SHIBUTANI TADAHIRO 澁谷忠弘

… Alternative Names

SHIBUTANI Tadahiro 澁谷忠弘

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Researcher Number	10332644
Other IDs
External Links
Affiliation (Current)	2025: 横浜国立大学, 総合学術高等研究院, 教授
Affiliation (based on the past Project Information) *help	2019 – 2021: 横浜国立大学, 先端科学高等研究院, 教授 2015 – 2018: 横浜国立大学, リスク共生社会創造センター, 准教授 2017: 横浜国立大学, 工学(系)研究科(研究院), 助手 2015: 横浜国立大学, 学内共同利用施設等, 准教授 2014: 横浜国立大学, 安心・安全の科学研究教育センター, 准教授 … More 2009 – 2013: Yokohama National University, 環境情報研究院, 准教授 2012: 横浜国立大学, 大学院・環境情報研究院, 准教授 2008: Yokohama National University, 大学院工学研究院, 特別研究教員 2007 – 2008: Yokohama National University, Division of System Research, Research Associate 2005 – 2006: 横浜国立大学, 大学院工学研究院, 助手 2005: Yokohama National University, Faculty of Engineering, Research Associate, 大学院・工学研究院, 助手 2004: 国立大学法人横浜国立大学, 大学院・工学研究院, 助手 2002 – 2003: 横浜国立大学, 大学院・工学研究院, 助手 2001: 横浜国立大学, 工学研究院, 助手 Less
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials / Basic Section 18010:Mechanics of materials and materials-related / Materials/Mechanics of materials Except Principal Investigator Materials/Mechanics of materials / Design engineering/Machine functional elements/Tribology / Materials/Mechanics of materials / Basic Section 18030:Design engineering-related / Social systems engineering/Safety system
Keywords	Principal Investigator 原子輸送 / 微小欠陥 / 応力 / 薄膜 / 界面強度 / 高加速限界試験 / 複合負荷 / 熱衝撃 / ランダム振動 / 材料強度 … More / 六自由度振動 / HALT / 損傷モデル / 振動疲労 / 熱サイクル疲労 / 接合強度 / 構造信頼性 / 添加元素 / 欠陥 / ナノ応力場 / ナノ材料強度 / モニタリング / 破壊予知 / 錫めっき / 界面破壊 / めっき / ウィスカ / 欠陥成長 / 高温破壊 / 微視組織変化 / 錫ウィスカ / クリープ / 微細組織 / 高温強度 / 金属薄膜 / LSI / 界面はく離じん性 / せん断はく離強度 / 界面はく離 / ナノ薄膜 / 破壊力学 / マイクロテスティング / 界面端はく離じん性 / せん断モードはく離 / 開口モードはく離 / サブミクロン薄膜 / LSI配線 … More Except Principal Investigator マルチ破壊モード / 界面破壊 / 炭素繊維強化プラスチック / 曲率線 / 形状モデリング / Finite Element Method / 有限要素法 / Fatigue Life / Low-cycle fatigue / 耐震裕度 / 低サイクル疲労 / 耐震安全裕度 / 経年配管 / Solder Joints / はんだ接合 / Electronics packaging / 信頼性設計 / 鉛フリーはんだ / 疲労破壊 / 破壊モード制御 / マイクロ多層構造 / 電子実装 / 疲労 / CFRP / 炭素繊維強化樹脂 / 炭素繊維配置方向 / B-spline / 自由曲面 / L-RTM法 / VaRTM法 / ストレッチ線 / 応力線 / ツールパス / 刺しゅう機 / 炭素繊維教科プラスチック / 安心安全科学 / リスク管理学 / 社会実装 / リスクマネジメント / 安全安心科学 / 政策科学 / レギュラトリ科学 / Strain Measurement / Creep / Multi-axial stresses / 3D-Packaging Technology / 弾塑性クリープ / 熱サイクル疲労 / 電子デバイス / ひずみ計測 / 疲労寿命則 / クリープ / 多軸応力 / 3次元実装技術 / Elasto-plastic Analysis / Life to Failure / Ratchet / Wall Thinning / Low-cycle Fatigue / Risk Assessment to Seismic Load / Aged Piping System / 設計基準 / 振動応答 / 経年劣化 / モード解析 / 弾塑性応答 / 加震試験 / 弾塑性 / 破損寿命 / ラチェット変形 / 部分減肉 / 低サイクル疲労評価 / 経年配管システム / Plasticity / Dynamic analysis / Ratcheting / Multi-fracture mode / Seismic Loading / Degraded Piping / 安全係数 / 低サイクル疲労寿命 / 振動解析 / 影響関数法 / 減肉配管 / 原子力配管 / 非線形振動 / ラチェット / 機械力学・振動 / 機械材料・材料力学 / 原子力配管系 / 耐震 / 疲労寿命評価 / 非弾性解析 / 配管系動解析 / 延性消耗 / Database for Fatigue Life / Response Surface Method / Clustering analysis / Influence of the design factors / Integrated Reliability Design / Reliability Evaluation / ばらつき評価 / 設計支援システム / 統計的設計支援システム / 熱疲労破壊 / 多層薄膜 / 3次元実装 / 統計的最適化 / マイクロはんだ接合 / 構造信頼性 / 3次元実装工学 / 疲労寿命データーベース / 応答曲面 / クラスタリング / 影響度解析 / 総合信頼性設計 / 信頼性評価 / Reliability design / Intermetallic compound / Lead-free solder / Thermal fatigue / Interfacial fracture / Fracture control / Multilayer structure / 金属間化合物 / 幾何処理 / 曲面曲率コントロール / Isogeometric解析 / 衝撃緩衝装置 / コルゲート管 / isogeometric解析 / 曲率制御 / 反復幾何処理 / 計算力学 / 信頼性 / 接合技術 / その場観察 / 非破壊評価 / 疲労損傷 / 損傷評価 / 応力集中 / 回折強度 / 微小部測定 / 応力測定 / 高エネルギー / 応力 / 微小部 / 損傷 / 材料評価 / 白色X線 / 界面端はく離じん性 / フリーエッジ効果 / マイクロテスティング / 破壊力学 / 界面強度 / ダマシンプロセス / 先端LSI配線 / サブミクロン薄膜 Less

