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Sugahara Tohru  菅原 徹

… Alternative Names

SUGAHARA Tohru  菅原 徹

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Researcher Number 20622038
Other IDs
  • ORCIDhttps://orcid.org/0000-0001-5842-5392
Affiliation (Current) 2025: 京都工芸繊維大学, 材料化学系, 教授
2025: 大阪大学, 産業科学研究所, 招へい教授
Affiliation (based on the past Project Information) *help 2022 – 2024: 京都工芸繊維大学, 材料化学系, 教授
2022 – 2023: 大阪大学, 産業科学研究所, 招へい教授
2020 – 2021: 大阪大学, 産業科学研究所, 准教授
2012 – 2017: 大阪大学, 産業科学研究所, 助教
Review Section/Research Field
Principal Investigator
Basic Section 26030:Composite materials and interfaces-related / Nanomaterials engineering / Device related chemistry
Except Principal Investigator
Basic Section 60040:Computer system-related / Medium-sized Section 62:Applied informatics and related fields / Basic Section 61020:Human interface and interaction-related / Medium-sized Section 60:Information science, computer engineering, and related fields / Organic and hybrid materials / Material processing/treatments
Keywords
Principal Investigator
ナノ構造 / ガスセンサ / 酸化物薄膜 / 有機金属分解法 / 電界効果トランジスタ / セラミックスコーティング / ハイブリッドガスセンサ / グラフェン / 酸化物半導体 / 酸化モリブデン … More / 酸化物ガスセンサ / 酸化物コーティング / ナノ構造材料 / 半導体ガスセンサ / 印刷法 / 導電性接着剤 / プリンテッド・エレクトロニクス / 熱電変換 / 実装材料 / 熱電発電 … More
Except Principal Investigator
太陽電池 / エネルギーハーベスティング技術 / 情報センシング / 超低消費電力パワーマネジメント技術 / 熱電発電デバイス / 環境発電 / 超低消費電力集積回路 / パワーマネジメント技術 / 行動情報取得システム / 生体情報取得システム / 行動情報 / 生体情報 / パワーマネジメント / 熱電発電素子 / LSI / CMOS / エネルギーハーベスティング / 食器型感覚提示デバイス / 口腔内外温度提示 / 食体験創出 / 味覚制御 / クロスモーダル / ヒューマンインタフェース / ディスプレイ / 分解能 / 時間分解能 / 温度感覚 / スピントロニクス材料 / パワーデバイス材料 / ビッグデータ / リアルタイムAI / スピントロニクス / パワーデバイス / 高速モデル学習 / ビッグデータ解析 / n型半導体 / アモルファス酸化物 / アモルファス / 酸化物半導体 / ウィスカ / エレクトロマイグレーショ ン / ウィスカー / 界面 / 高温耐熱 / ダイアタッチ / ワイドバンドギャップ半導体 / 表面・界面物性 / 材料加工・処理 / 電子・電気材料 / エレクトロマイグレーション / ナノ構造制御 / ウィスカ― / 次世代半導体 / 光接合 / メタル・ペースト焼結接合 / 銀スパッタ膜接合 / 超高耐熱実装技術 / Nano-Volcanic Eruption / 焼結接合 / 異相界面 / パワー半導体 / 電気接続・配線 Less
  • Research Projects

    (9 results)
  • Research Products

    (75 results)
  • Co-Researchers

    (18 People)
  •  食器型感覚提示デバイスの実現と味覚への他感覚の影響解明による新たな食体験の創出

    • Principal Investigator
      伊藤 雄一
    • Project Period (FY)
      2022 – 2025
    • Research Category
      Grant-in-Aid for Challenging Research (Pioneering)
    • Review Section
      Medium-sized Section 62:Applied informatics and related fields
    • Research Institution
      Aoyama Gakuin University
  •  畜産・酪農DXに向けた自律型牛生体・行動情報取得システム基盤の開拓

    • Principal Investigator
      廣瀬 哲也
    • Project Period (FY)
      2022 – 2024
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 60040:Computer system-related
    • Research Institution
      Osaka University
  •  Sensing Mechanism of Graphene-Assist Oxide Gas Sensor and Fabrication of Mixed Gas SensorPrincipal Investigator

