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Jpn. J. Appl. Phys.
Volume: 57 Issue: 1 Pages: 010101-010101
10.7567/jjap.57.010101
IEEE J. Elec. Dev. Soc.
Volume: 6 Pages: 1212-1217
10.1109/jeds.2018.2875927
2D mater
Volume: 4 Pages: 015035-015035
10.1088/2053-1583/aa50c4
Journal of Applied Physics
Volume: 122
10.1063/1.5009758
Applied physics Letters
Volume: 111
10.1063/1.4997298
Applied Physics Express
Volume: 8 Issue: 6 Pages: 065203-065203
10.7567/apex.8.065203
210000137562
Volume: 8 Issue: 2 Pages: 021301-021301
10.7567/apex.8.021301
210000137374
Volume: 8 Issue: 5 Pages: 051301-051301
10.7567/apex.8.051301
210000137492
Thin Solid Films
Volume: 557 Pages: 334-337
10.1016/j.tsf.2013.11.133
Volume: 7 Issue: 5 Pages: 051301-051301
10.7567/apex.7.051301
210000137073
Journalof Applied Physics
Volume: 116
10.1063/1.4901205
Applied Physics Letters
Volume: 104 Pages: 92909-92909
10.1063/1.4868032
ECS Transactions
Volume: 61(3) Pages: 147-156
10.1149/06103.0147ecst
Volume: 58(9) Pages: 309-315
10.1149/05809.0309ecst
Appl. Phys. Lett.
Volume: 102 Pages: 102106-1
10.1063/1.4794417
Volume: 102
10.1063/1.4810002
Volume: 58(9) Pages: 201-206
10.1149/05809.0201ecst
Jpn. J. Appl. Phys
ECS-Trans.
Volume: 41(7) Pages: 125-136
Volume: 50 Pages: 111502-111502
10.1143/jjap.50.111502
40019072737
Japanese Journal of Applied Physics
Volume: Vol.50
40018777874
Appl.Phys.Letters
Volume: 96
Volume: 28(2) Pages: 203-212
Volume: 33(3) Pages: 375-382
Volume: 28(2) Pages: 171-180
Volume: 96 Pages: 242901-242901
Volume: 33(6) Pages: 33-46
Volume: Vol.3
210000014682
Appl. Phys. Exp.
Volume: 3 Pages: 61501-61501
10027015062
Volume: 33(6) Pages: 463-477
Volume: 108
Applied Physics Express 2
Pages: 71404-71404
210000014403
Materials Research Society Symposium Proceedings 1155
Appl.Phys.Lett 94
ECS Transactions 19(1)
Pages: 243-252
MRS Symp. Proc.
Volume: 1155 Pages: 6-2
Journal of Applied Physics 105
Pages: 42901-42901
Applied Physics Letter 94
Pages: 132902-132902
ECS Transactions 19(2)
Pages: 101-116
Volume: 94 Pages: 42901-42901
ECS Transactions 25(6)
Pages: 3-16
Microelectronic Engineering 86
Pages: 1571-1576
Pages: 165-173
J. Appl. Phys.
Volume: 105 Pages: 34103-34103
Appl.Phys.Exp 1
10025080321
Appl. Surf. Sci.
Volume: 254 Pages: 6100-6105
Volume: 1
Volume: 47 Pages: 2410-2414
ECS Transaction 6(1)
Pages: 141-148
Applied Physics Letter 91
Pages: 123123-123123
ECS Transaction 11(4)
Pages: 461-469
Volume: 91 Pages: 123123-123123
ECS Transaction 11(6)
Volume: 46(11) Pages: 7251-7255
Volume: 6(1) Pages: 141-148
Japanese Journal of Applied Physics 46(11)
Pages: 7251-7255
40015705092
Japanese Journal of Applied Physics Pt. 1 46(7)
Pages: 4189-4192
40015465525
ECS Transactions 1(to be published)
International Conference on Microelectronics and Interfaces (ICMI'06)
2006 International Meeting for Future of Electron Devices, Kansai (IMFEDK)
Pages: 27-28
日本金属学会セミナー・非シリコン半導体の現状と展望
Applied Physics Letters 88(7)
Pages: 72904-72904
10022542508
Ext.Abst. 11th Workshop on Gate Stacks -Physics in Materials, Fabrication Processes and Characterizations-
Pages: 233-238
Present Status and Prospects of Non-Silicon Devices, The Japan Institute of Metals Seminar
ECS Transactions 1(出版予定)
Appl.Phys.Lett. 88
Appl.Phys.Lett. 86(6)
Pages: 63510-63510
Ext.Abst. 2005 Int.Conf. on Solid State Devices and Materials (SSDM)
Pages: 520-521
36th IEEE Semiconductor Interface Specialists Conference (SISC) 36
Pages: 10-10
Ext.Abst. 10th Workshop on Gate Stacks -Physics in Materials, Fabrication Processes and Characterizations-
Pages: 167-172
Pages: 858-859
10022543442
Applied Physics Letters 86(6)
Pages: 209-214
85th Spring Meeting of The Chemical Society of Japan 2L2-25
Pages: 252-253
Extended Abstracts of 2005 International Conference on Solid State Devices and Materials 2005
207th Meeting of the Electrochemical Society 207
Pages: 309-314
Pages: 546-547
Pages: 265-270
Jpn.J.Appl.Phys.Pt.1 44(8)
Pages: 6131-6135
Pages: 232-233
10022541528
Pages: 254-255
Japanese Journal of Applied Physics Pt.1,44
207th Meeting of the Electrochemical Society
Journal of The Surface Science Society of Japan HYOMEN KAGAKU 26(5)
Pages: 242-248
36th IEEE Semiconductor Interface Specialists Conference (SISC) P-11
Ext.Abst. 9th Workshop on Formation, Characterization and Reliability of Ultrathin Silicon Oxides
Pages: 259-264
Appl.Phys.Lett. 85(1)
Pages: 52-54
Ext. Abst. of 2004 Int. Workshop on Dielectric Thin Films for Future ULSI Devices-Science and Technology 2004
Pages: 3-4
Integration of Advanced Micro- and Nanoelectronic Devices - Critical Issues and Solutions, MRS Symp.Proc. 811
Pages: 169-174
Ext.Abst. 2004 Int.Conf. Solid State Dev.Mater. (SSDM)
Pages: 796-797
10022540167
Ext.Abst. of 2004 Int. Workshop on Dielectric Thin Films for Future ULSI Devices - Science and Technology (IWDTF)
Pages: 794-795
10022540160
35th IEEE Semiconductor Interface Specialists Conference (SISC) LP-3
Pages: 788-789
Pages: 319-324
Pages: 786-787
Pages: 790-791
10022540150
206^<th> Meeting of The Electrochemical Society,(Hawaii)
Appl.Phys.Lett. 86(7)102906(2005).rface Specialists Conference (SISC) LP-3
Pages: 226-227
10022538299
Pages: 534-535
Ext.Abst. 2003 Int.Conf. Solid State Dev.Mater. (SSDM)
Pages: 292-293
Jpn.J.Appl.Phys. 42,Pt.2(6B)
10011259919
2003 Int. Conference on Characterization and Metrology for ULSI Technology, AIP Conf.Proc. 550
Pages: 166-170
Int. Workshop on Gate Insulator (IWGI)
Pages: 186-191
Ext.Abst.Int.Conf. Solid State Dev.Mater. (SSDM)
Pages: 486-487
Pages: 66-67