Structural reliability of micro joints subjected to six degrees of freedom random vibration and thermal shockPrincipal Investigator
- Principal Investigator
  
  Shibutan Tadahiro
- Project Period (FY)
  2019 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Yokohama National University
Fabrication of doubly-curved CFRP shell structures by tailored fiber placement embroidery machines
- Principal Investigator
  
  Maekawa Takashi
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 18030:Design engineering-related
- Research Institution
  Waseda University
  Yokohama National University
Societal implementation of technological systems with safety sciences based on regulatory science and policy science
- Principal Investigator
  
  Miyake Atsumi
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Social systems engineering/Safety system
- Research Institution
  Yokohama National University
Development of CFRP forming based on principal strips and its applications
- Principal Investigator
  
  Maekawa Takashi
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Design engineering/Machine functional elements/Tribology
- Research Institution
  Yokohama National University
Three dimensional surface by using nano-scale stress field induced by addition of elementsPrincipal Investigator
- Principal Investigator
  
  Shibutani Tadahiro
- Project Period (FY)
  2014 – 2015
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Suface curvature control by iterative geometric algorithm and its application to isogeometric analysis
- Principal Investigator
  
  MAEKAWA Takashi
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Design engineering/Machine functional elements/Tribology
- Research Institution
  Yokohama National University
Crystallographic damage evaluation and life prediction in the fatigue process using high energy white X-rays
- Principal Investigator
  
  AKINIWA Yoshiaki
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
A Study on education system for packaging reliability of next generation Sic power device.
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Digital monitoring for prognostics to defects due to atomic migrationPrincipal Investigator
- Principal Investigator
  
  SHIBUTANI Tadahiro
- Project Period (FY)
  2009 – 2010
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Damage mechanism of thin film at elevated temperature due to atomic migration and evolution of microstructurePrincipal Investigator
- Principal Investigator
  
  SHIBUTANI Tadahiro
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Risk Assessment and Design Criteria ofAged Piping System under Seismir Load
- Principal Investigator
  