    • Principal Investigator
      Sugahara Tohru
    • Project Period (FY)
      2021 – 2023
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Kyoto Institute of Technology
      Osaka University
  •  Elucidation of temporal and spatial resolution of temperature sensation and its engineering applications

    • Principal Investigator
      Sato Katsunari
    • Project Period (FY)
      2021 – 2023
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Review Section
      Basic Section 61020:Human interface and interaction-related
    • Research Institution
      Nara Women's University
  •  Development of advanced analytical technology for materials science

    • Principal Investigator
      Sakurai Yasushi
    • Project Period (FY)
      2020 – 2022
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Review Section
      Medium-sized Section 60:Information science, computer engineering, and related fields
    • Research Institution
      Osaka University
  •  Simplification of device fabrication process for nanomaterial application and enhancement of semiconductor gas sensor propertiesPrincipal Investigator

    • Principal Investigator
      Tohru Sugahara
    • Project Period (FY)
      2016 – 2017
    • Research Category
      Grant-in-Aid for Challenging Exploratory Research
    • Research Field
      Nanomaterials engineering
    • Research Institution
      Osaka University
  •  Application of amorphous metal oxides

    • Principal Investigator
      Karakawa Makoto
    • Project Period (FY)
      2015 – 2016
    • Research Category
      Grant-in-Aid for Challenging Exploratory Research
    • Research Field
      Organic and hybrid materials
    • Research Institution
      Kanazawa University
      Osaka University
  •  Development of stretchable and flexible thermoelectric conversion module by printing methodPrincipal Investigator

    • Principal Investigator
      SUGAHARA Tohru
    • Project Period (FY)
      2013 – 2014
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Device related chemistry
    • Research Institution
      Osaka University
  •  Science of Hetero-Interface of Advanced Power Devises in Extreme Environments

    • Principal Investigator
      Suganuma Katsuaki
    • Project Period (FY)
      2012 – 2016
    • Research Category
      Grant-in-Aid for Scientific Research (S)
    • Research Field
      Material processing/treatments
    • Research Institution
      Osaka University

All 2018 2017 2016 2015 2014 2013 Other

All Journal Article Presentation Book Patent

  • [Book] ヘルスケア・ウェアラブルデバイスの開発、第5章4節ウェアラブル子機センサのための半導体ナノ材料2017

    • Author(s)
      菅原徹
    • Total Pages
      8
    • Publisher
      シーエムシー出版
    • ISBN
      9784781312392
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Book] 生体額計測と高感度ガスセンシング、第Ⅱ編1章7節ヘルスケアを目的とした揮発性有機化合物(VOC)を検出するナノ構想のガスセンサ素子2017

    • Author(s)
      菅原徹、菅沼克昭
    • Total Pages
      8
    • Publisher
      シーエムシー出版
    • ISBN
      9784781312507
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Book] ヘルスケア・ウェアラブルデバイスの開発、第5章4節ウェアラブル呼気センサのための半導体ナノ材料2017

    • Author(s)
      菅原徹
    • Total Pages
      8
    • Publisher
      CMC出版社
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Journal Article] Modifying the valence state of molybdenum in the cient oxide buer layer of organic solar cells via a mild hydrogen peroxide treatment2017

    • Author(s)
      Shuren Cong, Afshin Hadipour, Tohru Sugahara, Tingting Wei, Jinting Jiu, Samaneh Ranjbar, Yukiko Hirose, Makoto Karakawa, Shijo Nagao, Tom Aernouts and Katsuaki Suganuma
    • Journal Title

      Journal of Materials Chemistry C

      Volume: 5 Issue: 4 Pages: 889-895

    • DOI

      10.1039/c6tc04461a

    • Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Journal Article] Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices2017

    • Author(s)
      C. Chen, S. Nagao, K. Saganuma, J. Jiu, T. Sugahara, H. Zhang, T. Iwashige, K. Sugiura, T. Tsuruta
    • Journal Title

      Acta Mater.

