Yasuda Kiyokazu 安田清和

… Alternative Names

YASUDA Kiyokazu 安田清和

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Researcher Number	00210253
Other IDs	https://orcid.org/0000-0003-4998-1316
Affiliation (Current)	2024: 大阪大学, 大学院工学研究科, 講師
Affiliation (based on the past Project Information) *help	2010: 名古屋大学, 大学院・工学研究科, 講師 2009 – 2010: Nagoya University, 工学研究科, 講師 2009: 大阪大学, 工学研究科, 講師 2007 – 2008: 大阪大学, 大学院・工学研究科, 講師 1999 – 2002: 大阪大学, 大学院・工学研究科, 助手 … More 1995 – 1996: 大阪大学, 工学部, 助手 1989 – 1993: 大阪大学, 工学部, 助手 1989: 大坂大学, 工学部, 助手 Less
Review Section/Research Field	Principal Investigator Material processing/treatments / 溶接工学 / Material processing/treatments Except Principal Investigator 溶接工学 / 電子デバイス・機器工学 / Material processing/treatments / Microdevices/Nanodevices
Keywords	Principal Investigator STM / マイクロ接合 / 微細加工 / 走査型トンネル顕微鏡 / Contact angle / Solderability / Surface mount / Solder paste / Reflow soldering / Wetting balance method … More / Micro soldering / Wettability / リフローソルダリング / 接触角 / ソルダビリティ / 表面実装 / ソルダペースト / リフローワルダリング / ウェッティングバランス法 / マイクロソルダリング / ぬれ性評価 / Silicon / Surface modification / Field evaporation / Scanning tunneling microscope / Microjoining / Microfabrication / 有機金属錯体 / マイクロクラスタ- / LB膜 / シリコン / 表面加工 / 電界蒸発 / 極微細接合 / 極微細加工 / 電子材料 / レプリケーション / 自己集積 / ナノ材料 / 材料加工・処理 / 高密度実装 / はんだ / 自己組織化 / 自己形成 / 表面張力 / ぬれ / 微細接続 / 微細接合 / マイクロ加工 / メゾスコピックラスター / 電解蒸発 … More Except Principal Investigator 高精度位置決め / STS / STM / デバイス実装 / High Accurate Positioning / Surface Tension / Adhesion / Assembly of Optical Device / Device Asembly / Self-Alignment / Self-Organizing / 表面張力 / 樹脂接続 / 光素子実装 / セルフアライメント / 自己整合型実装 / loading control / TAB (Tape Automated Bonding) / pattern matching / binarizing / variance of gray level / separative viewing method / vision system / hight accurate positioning / シングルポイントTAB接合 / ステレオ視 / 高精度位置計測 / 視覚計測 / 超微細接合 / 加圧制御 / TAB接合 / パターンマッチング / 二値化 / 輝度分散値 / 視野分離撮像法 / 視覚システム / Adhesion Evaluation / microjoining / CVD process / Diamond Film / electrtoplating / Interconnection / 界面評価 / スクラッチ・テスト / 薄膜密着性評価方法 / CVD法 / トンネル電流特性 / めっきプロセス / STS分析 / 走査形トンネル顕微鏡 / 界面プロセス / 薄膜付着性評価法 / マイクロ接合 / 電子照射形CVD法 / ダイヤモンド薄膜 / 薄膜形成 / 界面接合プロセス / アンダーフィル / フリップチップ接合 / フリップチップ実装 / 粘性流体 / 溶融凝集 / 金属フィラー / 自己組織化 / 高密度実装 / スリットレ-ザ投光三角測量 / ハンドアイシステム / ハフ変換 / 楕円抽出 / 直線抽出 / 位置計測 / 知的複合視覚システム Less

Clarification and Emergence of Self-replication Phenomena in Microelectronic MaterialsPrincipal Investigator
- Principal Investigator
  