  SHIRATARI Masaki
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Advanced Assessment Methodology of Lead-free Solder Joints under Multi-loads in Three-dimensional Electronic Packaging
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Study on Evaluation Method for Safety Margin of Degraded Piping Against Seismic Loading with Multi-Fracture Mode
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Integrated Reliability Evaluation and Design for Advanced 3D Electronics Packaging
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2003 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
ダマシンプロセス技術を利用したサブミクロン構造物の界面強度評価法の開発
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Reliability Design and Multi-mode Fracture Control of Micro Joint Structure in Advanced Electronics Packaging
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
多層サブミクロン薄膜のせん断負荷による界面端はく離発生機構の解明Principal Investigator
- Principal Investigator
  
  澁谷忠弘
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University

All 2021 2018 2017 2016 2012 2011 2010 2009 2008 2007 2006 2005 2004

All Journal Article Presentation

[Journal Article] Fabrication of doubly-curved CFRP shell structures with control over fiber directions2021
- Author(s)
  Masahito. Takezawa, Yuto Otoguro, Kohei Matsuo, Tadahiro Shibutani, Akio Sakurai, Takashi Maekawa
- Journal Title
  
  Computer-Aided Design
  
  Volume: 136 Pages: 103028-103028
- DOI
  10.1016/j.cad.2021.103028
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H01355
[Journal Article] 曲率線展開法に基づく新たなCFRP 成形技術の開発2018
- Author(s)
  宇佐美陸, 櫻井昭男, 松尾宏平, 竹澤正仁, 鈴木健稔, 飯村峻, 澁谷忠弘, 前川卓
- Journal Title
  
  第9回日本複合材料会議 (JCCM-9)
  
  Volume: -
- Data Source
  KAKENHI-PROJECT-15H03910
[Journal Article] Preliminary hazard identification for qualitative risk assessment on a hybrid gasoline-hydrogen fueling station with an on-site hydrogen production system using organic chemical hydride2016
- Author(s)
  Jo Nakayama, Junji Sakamoto, Naoya Kasai, Tadahiro Shibutani and Atsumi Miyake
- Journal Title
  
  International Journal of Hydrogen Energy
  
  Volume: 41 Issue: 18 Pages: 7518-7525
- DOI
  10.1016/j.ijhydene.2016.03.143
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15J11362, KAKENHI-PROJECT-25282097, KAKENHI-PROJECT-15K12459
[Journal Article] Effect of Grain Size on Pressure Induced Tin Whisker Formation2010
- Author(s)
  Tadahiro Shibutani
- Journal Title
  
  IEEE Transactions on Electronics Packaging & Manufacturing Vol.33, Issue 3
  
  Pages: 177-182
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760068
[Journal Article] Effect of Grain Size on Pressure Induced Tin Whisker Formation2010
- Author(s)
  T.Shibutani
- Journal Title
  
  IEEE Transactions on Electronics Packaging & Manufacturing
  
  Volume: 33 Pages: 177-182
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760068
[Journal Article] 事故統計解析による冷凍設備における事故の要因と問題点2010
- Author(s)
  澁谷忠弘, 赤塚広隆, 小林英男
- Journal Title
  
  高圧ガス
  
  Volume: 47 Pages: 887-896
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360046
[Journal Article] Reliability Evaluation on Deterioration of Power Device Using Coupled Electrica1- Therma1-Mechanical Analysis2010
- Author(s)
  Takashi Anzawa, Qiang Yu, Masanori Yamagiwa Tadahiro Shibutani, Masaki Shiratori
- Journal Title
  
  Journal of Electronic Packaging(ASME JEP)
  
  Volume: 132
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] Reliability Evaluation on Deterioration of Power Device Using CoupledElectrical-Thermal-Mechanical Analysis2010
- Author(s)
  Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, TadahiroShibutani, Masaki Shiratori
- Journal Title
  
  Journal of Electronic Packaging(ASME JEP), 132, Iss.3 Selected Paper(ThETA2)
  
  Volume: v6.132, N.3 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] 事故統計解析による冷凍設備における事故の要因と問題点2010
- Author(s)
  澁谷忠弘,赤塚広隆,小林英男
- Journal Title
  
  高圧ガス
  
  Volume: Vol.47 Pages: 887-896
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360046
[Journal Article] 錫ウィスカ発生における局所成長した金属間化合物の影響2009
- Author(s)
  澁谷忠弘、山下拓馬、于強、白鳥正樹
- Journal Title
  