      Volume: 129 Pages: 41-51

    • DOI

      10.1016/j.actamat.2017.02.065

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Die-attaching silver paste based on a novel solvent for high-power semiconductor devices2016

    • Author(s)
      J. Jiu, H. Zhang, S. Nagao, T. Sugahara, N. Kagami, Y. Suzuki, Y. Akai, K. Suganuma
    • Journal Title

      J. Mater. Sci.

      Volume: 51 Issue: 7 Pages: 3422-3430

    • DOI

      10.1007/s10853-015-9659-8

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Diverse Adsorption/Desorption Abilities Originating from the Nanostructural Morphology of VOC Gas Sensing Devices Based on Molybdenum Trioxide Nanorod Arrays2016

    • Author(s)
      Shuren Cong, Tohru Sugahara, Tingting Wei, Jinting Jiu, Yukiko Hirose, Shijo Nagao, and Katsuaki Suganuma
    • Journal Title

      Advanced Materials Interfaces

      Volume: 3 Issue: 14 Pages: 1600252-1600252

    • DOI

      10.1002/admi.201600252

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Journal Article] Self-healing of cracks in Ag joining layer for die-attachment in power devices2016

    • Author(s)
      C. Chen, S. Nagao, K. Suganuma, J. Jiu, H. Zhang, T. Sugahara, T. Iwashige, K. Sugiura, K. Tsuruta
    • Journal Title

      Appl. Phys. Lett.

      Volume: 109 Issue: 9

    • DOI

      10.1063/1.4962333

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air2015

    • Author(s)
      Su Ding, Jinting Jiu, Yanhong Tian, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
    • Journal Title

      Physical Chemistry Chemical Physics

      Volume: 17 Issue: 46 Pages: 31110-31116

    • DOI

      10.1039/c5cp04582g

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] The effect of light and humidity on the stability of silver nanowire transparent electrodes2015

    • Author(s)
      J. Jiu, J. Wang, T. Sugahara, S. Nagao, M. Nogi, H. Koga, K. Suganuma, M. Hara, E. Nakazawa, H. Uchida
    • Journal Title

      RSC Adv.

      Volume: 15 Issue: 35 Pages: 27657-27664

    • DOI

      10.1039/c5ra02722e

    • Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] High performance heat curing copper-silver powders filled electrically conductive adhesives2015

    • Author(s)
      H.-W. Cui, J.-T. Jiu, T. Sugahara, S. Nagao, K. Suganuma, H. Uchida
    • Journal Title

      Electronic Materials Letters

      Volume: N/A Issue: 2 Pages: 315-322

    • DOI

      10.1007/s13391-014-4292-2

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment2015

    • Author(s)
      S. Park, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 26 Issue: 9 Pages: 7277-7289

    • DOI

      10.1007/s10854-015-3355-y

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Fabrication of flexible copper pattern based on sub-micro copper paste by low temperature plasma technique2015

    • Author(s)
      Y. Gao, H. Zhang, J. Jiu, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      RSC Advances

      Volume: 5 Issue: 109 Pages: 90202-90208

    • DOI

      10.1039/c5ra18583a

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature2015

    • Author(s)
      T. Kunimune, M. Kuramoto, S. Ogawa, T. Sugahara, S. Nagao*, K. Suganuma
    • Journal Title

      Acta Materialia

      Volume: 89 Pages: 133-140

    • DOI

      10.1016/j.actamat.2015.02.011

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements2014

    • Author(s)
      Y. Kim, S. Nagao*, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke, J. Strogies
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 25 Issue: 7 Pages: 3090-3095

    • DOI

      10.1007/s10854-014-1988-x

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics2014

    • Author(s)
      Hui-Wang Cui, Jin-Ting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Hiroshi Uchida and Kurt A. Schroder
    • Journal Title

      RSC Adv.

      Volume: 4 Issue: 31 Pages: 15914-15922

    • DOI

      10.1039/c4ra00292j

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Journal Article] Mitigation of Sn Whisker Growth by Small Bi Additions2014

    • Author(s)
      Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto, Tohru Sugahara, Katsuaki Suganuma
    • Journal Title

      Journal of Electronic Materials

      Volume: 43 Issue: 1 Pages: 1-8

    • DOI

      10.1007/s11664-013-2706-9

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components2014

    • Author(s)
      Y. Kim, S. Nagao, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke
    • Journal Title

      JJAP

      Volume: 53 Issue: 4S Pages: 04EB02-04EB02

    • DOI

      10.7567/jjap.53.04eb02

    • NAID

      210000143550

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Photonic sintering of thin film prepared by dodecylamine capped CuIn x Ga 1-x Se 2 nanoparticles for printed photovoltaics2014