  YASUDA Kiyokazu
- Project Period (FY)
  2008 – 2010
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Clarification of Coalescence Mechanism of Metal Fillers in Self-Organization Assembly Process
- Principal Investigator
  
  FUJIMOTO Kozo
- Project Period (FY)
  2007 – 2009
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Microdevices/Nanodevices
- Research Institution
  Osaka University
Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device
- Principal Investigator
  
  FUJIMOTO Kozo
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  OSAKA UNIVERSITY
Evaluation of Wettability for Microelectronics Materials Based on Dynamic Wetting ModelPrincipal Investigator
- Principal Investigator
  
  YASUDA Kiyokazu
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Study on Vision System for High Accurate Positioning and Process Control in Micro-Joining
- Principal Investigator
  
  FUJIMOTO Kozo
- Project Period (FY)
  1995 – 1996
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
電界誘起によるメゾスコピック表面微細加工Principal Investigator
- Principal Investigator
  
  安田清和
- Project Period (FY)
  1993
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Microfabrication and Joining by Field Evaporation MechanismPrincipal Investigator
- Principal Investigator
  
  YASUDA Kiyokazu
- Project Period (FY)
  1991 – 1992
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  溶接工学
- Research Institution
  Osaka University
マクロ視角とミクロ視角の協調による溶接ロボットの知的複合視角システムの研究開発
- Principal Investigator
  
  FUJIMOTO Kozo
- Project Period (FY)
  1989
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  溶接工学
- Research Institution
  Osaka University
Interconnection process of the thin film and its evaluation
- Principal Investigator
  
  NAKATA Shuji
- Project Period (FY)
  1989 – 1991
- Research Category
  
  Grant-in-Aid for General Scientific Research (A)
- Research Field
  
  溶接工学
- Research Institution
  Osaka University

All 2011 2010 2009 2008 2007

All Journal Article Presentation

[Journal Article] Sn-Biはんだ粒子-シリコーン混合系による自己形成マイクロバンブの観察2011
- Author(s)
  雨森則人, 安田清和, 高井治
- Journal Title
  
  第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 17
  
  Pages: 253-256
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20560671
[Journal Article] Self-replicating process for micro interconnect array pattern using solder/polymer hybrid materials, Transactions on Components2011
- Author(s)
  安田清和
- Journal Title
  
  Packaging and Manufacturing technology (accepted)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20560671
[Journal Article] Self-replicating process for micro interconnect array pattern using solder/polymer hybhd materials2011
- Author(s)
  Kiyokazu Yasuda
- Journal Title
  
  Transactions on Components, Packaging and Manufacturing Technology
  
  Volume: in press
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20560671
[Journal Article] Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process2009
- Author(s)
  K. Ohta, K. Yasuda, M. Matsushima, K. Fujimoto
- Journal Title
  
  Journal of Physics: Conference Series Vol.165
  
  Pages: 12047-12047
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects by Self-organization Assembly2009
- Author(s)
  K. Ohta, K. Yasuda, M. Matsushima, K. Fujimoto
- Journal Title
  
  International Conference on Electronics Packaging 2009
  
  Pages: 939-942
- NAID
  130005469417
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] 自己組織化実装法におけるソルダフィラー合一性に及ぼす酸化膜と樹脂の活性作用の影響2009
- Author(s)
  大田皓之, 戸屋正雄, 安田清和, 松嶋道也, 藤本公三
- Journal Title
  
  電子情報通信学会和文論文誌C Vol.J92-C,No.12
- NAID
  110007482158
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process2009
- Author(s)
  Kiyokazu Yasuda
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering 3
  
  Pages: 1356-1362
- NAID
  130000147526
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20560671
[Journal Article] Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process2009
- Author(s)
  安田清和
- Journal Title
  
