Kino Hisashi 木野久志

… Alternative Names

KINO Hisashi 木野久志

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Researcher Number	10633406
Other IDs
Affiliation (Current)	2025: 九州大学, システム情報科学研究院, 准教授
Affiliation (based on the past Project Information) *help	2023 – 2024: 九州大学, システム情報科学研究院, 准教授 2021 – 2023: 東北大学, 医工学研究科, 特任准教授 2022: 東北大学, その他の研究科, 准教授 2014 – 2021: 東北大学, 学際科学フロンティア研究所, 助教 2013: 東北大学, 医工学研究科, 特任助教
Review Section/Research Field	Principal Investigator Basic Section 21060:Electron device and electronic equipment-related / Medium-sized Section 21:Electrical and electronic engineering and related fields / Electron device/Electronic equipment Except Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Medium-sized Section 90:Biomedical engineering and related fields / Medium-sized Section 59:Sports sciences, physical education, health sciences, and related fields / Medical systems / Electron device/Electronic equipment
Keywords	Principal Investigator 半導体 / 半導体メモリ / ニューラルネットワーク / トンネル効果 / メモリ / SNN / STDP / 不揮発性メモリ / トンネルFET / スパイキングニューラルネットワーク … More / 移動度 / 結晶歪み / 負の熱膨張 / トランジスタ / 負熱膨張 / 半導体材料・デバイス / プロセス技術・微細加工 / 高密度実装 / 集積エレクトロニクス / 曲げ応力 / 信頼性 / アンダーフィル / 金属マイクロバンプ / 3D IC … More Except Principal Investigator 人工網膜 / 医用システム / 三次元集積回路 / FHE / チップレット / フレキシブルデバイス / FOWLP / 生体医工学 / TSV / 三次元実装 / 常温接合 / 3D-IC / マイクロLEDディスプレイ / 人工視覚 / マイクロ・ナノ加工 / フレキシブル / 蓄電池 / エネルギー / トレンチキャパシタ / 高分子誘電体 / DC-DCコンバータ / 絶縁破壊電圧 / ロールトゥーロール / エネルギー貯蔵 / 抗炎症 / 恒常性維持 / 適度な運動 / 身体不活動 / 慢性炎症 / 生体恒常性維持 / メカニカルストレス / ウェアラブルディスプレイ / 成型加工 / 半導体パッケージング / ディスプレイ / マイクロLED / めっき / Micro-LED / ヘルスケアデバイス / フレキシブルエレクトロニクス / ヘテロインテグレーション / フレキシブルコイル / 高分子材料 / 応力 / マイクロXRD / PDMS / ウエハレベルパッケージ / 応力エンジニアリング / 応力解析 / 埋め込みデバイス / 無線給電 / 材料力学 / 応力制御 / 半導体パッケージ / 透明電極 / 生体適合性 / 人間医工学 / スマートセンサ情報システム / システムオンチップ / 半導体物性 / 先端機能デバイス / 電子デバイス・機器 Less

トンネルFET構造による3D-NANDフラッシュメモリの超多値化Principal Investigator
- Principal Investigator
  
  木野久志
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
人と同じ広視野・高機能視覚を有する三次元積層チップレット型完全埋植人工網膜の開発
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
不揮発性トンネルFETメモリを用いたスパイキングニューラルネットワークの構築Principal Investigator
- Principal Investigator
  
  木野久志
- Project Period (FY)
  2023 – 2025
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (A))
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
  Tohoku University
Energy Storage Roll Fabrication Based on Flexible Hybrid Electronics and Advanced Microelectronics Packaging
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2023 – 2027
- Research Category
  
  Fund for the Promotion of Joint International Research (International Collaborative Research)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of minimally invasive pixel-dispersive fully implantable retinal prosthesis with human-like viewing angle and information processing functions
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin Display
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2021 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Molecular mechanisms of how mechanical stresses alleviate chronic inflammation of the brain and muscles induced by physical inactivity
- Principal Investigator
  
  Sawada Yasuhiro
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 59:Sports sciences, physical education, health sciences, and related fields
- Research Institution
  National Rehabilitation Center for Persons with Disabilities
Development of ultra-low power neural network chips using non-volatile tunnel FET memoryPrincipal Investigator
- Principal Investigator
  
