DOI Toshiro 土肥俊郎

… Alternative Names

DOI Toshirou 土肥俊郎

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Researcher Number	30207675
Affiliation (based on the past Project Information) *help	2012 – 2015: 九州大学, 産学連携センター, 特任教授 2008 – 2010: Kyushu University, 大学院・工学研究院, 教授 1989 – 1991: 埼玉大学, 教育学部, 助教授
Review Section/Research Field	Principal Investigator Production engineering/Processing studies Except Principal Investigator 物理計測・光学
Keywords	Principal Investigator 難加工材料 / 加工レート / CMP / 超押し込み試験 / SiC, GaN, ダイヤモンド / PCVM / TEM / 超押し込み実験 / SiC, GaN, ﾀﾞｲﾔﾓﾝﾄﾞ / フェムト秒(Fs)レーザ … More / 融合加工装置 / 超難加工結晶 / 疑似ラジカル / 超難加工材料 / 疑似ラジカル場 / P-CVM / フェムト秒レーザ / 表面粗さ / 加工効率 / プラズマ融合CMP / 高圧酸素雰囲気 / 電解CMP / 雰囲気制御加工 / 多枚数同時加工 / 両面同時加工 / 光触媒反応の援用 / 高圧ガス雰囲気と減圧雰囲気 / ベルジャー密閉型 / SiC / Si / 光触媒反応 / 密閉雰囲気 / 密閉型加工 … More Except Principal Investigator Polarization bistability / Semiconductor laser / Optical short pulse generation / Mode-locking / Degenerate four-wave mixing / Nonlinear optics / Semiconductor-doped glass / Quantum well / 量子箱 / 半導体レ-ザ- / 利得スイッチング / 偏波面双安定 / 半導体レ-ザ / 短光パルス発生 / モ-ド同期 / 縮退4光波混合法 / 光非線形効果 / 半導体超微粒子 / 量子井戸 Less

Breakthrough in the ultra-precison polishing process of diamond substrates as an ulimate devicePrincipal Investigator
- Principal Investigator
  
  DOI Toshiro
- Project Period (FY)
  2012 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Production engineering/Processing studies
- Research Institution
  Kyushu University
Development of a new Chemical Mechanical Polishing (CMP) machine, assisted by the photocatalytic reactions and electrolytic actions in the atmosphere controlled sealed CMP chamberPrincipal Investigator
- Principal Investigator
  
  DOI Toshiro
- Project Period (FY)
  2008 – 2010
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Production engineering/Processing studies
- Research Institution
  Kyushu University
Research on ultra-fast optical bistable devices with multi-dimentional quantum well structure
- Principal Investigator
  
  KAWAGUCHI Hitoshi
- Project Period (FY)
  1989 – 1991
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Field
  
  物理計測・光学
- Research Institution
  Yamagata University

All 2016 2015 2014 2013 2012 2011 2010 2009 2008 Other

All Journal Article Presentation Book Patent

[Book] New Diamond Vol.322016
- Author(s)
  會田英雄、土肥俊郎、佐野泰久、黒河周平、大山幸希、金聖祐
- Total Pages
  2
- Publisher
  (社）ニューダイヤモンドフォーラム
- Data Source
  KAKENHI-PROJECT-24226005
[Book] Handbook of Ceramics Grinding and Polishing(2E)2014
- Author(s)
  T.Doi, I.D.Marinescu, E.Uhlmann
- Total Pages
  544
- Publisher
  elsevier
- Data Source
  KAKENHI-PROJECT-24226005
[Book] Chemical-Mechanical Machining Process / Handbook of Manufacturing Engineering & Technology(Chap.4-3)2014
- Author(s)
  T. Doi
- Total Pages
  12
- Publisher
  Springer-Velag London
- Data Source
  KAKENHI-PROJECT-24226005
[Book] 精密加工と微細構造の形成技術2013
- Author(s)
  會田英雄, 武田秀俊、土肥俊郎
- Total Pages
  17
- Publisher
  技術情報協会
- Data Source
  KAKENHI-PROJECT-24226005
[Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-113,11042010
- Author(s)
  土肥俊郎
- Total Pages
  896
- Publisher
  日本機械学会誌
- Data Source
  KAKENHI-PROJECT-20246033
[Book] 超精密研磨/CMP技術とその最新動向(その-最新のCMP技術とトライボケミカル応用-第55巻第11号2010
- Author(s)
  土肥俊郎, 黒河周平, 大西修, 山崎努
- Publisher
  トライボロジスト
- Data Source
  KAKENHI-PROJECT-20246033
[Book] 超精密研磨/CMP技術とその最新動向(その1)-研磨の発展経緯と加工原理-第55巻第11号2010
- Author(s)
  土肥俊郎, 黒河周平, 大西修, 山崎努
- Publisher
  トライボロジスト
- Data Source
  KAKENHI-PROJECT-20246033
[Book] 超精密研磨/CMP技術とその最新動向(その2)-最新のCMP技術とトライボケミカル応用-2010
- Author(s)
  土肥俊郎, 黒河周平, 大西修, 山崎努
- Total Pages
  72
- Publisher
  日本トライボロジー学会
- Data Source
  KAKENHI-PROJECT-20246033
[Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-2010
- Author(s)
  土肥俊郎
- Total Pages
  98
- Publisher
  日本機械学会誌
- Data Source
  KAKENHI-PROJECT-20246033
[Book] ものづくりのイノベーションとそのサステナビリティを目指して第75巻,第6号2009
- Author(s)
  土肥俊郎, 黒河周平, 梅崎洋二
- Publisher
  精密工学会誌
- Data Source
  KAKENHI-PROJECT-20246033
[Book] 平坦化CMP装置,電子材料(12月号別冊超LSI製造・試験装置ガイドブック)2008
- Author(s)
  土肥俊郎, 黒河周平
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates2016
- Author(s)
  Yasuhisa Sano, Kousuke Shiozawa, Toshiro Doi, Hideo Aida, Tadakazu Miyashita and Kazuto Yamauchi
- Journal Title
  
  Mechanical Engineering Journal
  
  Volume: 3 Issue: 1 Pages: 15-00527-15-00527
- DOI
  10.1299/mej.15-00527
- NAID
  130005126182
- ISSN
  2187-9745
- Language
  English
- Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] 高効率加工を目指す革新的プラズマ融合CMP技術と難加工材料への適用2016
- Author(s)
  土肥俊郎、會田英雄
- Journal Title
  