  J.Solid Mechanics and Materials Engineering 3,12
  
  Pages: 1356-1362
- NAID
  130000147526
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20560671
[Journal Article] Observation of Solder Fillers Coalescence in Resin for Development of Self-Organization Assembly Process2008
- Author(s)
  K. Ohta, M. Toya, K. Yasuda, M. Matsushima, K. Fujimoto
- Journal Title
  
  e-Proceedings of the 33rd International Electronics Manufacturing Technology Conference No.C5.1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] 自己組織化実装法におけるソルダ微粉の流動メカニズム2008
- Author(s)
  大田皓之, 戸屋正雄, 安田清和, 藤本公三
- Journal Title
  
  14th Symposium on "Microjoining and Assembly Technology on Electronic
  
  Pages: 207-212
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] 自己組織化実装法における樹脂の活性度と実装性の関係2008
- Author(s)
  戸屋正雄, 大田皓之, 元重慎市, 安田清和, 松嶋道也, 藤本公三
- Journal Title
  
  14th Symposium on "Microjoining and Assembly Technology on Electronics
  
  Pages: 201-206
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] 自己組織化実装法による導電路形成過程の数値解析2007
- Author(s)
  大田皓之, 戸屋正雄, 元重慎市, 安田清和, 松嶋道也, 藤本公三
- Journal Title
  
  第17回マイクロエレクトロニクスシンポジウム論文集
  
  Pages: 59-64
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Journal Article] Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamic2007
- Author(s)
  K. Ohta, K. Yasuda, M. Matsushima,, K. Fujimoto
- Journal Title
  
  Solid State Phenomena Vol.124-126
  
  Pages: 543-546
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19201027
[Presentation] はんだ-高分子ハイブリッド材によるマイクロ接続のための自己形成プロセス2011
- Author(s)
  安田清和
- Organizer
  第25回エレクトロニクス実装学会講演大会
- Place of Presentation
  横浜国立大学(横浜市)
- Year and Date
  2011-03-10
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] はんだ-高分子ハイブリッド材によるマイクロ接続のための自己形成プロセス2011
- Author(s)
  安田清和
- Organizer
  第25回エレクトロニクス実装学会講演大会
- Place of Presentation
  横浜国立大学(神奈川県)
- Year and Date
  2011-03-10
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] 低融点はんだ-高分子混合系における巨視的自己形成プロセスの解析2010
- Author(s)
  雨森則人, 高井治, 安田清和
- Organizer
  第20回マイクロエレクトロニクスシンポジウム
- Place of Presentation
  立命館大学(草津市)
- Year and Date
  2010-09-10
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Micro Bump Formation by Self-Replication Method2010
- Author(s)
  安田清和
- Organizer
  International Conference on Electronics Packaging 2010 (ICEP2010)
- Place of Presentation
  Sapporo
- Year and Date
  2010-05-13
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials2010
- Author(s)
  安田清和
- Organizer
  The 60th Electronic (3 Components & Technology Conference 2010 (ECTC2010)
- Place of Presentation
  Las Vegas
- Year and Date
  2010-06-04
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Smart Processing for Micro Interconnects by Self-Replication2010
- Author(s)
  安田清和
- Organizer
  Proceedings of Materials Science and Technology (MS&T2010)
- Place of Presentation
  Houston
- Year and Date
  2010-10-21
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Process Design of Self-Replication for Micro Bump Formation2010
- Author(s)
  安田清和
- Organizer
  IEEE CPMT Symposium Japan (10th VLSI Packaging Workshop in Japan)
- Place of Presentation
  Tokyo
- Year and Date
  2010-08-25
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Solder Filler Motion Driven by Surface Tension in Self-Organization Assembly Process2009
- Author(s)
  Kiyokazu Yasuda
- Organizer
  ASMP2009 and RAMM2009
- Place of Presentation
  ペナン(マレーシア)
- Year and Date
  2009-06-03
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects by Self-organization Assembly2009
- Author(s)
  (2)K. Ohta, K. Yasuda, K. Fujimoto
- Organizer
  International Conference on Electronics Packaging (ICEP 2009)
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-19201027
[Presentation] Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects2009
- Author(s)
  K.Ohta, K.Fuiimoto, M.Matsushima, K.Yasuda
- Organizer
  International Conference on Electronics Packaging 2009 (ICEP2009)
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Movement of Solder Fillers due to Unevenness of Interfacial Tension in Self-Organization Assembly Process2008
- Author(s)
  K. Ohta, K. Yasuda, K. Fujimoto
- Organizer
  International Conference on Advanced Structural and Functional Materials Design
- Place of Presentation
  Osaka
- Year and Date
  2008-11-01
- Data Source
  KAKENHI-PROJECT-19201027
[Presentation] Effect of Fluxing Activation on the Format on of Bubbles in Self-Organization Joining2008
- Author(s)
  Kiyokazu Yasuda
- Organizer
  8th International Welding Symposium
- Place of Presentation
  Kyoto
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] 可融金属微粒子含有樹脂による自己組織化導電性接着2008
- Author(s)
  安田清和
- Organizer
  日本接着学会第46回年次大会
- Place of Presentation
  大阪
- Year and Date
  2008-06-27
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Effect of Fluxing Activation on the Formation of Bubbles in Self-Organization Joining (invited)2008
- Author(s)
  Kiyokazu Yasuda, Masao Toya, Michiva Matsushima, Kozo Fuiimoto
- Organizer
  The 8th International Welding Symposium
- Place of Presentation
  Kyoto
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-20560671
[Presentation] Effect of Bubble Generation on Self-organization Joining2007
- Author(s)
  Kiyokazu Yasuda
- Organizer
  The Second International Symposium on Smart Processing Technology
- Place of Presentation
  Osaka
- Data Source
  KAKENHI-PROJECT-19201027
[Presentation] Effect of Bubble Generation on Self-Organization Joining2007
- Author(s)
  K. Yasuda, S. Motoshige, M. Matsushima, K. Fujimoto
- Organizer
  The Second International Symposium on Smart Processing Technology
- Place of Presentation
  Osaka
- Data Source
  KAKENHI-PROJECT-19201027

