CHEN CHUANTONG 陳伝とう

… Alternative Names

Chen Chuantong 陳伝とう

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Researcher Number	50791703
Other IDs
Affiliation (Current)	2026: 大阪大学, 産業科学研究所, 特任教授(常勤)
Affiliation (based on the past Project Information) *help	2024: 東京都市大学, 総合研究所, 特任教授 2019 – 2023: 大阪大学, 産業科学研究所, 特任准教授(常勤)
Review Section/Research Field	Principal Investigator Basic Section 21060:Electron device and electronic equipment-related
Keywords	Principal Investigator 信頼性評価 / 大面積接合 / SiCパワーモジュール / パワーモジュール / 多素子実装 / 高放熱モジュール / Ag粒子圧粉材 / 低温低圧接合技術 / 高放熱 / 短時間焼結 … More / Ag シート接合 / 大面積基板接合 / パワーモジュール構造 / 高放熱高耐熱実装技術 / 低温短時間焼結 / Ag 圧粉材シート接合 / 短時間接合 / 短時間固相接合 / Ag多孔シート / 高転位密度 / 低温低加圧 / SiCダイアタッチ / Alシート / ヒーロク / ダイアタッチ接合 / 成膜プロセス / 高温信頼性 / パワー半導体 / アルミシート接合 Less

Research Projects
(2 results)
Research Products
(60 results)

Development of low-temperature low-pressure large-area bonding technology by high heat-resistant and high-heat dissipation Ag solid porous materialsPrincipal Investigator
- Principal Investigator
  
  Chen chuantong
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Tokyo City University
  Osaka University
Development of low temperature low pressure large area heat resistant bonding technologyPrincipal Investigator
- Principal Investigator
  
  Chen Chuantong
- Project Period (FY)
  2019 – 2022
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Osaka University

All 2025 2024 2023 2022 2021 2020 2019

All Journal Article Presentation Book Patent

[Book] 次世代パワーデバイスに向けた実装材料、技術と熱対策-第3章第7節2024
- Author(s)
  Chuantong Chen
- Total Pages
  569
- Publisher
  (株)技術情報協会
- ISBN
  9784867980309
- Data Source
  KAKENHI-PROJECT-22K04243
[Book] Sic Power Module Design: Performance, Robustness and Reliability2022
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Total Pages
  300
- Publisher
  Inst of Engineering & Technology
- ISBN
  9781785619076
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections2025
- Author(s)
  Liu Canyu、Chen Chuantong、Liu Changqing、Suganuma Katsuaki
- Journal Title
  
  Materials Characterization
  
  Volume: 221 Pages: 114779-114779
- DOI
  10.1016/j.matchar.2025.114779
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature2025
- Author(s)
  Liu Wei、Xie Lingzhu、Ma Haojie、Chen Chuantong、Han Dawei、Wang Qian、Zou Yiwen、Chen Zhiwen、Liu Li
- Journal Title
  
  Journal of Alloys and Compounds
  
  Volume: 1021 Pages: 179696-179696
- DOI
  10.1016/j.jallcom.2025.179696
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Oxidation-free silver porous sheet bonding onto a bare copper substrate in air2025
- Author(s)
  Jo Eunjin、Kim YehRi、Lee Sangmin、Nishijima Masahiko、Chen Chuantong、Suganuma Katsuaki、Park Young-Bae、Kim Dongjin
- Journal Title
  
  Materials Letters
  
  Volume: 378 Pages: 137633-137633
- DOI
  10.1016/j.matlet.2024.137633
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Low temperature Al/AlN joint by Ag sinter paste from 180°C: Interface formation and joint reliability2025
- Author(s)
  Chen Chuantong、Liu Li、Huo Fupeng、Kim Dongjin、Lee Sangmin、Li Wanli、Suganuma Katsuaki
- Journal Title
  
  Ceramics International
  
  Volume: 51 Issue: 12 Pages: 16061-16072
- DOI
  10.1016/j.ceramint.2025.01.444
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Decomposition and sintering behaviors of MOD-assisted Ag pastes for power electronics2025
- Author(s)
  Liu Li、Ma Haojie、Chen Chuantong、Xu Zixuan、Nong Liting、Zou Yiwen、Xu Xiyu、Wang Xuanguo、Chen Zhiwen
- Journal Title
  
  Materials Today Communications
  
  Volume: 45 Pages: 112265-112265
- DOI
  10.1016/j.mtcomm.2025.112265
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability2024
- Author(s)
  Chen Chuantong、Suetake Aiji、Huo Fupeng、Kim Dongjin、Zhang Zheng、Hsieh Ming-Chun、Li Wanli、Wakasugi Naoki、Takeshita Kazutaka、Yamaguchi Yoshiji、Momose Yashima、Suganuma Katsuaki
- Journal Title
  