    • Author(s)
      M. Singh, J. Jiu, T. Sugahara, K. Suganuma
    • Journal Title

      Thin Sol. Film

      Volume: 28 Pages: 11-18

    • DOI

      10.1016/j.tsf.2014.06.036

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Journal Article] Hillock growth dynamics for Ag stress migration bonding2014

    • Author(s)
      S. Nagao*, C. Oh, T. Sugahara, K. Suganuma
    • Journal Title

      Materials Letters

      Volume: 137 Pages: 170-173

    • DOI

      10.1016/j.matlet.2014.09.006

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates2014

    • Author(s)
      S. Park*, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      JJAP

      Volume: 53 Issue: 4S Pages: 04EP06-04EP06

    • DOI

      10.7567/jjap.53.04ep06

    • NAID

      210000143698

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Sol-gel-derived High-performance Stacked Transparent Conductive Oxide Thin Films2014

    • Author(s)
      T. Sugahara, Y. Hirose, S. Cong, H. Koga, J. Jiu, M. Nogi, S. Nagao, K. Suganuma
    • Journal Title

      J. Am. Ceram. Soc.

      Volume: 10 Issue: 10 Pages: 3238-3243

    • DOI

      10.1111/jace.13116

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Journal Article] Refinement of the microstructure of Sn-Ag-Bi-In solder, by addition of SiC nanoparticles, to reduce electromigration damage under high electric current2014

    • Author(s)
      Y. Kim, S. Nagao*, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke, J. Strogies
    • Journal Title

      J. Electron.Mater.

      Volume: 43 Issue: 12 Pages: 4428-4434

    • DOI

      10.1007/s11664-014-3377-x

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Thin-Film Copper Indium Gallium Selenide Solar Cell Based on Low-Temperature All-Printing Process2014

    • Author(s)
      M. Singh, J. Jiu, T. Sugahara, K. Suganuma
    • Journal Title

      ACS Appl. Mater. Interfaces

      Volume: 18 Issue: 18 Pages: 16297-16303

    • DOI

      10.1021/am504509r

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Journal Article] La doped effects on structure and thermoelectric properties of Sr2MnMoO6 double-perovskite oxides2013

    • Author(s)
      Tohru Sugahara, Michitaka Ohtaki, Katsuaki Suganuma
    • Journal Title

      Journal of Asian Ceramic Societies

      Volume: 1 Issue: 3 Pages: 282-288

    • DOI

      10.1016/j.jascer.2013.06.006

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Journal Article] LEAST LEAD ADDITION TO MITIGATE TIN WHISKER FOR AMBIENT STORAGE2013

    • Author(s)
      Jung-Lae Jo, Keun-Soo Kim, Tohru Sugahara, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto and Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 8 Pages: 3108-3115

    • DOI

      10.1007/s10854-013-1218-y

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition2013

    • Author(s)
      S.W.Park, Shijo Nagao, Tohru Sugahara, Keun-Soo Kim, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 12 Pages: 4704-4712

    • DOI

      10.1007/s10854-013-1463-0

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering2013

    • Author(s)
      T. Araki, T. Sugahara, J. Jiu, S. Nagao, M. Nogi, H. Koga, H. Uchida, K. Shinozaki, K. Suganuma
    • Journal Title

      Langmuir

      Volume: 29 Issue: 35 Pages: 11192-11197

    • DOI

      10.1021/la402026r

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-12J00866, KAKENHI-PROJECT-25810140
  • [Journal Article] Microstructural stability of Ag sinter joining in thermal cycling2013

    • Author(s)
      Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 4 Pages: 1332-1340

    • DOI

      10.1007/s10854-012-0929-9

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Journal Article] Thermal stress driven Sn whisker growth: in air and in vacuum2013

    • Author(s)
      Jung-Lae Jo, Shijo Nagao, Tohru Sugahara, Masanobu Tsujimoto, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 10 Pages: 3897-3904

    • DOI

      10.1007/s10854-013-1336-6

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Patent] 接合方法2013

    • Inventor(s)
      菅沼 克昭、長尾 至成、菅原 徹 他
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-04-01
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Patent] 接合構造体の製造方法、構造体および装置2013