  光技術コンタクト
  
  Volume: 54（4） Pages: 1-9
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface2015
- Author(s)
  asuhisa Sano, Toshiro Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Yuu Okada, Hiroaki Nishikawa and Kazuto Yamauchi
- Journal Title
  
  Key Engineering Materials
  
  Volume: 625 Pages: 550-553
- Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] 革新的概念に基づく超高効率加工技術の構築（ダイラタンシー・パッド工具と液中加工システムによるSiC基板の効果的加工プロセスの確立）2015
- Author(s)
  土肥俊郎，瀬下清, 山崎努, 大坪正徳, 西澤秀明, 村上幸, 市川大造, 中村由夫, 宮下忠一, 川村佳秀, 高木正孝, 柏田太志, 曾田英雄
- Journal Title
  
  日本機械学会論文集
  
  Volume: 81 Pages: 1-12
- NAID
  130005066595
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Precise Mechanical Polishing of Brittle Materials with Free Diamond Abrasives Dispersed in micro-nano-bubble Water2015
- Author(s)
  Hideo AIDA, Seong-Woo KIM, Kenjiro IKEJIRI, Toshiro DOI, Tsutomu YAMAZAKI, Kiyoshi SESHIMO, Koji KOYAMA, Hidetoshi TAKEDA, and Natsuko AOTA
- Journal Title
  
  Precision Engineering
  
  Volume: 40 Pages: 81-86
- Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Consideration of Femtosecond Laser-induced Effect on Semiconductor Material SiC Substrate for CMP Processing2015
- Author(s)
  hengwu WANG, Syuhei KUROKAWA, Toshiro DOI, Yasuhisa SANO, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Koki OYAMA, Terutake HAYASHI, Ji ZHANG, Asakawa EIJI
- Journal Title
  
  Applied Mechanics and Materials
  
  Volume: 799-800 Pages: 458-462
- Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives2014
- Author(s)
  H. AIDA, H. TAKEDA, S.-W. KIM, N. AOTA, K. KOYAMA, T. YAMAZAKI, and T. DOI
- Journal Title
  
  Appl. Surf. Sci
  
  Volume: 292 Pages: 531-536
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Growth of Thick GaN Layers on Laser-processed Sapphire Substrate by Hydride Vapor Phase Epitaxy2014
- Author(s)
  Koji KOYAMA, Hideo AIDA, Seong-Woo KIM, Kenjiro IKEJIRI, Toshiro DOI, Tsutomu YAMAZAKI
- Journal Title
  
  J. Crystal Growth
  
  Volume: 403 Pages: 38-42
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage2014
- Author(s)
  Y.Sano, T.K.Doi, S.Kurokawa, H.Aida, O.Ohnishi, M.Uneda, K.Shiozawa, Y.Okada, K.Yamauchi
- Journal Title
  
  Sensors and Materials
  
  Volume: 26 Pages: 429-434
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] N-Face Finishing Influence on Geometry of Double-Side Polished GaN Substrate2014
- Author(s)
  Koji KOYAMA, Hideo AIDA, Michio UNEDA, Hidetoshi TAKEDA, Seong-Woo KIM, Hiroki TAKEI, Tsutomu YAMAZAKI, and Toshiro DOI
- Journal Title
  
  Int. J. Automation Technology
  
  Volume: 8 Pages: 121-127
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] N-Face Finishing Influence on Geometry of Double-Side Polished GaN Substrate2014
- Author(s)
  Koji Koyama, Hideo Aida, Michio Uneda, Hidetoshi Takeda, Seong-Woo Kim, Hiroki Takei, Tsutomu Yamazaki, Toshiro Doi
- Journal Title
  
  International Journal of Automation Technology
  
  Volume: 8 Pages: 121-127
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Approach to High Efficient CMP For Power Device Substrates2014
- Author(s)
  Syuhei KUROKAWA, Toshiro DOI, Chengwu W.WANG, Yasuhisa SANO, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI
- Journal Title
  
  ECS Transactions
  
  Volume: 60 Pages: 641-646
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] グリーンﾃﾞﾊﾞｲｽ用難加工材料(SiC, GaN, ダイヤモンドﾞ）基板の革新的加工プロセス技術、2014
- Author(s)
  土肥俊郎
- Journal Title
  
  月刊トライボロジー
  
  Volume: 28 Pages: 16-18
- Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts2014
- Author(s)
  Toshiro K. Doi, Yasuhisa Sano, Syuhei Kurowaka, Hideo Aida, Osamu Ohnishi, Michio Uneda and Koki Ohyama
- Journal Title
  
  Sensors and Materials
  
  Volume: 26 Pages: 403-415
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining [CMP/P-CVM] Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts2014
- Author(s)
  T. K. Doi, Y. Sano, S. Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Koki Ohyama
- Journal Title
  
  Sensors & Materials
  
  Volume: 未定
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Surface Planarization of GaN-on-Sapphire Template by Chemical Mechanical Polishing for Subsequent GaN Homoepitaxy2014
- Author(s)
  Hideo AIDA, Seong-woo KIM, Toshimasa SUZUKI, Koji KOYAMA, Natsuko AOTA, Toshiro DOI, Tsutomu YAMAZAKI
- Journal Title
  
  ECS Journal of Solid State Science and Technology
  
  Volume: 3 Pages: 163-168
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface2014
- Author(s)
  Yasuhisa Sano, Toshiro Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Yuu Okada, Hiroaki Nishikawa, Kazuto Yamauchi
- Journal Title
  
  Key Engineering Materials
  
  Volume: 625 Pages: 550-553
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives2014
- Author(s)
  Hideo AIDA, Hidetoshi TAKEDA, Seong-Woo KIM, Natsuko AOTA, Koji KOYAMA, Tsutomu YAMAZAKI, Toshiro DOI
- Journal Title
  
  Appl. Surf. Science
  
  Volume: 292 Pages: 531-536
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Current Status and Future Prospects of GaN Substrates for Green Devices2013
- Author(s)
  Toshiro Doi
- Journal Title
  
  Sensor and Materials
  
  Volume: Vol.25, No.3 Pages: 141-154
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] The Effects of Strong Oxidizing Slurry and Processing Atmosphere on Double-sided CMP of SiC Wafer2012
- Author(s)
  Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Zhida WANG, and Zhe TAN
- Journal Title
  