  IEEE Transactions on Power Electronics
  
  Volume: 39 Issue: 9 Pages: 10638-10650
- DOI
  10.1109/tpel.2024.3408798
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation2024
- Author(s)
  Liu Yang、Chen Chuantong、Wang Ye、Zhang Zheng、Liu Ran、Ueshima Minoru、Ota Ichiro、Nishikawa Hiroshi、Nishijima Masahiko、Nakayama Koji S.、Suganuma Katsuaki
- Journal Title
  
  Composites Part B: Engineering
  
  Volume: 281 Pages: 111519-111519
- DOI
  10.1016/j.compositesb.2024.111519
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module2024
- Author(s)
  Huo Fupeng、Chen Chuantong、Zhang Zheng、Zhang Yicheng、Suetake Aiji、Takeshita Kazutaka、Yamaguchi Yoshiji、Momose Yashima、Suganuma Katsuaki
- Journal Title
  
  Materials Characterization
  
  Volume: 217 Pages: 114360-114360
- DOI
  10.1016/j.matchar.2024.114360
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations2024
- Author(s)
  Kim Dongjin、Chen Chuantong、Lee Sangmin、Kim Min-Su、Suganuma Katsuaki
- Journal Title
  
  Corrosion Science
  
  Volume: 226 Pages: 111614-111614
- DOI
  10.1016/j.corsci.2023.111614
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties2024
- Author(s)
  Huo Fupeng、Chen Chuantong、Zhang Zheng、Zhang Yicheng、Suetake Aiji、Takeshita Kazutaka、Yamaguchi Yoshiji、Momose Yashima、Zhang Keke、Suganuma Katsuaki
- Journal Title
  
  Journal of Materials Research and Technology
  
  Volume: 31 Pages: 3591-3603
- DOI
  10.1016/j.jmrt.2024.07.071
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging2024
- Author(s)
  Huo Fupeng、Chen Chuantong、Zhang Zheng、Wang Ye、Suetake Aiji、Takeshita Kazutaka、Yamaguchi Yoshiji、Momose Yashima、Suganuma Katsuaki
- Journal Title
  
  Materials & Design
  
  Volume: 240 Pages: 112863-112863
- DOI
  10.1016/j.matdes.2024.112863
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion2024
- Author(s)
  Xu Yuxin、Qiu Xiaoming、Wang Suyu、Huo Fupeng、Su Yutai、Xu Long、Ma Ninshu、Chen Chuantong、Suganuma Katsuaki
- Journal Title
  
  Journal of Alloys and Compounds
  
  Volume: 996 Pages: 174874-174874
- DOI
  10.1016/j.jallcom.2024.174874
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition2024
- Author(s)
  Li Wangyun、Chen Chuantong、Nishijima Masahiko、Ueshima Minoru、Nishikawa Hiroshi、Suganuma Katsuaki
- Journal Title
  
  Materials & Design
  
  Volume: 246 Pages: 113308-113308
- DOI
  10.1016/j.matdes.2024.113308
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of micron-sized Cu-Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests2023
- Author(s)
  Chen Chuantong、Kim Dongjin、Liu Yang、Sekiguchi Takuya、Su Yutai、Long Xu、Liu Canyu、Liu Changqing、Suganuma Katsuaki
- Journal Title
  
  Journal of Materials Research and Technology
  
  Volume: 24 Pages: 8967-8983
- DOI
  10.1016/j.jmrt.2023.05.104
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules2023
- Author(s)
  Xu Yuxin、Qiu Xiaoming、Li Wangyun、Wang Suyu、Ma Ninshu、Ueshima Minoru、Chen Chuantong、Suganuma Katsuaki
- Journal Title
  
  Journal of Materials Research and Technology
  
  Volume: 26 Pages: 1079-1093
- DOI
  10.1016/j.jmrt.2023.07.254
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Large-scale bare Cu bonding by 10μm-sized Cu-Ag composite paste in low temperature low pressure air conditions2023
- Author(s)
  Chen Chuantong、Zhao Shuaijie、Sekiguchi Takuya、Suganuma Katsuaki
- Journal Title
  
  Journal of Science: Advanced Materials and Devices
  
  Volume: 8 Issue: 3 Pages: 100606-100606
- DOI
  10.1016/j.jsamd.2023.100606
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures2023
- Author(s)
  Li W.Y.、Chen C.T.、Ueshima M.、Kobatake T.、Suganuma K.
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 150 Pages: 115105-115105
- DOI
  10.1016/j.microrel.2023.115105
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Fatigue-Resistant of Ag Sinter Joining on Ni-P/Pd/Au Finished DBA Substrate with Thick Ni-P Layer During Thermal Shock Test2022
- Author(s)
  Chuantong Chen，Katsuaki Suganuma
- Journal Title
  
  ECS Transactions
  
  Volume: 108 Pages: 21-26
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022
- Author(s)
  Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
- Journal Title
  