  Kino Hisashi
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Tohoku University
Development of transistors with negative-CTE gate electrode for introducing strained SiPrincipal Investigator
- Principal Investigator
  
  Kino Hisashi
- Project Period (FY)
  2019 – 2020
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress Engineering
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2019 – 2023
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (B))
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of Fully Implantable and Minimally Invasive Flexible Retina Prosthesis for Reconstruction of Wide Field of Vision
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Stereo-Vision Image Sensor LSI Fabricated by 3D Heterogeneous Integration Technology
- Principal Investigator
  
  KOYANAGI MITSUMASA
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human vision
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Medical systems
- Research Institution
  Tohoku University
The effect of dynamic-local deformation on transistor characteristics by operation heating in 3D-ICPrincipal Investigator
- Principal Investigator
  
  KINO Hisashi
- Project Period (FY)
  2013 – 2014
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

All 2024 2023 2022 2021 2020 2019 2018 2017 2016 2015 2014 2013 Other

All Journal Article Presentation Book Patent

[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018
- Author(s)
  木野久志,　田中徹
- Total Pages
  205
- Publisher
  シーエムシー出版
- ISBN
  9784781313160
- Data Source
  KAKENHI-PROJECT-15H01812
[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018
- Author(s)
  木野久志,　田中徹
- Total Pages
  205
- Publisher
  シーエムシー出版
- ISBN
  9784781313160
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] * Bendability Enhancement of 3D Interconnections with Out-of-plane Corrugation for Flexible Hybrid Electronics2024
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 63
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19KK0101
[Journal Article] Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansion gate electrodes2022
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 15 Issue: 11 Pages: 111004-111004
- DOI
  10.35848/1882-0786/ac9d24
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics2022
- Author(s)
  Miwa Yuki、Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Journal of Vacuum Science & Technology B
  
  Volume: 40 Issue: 5 Pages: 052202-052202
- DOI
  10.1116/6.0001836
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path2021
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 14 Issue: 9 Pages: 091003-091003
- DOI
  10.35848/1882-0786/ac18b0
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics2020
- Author(s)
  Takafumi Fukushima , Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, and Tetsu Tanaka,
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 10 Issue: 8 Pages: 1419-1422
- DOI
  10.1109/tcpmt.2020.3009640
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19KK0101, KAKENHI-PROJECT-18H04159
[Journal Article] Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks2020
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  IEEE Journal of the Electron Devices Society
  
  Volume: 8 Pages: 1266-1271
- DOI
  10.1109/jeds.2020.3025336
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19K21953
[Journal Article] Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory2020
- Author(s)
  Kino Hisashi、Fukusima Takafumi、Tanaka Tetsu
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 59 Issue: SG Pages: SGGB12-SGGB12
- DOI
  10.35848/1347-4065/ab6867
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19K21953
[Journal Article] High-Thermoresistant Temporary Bonding　Technology for Multichip-to-Wafer　3-D Integration With Via-Last TSVs2019
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 9 Issue: 1 Pages: 181-188
- DOI
  10.1109/tcpmt.2018.2871764
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter2019
- Author(s)
  Miao Xiong, Zhiming Chen, Yingtao Ding , Hisashi Kino , Takafumi Fukushima , and Tetsu Tanaka
- Journal Title
  
  IEEE TRANSACTIONS DEVICE LETTERS
  
  Volume: 40 Issue: 1 Pages: 95-98
- DOI
  10.1109/led.2018.2884452
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  IEEE Journal of the Electron Devices Society
  
  Volume: 7 Pages: 1225-1231
- DOI
  10.1109/jeds.2019.2936180
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 59 Issue: SB Pages: SBBA04-SBBA04
- DOI
  10.7567/1347-4065/ab4f3c
- NAID
  210000157397
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018
- Author(s)
  菅原陽平, 木野久志, 福島誉史, 田中徹
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J101-C Pages: 58-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Study of Al-doped ZnO Transparent Stimulus Electrodefor Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip2018
- Author(s)
  Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Journal Title
  