  エレクトロニクス実装学会誌 12巻、1号
  
  Pages: 53-61
- NAID
  110007021782
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] 錫ウィスカ発生におけるAg添加の影響2009
- Author(s)
  澁谷忠弘
- Journal Title
  
  日本機械学会2009年度次大会講演論文集 No.09-1
  
  Pages: 41-42
- Data Source
  KAKENHI-PROJECT-21760068
[Journal Article] Tin Whisker Reliability in Microelectronics2009
- Author(s)
  T.Shibutani, et.al.
- Journal Title
  
  Micromaterials and Nanomaterials No.9
  
  Pages: 49-53
- Data Source
  KAKENHI-PROJECT-21760068
[Journal Article] Tin Whisker Reliability in Microelectronics2009
- Author(s)
  Tadahiro Shibutani, 他
- Journal Title
  
  Micromaterials and Nanomaterials No.9
  
  Pages: 49-53
- Data Source
  KAKENHI-PROJECT-21760068
[Journal Article] 錫ウィスカ発生における局所成長した金属間化合物の影響2009
- Author(s)
  澁谷忠弘, 他3名
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 53-61
- NAID
  110007021782
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] Pressure induced tin whisker formation2008
- Author(s)
  Tadahiro Shibutani, Qiang Yu, Masaki Shiratori and Michael Pecht
- Journal Title
  
  Microelectronics Reliability Vol. 48, No. 6
  
  Pages: 1033-1039
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] Key reliability concerns with lead-free connectors2008
- Author(s)
  Tadahiro Shibutani, Ji Wu, Qiang Yu and Michael Pect
- Journal Title
  
  Microelectronics Reliability Vol 48, No. 10
  
  Pages: 1613-1627
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] Key Reliability Concern with Lead-free Electronics2008
- Author(s)
  T. Shibutani, 他
- Journal Title
  
  Microelectronics Reliability 48
  
  Pages: 1613-1617
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] Mechanism of Damage Process on Si_3N_4/Cu Interface in Nanoscratch Test2007
- Author(s)
  Shibutani, T.
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering 1
  
  Pages: 322-331
- NAID
  110004999024
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation Method of Interaction Relation between Design Factors And Simple Assessment Approach for BGA Package Reliability2007
- Author(s)
  Kondo, S., Yu, Q., Shibutani, T., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Tin Whiskers: How to Manage and Mitigate the Risks2007
- Author(s)
  T. Shibutani
- Journal Title
  
  Proceedings of the International Symposium on High Density Packaging and Microsystem Integration
  
  Pages: 1-8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls2007
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹
- Journal Title
  
  Journal of Electronic Packaging 129・1
  
  Pages: 71-75
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation Technique for The Failure Life Scatter of Lead-Free Solder Joints in Electronic Device2007
- Author(s)
  Miyauchi, H., Yu, Q., Shibutani, T., Shiratori, M
- Journal Title
  
  Proceedings of the THERMINIC 2007
  
  Pages: 32-37
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Low - cycle fatigue reliability evaluation for lead - free solders in vehicle electronics devices2007
- Author(s)
  Yu, Q., Shibutani, T., Tanaka, A. Koyama, T., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads2007
- Author(s)
  Tosaka, A. Yu, Q., Shibutani, T., Kondo, S., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Delamination Evaluation Approach for Bimaterial Structure Considering Interfacial Layer2007
- Author(s)
  Yu, Q., Shibutani, T., Shiratori, M., Matsuzaki, T., Matsumoto, T
- Journal Title
  
  Proceedings of the 2007 ASME IMECE2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Pressure induced tin whisker formation2007
- Author(s)
  T. Shibutani
- Journal Title
  
  Microelectronics Reliability (掲載予定)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19760060
[Journal Article] A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls2007
- Author(s)
  Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  Journal of Electronic Packaging Vol.129, No.1
  
  Pages: 71-75
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls2007
- Author(s)
  Shibutani, T.
- Journal Title
  
  Journal of Electronic Packaging 129
  
  Pages: 71-75
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Mechanism of Damage Process on Si3N4/Cu Interface in Nanoscratch Test2007
- Author(s)
  Shibutani, T., Yu, Q, Shiratori, M., Akai, T
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering Vol.1, No.3
  