  Advanced Materials Research
  
  Volume: Vols.591-593 Pages: 1131-1134
- DOI
  10.4028/www.scientific.net/amr.591-593.1131
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24226005
[Journal Article] Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed,Pressure-Resistance Container2010
- Author(s)
  K.Kitamura, T.Doi, S.Kurokawa, Y.Umezaki, Y.Matsukawa, Y.Ooki, T.Hasegawa, I.Koshiyama, K.Ichikawa, Y.Nakamura
- Journal Title
  
  Key Engineering Materials Vols.447-448
  
  Pages: 61-65
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry2010
- Author(s)
  T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, O.Ohnishi,Y.Akagami, Y.Yamaguchi, S.Kishii
- Journal Title
  
  Advances in Science and Technology Vol.64
  
  Pages: 65-70
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] Study on the Development of Resource-Saving High Performance Slurry -Polishing/CMP for glass substrates in a radical polishing environment, using manganese oxide slurry as an alternative for ceria slurry-2010
- Author(s)
  T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, et al.
- Journal Title
  
  Advances in Science and Technology
  
  Volume: 64 Pages: 65-70
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container2010
- Author(s)
  K.Kitamura, T.Doi, et al.
- Journal Title
  
  Key Engineering Materials
  
  Volume: 447-448 Pages: 61-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] Polishing Characteristics of Optoelectronics Materials by Bell-jar-shaped CMP Machine under the Controlled Working Atmosphere2009
- Author(s)
  土肥俊郎
- Journal Title
  
  Proceeding of First International Symposium on Atomically Controlled Fabrication Technology 1
  
  Pages: 12-13
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] Si CMP with a sealed “Bell Jar"type CMP machine-Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry-2008
- Author(s)
  木原丈晴, 土肥俊郎, 他7名
- Journal Title
  
  Proceeding of The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium) 1
  
  Pages: 98-102
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20246033
[Journal Article] CMP of SiC Wafers as a Post-Si Power-Device-Photocatalitic reaction assisted Bell-Jar shaped CMP machine under high pressure oxygen gas-2008
- Author(s)
  土肥俊郎, 黒河周平
- Journal Title
  
  Proceeding of The 5^<th> International Conference on Planarization/CMP Technology (ICPT 2008) 1
  
