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趙 帥捷  チョウ スイショウ

ORCIDConnect your ORCID iD *help
Researcher Number 70899244
Other IDs
Affiliation (based on the past Project Information) *help 2023: 大阪大学, 産業科学研究所, 特任研究員(常勤)
Review Section/Research Field
Principal Investigator
Basic Section 26030:Composite materials and interfaces-related
Keywords
Principal Investigator
異相界面 / パワーモジュール / エポキシ樹脂封止 / 金属樹脂接合 / 異材接合 / 異材界面 / 銅拡散 / 信頼性 / パワー半導体 / 銅エポキシ樹脂接合
  • Research Projects

    (1 results)
  • Research Products

    (1 results)
  •  Elucidation of epoxy encapsulation interface degradation mechanism in various environments for next-generation power modulesPrincipal Investigator

    • Principal Investigator
      趙 帥捷
    • Project Period (FY)
      2023
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Osaka University

All 2023

All Patent

  • [Patent] 積層体2023

    • Inventor(s)
      芳我基治、趙帥捷
    • Industrial Property Rights Holder
      株式会社ダイセル、国立大学法人大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2023
    • Data Source
      KAKENHI-PROJECT-23K13559

URL: 

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