  Pages: 322-331
- NAID
  110004071282
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test2006
- Author(s)
  Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  JSME International Journal, Series A Vol.49, No.3
  
  Pages: 397-402
- NAID
  110004999080
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Easy reliability design approach for solder joint BGA package considering correlation of each design factor2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System
  
  Pages: 900-905
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Stress-Induced Tin Whisker Initiation Under Contact Loading2006
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹他1名
- Journal Title
  
  IEEE Transactions on Electronics Packaging Manufacturing 29・4
  
  Pages: 259-264
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Stress Relaxation Method2006
- Author(s)
  Tanimura, T., Yu, Q., Shibutani, T., Jin, J.C., Shiratori, M
- Journal Title
  
  Proceedings of EMAP 2006
  
  Pages: 658-666
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Stress-Induced Tin Whisker Initiation Under Contact Loading2006
- Author(s)
  Shibutani, T., Yu, Q., Yamashita, T., Shiratori, M
- Journal Title
  
  IEEE Transactions on Electronics Packaging Manufacturing Vol.29, No.4
  
  Pages: 259-264
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Study on Whisker Outbreak on Tin Plating by Contact Force2006
- Author(s)
  Yamashita, T., Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  Proceedings of the 2006 ASME IMECE2006
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Stress-Induced Tin Whisker Initiation Under Contact Loading2006
- Author(s)
  Shibutani, T.
- Journal Title
  
  IEEE Transactions on Electronics Packaging Manufacturing 29
  
  Pages: 259-264
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Modeling with Structure of Resins in Electronic Components2006
- Author(s)
  Yu, Q., Shibutani, T., Shiratori, M., Matsumoto, T
- Journal Title
  
  Proceedings of Therm 2006
  
  Pages: 107-111
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Easy reliability design approach for solder joint BGA package considering correlation of each design factor2006
- Author(s)
  Yu, Q., Shibutani, T., Jin, J.C., Kondo, S., Shiratori, M
- Journal Title
  
  Proceedings of ITherm 2006
  
  Pages: 900-905
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] サブミクロン金粒子低温焼結マイクロ接合構造の機械的疲労信頼性評価2006
- Author(s)
  澁谷忠弘
- Journal Title
  
  エレクトロニクス実装学会誌 9
  
  Pages: 465-471
- NAID
  110004781807
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Low Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronic Devices2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  Proc. of the New Methods of Damage and Failure Analysis of Structural Parts
  
  Pages: 103-110
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard2006
- Author(s)
  Yu, Q., Shibutani, T., Kobayashi, Y., Shiratori, M
- Journal Title
  
  Proceedings of ITherm 2006
  
  Pages: 1024-1030
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] 応力緩和法を用いたはんだの弾塑性・クリープ・粘塑性の物性値取得の効率化2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  エレクトロニクス実装学会誌 10・1
  
  Pages: 52-61
- NAID
  110006152001
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test2006
- Author(s)
  Shibutani, T.
- Journal Title
  
  JSME International Journal, SeriesA 49
  
  Pages: 397-402
- NAID
  110004798976
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Mechanism of Damage Process on the Si3N4/Cu Interface in Nanoscratch Test2005
- Author(s)
  Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Takeshi Akai
- Journal Title
  
  Transactions of the JSME Vol.71, No.706
  
  Pages: 884-890
- NAID
  110004071282
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノスクラッチ試験によるSi3N4/Cu薄膜界面損傷機構2005
- Author(s)
  澁谷忠弘, 干強, 白鳥正樹, 赤井武志
- Journal Title
  
  日本機械学会論文集(A編) 71・706
  
  Pages: 884-890
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints2005
- Author(s)
  Jin, J.C., Yu, Q., Shibutani, T., Abe, H., Shiratori, M.
- Journal Title
  
  Key Engineering Materials 297-300
  
  Pages: 1822-1827
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005
- Author(s)
  Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
- Journal Title
  
  Key Engineering Materials Vols.297-300
  
  Pages: 1822-1827
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノインデンテーションクリープ試験による低融点材料の拡散クリープ特性評価2005
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹
- Journal Title
  
  日本機械学会論文集A編 71・710
  
  Pages: 1285-1291
- NAID
  110004999080
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005
- Author(s)
  Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
- Journal Title
  