  Pages: 2-2
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20246033
[Patent] 「プラズマ融合CMP」「plasma fusion CMP」2016
- Inventor(s)
  土肥俊郎、佐野泰久、黒河周平、不二越機械工業、並木精密宝石
- Industrial Property Rights Holder
  土肥俊郎、佐野泰久、黒河周平、不二越機械工業、並木精密宝石
- Industrial Property Rights Type
  実用新案
- Filing Date
  2016-03-01
- Data Source
  KAKENHI-PROJECT-24226005
[Patent] 加工方法及び該方法を用いる複合加工装置並びに該方法または該装置により加工された加工物2014
- Inventor(s)
  佐野, 土肥, 黒河、會田, 大山, 宮下
- Industrial Property Rights Holder
  佐野, 土肥, 黒河、會田, 大山, 宮下
- Industrial Property Rights Type
  特許
- Filing Date
  2014-02-25
- Data Source
  KAKENHI-PROJECT-24226005
[Patent] 加工方法及び該方法を用いる複合加工装置並びに該方法または該装置により加工された加工物2014
- Inventor(s)
  土肥、佐野、宮下、曾田、大山
- Industrial Property Rights Holder
  土肥、佐野、宮下、曾田、大山
- Industrial Property Rights Type
  特許
- Filing Date
  2014-02-25
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第11報）－B-Type装置によるGaN基板加工特性とその加工メカニズム-2016
- Author(s)
  大山幸希、土肥俊郎、西澤秀明、會田英雄、佐野泰久、黒河周平山崎直
- Organizer
  2016年度精密工学会春季大会学術講演会
- Place of Presentation
  東京理科大学野田キャンパス
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第10報）－基本型装置（A型）によるダイヤモンドの加工－2016
- Author(s)
  佐野泰久, 土肥俊郎, 黒河周平, 會田英雄, 大山幸希, 宮下忠一, 住澤春男, 宮崎俊亘, 山内和人
- Organizer
  2016年度精密工学会春季大会学術講演会
- Place of Presentation
  東京理科大学野田キャンパス
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的プラズマ融合CMP技術の提案とDiamond基板の加工2016
- Author(s)
  西澤秀明、土肥俊郎、會田英雄、黒河周平、佐野泰久
- Organizer
  第31回精密加工ﾌﾟﾛｾｽ研究会
- Place of Presentation
  リファレンス駅東ビル（福岡）
- Year and Date
  2016-02-25
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第12報）－B-Type装置によるダイヤモンド基板とその加工メカニズム-2016
- Author(s)
  西澤秀明、土肥俊郎、大山幸希、會田英雄、佐野泰久、黒河周平、金聖祐
- Organizer
  2016年度精密工学会春季大会学術講演会
- Place of Presentation
  東京理科大学野田キャンパス
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 先端的難加工基板の高能率精密加工法の研究（第6報）-ｆｓレーザ照射による疑似ラジカルば形成基板表面のCMP研磨特性-2016
- Author(s)
  黒河周平、王成武、土肥俊郎、佐野泰久、會田英雄、大山幸希
- Organizer
  2016年度精密工学会春季大会学術講演会
- Place of Presentation
  東京理科大学野田キャンパス
- Year and Date
  2016-03-15
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] High-efficiency planarization method for hard-to-machine semiconductor substrates combining mechanical polishing and atmospheric-pressure plasma etching2015
- Author(s)
  Yasuhisa Sano, Kousuke Shiozawa, Toshiro Doi, Syuhei Kurokawa, Hideo Aida, Tadakazu Miyashita, and Kazuto Yamauchi
- Organizer
  2015 JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment
- Place of Presentation
  神戸国際会議場
- Year and Date
  2015-06-14
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] A New ”Dilatancy Pad” and its Polishing　Characteristics for SiC Substrates including Sapphire2015
- Author(s)
  Toshiro Doi
- Organizer
  The 7th Xihu Swording Salon
- Place of Presentation
  Hangzhou（中国）
- Year and Date
  2015-12-24
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的 “Plasma fusion CMP装置”の設計・試作(第9報) －ダイヤモンド単結晶基板の加工特性－2015
- Author(s)
  西澤秀明，大山幸希，土肥俊郎，曾田英雄，金　聖祐，佐野泰久，黒河周平，王　成武
- Organizer
  2015年度精密工学会秋季大会学術講演会
- Place of Presentation
  東北大学川内北キャンパス
- Year and Date
  2015-09-04
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第8報） -基本型装置（A型）によるダイヤモンド加工の基礎検討-2015
- Author(s)
  佐野泰久，塩澤昂祐，土肥俊郎，黒河周平，會田英雄，大山幸希，宮下忠一，山内和人
- Organizer
  2015年度精密工学会秋季大会学術講演会
- Place of Presentation
  東北大学川内北キャンパス
- Year and Date
  2015-09-04
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Damage-induced increase of removal rate of atmospheric-pressure plasma etching of diamond substrate2015
- Author(s)
  Y.Sano, K. Shiozawa, T. Doi, S. Kurokawa, H. Aida, K. Oyama, T. Miyashita, H. Sumizawa, K. Yamauchi
- Organizer
  The 9th International Conference on New Diamonds and Nano Carbons 2015
- Place of Presentation
  静岡県コンベンションアーツセンター
- Year and Date
  2015-05-24
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 「オプトﾒｶﾄﾛﾆｸｽ産業を支える超精密加工/CMP」の来し方行く末2015
- Author(s)
  土肥俊郎
- Organizer
  GNG創立25周年記念講演会
- Place of Presentation
  銀座ブロッサム
- Year and Date
  2015-07-17
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Optimization of Machining Conditions of Basic-Type CMP/P-CVM Fusion Processing Using SiC Substrate2015
- Author(s)
  Yasuhisa Sano, Kousuke Shiozawa, Toshiro Doi, Syuhei kurokawa, Hideo Aida, Koki Oyama, Tadakazu Miyashita, Haruo Sumizawa, Kazuto Yamauchi
- Organizer
  2015 International Conference on Planarization/CMP Technology (ICPT2015)
- Place of Presentation
  アリゾナ（米国）
- Year and Date
  2015-09-30
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] モノづくりの起源”研磨”からCMP,そして将来－先端的超難加工材料の高効率加工へのブレークスルー2015
- Author(s)
  土肥俊郎
- Organizer
  2015年度砥粒加工学会先進テクノフェア(ATF2015)
- Place of Presentation
  (独）産業技術総合研究所（東京都江東区）
- Year and Date
  2015-03-06
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 結晶基板の加工プロセス設計と高効率加工へのブレークスルー2015
- Author(s)
  土肥俊郎
- Organizer
  第20回結晶工学セミナー「基板の加工と評価が切り拓くSi, SiC, GaN結晶の基盤技術」
- Place of Presentation
  学習院創立百周年記念会館
- Year and Date
  2015-12-10
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Consideration of Femtosecond laser-induced Effect on Semiconductor Material SiC Substrate for CMP Processing2015
- Author(s)
  Syuhei Kurokawa, Toshiro Doi, Yasuhisa Sano, Hideo Aida, Osamu Ohnishi, Michio Uneda, Koki Ohyama, Terutake Hayashi, Ji Zhang, Asakawa Eiji
- Organizer
  2015 ASR Bali Conferences(ICMMT2015/ICRE2015/ICLB2015)
- Place of Presentation
  Bali, Indonesia
- Year and Date
  2015-05-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Development of the innovative CMP/P-CVM combined apparatus (basic type)2014
- Author(s)
  K. Shiozawa, Y. Sano, T. Doi, S. Kurokawa, H. Aida, T. Miyashita, H. Sumizawa and K. Yamauchi
- Organizer
  International Conference on Planarization/CMP Technology 2014 (ICPT2014)
- Place of Presentation
  神戸国際会議場（兵庫）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Fabrication of Gallium Nitride Substrate with Novel Approaches –Internally Focused Laser Processing for Crystal Growth and Advanced CMP for Wafering–2014
- Author(s)
  H. AIDA, T. DOI, H. TAKEDA, K. KOYAMA, S. KUROKAWA, Y. SANO
- Organizer
  EMN Spring 2014
- Place of Presentation
  Hotel. red rock(米国・ラスベガス）
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第1報）―装置化の基本のコンセプトと試作装置―2014
- Author(s)
  土肥俊郎、佐野泰久、黒河周平、曾田英雄
- Organizer
  2014年度精密工学会春季大会学術講演会
- Place of Presentation
  東京大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作－基本型融合加工装置(A-type)とその基本特性－2014
- Author(s)
  塩澤昂祐, 佐野泰久, 土肥俊郎, 黒河周平, 會田英雄, 宮下忠一, 住澤春男, 山内和人
- Organizer
  2014年度精密工学会春季大会学術講演会
- Place of Presentation
  東京大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Removal Rate of Plasma Chemical Vaporization Machining of Intentionally Damaged Surface by Mechanical Action2014
- Author(s)
  K. Shiozawa, Y. Sano, T. Doi, S. Kurokawa, H. Aida, O.Ohnishi, M. Uneda, Y. Okada, and K. Yamauchi