  Sensors and Materials
  
  Volume: 30 Pages: 225-234
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018
- Author(s)
  菅原陽平, 木野久志, 福島誉史, 田中徹
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J101-C Pages: 58-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration2017
- Author(s)
  Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 7 Pages: 2912-2918
- DOI
  10.1109/ted.2017.2705562
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 12 Pages: 5065-5072
- DOI
  10.1109/ted.2017.2767598
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC07-04EC07
- DOI
  10.7567/jjap.55.04ec07
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC2016
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC03-04EC03
- DOI
  10.7567/jjap.55.04ec03
- NAID
  210000146283
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: 7 Issue: 10 Pages: 184-184
- DOI
  10.3390/mi7100184
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246, KAKENHI-PROJECT-15K14139
[Journal Article] Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration2015
- Author(s)
  Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Journal of Microelectromechanical Systems
  
  Volume: 25 Issue: 1 Pages: 91-100
- DOI
  10.1109/jmems.2015.2480787
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014
- Author(s)
  Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 61 Issue: 2 Pages: 540-546
- DOI
  10.1109/ted.2013.2295463
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060, KAKENHI-PROJECT-25820133
[Patent] 東北大学, 半導体装置の製造方法、半導体装置を備えた装置の製造方法、半導体装置、半導体装置を備えた装置2020
- Inventor(s)
  福島誉史, 田中徹, 木野久志, 煤孫祐樹
- Industrial Property Rights Holder
  福島誉史, 田中徹, 木野久志, 煤孫祐樹
- Industrial Property Rights Type
  特許
- Filing Date
  2020
- Overseas
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] * High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2023
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last2023
- Author(s)
  J. Shen, C. Liu, T. Hoshi, A. Shinoda, H. Kino, T. Tetsu, M. Murugesan, M. Koyanagi, and T. Fukushima
- Organizer
  IEEE 3D System Integration Conference (3DIC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Negative-Thermal-Expansion Gate Electrode to Introduce Tensile Strain into the Channel of MOSFETs for Mobility Enhancement2023
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] ハイドロゲルFHEデバイスのためのRDL-first Multichip-to-Wafer集積技術2023
- Author(s)
  星匡朗, 西口大智, 木野久志, 田中徹, 福島誉史
- Organizer
  第84回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] FOWLP-based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display2023
- Author(s)
  Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  IEEE Components, Packaging and Manufacturing Technology (CPMT) Symposium Japan (ICSJ)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics (FHE) Using Wafer-Level Packaging2023
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Tak Fukushima
- Organizer
  The 4th UCLA CHIPS Workshop (CHIPS: Center for Heterogeneous Integration and Performance Scaling
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs2022
- Author(s)
  Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 埋込型医療機器向け無線給電の設計2022
- Author(s)
  清山浩司, 福島誉史, 木野久志, 田中徹
- Organizer
  2022年度　電子情報通信学会総合大会
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display2022
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Tak Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet- Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] A Finite Element Study of Stretchable Corrugated Interconnections on Chiplet-Embedded Flexible Hybrid Electronics2022
- Author(s)
  Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Flex2022 (2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] A Finite Element Study of Stretchable Corrugated Interconnections on Chiplet-Embedded Flexible Hybrid Electronics2022
- Author(s)
  Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Flex2022
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet- Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Liu Chang, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  2022 International Conference on Solid State Devices and Materials (SSDM), 715-716(2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration2022
- Author(s)
  Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices2022
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2022 IEEE International Interconnect Technology Conference (IITC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] Die-first and RDL-first FOWLP Processing for Flexible Hybrid Electronics2021
- Author(s)
  Takafumi Fukushima, Yuki Susumago, Noriyuki Takahashi, Hisashi Kino, and Tetsu Tanaka
- Organizer
  IMAPS (International Microelectronics Assembly and Packaging Society) 17th International Conference on Device Packaging, 2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets2021
- Author(s)
  Tomo Odashima, Yuki Susumago, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, and T. Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021
- Author(s)
  Zhe Wang, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第68回応用物理学会春季学術講演予稿集
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] スマートスキンディスプレイの提案とマイクロLEDの常温Cu直接接合技術2021
- Author(s)
  煤孫祐樹, 王喆, 小田島輩, 荒山俊亮, 星匡朗, 木野久志, 田中徹, 福島誉史
- Organizer
  第82回応用物理学会秋季学術講演会講演予稿集
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021
- Author(s)
  Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第68回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display2021
- Author(s)
  Yuki Susumago, Tomo Odashima, Masatsugu Ichikawa, Hiroki Hanaoka, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] UV-LED内蔵ハイドロゲルフレキシブル基板を用いた殺菌絆創膏の作製と評価2021