  Key Engineering Materials 297-300
  
  Pages: 1822-1827
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノスクラッチ試験によるSi_3N_4/Cu薄膜界面損傷機構2005
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹他
- Journal Title
  
  日本機械学会論文集A編 71・706
  
  Pages: 864-890
- NAID
  110004999024
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Evaluation of Crack Initiation at the Corner of the Interface between Sub-Micron Films on the Basis of Fracture Mechanics Concept2004
- Author(s)
  Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Tetsu Tsuruga
- Journal Title
  
  J.Soc.Mat.Sci.Japan Vol.53, No.8
  
  Pages: 850-855
- NAID
  110006266334
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Evaluation of interface strength between thin films fabricated on a silicon substrate for mixed mode of fracture2004
- Author(s)
  Shibutani, T., Tsuruga, T., Yu, Q., Shiratori, M.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 192-198
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint2004
- Author(s)
  Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging Vol.7, No.2
  
  Pages: 161-169
- NAID
  110002525974
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints2004
- Author(s)
  Kim, D.S., Yu, Q., Shibutani, T., Sadakata, N, Inoue, T.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 325-329
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価2004
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹, 鶴賀哲
- Journal Title
  
  材料別冊第53巻・第8号
  
  Pages: 850-855
- NAID
  110006266334
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 鉛フリーはんだ接合部の応力・非線形ひずみ振幅評価に及ぼす硬化則の影響2004
- Author(s)
  金道燮, 干強, 澁谷忠弘, 白烏正樹
- Journal Title
  
  エレクトロニクス実装学会誌 7-2
  
  Pages: 161-169
- NAID
  110001235346
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価2004
- Author(s)
  澁谷忠弘, 干強, 白鳥正樹, 鶴賀哲
- Journal Title
  