    • Inventor(s)
      菅沼 克昭、菅原 徹、長尾 至成
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-04-01
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Growth and gas sensing properties of TiO2 nanostructures by MOD method2018

    • Author(s)
      Leila Alipour, Tohru Sugahara, Jun-ichi Nakamura, Hironobu Ono, Nobuyuki Harada, Katsuaki Suganuma
    • Organizer
      第65回応用物理学会春季学術講演会,東京, 早稲田大学,2018年 3月17-20日
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Presentation] Amorphous Oxide Semiconductor Thin Film with an Energy-Efficient Beneficial Coating Process for OPV2017

    • Author(s)
      T. Sugahara, S. Cong, M. Karakawa and K. Suganuma
    • Organizer
      12th Pacific Rim Conference (PACRIM)
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Presentation] 印刷法で作製したMoO3ナノ構造アレイの半導体式ガスセンサ応用2016

    • Author(s)
      菅原 徹・叢 樹仁・菅沼 克昭
    • Organizer
      第29回セラミックス協会秋季シンポジウム
    • Place of Presentation
      広島
    • Year and Date
      2016-09-07
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Presentation] WBG Die-attach Ceramic Substrate for Severe Thermal Cycling2016

    • Author(s)
      K. Suganuma, H. Zhang, S. Nagao, T. Sugahara. M. Ueshima, Y. Furukawa, K. Minami, H.-J. Albrecht, K. Wilke, Y. Shirakawa, S. Kurosaka. M. Tsujimoto, M. Kiso
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Nano-ink development for wearable printed electronics2016

    • Author(s)
      K. Suganuma, M. Nogi, H. Koga, J. Jiu, and T. Sugahara
    • Organizer
      International Conference on Radiation Curing in Asia
    • Place of Presentation
      Tokyo
    • Year and Date
      2016-10-24
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Die-attach Structure Using SiC Particle Added Ag Paste for Ultra High Thermal Stability Usage2016

    • Author(s)
      H. Zhang, S. Nagao, T. Sugahara, E. Yokoi, K. Suganuma
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Gas Sensor Property of MoO3 Nanorod Arrays synthesized by Metal Organic Decomposition Method2016

    • Author(s)
      T. sugahara, S. Cong, K. Suganuma
    • Organizer
      International Korea-Japan Seminar on Ceramics
    • Place of Presentation
      Daejeon, Korea
    • Year and Date
      2016-11-16
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K13637
  • [Presentation] Silver Sinter Joining and Stress Migration Bonding for Wbg Die-Attach2015

    • Author(s)
      K. Suganuma, T. Sugahara, J. Jiu, S. Nagao, E. Yokoi, and H. Zhang
    • Organizer
      228th ECS Meeting
    • Place of Presentation
      Phoenix
    • Year and Date
      2015-10-11
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Recent advances of nanomaterials for printed electronics2015

    • Author(s)
      K. Suganuma, M. Nogi, J. Jiu, H. Koga, T. Sugahara and S. Nagao
    • Organizer
      2015 JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment
    • Place of Presentation
      Kobe
    • Year and Date
      2015-06-14
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] WBG 半導体パワーデバイス用Cu/Al クラッドリボン配線の高温信頼性2015

    • Author(s)
      朴 世珉,長尾至成,菅原 徹,横井絵美, 菅沼克昭
    • Organizer
      第25回 マイクロエレクトロニクスシンポジウム 秋季大会
    • Place of Presentation
      大阪
    • Year and Date
      2015-09-03
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 極限環境パワー半導体の異相界面制御2015

    • Author(s)
      菅沼克昭,長尾至成,菅原 徹,酒 金婷,横井絵美
    • Organizer
      第25回 マイクロエレクトロニクスシンポジウム 秋季大会
    • Place of Presentation
      大阪
    • Year and Date
      2015-09-03
    • Invited
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Ultra-Heat Resistant Interconnection for Wide Band Gap Semiconductors2015

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara, J. Jiu
    • Organizer
      2015 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Sapporo
    • Year and Date
      2015-09-27
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Fabrication of Flexible Thermoelectric Generation Modules for Applying to Heat Sources with the Curved Surface2014