- Organizer
  15th International Conference on Precision Engineering (ICPE2014)
- Place of Presentation
  石川県政記念しいのき迎賓館（石川）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface2014
- Author(s)
  Y. Sano, T. Doi, S. Kurokawa, H. Aida, O. Ohnishi, M. Uneda, Y. Okada, H. Nishikawa, and K. Yamauchi
- Organizer
  5th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2013)
- Place of Presentation
  Howard Civil International Centre(台湾）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] グリーンデバイスとしてのSiC, GaN, ダイヤモンド基板とその加工プロセス技術2014
- Author(s)
  土肥俊郎
- Organizer
  砥粒加工学会「先端加工井フォーラムとやま2014」
- Place of Presentation
  富山大学（富山）
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP／P-CVM 融合加工法の提案とその加工特性－ワイドギャップ結晶材料の高効率加工へのブレークスルー－2014
- Author(s)
  大山幸希, 土肥俊郎, 佐野泰久, 會田英雄,黒河周平, 金聖祐, 宮下忠一
- Organizer
  日本機械学会2014 年度年次大会
- Place of Presentation
  東京電機大学（東京都）
- Year and Date
  2014-09-10
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Diamond Substrate Planarization Polishing Technique2013
- Author(s)
  K. OYAMA, T. DOI, H. AIDA, S. KUROKAWA, Y.SANO, H. TAKEDA, K. KOYAMA, T. YAMAZAKI, and K. TAKAHASHI
- Organizer
  International Conference on Planarization/CMP Technology
- Place of Presentation
  Ambassador Hotel (台湾）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Growth of Thick GaN Layers on Laser-Processed Sapphire Substrate by Hydride Vapor Phase Epitaxy2013
- Author(s)
  H. AIDA, S.-Woo KIM, K. IKEJIRI, K. KOYAMA, T. DOI, and T. YAMAZAKI
- Organizer
  International Workshop on Bulk Nitride Semiconductors
- Place of Presentation
  Kloster Seeon（ドイツ）
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Advanced high efficient precision processing method based on the III-N semiconductor processing-A proposal of a process with new concepts for hard-to-process crystal wafers2013
- Author(s)
  T. Doi, Y. Sano, S. Kurokawa, H. Aida
- Organizer
  WUPP for III-Nitride 2013
- Place of Presentation
  The BEST WESTERN PLUS(米国）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Progress and Challenges for Chemical Mechanical Polishing of Gallium Nitride2013
- Author(s)
  H. AIDA, T. DOI, T.YAMAZAKI, H. TAKEDA, and K.KOYAMA
- Organizer
  Material Research Society 2013 Spring meeting
- Place of Presentation
  Public Outreach Center(米国）
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Laser-Processed Substrate for Stress Reduction in Heteroepitaxy2013
- Author(s)
  H. AIDA, H. TAKEDA, N.AOTA, K.IKEJIRI, S.-Woo KIM, K. KOYAMA, T. DOI, and T. Yamazaki.
- Organizer
  2013 Collaborative Conference on Crystal Growth (3CG)
- Place of Presentation
  The WESTIN Resort&Spa(メキシコ）
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 先端的難加工基板の高効率精密加工法の研究（第4報）－加工変質層の断面TEM による評価とそのPCVM加工特性－2013
- Author(s)
  塩澤昂祐, 佐野泰久, 土肥俊郎, 黒河周平, 會田英雄, 大西修, 畝田道雄, 岡田悠, 山内和人
- Organizer
  2013年度精密工学会秋季大会学術講演会
- Place of Presentation
  関西大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Formation and Evaluation of Quasi-radical Site Induced by Femtosecond Laser on the Surface of Diamond2013
- Author(s)
  C. WANG, S. KUROKAWA, S. KOMAI, H. AIDA, K. OYAMA, K. TAKAHASHI, Y. SANO, K. TSUKAMOTO, and Toshiro DOI
- Organizer
  the 13th International Symposium on Aerospace Technology
- Place of Presentation
  サンポートホール高松（香川）
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] ダィヤモンド基板の窒化物半導体デバイスヘの応用-ダイヤモンド基板の平坦化研磨技術-2013
- Author(s)
  大山幸希・武田秀俊・小山浩司・曾田英雄・土肥俊郎
- Organizer
  日本機械学会 IIIP2013 情報・知能・精密機器部門(IIP部門)講演会
- Place of Presentation
  東洋大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP2012
- Author(s)
  Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Zhida WANG, and Zhe TAN
- Organizer
  International Conference on Planarization/CMP Technology 2012
- Place of Presentation
  Grenoble, France
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Chemical mechanical polishing of inorganic crystals and its application for organic photonics crystals2012
- Author(s)
  Hideo AIDA, Toshiro DOI, Haruji KATAKURA, Jun TAKAHASHI, and Tsutomu YAMAZAKI
- Organizer
  12th Int'l Symp. Advanced Organic Photonics (ISAOP-12)
- Place of Presentation
  Naha, Okinawa
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] SiC-CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant2012
- Author(s)
  Zhe TAN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, and Tao YIN
- Organizer
  Advanced Metallization Conference 2012
- Place of Presentation
  東京大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] GaN Substrate for Post-Silicon Power Devices -Surface and Subsurface Damage Evaluation for GaN Substrate Prepared by Chemical Mechanical Polishing-2012
- Author(s)
  Koji KOYAMA, Hideo AIDA, Junya NAKATA, Takuhiro SUGIYAMA, Aki TOSAKA, Yukichi SHIGETA, Hidetoshi TAKEDA, Natsuko AOTA, Toshiro DOI, Tsutomu YAMAZAKI
- Organizer
  6th Int'l Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium)
- Place of Presentation
  Kona, U.S.A
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar Type CMP Machine2012
- Author(s)
  Takateru EGASHIRA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Isamu KOSHIYAMA, and Daizo ICHIKAWA
- Organizer
  Advanced Metallization Conference 2012
- Place of Presentation
  東京大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 密閉耐圧チャンバー型両面同時CMP装置の開発-各種加工雰囲気下でのSiおよびSiCウエハのCMP特性と光触媒援用CMPの可能性について-2011
- Author(s)
  北村圭, 土肥俊郎, 黒河周平, 大西修, 尹涛, 長谷川正, 越山勇, 市川浩一郎
- Organizer
  日本機械学会九州支部講演会
- Place of Presentation
  九州大学(福岡)
- Year and Date
  2011-03-17
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 酸化マンガン系スラリーを用いたSiC単結晶基板の精密加工-密閉型加工環境コントロールCMP装置による加工特性-2011
- Author(s)
  長谷川正, 土肥俊郎, 黒河周平, 大西修, 山崎努, 尹涛, 河瀬康弘, 山口靖英, 岸井貞浩
- Organizer
  2011年度精密工学会春季大会学術講演会
- Place of Presentation
  東洋大学(東京)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 酸化マンガン系スラリーを用いたSiC単結晶基板の精密加工プロセスに関する研究-密閉型加工環境コントロールCMP装置による加工-2011
- Author(s)
  長谷川正, 土肥俊郎, 黒河周平, 大西修, 河瀬康弘, 尹涛, 山崎努, 岸井貞浩
- Organizer
  日本機械学会九州支部講演会
- Place of Presentation
  九州大学(福岡)
- Year and Date
  2011-03-17
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 耐圧密閉チャンバー型CMP装置を用いた加工環境制御下における加工特性2011
- Author(s)
  江頭峻輝, 土肥俊郎, 黒河周平, 大西修, 山崎努
- Organizer
  日本機械学会九州学生会第42回卒業研究発表講演会
- Place of Presentation
  大分工業高等専門学校(大分)
- Year and Date
  2011-03-11
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 加工環境を制御したCMP装置によるSiCウエハの高能率加工に関する研究-コロイダルシリカとダイヤモンド微粒子スラリーを用いた加工特性-2011
- Author(s)
  尹涛, 土肥俊郎, 黒河周平, 大西修, 山崎努, 北村圭, 長谷川正
- Organizer
  日本機械学会九州支部講演会
- Place of Presentation
  九州大学(福岡)
- Year and Date
  2011-03-17
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Characteristics of Silicon CMP performed in various high pressure atmospheres-Development of a new double-side simultaneous CMP machine housed in a high pressure chamber2010