  China Welding
  
  Volume: 31 Pages: 15-21
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022
- Author(s)
  Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
- Journal Title
  
  China welding
  
  Volume: 31 Pages: 15-21
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock2022
- Author(s)
  Liu Yang、Chen Chuantong、Zhang Zheng、Ueshima Minoru、Sakamoto Takeshi、Naoe Takuya、Nishikawa Hiroshi、Oda Yukinori、Suganuma Katsuaki
- Journal Title
  
  Materials & Design
  
  Volume: 224 Pages: 111389-111389
- DOI
  10.1016/j.matdes.2022.111389
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release2020
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Journal Title
  
  Scientific reports
  
  Volume: 10 Issue: 1 Pages: 9042-9042
- DOI
  10.1038/s41598-020-66069-8
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19K15046
[Patent] 接合材及び該接合材を用いた接合方法2024
- Inventor(s)
  陳伝トウ
- Industrial Property Rights Holder
  陳伝トウ
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2024-053244
- Filing Date
  2024
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 金属シート2024
- Inventor(s)
  陳伝トウ,上島稔
- Industrial Property Rights Holder
  陳伝トウ,上島稔
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2023-068159
- Filing Date
  2024
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 放熱構造体の製造方法2024
- Inventor(s)
  CHEN　CHUANTONG、小林　幸司
- Industrial Property Rights Holder
  CHEN　CHUANTONG、小林　幸司
- Industrial Property Rights Type
  特許
- Filing Date
  2024
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 合金粉末含有組成物、及び半導体装置2023
- Inventor(s)
  CHEN　CHUANTONG、劉洋、直永卓也、上島稔、坂本健志
- Industrial Property Rights Holder
  CHEN　CHUANTONG、劉洋、直永卓也、上島稔、坂本健志
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 金属シート2023
- Inventor(s)
  CHEN　CHUANTONG、上島　稔、下山　章夫
- Industrial Property Rights Holder
  CHEN　CHUANTONG、上島　稔、下山　章夫
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 劣化診断方法および劣化診断装置2023
- Inventor(s)
  CHEN　CHUANTONG、菅沼克昭、柳田憲史、増澤高志
- Industrial Property Rights Holder
  CHEN　CHUANTONG、菅沼克昭、柳田憲史、増澤高志
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 低温焼結性接合用材料および接合構造体2023
- Inventor(s)
  CHEN　CHUANTONG、劉　洋、上島　稔
- Industrial Property Rights Holder
  CHEN　CHUANTONG、劉　洋、上島　稔
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 表面改質低温焼結接合金属2023
- Inventor(s)
  陳伝とう
- Industrial Property Rights Holder
  陳伝とう
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Acquisition Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] 銀の複合実装材料の開発による高信頼パワーモジュール構造設計2024
- Author(s)
  Chuantong Chen
- Organizer
  一般社団法人日本接着学会
- Invited
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development Cu-Ag composite sinter paste for low temperature bonding of SiC power Device2024
- Author(s)
  Chuantong Chen
- Organizer
  2024 International Conference on Brazing, Diffusion Bonding and Micro-Nano Joining (BDB-MNJ 2024)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Sintering materials for high reliability SiC power modules2024
- Author(s)
  Chuantong Chen
- Organizer
  China-Japan Forum on the Development of Electrical Materials
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Improvement of Bonding Strength for Ag Sinter Joining Direct on Al Heatsink in SiC Power Module2024
- Author(s)
  Chuantong Chen, Katsuaki Suganuma, Koji Kobayashi
- Organizer
  2024 25th International Conference on Electronic Packaging Technology (ICEPT)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules2024
- Author(s)
  Fupeng Huo, Chuantong Chen, Zheng Zhang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma
- Organizer
  2024 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of low temperature Ag-Si composite paste sintering material for high-reliability SiC power modules2024
- Author(s)
  Chuantong Chen
- Organizer
  18th International Conference Reliability and StressRelated Phenomena in Nanoelectronics (ISMP-IRSP 2024)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] 銀粒子焼結接合と新規実装材料の開発による高信頼パワーモジュール構造設計2024
- Author(s)
  Chuantong Chen
- Organizer
  ナノインク懇話会2024総会・第46回例会
- Invited
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] New interconnect material for high-reliability SiC power modules2024
- Author(s)
  Chuantong Chen
- Organizer
  2024 25th International Conference on Electronic Packaging Technology (ICEPT)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Low temperature Ag sinter joining on different metal surface and interface formation mechanism2024
- Author(s)
  Chuantong Chen
- Organizer
  The 9th International Conference on Surface and Interface of Materials (SIM 2025)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Bare Cu Bonding by Cu-Ag Composite Paste in Low Temperature Low Pressure Air Sintering2024
- Author(s)
  Chuantong Chen, Takuya Sekiguchi, Katsuaki Suganuma
- Organizer
  2024 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] 銀焼結接合と新実装材料の開発、構造信頼性評価2024
- Author(s)
  Chuantong Chen
- Organizer
  技術情報協会講習会
- Invited
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel Al/AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions2023
- Author(s)
  C Chen; Y Liu; M Ueshima; K Suganuma
- Organizer
  2023 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] "(Invited Keynote) Progress of Ag paste sinter joining in WBG power modules "2023
- Author(s)
  C Chen
- Organizer
  The 9th International Forum on Wide Bandgap Semiconductors (IFWS 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Simulation of morphology evolution and pore segregation of Ag sinter joint at high temperature2023