    • Author(s)
      Tohru Sugahara, Yukiko Hirose, Keiichi Ohata, Shutaro Nambu, Chieko Kawate, Yusuke Okabe, Yoshiyuki Kohno, Atsushi Saitou, and Katsuaki Suganuma
    • Organizer
      International Conference on Thermoelectrics (ICT2014)
    • Place of Presentation
      Tennessee, USA
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Physical Properties and Deposited Condition of Sol-Gel Derived Metal Oxide for Transparent Conductive Film2014

    • Author(s)
      Tohru Sugahara, Yukiko Hirose, Shuren Cong, Hirotaka Koga, Jinting Jiu, Masaya Nogi, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      EMN Summer meeting 2014
    • Place of Presentation
      Cancun, Mexico
    • Invited
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Partial transient liquid phase bonding for hightemperature power electronics using Sn/Zn/Sn sandwich structure solder2014

    • Author(s)
      Sungwon Park1, Shijo Nagao1, Tohru Sugahara1, Yoshitaka Katoh2, Hiroshi Ishino2, Kazuhiko Sugiura2, Katsuaki Suganuma
    • Organizer
      CIPS 2014 8th Meeting & Exhibition
    • Place of Presentation
      Nuremberg, Germany
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Microstructure Refinement in Sn-Ag-Bi-In Solder by Adding SiC Nanoparticles to Reduce Electromigration under High Electric Current2014

    • Author(s)
      Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke, Joerg Stogies
    • Organizer
      TMS 2014 143rd Annual Meeting & Exhibition
    • Place of Presentation
      San Diego, CA, USA
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] ゾル・ゲル法を用いた金属酸化物薄膜の作製と物性評価2014

    • Author(s)
      菅原 徹、廣瀬 由紀子、松尾 琢朗、長尾 至成、酒 金テイ、菅沼 克昭
    • Organizer
      日本セラミックス協会2014年年会
    • Place of Presentation
      慶応義塾大学 (日吉キャンパス)
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Silver Nanowires Transparent Conductive Films: Fabrication Using Different Sintering Techniques2013

    • Author(s)
      Jiu, Jinting, Tohru Sugahara, Masaya Nogi, Shijo Nagao, Suganuma Katsuaki
    • Organizer
      13th IEEE International Conference on Nanotechnology
    • Place of Presentation
      Shangri-La Hotel, Beijing, China
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Oxidation Resistance and Joining Properties of Cr-Doped Zn Bonding for SiC Die-Attachment2013

    • Author(s)
      S.-W. Park, T. Sugahara, S. Nagao, K. Suganuma
    • Organizer
      63rd IEEE Electronic Components and Technology Conference 2013
    • Place of Presentation
      Las Vegas, NV, USA
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Electromigration effect on mechanical shock behavior of Sn-Ag-Bi-In + Co solder joints for surface-mounted chip components2013

    • Author(s)
      Youngseok Kim, Shijo Nagao, Tohru Sugahara and Katsuaki Suganuma
    • Organizer
      Solid State Devices and Materials 2013
    • Place of Presentation
      Hilton Fukuoka Sea Hawk, Fukuoka, Japan
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 銅および酸化銅フレークを用いた低温焼結接合2013

    • Author(s)
      上瀧 領二, 朴 聖源, 菅原 徹, 長尾 至成, 菅沼 克昭
    • Organizer
      日本金属学会 2013秋季講演大会(第153回)
    • Place of Presentation
      金沢大学
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 銀ダイレクトボンディングにおける接合条件の最適化2013

    • Author(s)
      呉 哲旼,長尾 至成,菅原 徹,菅沼 克昭
    • Organizer
      第23回マイクロエレクトロニクスシンポジウム MES2013
    • Place of Presentation
      大阪大学
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 超耐熱 Zn-0.1Cr はんだと Cu 及び Ni 基板の界面反応2013

    • Author(s)
      朴 聖源,長尾 至成,菅原 徹,菅沼 克昭
    • Organizer
      第23回マイクロエレクトロニクスシンポジウム MES2013
    • Place of Presentation
      大阪大学
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Heavy Ribbon Wire Bonding for Advanced Power Module Packages2013