- Author(s)
  K.Kitamura, T.Doi, S.Kurokawa, O.Ohnishi, Y.Umezaki, T.Yamazaki, Y.Matsukawa, T.Hasegawa, I.Koshiyama, K.Ichikawa
- Organizer
  Advanced Metallization Conference 2010 : 20^<th> Asian Session)
- Place of Presentation
  東京大学(大学)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Characteristics of Micro Fiber Pads in Electro-Chemical Mechanical Polishing(E-CMP)of Copper Substrates,2010
- Author(s)
  T.HASEGAWA, T.Doi, et al.
- Organizer
  International Symposium on Technology of Mechanical Design and Production 2010,
- Place of Presentation
  Jinjy, Korea
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Polishing/CMP for glass substrates in a radical polishing environment, using manganese oxide slurry as an alternative for ceria slurry2010
- Author(s)
  T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, et al.
- Organizer
  Proc.of CIMTEC2010 (12th International Ceramics Congress)
- Place of Presentation
  Itary
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres -Development of a New Double-side Simultaneous CMP Machine Housed in a High Pressure Chamber-2010
- Author(s)
  K.Kitamura, T.Doi, S.Kurokawa, O.Ohnishi, Y.Umezaki, T.Yamazaki, Y.Matsukawa, T.Hasegawa, I.Koshiyama, K.Ichikawa
- Organizer
  Advanced Metallization Conference
- Place of Presentation
  東京大学(大学)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry -Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine-2010
- Author(s)
  T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, T.Yamazaki, Y.Kawase, Y.Yamaguchi, S.Kishi
- Organizer
  International Conference on Planarization/CMP Technology
- Place of Presentation
  Phoenix, Arizona (USA)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 4酸化マンガン系スラリーを用いたSiC基板の精密加工プロセスに関する研究-ベルジャー型加工機を用いた各種加工雰囲2010
- Author(s)
  長谷川正, 土肥俊郎, 黒河周平, 大西修, 梅崎洋二, 山崎努, 北村圭, 河瀬康弘, 岸井貞浩
- Organizer
  2010年度精密工学会秋季大会学術講演会
- Place of Presentation
  名古屋大学(名古屋
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for glasssubstrates in a radical polishing environment2010
- Author(s)
  T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, O.Ohnishi,Y.Akagami, Y.Yamaguchi, S.Kishii
- Organizer
  using manganese oxide slurry as an alternative for ceria slurry-, CIMTEC2011 12th International Ceramics Congress
- Place of Presentation
  Montecatine Terme, Itary
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] ガラス基板の研磨とラジカル環境場の効果-酸化セリウム系スラリーと酸化マンガン系スラリーによるCMP特性-2010
- Author(s)
  山崎努, 土肥俊郎, 黒河周平, 大西修, 梅崎洋二, 松川洋二, 山口靖英, 岸井貞浩
- Organizer
  2010年度精密工学会秋季大会学術講演会
- Place of Presentation
  名古屋大学(名古屋
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] SiC単結晶基板の酸化マンガン系スラリーによる精密加工プロセスに関する研究2010
- Author(s)
  長谷川正, 土肥俊郎, 黒河周平, 大西修, 河瀬康弘, 山口靖英, 岸井貞浩
- Organizer
  2010年度精密工学会九州支部熊本地方講演会
- Place of Presentation
  熊本大学(熊本)
- Year and Date
  2010-12-11
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry---Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine---2010
- Author(s)
  H.Hasegawa, T.Doi, et al.
- Organizer
  International Conference on Planarization/CMP Technology (ICPT) 2010
- Place of Presentation
  Phoenix, USA
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] SiC-CMP characteristics under high pressure gas atmospheres using manganese slurry2010
- Author(s)
  T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, Y.Kawase, Y.Yamaguchi, S.Kishii
- Organizer
  Advanced Metallization Conference
- Place of Presentation
  東京大学(大学)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres- Development of a new double-side simultaneous CMP machine, housed in a high pressure chamber-2010
- Author(s)
  K.Kitamura, T.Doi, et al.
- Organizer
  Advanced Metallization Conference (ADMETA) 2010 : 20^<th> Asian Session
- Place of Presentation
  Tokyo, Japan
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container2010
- Author(s)
  K.Kitamura, T.Doi, et al.
- Organizer
  International Conference on Precision Engineering (ICoPE2010 & 13th ICPE)
- Place of Presentation
  Singapore
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] SiC-CMP Characteristics under High Pressure Gas Atmospheres using Manganese Slurry2010
- Author(s)
  T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, Y.Kawase, Y.Yamaguchi, S.Kishii
- Organizer
  Advanced Metallization Conference
- Place of Presentation
  東京大学(大学)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] SiC-CMP characteristics under high pressure gas atmospheres using manganese slurry2010
- Author(s)
  H.Hasegawa, T.Doi, et al.
- Organizer
  Advanced Metallization Conference (ADMETA) 2010 : 20^<th> Asian Session
- Place of Presentation
  Tokyo, Japan
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Electro-Chemical Mechanical Polishing(E-CMP)of Copper Substrates with Micro Fiber Pad2009
- Author(s)
  T.Hasegawa, T.Doi, et al.
- Organizer
  International Conference on Planarization/CMP Technology 2009
- Place of Presentation
  Fukuoka, Japan
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] CMP of SiC Wafers as a Post-Si Power-Device-Bell-Jar shaped CMP machine, assisted by photocatalitic reactions under high pressure oxygen gas, and CMP Characteristics of functional materials-2009
- Author(s)
  T.Doi, S.Kurokawa
- Organizer
  1^<st> International Conference on Surface and Interface Fabrication Techonologies(ICSIF)
- Place of Presentation
  RIKEN Wako Institute Welfare and Conference Building, Japan
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Cu-CMP Characteristics by Controlled Atmosphere polishin Machine and Effect of High Pressure CO_2 Gas2009
- Author(s)
  Y.Oki, T.Doi, et al.
- Organizer
  International Conference on Planarization/CMP Technology 2009
- Place of Presentation
  Fukuoka, Japan
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Polishing Characteristics of Optoelectronics Materials by Bell-jar-shaped CMP Machine under the Controlled Working Atmosphere2009
- Author(s)
  土肥俊郎
- Organizer
  First International Symposium on Atomically Controlled Fabrication Technology
- Place of Presentation
  大阪大学
- Year and Date
  2009-02-16
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] CMP of SiC Wafers as a Post-Si Power-Device (Bell-Jar shaped CMP machine assisted by photocatalitic reactions under high pressure oxygen gas and CMP characteristics of functional material2009
- Author(s)
  土肥俊郎, 黒河周平
- Organizer
  The 1st International Conference on Surface and Interface Fabrication Techonologies (ICSIF)
- Place of Presentation
  (独)理化学研究所(埼玉)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] ベルジャー密閉型CMPシステムによる付加作用の効果に関する研究2008
