tsuyoshi (00037714)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. 只野裕一 (00346818)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. WATANABE Takayuki

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

IKEDA Toru 池田 徹

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Experimental and numerical studies of interfacial stress between dissimilar materials in a nano-scale areaPrincipal Investigator

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Strength evaluation of an interfacial corner of jointed dissimilar materials considering the multi-scale effectPrincipal Investigator

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Nano-mechanical investigation of the effects of mechanical strain on semiconductor devicesPrincipal Investigator

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Evaluation technigue of bonding strength for microstructures and anisotropic materialsPrincipal Investigator

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Reliability Design of Conductive Adhesive Connection in Electronic PackagesPrincipal Investigator

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Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal StressPrincipal Investigator

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接着構造物中のき裂の破壊靭性値におよぼす被着材の拘束効果の研究Principal Investigator

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IKEDA Toru 池田徹

[Journal Article] パワーデバイス用高耐熱樹脂の低サイクル疲労強度評価2020