    • Author(s)
      Semin Park, Shijo Nagao, Tohru Sugahara, and Katsuaki Suganuma
    • Organizer
      Solid State Devices and Materials 2013
    • Place of Presentation
      Hilton Fukuoka Sea Hawk, Fukuoka, Japan
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Synthesis of molybdenum trioxide nanorods arrays via one-step sol-gel spin coating method

    • Author(s)
      Shuren Cong, Tohru Sugahara, Jinting Jiu, Yukiko Hirose, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      日本セラミックス協会、2015年年会
    • Place of Presentation
      岡山大学、岡山
    • Year and Date
      2015-03-18 – 2015-03-20
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] CIGS solar cell based on all printed layers

    • Author(s)
      Manjeet Singh, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma
    • Organizer
      5th International Conference on Flexible and Printed Electronics (ICFPE 2014)
    • Place of Presentation
      Beijing, China
    • Year and Date
      2014-10-21 – 2014-10-23
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] 6.Pressureless Ag thin-film die-attach for SiC devices C. Oh

    • Author(s)
      S. Nagao, S. Koga , T. Sugahara, K. Suganuma
    • Organizer
      European Conference of Silicon Carbide & Repated Materials (ECSCRM)
    • Place of Presentation
      Grenoble
    • Year and Date
      2014-09-21 – 2014-09-25
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Sol-Gel Ink Development Electronic Device Fabrication by for Printed Electronics

    • Author(s)
      T. Sugahara, Y. Hirose, S. Cong, M. Karakawa, K. Imamura, and K. Suganuma
    • Organizer
      EMN Summer and Energy Materials Nanotechnology 2015
    • Place of Presentation
      Qingdao, China
    • Year and Date
      2015-07-14 – 2015-07-17
    • Invited
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] 9.Low-pressure sintering bonding with Cu and CuO flake paste for power devices

    • Author(s)
      S.W. Park, R. Uwataki, S. Nagao, T. Sugahara, Y. Katoh, H.Ishino, K. Sugiura, K. Tsuruta, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vist
    • Year and Date
      2014-05-27 – 2014-05-30
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] SiC 粒子を添加した銀ペーストの焼結特性の改善

    • Author(s)
      張昊, 長尾至成, 朴聖源, 菅原徹, 菅沼克昭
    • Organizer
      第24回マイクロエレクトロニクスシンポジウム(MES2014)
    • Place of Presentation
      大阪
    • Year and Date
      2014-09-04 – 2014-09-05
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Rapid photo-sintering techniques for printing devices

    • Author(s)
      Jinting Jiu, Manjeet Singh, Teppei Araki, Tohru Sugahara, Masaya Nogi, Hirotaka Koga, Shijo Nagao, Katsuaki Suganuma, Hiroshi Uchida
    • Organizer
      5th International Conference on Flexible and Printed Electronics (ICFPE 2014)
    • Place of Presentation
      Beijing, China
    • Year and Date
      2014-10-21 – 2014-10-23
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Growth and characterization of molybdenum oxide nanorods by one-step sol-gel spin coating method

    • Author(s)
      Shuren Cong, Tohru Sugahara, Jinting Jiu, Yukiko Hirose, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      第75回応用物理学会秋季学術講演会
    • Place of Presentation
      北海道大学、札幌
    • Year and Date
      2014-09-17 – 2014-09-20
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] ゾルゲル法によるIGZO均一膜の作製と安定剤の効果

    • Author(s)
      松尾琢朗・菅原徹・廣瀬由紀子・酒金婷・長尾至成・菅沼克昭
    • Organizer
      日本セラミックス協会、第27回秋季シンポジウム
    • Place of Presentation
      鹿児島大学、鹿児島
    • Year and Date
      2014-09-09 – 2014-09-11
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Photoelectrical and microphysical properties of Sol-Gel derived IGZO thin films for printed TFTs

    • Author(s)
      T. Matsuo, T. Sugahara, Y. Hirose, J. Jiu, S. Nagao, K. Suganuma, Jianying He, Zhiliang Zhang
    • Organizer
      ESTC 2014
    • Place of Presentation
      Helsinki, Finland
    • Year and Date
      2014-09-16 – 2014-09-18
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Sol-Gel-Derived Amorphous Semiconductor TFT Fabrication and its Performance