- Author(s)
  大木洋太, 土肥俊郎, 他4名
- Organizer
  2008年度精密工学会福岡地方講演会
- Place of Presentation
  九州大学
- Year and Date
  2008-12-07
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] CMP of SiC Wafers as a Post-Si Power-Device-Photocatalitic reaction assisted Bell-Jar shaped CMP Machine under high pressure oxygen gas-2008
- Author(s)
  土肥俊郎, 黒河周平
- Organizer
  The 5^<th> International Conference on Planarization/CMP Technology (ICPT2008)
- Place of Presentation
  台湾・新竹市
- Year and Date
  2008-11-10
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] 加工環境コントロールによる機能性材料の加工に関する研究2008
- Author(s)
  木原丈晴, 土肥俊郎, 他5名
- Organizer
  2008年度精密工学会福岡地方講演会
- Place of Presentation
  九州大学
- Year and Date
  2008-12-07
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] CMP of SiC Wafers as a Post-Si Power-Device -Photocatalitic Reaction Assisted Bell-Jar shaped CMP Machine under High Pressure Oxygen Gas-2008
- Author(s)
  土肥俊郎, 黒河周平
- Organizer
  International Conference on Planarization/CMP Technology
- Place of Presentation
  Congress Center,浜松(静岡)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Si CMP with a sealed“Bell Jar"type CMP machine-Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry-2008
- Author(s)
  木原丈晴, 土肥俊郎, 他7名
- Organizer
  The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium)
- Place of Presentation
  Hawaii (America)
- Year and Date
  2008-11-11
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Si CMP with a Sealed "Bell-Jar" Type CMP Machine -Proc. Characteristics of Si-CMP, Influenced by the Processing Atmosphere and Additives Dispersed in the Slurry-2008
- Author(s)
  T.Kihara, T.Doi, S.Kurokawa, Y.Ooki, Y.Umezaki, Y.Matsukawa, K.Ichikawa, I.Koshiyama, H.Kohno
- Organizer
  The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials
- Place of Presentation
  Kona, Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-20246033
[Presentation] Development of Basic-Type CMP/P-CVM Fusion Processing System (Type A) and Its Fundamental Characteristics
- Author(s)
  K. Shiozawa, Y. Sano, T. Doi, S. Kurokawa, H. Aida, K. Oyama, T. Miyashita, H. Sumizawa, and K. Yamauchi
- Organizer
  2014 International Conference on Planarization/CMP Technology (ICPT2014)
- Place of Presentation
  神戸国際会議場（兵庫県神戸市）
- Year and Date
  2014-11-19 – 2014-11-20
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Innovation in Chemical Mechanical Polishing(CMP): Plasma Fusion CMP for Highly Efficient Processing of Next-Generation Optoelectronics Single Crystals
- Author(s)
  Hideo Aida, Toshiro Doi, Yasuhisa Sano, Syuhei Kurokawa, Seong Woo Kim, Koki Oyama, Tadakazu Miyashita, Michio Uneda, Osamu Ohnishi, Chengwu Wang
- Organizer
  The 8th Manufacturing Institute for Research on Advanced Initiatives
- Place of Presentation
  Taiwan
- Year and Date
  2015-03-25 – 2015-03-26
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Removal Rate of Plasma Chemical Vaporization Machining of Intentionally Damaged Surface by Mechanical Action
- Author(s)
  K. Shiozawa, Y. Sano, T. Doi, S. Kurokawa, H. Aida, O. Ohnishi, M. Uneda, Y. Okada, and K. Yamauchi
- Organizer
  15th International Conference on Precision Engineering (ICPE2014)
- Place of Presentation
  ホテル日航金沢（石川県金沢市）
- Year and Date
  2014-07-22 – 2014-07-25
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] グリーンデバイス用結晶基板の加工プロセス技術の研究開発　-第1報-
- Author(s)
  土肥俊郎、山崎努、瀬下清、市川大造
- Organizer
  2013年度精密工学会春季大会学術講演会
- Place of Presentation
  東京工業大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的plasma fusion CMP装置の設計・試作（第7報）― plasma fusion CMP装置”（B型）による加工メカニズムの検討―
- Author(s)
  塩澤昂祐，平岡佑太，佐野泰久，土肥俊郎，黒河周平，會田英雄，大山幸希，宮下忠一，住澤春男，山内和人
- Organizer
  2015年度精密工学会春季大会学術講演会
- Place of Presentation
  東洋大学白山キャンパス（東京都文京区）
- Year and Date
  2015-03-17 – 2015-03-19
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 先端的難加工基板の高効率精密加工法の研究（第2報）－疑似ラジカル場を想定した加工変質層の形成によるPCVM加工速度の増大－
- Author(s)
  佐野泰久、土肥俊郎、黒河周平、曾田秀雄、大西修、畝田道雄、岡田悠、西川央明、山内和人
- Organizer
  2013年度精密工学会春季大会学術講演会
- Place of Presentation
  東京工業大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Study on a novel CMP/P-CVM fusion processing system(Type B) and its basic characteristics
- Author(s)
  Koki Oyama, Toshiro K. Doi, Yasuhisa Sano, Syuhei Kurokawa, Hideo Aida, Tadakazu Miyashita, Seongwoo Kim, Hideakli Nishizawa, Tsutomu Yamazaki
- Organizer
  2014 International Conference on Planarization/CMP Technology (ICPT2014)
- Place of Presentation
  神戸国際会議場（兵庫県神戸市）
- Year and Date
  2014-11-19 – 2014-11-20
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] "KENMA", the Origin of Manufacturing, Planarization CMP and Its Future -A Breakthrough toward High-efficient Machining of Hard-to-machine Innovative Materials -
- Author(s)
  土肥俊郎
- Organizer
  2014 International Conference on Planarization/CMP Technology (ICPT2014)
- Place of Presentation
  神戸国際会議場（兵庫県神戸市）
- Year and Date
  2014-11-19 – 2014-11-20
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] グリーンデバイス用結晶基板の加工プロセス技術の研究開発　-第2報-
- Author(s)
  山崎努、土肥俊郎、瀬下清、大坪正徳、塚本敬一、紀文勇、若林豊博、住澤春男
- Organizer
  2013年度精密工学会春季大会
- Place of Presentation
  東京工業大学
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的CMP/P-CVM融合装置の設計・試作（第4報）；A-type装置による炭化ケイ素を加工対象とした平坦化特性の評価
- Author(s)
  塩澤昂祐，佐野泰久，土肥俊郎，黒河周平，會田英雄，大山幸希，宮下忠一，山内和人
- Organizer
  2014年度精密工学会秋季大会学術講演会
- Place of Presentation
  鳥取大学（鳥取県）
- Year and Date
  2014-09-16 – 2014-09-18
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的 CMP/P-CVM加工装置の設計・試作(第５報)- B-type装置による各種難加工材料の基本的加工特性とその評価 -
- Author(s)
  大山幸希, 土肥俊郎, 佐野泰久, 黒河周平, 會田英雄, 塩澤昂祐, 宮下忠一, 金聖祐
- Organizer
  2014年度精密工学会秋季大会学術講演会
- Place of Presentation
  鳥取大学（鳥取県）
- Year and Date
  2014-09-16 – 2014-09-18
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] Design and Prototyping of Innovative CMP/P-CVM Fusion Processing Machine for Hard-to-Process Crystals and Its Processing Characteristics
- Author(s)
  Toshiro Doi
- Organizer
  Workshop on Ultra-Precision Processing (WUPP) for Wide-gap Semiconductors 2014
- Place of Presentation
  Hilton Bath City Hotel (英国)
- Year and Date
  2014-08-20 – 2014-08-22
- Invited
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 革新的plasma fusion CMP装置の設計・試作（第6報）― 基本型(A型）の平坦化特性についての詳細な検討－
- Author(s)
  塩澤昂祐，平岡佑太，佐野泰久，土肥俊郎，黒河周平，會田英雄，大山幸希，宮下忠一，住澤春男，山内和人
- Organizer
  2015年度精密工学会春季大会学術講演会
- Place of Presentation
  東洋大学白山キャンパス（東京都文京区）
- Year and Date
  2015-03-17 – 2015-03-19
- Data Source
  KAKENHI-PROJECT-24226005
[Presentation] 先端的難加工基板の高効率精密加工法の研究（第1報）-新しい概念を導入した加工プロセスの提案－
- Author(s)
  土肥俊郎、佐野泰久、黒河周平、曾田秀雄、大西修、畝田道雄
- Organizer
  2013年度精密工学会春季大会
- Place of Presentation
  東京工業大学
- Data Source
  KAKENHI-PROJECT-24226005