- Author(s)
  高橋則之, 煤孫祐樹, 王喆, 小田島輩, 木野久志, 田中徹, 福島誉史
- Organizer
  第68回応用物理学会春季学術講演予稿集
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs2021
- Author(s)
  Hisashi Kino
- Organizer
  2021IEEE International Interconnect Technology Conference, IITC 2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] チップレット内蔵インモールドエレクトロニクス用フレキシブル基板の細線化2021
- Author(s)
  小田島輩, 煤孫祐樹, 王喆, 木野久志, 田中徹, 福島誉史
- Organizer
  第82回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks2020
- Author(s)
  Hisashi Kino
- Organizer
  2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K21953
[Presentation] Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave/SpO2 Monitoring2020
- Author(s)
  Tomo Odashima, Yuki Susumago, Qian Zhengyang, Noriyuki Takahashi, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  The 2020 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD2020
- Author(s)
  M. Murugesan, Y. Susumago, T. Odashima, H. Kino, T. Tanaka, K. Sumitani, Y. Imai, S. Kimura, and T. Fukushima
- Organizer
  The 2020 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] インモールドエレクトロニクス用フレキシブル三次元波状配線の作製2020
- Author(s)
  永田柊太, 木野久志, 田中徹, 福島誉史
- Organizer
  第81回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices2020
- Author(s)
  Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Die-Level Cu-CMP　Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration2020
- Author(s)
  Shuai Liu, Kousei Kumahara, Yuki Miwa , Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration2020
- Author(s)
  Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion2020
- Author(s)
  Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  N. Takahashi, Y. Susumago, S. Lee, H. Kino, T. Tanaka, and T. Fukushima,
- Organizer
  The 69th Electronic Components and Technology Conference (ECTC 2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukishima
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  The 2019 IEEE 69th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of 3D-IC Embedded Flexible Hybrid System2019
- Author(s)
  S. Lee, Y. Susumago, Z. Qian, N. Takahashi, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Technology Platform Development of Multichip-to-Wafer 3D Integration (2)- SiO2 Liner Technology for Low Temperature TSV Process -2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] RDL-first FOWLPによるハイドロゲル用いたFHEのためのチップ内蔵技術2019
- Author(s)
  髙橋則之, 煤孫祐樹, 木野久志, 田中徹, 福島誉史
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] マイクロLED埋め込み型フレキシブルオプト神経プローブの開発2019
- Author(s)
  島智大, 煤孫裕樹, 張博文, 浦山翔太, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Study of Transparent Electrodes for 3D-Stacked Retinal Prosthesis2019
- Author(s)
  Michael Proffitt, Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino, Hiroshi Tomita
- Organizer
  2019 MRS Spring Meeting
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer三次元集積化基盤技術の開発 (1)－テンポラリ接着剤を用いた一括チップ薄化技術－2019
- Author(s)
  李晟豪、梁ザイ、三輪侑紀、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara,Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Room Temperature SiO2 Liner Technology for Multichip-to-Wafer 3D Integration with Via-last TSV2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC 2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of underfill with negative-CTE material for high-reliable three-dimensional integrated circuit (3DIC)2019
- Author(s)
  Hisashi Kino
- Organizer
  3rd International Symposium on Negative Thermal Expansion and Related Materials (ISNTE-3)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs2019
- Author(s)
  Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Annealing Effect on Room-Temperature-Deposited SiO2 Liner for Multichip-to-Wafer 3D Integration Process2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Hisashi Kino,Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer 三次元集積化基盤技術の開発 (3) ―異種機能集積化に向けたマイクロバンプ接合技術―2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 6th International Workshop on Low Temperature Bonding for 3D Integration
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 多段階励起による発光現象を用いた光遺伝学用神経プローブの作製2019
- Author(s)
  浦山翔太、島智大、張博文、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical Characterization of FOWLP Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  2019 International Conference on Electronics Packaging ICEP 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer三次元集積に向けたマイクロバンプ接合技術2019
- Author(s)
  熊原宏征、三輪侑紀、李晟豪、梁ザイ、木野久志、福島誉史、田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 高密度電極接続を用いた三次元集積のための低背マイクロバンプ接合評価2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 熊原宏征, 木野久志, 福島誉史, 田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Investigation of the Underfill with Negative-Thermal- Expansion Material to Suppress Mechanical Stress in 3D Integration System2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018
- Author(s)
  李晟豪, 菅原陽平, 伊藤誠人, 木野久志, 福島誉史, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 Japan-Taiwan Workshop on Electronic Interconnection Ⅱ
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs2018
- Author(s)
  H. Kino, S. Lee, Y. Sugawara, T. Fukushima, T. Tanaka
- Organizer
  21st IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] DRAMセルアレイを用いた3D-IC内部Cu汚染の高精度評価2018
- Author(s)
  谷川星野, 福島誉史, 木野久志, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018
- Author(s)
  李晟豪, 菅原陽平, 伊藤誠人, 木野久志, 福島誉史, 田中徹
- Organizer
  エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017
- Author(s)
  Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC 2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Ultrawide range square wave impedance analysis circuit with ultra-slow Ring-Oscillator using gate-induced drain-leakage current2017
- Author(s)
  Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Experimental Evaluation of Stimulus Current Generator with Laplacian Edge-enhancement for 3-D Stacked Retinal Prosthesis Chip2017
- Author(s)
  Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017
- Author(s)
  Miao Xiong,Yangyang Yan, Yingtao Ding，Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator2017
- Author(s)
  Yoshiki Takezawa, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D-IC Technology and Its Application to Fully Implantable Retinal Prosthesis2017
- Author(s)
  Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino
- Organizer
  14th International Conference on Flow Dynamics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 三次元積層人工網膜チップのためのラプラシアンエッジ強調機能を有する刺激電流生成回路の評価2017
- Author(s)
  下川賢士, 銭正よう, 竹澤好樹, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017
- Author(s)
  Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017
- Author(s)
  Miao Xiong,Yangyang Yan, Yingtao Ding，Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  International Conference on Solid State Devices and Materials (SSDM2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 矩形波インピーダンス計測のためのGIDL電流を用いた低周波リングオシレータの設計と評価2017
- Author(s)
  竹澤好樹, 下川賢士, 銭正よう, 福島奨, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 IEEE 67th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Wide-range and precise tissue impedance anaysis circuit with ultralow current source using gate-induced drain-leakage current2016
- Author(s)
  Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, and Tetsu Tanaka
- Organizer
  2016 IEEE Biomedical Circuits and Systems Conference(BioCAS 2016)
- Place of Presentation
  Hotel Pullman Shanghai Skyway, Shanghai, China
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique2016
- Author(s)
  Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  2016 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan
- Year and Date
  2016-09-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価2016
- Author(s)
  下川賢士、後藤大輝、木野久志、福島誉史、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2016 IEEE International Reliability Physics Symposium(IRPS 2016)
- Place of Presentation
  Pasadena Convention Center, Pasadena, USA
- Year and Date
  2016-04-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価2016
- Author(s)
  菅原陽平、木野久志、福島誉史、李康旭、小柳光正、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 画素間ばらつき補正機能を有する３次元積層人工網膜チップの提案2016
- Author(s)
  伊藤圭汰、宇野正真、後藤竜也、竹澤好樹、西野悟、木野久志、清山浩司、田中徹
- Organizer
  LSIとシステムのワークショップ2016
- Place of Presentation
  東京大学、東京都
- Year and Date
  2016-05-16
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価2016
- Author(s)
  谷川星野, 木野久志, 福島誉史, 田中徹
- Organizer
  2016年第63回応用物理学会春季学術講演会
- Place of Presentation
  東京工業大学　大岡山キャンパス、東京都
- Year and Date
  2016-03-19
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  T. Fukushima, H. Hashiguchi, H. Kino, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV2015
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価2015
- Author(s)
  菅原　陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array2015
- Author(s)
  Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Consideration of Microbump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Activated Chip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors2015
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究2015
- Author(s)
  木野久志, 橋口日出登, 谷川星野, 菅原陽平, 池ヶ谷俊介, 福島誉史, 小柳光正, 田中徹
- Organizer
  第25回マイクロエレクトロニクスシンポジウム MES2015
- Place of Presentation
  大阪大学吹田キャンパス、大阪府、吹田市
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Development of Highly-Reliable　Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges2015
- Author(s)
  Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価2015
- Author(s)
  谷川星野、木野久志、福島誉史、小柳光正、田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive,2014
- Author(s)
  H. Kino, H. Hashiguchi, Y. Sugawara, S. Tanikawa, T. Fukusima, K.-W. Lee, M. Koyanagi, and T. Tanaka
- Organizer
  64th Electronic Components and Technology Conference 2014
- Place of Presentation
  Florida, USA
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013
- Author(s)
  H. Kino, T. Fukusima, K.-W. Lee, M. Koyanagi, and T. Tanaka
- Organizer
  2013 International Conference on Solid State Materials and Devices
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013
- Author(s)
  木野久志，　福島　誉史，　小柳光正，　田中徹
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価
- Author(s)
  菅原陽平，橋口日出登，谷川星野，木野久志，福島誉史，李康旭，小柳光正，田中徹
- Organizer
  第75回応用物理学会秋季学術講演会
- Place of Presentation
  北海道
- Year and Date
  2014-09-17 – 2014-09-20
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響
- Author(s)
  木野久志、池ヶ谷俊介、小柳光正、田中徹
- Organizer
  第62回応用物理学会春季学術講演会
- Place of Presentation
  神奈川
- Year and Date
  2015-03-11 – 2015-03-14
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
- Author(s)
  Yohei Sugawara1, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, and Tetsu Tsnaka
- Organizer
  International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba, Japan
- Year and Date
  2014-09-08 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-25820133
[Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
- Author(s)
  H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
- Organizer
  The 64th Electronic Components and Technology Conference
- Place of Presentation
  Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-25820133