    • Author(s)
      Tohru Sugahara, Takuro Matsuo, Yukiko Hirose, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      EMN Ceramics Meeting 2015
    • Place of Presentation
      Orlando, FL USA
    • Year and Date
      2015-01-26 – 2015-01-29
    • Invited
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] 7.Ultrasonic bonding of Cu/Al clad ribbon interconnections in power electronic modules

    • Author(s)
      S. Park, S. Nagao, T. Sugahara, E. Yokoi, O. Iizuka, K. Suganuma
    • Organizer
      67th IIW Annual Assembly & International Conference
    • Place of Presentation
      Seoul
    • Year and Date
      2014-07-13 – 2014-07-18
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 8.Microimpact testing for miniaturized electronic component packaging

    • Author(s)
      S. Nagao, Y.-S. Kim, T. Sugahara, Y. Onishi, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vista
    • Year and Date
      2014-05-27 – 2014-05-30
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Physical Properties and Deposited Condition of Sol-Gel Derived Metal Oxide for Transparent Conductive Film

    • Author(s)
      T. Sugahara, Y. Hirose, H. Koga, J. Jiu, M. Nogi, S. Nagao, and K. Suganuma
    • Organizer
      EMN Summer and Energy Materials Nanotechnology 2014
    • Place of Presentation
      Cancun, Mexico
    • Year and Date
      2014-07-09 – 2014-07-12
    • Invited
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] Silver sinter joining and new thin film bonding for WBG die-attach

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara, C. Oh, H. Zhang, S. Koga, S. Park
    • Organizer
      2nd International Conference on Nanojoining and Microjoining
    • Place of Presentation
      Emmetten
    • Year and Date
      2014-12-07 – 2014-12-10
    • Invited
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] ゾル・ゲル由来のアモルファスIGZO-TFTの創製とその特性

    • Author(s)
      菅原 徹、松尾 琢朗、廣瀬 由紀子、酒金婷、長尾 至成、菅沼 克昭
    • Organizer
      日本セラミックス協会、2015年年会
    • Place of Presentation
      岡山大学、岡山
    • Year and Date
      2015-03-18 – 2015-03-20
    • Data Source
      KAKENHI-PROJECT-25810140
  • [Presentation] 10.Pressure-Less Plasma Sintering of Cu Paste for SiC Die-Attach of High-Temperature Power Device Manufacturing

    • Author(s)
      S. Nagao, K. Kodani, S. Sakamoto, S. W. Park, T. Sugahara, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vista
    • Year and Date
      2014-05-27 – 2014-05-30
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] Towards high reliability interconnections for advanced electronics

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara
    • Organizer
      67th IIW Annual Assembly & International Conference (IIW2014)
    • Place of Presentation
      Soul
    • Year and Date
      2014-07-17 – 2014-07-18
    • Data Source
      KAKENHI-PROJECT-24226017
  • [Presentation] 7.Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

    • Author(s)
      S. Nagao, N. Fujisawa , T. Sugioka, S. Ogawa, T. Fujibayashi, T. Wada, T. Sugahara, K. Suganuma
    • Organizer
      European Conference of Silicon Carbide & Repated Materials (ECSCRM)
    • Place of Presentation
      Grenoble
    • Year and Date
      2014-09-21 – 2014-09-25
    • Data Source
      KAKENHI-PROJECT-24226017
  • 1.  Suganuma Katsuaki (10154444)
    # of Collaborated Projects: 2 results
    # of Collaborated Products: 44 results
  • 2.  Karakawa Makoto (80452457)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 3.  Sakurai Yasushi (30466411)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 4.  Sato Katsunari (00708381)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 5.  長尾 至成 (10315054)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 6 results
  • 6.  酒 金テイ (00467622)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 1 results
  • 7.  小野 尭生 (00752875)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 8.  永村 直佳 (40708799)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 9.  松原 靖子 (00721739)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 10.  千葉 大地 (10505241)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 11.  伊藤 雄一 (40359857)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 12.  鳴海 拓志 (70614353)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 13.  伊庭野 健造 (80647470)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 14.  廣瀬 哲也 (70396315)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 15.  清水 徹 (90588344)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 16.  兼本 大輔 (90603332)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 17.  HIROSE Yukiko
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 18.  Lin Shih-kang
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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