1. FUJIMOTO Kozo (70135664)

# of Collaborated Projects: 9 results

# of Collaborated Products: 11 results
2. NAKATA Shuji (90029075)

# of Collaborated Projects: 6 results

# of Collaborated Products: 0 results
3. IWATA Yoshiharu (30263205)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
4. MATSUSHIMA Michiya (90403154)

# of Collaborated Projects: 2 results

# of Collaborated Products: 10 results
5. FUKUMOTO Sinji (60275310)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Yasuda Kiyokazu 安田 清和

YASUDA Kiyokazu 安田 清和

Research Projects

Research Products

Co-Researchers

Clarification and Emergence of Self-replication Phenomena in Microelectronic MaterialsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Clarification of Coalescence Mechanism of Metal Fillers in Self-Organization Assembly Process

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Evaluation of Wettability for Microelectronics Materials Based on Dynamic Wetting ModelPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Study on Vision System for High Accurate Positioning and Process Control in Micro-Joining

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

電界誘起によるメゾスコピック表面微細加工Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Microfabrication and Joining by Field Evaporation MechanismPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

マクロ視角とミクロ視角の協調による溶接ロボットの知的複合視角システムの研究開発

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Interconnection process of the thin film and its evaluation

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Sn-Biはんだ粒子-シリコーン混合系による自己形成マイクロバンブの観察2011

Author(s)

Journal Title

Data Source

[Journal Article] Self-replicating process for micro interconnect array pattern using solder/polymer hybrid materials, Transactions on Components2011

Author(s)

Journal Title

Data Source

[Journal Article] Self-replicating process for micro interconnect array pattern using solder/polymer hybhd materials2011

Author(s)

Journal Title

Data Source

[Journal Article] Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process2009

Author(s)

Journal Title

Data Source

[Journal Article] Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects by Self-organization Assembly2009

Author(s)

Journal Title

NAID

Data Source

Yasuda Kiyokazu 安田清和

YASUDA Kiyokazu 安田清和