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NASSHO Yasuka  納所 泰華

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… Alternative Names

納所 泰華  ナッショ ヤスカ

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Researcher Number 90906596
Other IDs
Affiliation (Current) 2026: 富山県立大学, 工学部, 講師
Affiliation (based on the past Project Information) *help 2023 – 2024: 富山県立大学, 工学部, 助教
Review Section/Research Field
Principal Investigator
Basic Section 18010:Mechanics of materials and materials-related
Keywords
Principal Investigator
有限要素解析 / 複合材料 / 体積抵抗率 / ナノフィラー / 自己修復 / 熱伝導率 / マイクロカプセル / 熱伝導性フィラー / ポリマー系複合材料 / 材料試験
  • Research Projects

    (1 results)
  • Research Products

    (4 results)
  •  自己修復性付与による高分子系放熱材料の長期信頼性向上Principal Investigator

    • Principal Investigator
      納所 泰華
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 18010:Mechanics of materials and materials-related
    • Research Institution
      Toyama Prefectural University

All 2024

All Presentation

  • [Presentation] マイクロカプセルを用いた自己修復高分子系複合材料の熱伝導性・電気絶縁性の評価2024

    • Author(s)
      納所泰華・真田和昭・寺田光希
    • Organizer
      日本機械学会北陸信越支部2024年合同講演会
    • Data Source
      KAKENHI-PROJECT-23K13223
  • [Presentation] Thermal Conductivity and Self-healing Under Thermal Cycling of Alumina/Epoxy Resin Composites Containing Microcapsules2024

    • Author(s)
      Yasuka Nassho・Kazuaki Sanada・Hiroki Koyama・Koki Terada
    • Organizer
      13th Asian-Australian Conference on Composite Materials
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13223
  • [Presentation] 自己修復性を有するアルミナ/エポキシ樹脂複合材料の熱伝導率に及ぼすマイクロカプセル含有量と粒径の影響2024

    • Author(s)
      納所 泰華・真田 和昭・小山 紘生・寺田 光希
    • Organizer
      日本機械学会 機械材料・材料加工部門 第31回機械材料・材料加工技術講演会
    • Data Source
      KAKENHI-PROJECT-23K13223
  • [Presentation] Thermal Conductivity and Electrical Insulation Property Evaluation of Self-Healing Alumina/Epoxy Resin Composites Using Microcapsules2024

    • Author(s)
      Yasuka Nassho・Kazuaki Sanada ・Koki Terada
    • Organizer
      9th International Conference on Self-Healing Materials
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13223

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