- Author(s)
  Y Wang; C Chen; G Fu; B Wan; K Suganuma
- Organizer
  2023 24th International Conference on Electronic Packaging Technology (ICEPT)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of Ag-Si composite paste joining for high thermal reliability in SiC power module2023
- Author(s)
  C Chen; Y Liu; M Ueshima; K Nakayama; K Suganuma
- Organizer
  Materials Research Society of Japan (MRS-J)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] (Invited Keynote)Progress of Ag sinter joining technology in SiC power modules2023
- Author(s)
  C Chen
- Organizer
  9th International Conference on Welding Science and Engineering (WSE 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Phase Formation and Transformation Behavior in Rapidly Solidified Ag-Si Alloys2023
- Author(s)
  Yicheng Zhang; Koji Nakayama; Chuantong Chen; Minoru Ueshima; Katsuaki Suganuma
- Organizer
  TMS 2024 Annual Meeting & Exhibition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] High reliability design Ag sinter joining on softened Ni-P/Pt/Ag metallization substrate during harsh thermal cycling2023
- Author(s)
  C Chen; Y Liu; W Li; F Huo; M Ueshima; T Sakamoto; Y Oda,K Suganuma
- Organizer
  2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate2023
- Author(s)
  C Chen; R Liu; K Kobayashi; H Osanai; Z Zhang; K Suganuma
- Organizer
  2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions2023
- Author(s)
  Chuantong Chen , Yang Liu, Minoru Ueshima, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Rapid silver sinter joining technology for large area chips2023
- Author(s)
  Luobin Zhang,Chuantong Chen, Fupeng Huo, Wangyun Li, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging2023
- Author(s)
  C Chen; Y Liu; W Li; M Ueshima; K Nakayama; K Suganuma
- Organizer
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] "(Invited Keynote) Ag sinter joining and beyond Ag sinter joining technologies for WEB power device in high temperature applications "2023
- Author(s)
  C Chen
- Organizer
  2023 24th International Conference on Electronic Packaging Technology (ICEPT)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules2022
- Author(s)
  Chuantong Chen, Zheng Zhang, Yang Liu, Katsuaki Suganuma
- Organizer
  2022 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules2022
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel approach of die attach technology for SiC power module by pure Al thin film bonding2021
- Author(s)
  Chuantong Chen,Katsuaki Suganuma
- Organizer
  2021 International Conference on Electronics Packaging
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] SiCパワーモジュール向けの新型アルミ膜ダイアタッチ接合技術2020
- Author(s)
  陳伝とう;・菅原徹・菅沼克昭
- Organizer
  第 33 回（2020 年）セラミックス秋季シンポジウム
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] Die attach module by Cu sheet interconnect for high temperature applications2019
- Author(s)
  Chuantong Chen, Dongjin Kim, Zheng Zhang, Katsuaki Suganuma
- Organizer
  20th International Conference on Electronic Materials and Packaging (EMAP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046

CHEN CHUANTONG 陳 伝とう

Chen Chuantong 陳 伝とう

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Development of low-temperature low-pressure large-area bonding technology by high heat-resistant and high-heat dissipation Ag solid porous materialsPrincipal Investigator

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Development of low temperature low pressure large area heat resistant bonding technologyPrincipal Investigator

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[Book] 次世代パワーデバイスに向けた実装材料、技術と熱対策-第3章第7節2024

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[Book] Sic Power Module Design: Performance, Robustness and Reliability2022

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[Journal Article] Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections2025

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[Journal Article] Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature2025

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[Journal Article] Oxidation-free silver porous sheet bonding onto a bare copper substrate in air2025

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[Journal Article] Low temperature Al/AlN joint by Ag sinter paste from 180°C: Interface formation and joint reliability2025

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[Journal Article] Decomposition and sintering behaviors of MOD-assisted Ag pastes for power electronics2025

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[Journal Article] Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability2024

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[Journal Article] Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation2024

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[Journal Article] Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module2024

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[Journal Article] Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations2024

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[Journal Article] Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties2024

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[Journal Article] Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging2024

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CHEN CHUANTONG 陳伝とう

Chen Chuantong 陳伝とう