1. Fukushima Takafumi (10374969)

# of Collaborated Projects: 9 results

# of Collaborated Products: 98 results
2. TANAKA Tetsu (40417382)

# of Collaborated Projects: 8 results

# of Collaborated Products: 94 results
3. 清山浩司 (60412722)

# of Collaborated Projects: 8 results

# of Collaborated Products: 9 results
4. 富田浩史 (40302088)

# of Collaborated Projects: 4 results

# of Collaborated Products: 1 results
5. SUGANO Eriko (70375210)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
6. KOYANAGI MITSUMASA (60205531)

# of Collaborated Projects: 2 results

# of Collaborated Products: 23 results
7. ベジチョル (40509874)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
8. Sawada Yasuhiro (50313135)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. 橋本宏之 (80589432)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. マリアッパンムルゲサン (10509699)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 崎谷直義 (30824859)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. 篠原正浩 (60345733)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. 吉野大輔 (80624816)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. 高野晴子 (40532891)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. 梶原一宏 (10779937)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. BEA Jichel

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results
17. MURUGESAN Mariappan

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

Kino Hisashi 木野 久志

KINO Hisashi 木野 久志

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トンネルFET構造による3D-NANDフラッシュメモリの超多値化Principal Investigator

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不揮発性トンネルFETメモリを用いたスパイキングニューラルネットワークの構築Principal Investigator

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Development of ultra-low power neural network chips using non-volatile tunnel FET memoryPrincipal Investigator

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Development of transistors with negative-CTE gate electrode for introducing strained SiPrincipal Investigator

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The effect of dynamic-local deformation on transistor characteristics by operation heating in 3D-ICPrincipal Investigator

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Kino Hisashi 木野久志

KINO Hisashi 木野久志

[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018

[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018

[Journal Article] High-Thermoresistant Temporary Bonding　Technology for Multichip-to-Wafer　3-D Integration With Via-Last TSVs2019