  材料 53・8
  
  Pages: 850-855
- NAID
  110006266334
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Presentation] 曲率線展開法に基づく新たなCFRP 成形技術の開発（上記2番目の雑誌論文の内容を発表）2018
- Author(s)
  宇佐美陸, 櫻井昭男, 松尾宏平, 竹澤正仁, 鈴木健稔, 飯村峻, 澁谷忠弘, 前川卓
- Organizer
  第9回日本複合材料会議 (JCCM-9)
- Data Source
  KAKENHI-PROJECT-15H03910
[Presentation] Security risk analysis of a hydrogen fueling station with an on-site hydrogen production system involving methylcyclohexanse2017
- Author(s)
  J. Nakayama, N. Kasai, T. Shibutani and A. Miyake
- Organizer
  7th International Conference on Hydrogen Safety (ICHS2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K12459
[Presentation] In-situ observation ofwhisker nucleation in air by AFM2012
- Author(s)
  T.Shibutani
- Organizer
  IEEE CPMT Symposium
- Place of Presentation
  京都
- Year and Date
  2012-12-10
- Data Source
  KAKENHI-PROJECT-22360046
[Presentation] In-situ observation of whisker nucleation in air by AFM2012
- Author(s)
  T.Shibutani
- Organizer
  IEEE CPMT Symposium
- Place of Presentation
  京都
- Data Source
  KAKENHI-PROJECT-22360046
[Presentation] 地震荷重下における減肉配管系のパラメトリック解析による疲労損傷評価2012
- Author(s)
  中垣真美,澁谷忠弘,中村いずみ,大谷章仁
- Organizer
  安全工学研究発表会
- Place of Presentation
  米沢
- Year and Date
  2012-02-13
- Data Source
  KAKENHI-PROJECT-22360046
[Presentation] Failure Analysis of Piping Systems with Thinned Elbows on Tri-Axial Shake Table Tests2011
- Author(s)
  T.Shibutani, I.Nakamura, A.Otani
- Organizer
  ASME 2011 Pressure Vessels & Piping Conference
- Place of Presentation
  Baltimore, USA
- Year and Date
  2011-07-19
- Data Source
  KAKENHI-PROJECT-22360046
[Presentation] Failure Analysis of Piping Systems withThinned Elbows on Tri-Axial Shake TableTests2011
- Author(s)
  T.Shibutani I. Nakamura, A.Otani
- Organizer
  ASME 2011 Pressure Vessels&Piping Conference
- Place of Presentation
  Baltimore, USA
- Year and Date
  2011-07-19
- Data Source
  KAKENHI-PROJECT-22360046
[Presentation] 錫ウィスカ発生におけるAg添加の影響2009
- Author(s)
  澁谷忠弘
- Organizer
  日本機械学会2009年度年次大会講演会 pp.41-42 No.09-1
- Year and Date
  2009-09-14
- Data Source
  KAKENHI-PROJECT-21760068
[Presentation] Effect of grain size on pressure induced tin whiskers2009
- Author(s)
  T.Shibutani
- Organizer
  3^<rd> International Symposium on Tin Whiskers
- Year and Date
  2009-06-23
- Data Source
  KAKENHI-PROJECT-21760068
[Presentation] Effect of grain size on pressure induced tin whiskers2009
- Author(s)
  澁谷忠弘
- Organizer
  3rd International Symposium on Tin Whiskers
- Place of Presentation
  デンマーク工科大学
- Year and Date
  2009-06-23
- Data Source
  KAKENHI-PROJECT-21760068
[Presentation] Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep2008
- Author(s)
  澁谷忠弘
- Organizer
  10^<th> Electronics Packaging & Technology Conference
- Place of Presentation
  Singapore
- Year and Date
  2008-12-12
- Data Source
  KAKENHI-PROJECT-19760060
[Presentation] Effect of Creep Properties on Pressure Induced Tin Whisker Formation2008
- Author(s)
  澁谷忠弘
- Organizer
  Second International Conference on Secure System Integration and Reliability Improvement
- Place of Presentation
  Yokohama
- Year and Date
  2008-07-17
- Data Source
  KAKENHI-PROJECT-19760060
[Presentation] Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep2008
- Author(s)
  澁谷忠弘
- Organizer
  10th Electronics Packaging & Technology Conference
- Place of Presentation
  Singapore
- Year and Date
  2008-12-12
- Data Source
  KAKENHI-PROJECT-19760060
[Presentation] Evaluation of Resistance to Tin Whisker Formation Induced by Contact Force2007
- Author(s)
  T. Shibutani
- Organizer
  International Symposium on Tin Whiskers
- Place of Presentation
  CALCE
- Year and Date
  2007-04-24
- Data Source
  KAKENHI-PROJECT-19760060
[Presentation] Evaluation of pressure induced tin whisker formation2007
- Author(s)
  澁谷忠弘
- Organizer
  Successful Lead-Free/RoHS Strategies Conference 2007
- Place of Presentation
  Boxborough, MA, USA
- Year and Date
  2007-06-21
- Data Source
  KAKENHI-PROJECT-19760060

1. SHIRATORI Masaki (60017986)

# of Collaborated Projects: 7 results

# of Collaborated Products: 33 results
2. YU Qiang (80242379)

# of Collaborated Projects: 7 results

# of Collaborated Products: 35 results
3. MAEKAWA Takashi (70361863)

# of Collaborated Projects: 3 results

# of Collaborated Products: 3 results
4. MATSUI Kazumi (00377110)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
5. 松尾宏平 (00399528)

# of Collaborated Projects: 2 results

# of Collaborated Products: 3 results
6. 竹澤正仁 (50782489)

# of Collaborated Projects: 2 results

# of Collaborated Products: 3 results
7. AKINIWA Yoshiaki (00212431)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. TAKADA Hajime (20154792)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. Miyake Atsumi (60174140)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
10. 野口和彦 (50436763)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 南川秀樹 (60751485)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. 櫻井昭男 (20373417)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
13. 川原田寛 (40462676)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

SHIBUTANI TADAHIRO 澁谷 忠弘

SHIBUTANI Tadahiro 澁谷 忠弘

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Structural reliability of micro joints subjected to six degrees of freedom random vibration and thermal shockPrincipal Investigator

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Three dimensional surface by using nano-scale stress field induced by addition of elementsPrincipal Investigator

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Digital monitoring for prognostics to defects due to atomic migrationPrincipal Investigator

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Damage mechanism of thin film at elevated temperature due to atomic migration and evolution of microstructurePrincipal Investigator

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SHIBUTANI TADAHIRO 澁谷忠弘

SHIBUTANI Tadahiro 澁谷忠弘