1. KUROKAWA Syuhei (90243899)

# of Collaborated Projects: 2 results

# of Collaborated Products: 72 results
2. UMEZAKI Yoji (70038066)

# of Collaborated Projects: 1 results

# of Collaborated Products: 11 results
3. SANO Yasuhisa (40252598)

# of Collaborated Projects: 1 results

# of Collaborated Products: 40 results
4. OHNISHI Osamu (50315107)

# of Collaborated Projects: 1 results

# of Collaborated Products: 18 results
5. UNEDA Michio (00298324)

# of Collaborated Projects: 1 results

# of Collaborated Products: 17 results
6. KAWAGUCHI Hitoshi (40211180)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. MATSUSHITA Kouichi (70124625)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. OSHIMA Shigetoshi (40124557)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. YOKOTO Ken-ichi (20006969)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. TAN-NO Naohiro (00006248)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 鬼鞍宏猷 (90108655)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. AIDA Hideo

# of Collaborated Projects: 1 results

# of Collaborated Products: 50 results

DOI Toshiro 土肥 俊郎

DOI Toshirou 土肥 俊郎

Research Projects

Research Products

Co-Researchers

Breakthrough in the ultra-precison polishing process of diamond substrates as an ulimate devicePrincipal Investigator

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Research Institution

Development of a new Chemical Mechanical Polishing (CMP) machine, assisted by the photocatalytic reactions and electrolytic actions in the atmosphere controlled sealed CMP chamberPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Research on ultra-fast optical bistable devices with multi-dimentional quantum well structure

Principal Investigator

Project Period (FY)

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Research Institution

[Book] New Diamond Vol.322016

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[Book] Handbook of Ceramics Grinding and Polishing(2E)2014

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[Book] Chemical-Mechanical Machining Process / Handbook of Manufacturing Engineering & Technology(Chap.4-3)2014

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[Book] 精密加工と微細構造の形成技術2013

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[Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-113,11042010

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[Book] 超精密研磨/CMP技術とその最新動向(その-最新のCMP技術とトライボケミカル応用-第55巻第11号2010

Author(s)

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[Book] 超精密研磨/CMP技術とその最新動向(その1)-研磨の発展経緯と加工原理-第55巻第11号2010

Author(s)

Publisher

Data Source

[Book] 超精密研磨/CMP技術とその最新動向(その2)-最新のCMP技術とトライボケミカル応用-2010

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Total Pages

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Data Source

[Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-2010

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[Book] ものづくりのイノベーションとそのサステナビリティを目指して第75巻,第6号2009

Author(s)

Publisher

Data Source

[Book] 平坦化CMP装置,電子材料(12月号別冊超LSI製造・試験装置ガイドブック)2008

Author(s)

Data Source

[Journal Article] High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates2016

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DOI Toshiro 土肥俊郎

DOI Toshirou 土肥俊郎