Kuroda Tadahiro 黒田忠広

… Alternative Names

KURODA Tadahiro 黒田忠広

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Researcher Number	50327681
External Links
Affiliation (based on the past Project Information) *help	2020 – 2022: 東京大学, 大学院工学系研究科(工学部), 教授 2016 – 2019: 慶應義塾大学, 理工学部(矢上), 教授 2013 – 2015: 慶應義塾大学, 理工学部, 教授 2002 – 2006: 慶應義塾大学, 理工学部, 教授 2001: 慶應義塾大学, 理工学部, 助教授
Review Section/Research Field	Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Electron device/Electronic equipment Except Principal Investigator Basic Section 60040:Computer system-related / 電子デバイス・機器工学 / Computer system
Keywords	Principal Investigator SiP / CMOS / LSI / 小型化 / 低電力化 / リーダ / Society 5.0 / IoT / オンチップアンテナ / 無線タグ … More / RFID / inductive coupling / inter-chin communication / wireless / interface / low power / インダクティブ結合 / チップ間通信 / ワイヤレス / インタフェース / 低電力 … More Except Principal Investigator コンピュータアーキテクチャ / System In Package技術 / ワイヤレスチップ間通信 / チップ積層 / 計算機システム / チップ間ワイヤレス通信 / 三次元積層技術 / quantum dynamics / atomic layer doping / nuclear magnetic resonance / ^<31>P nuclear spin / isotope control / spin-free silicon / silicon / quntum computating / 量子ダイナミックス / 単原子層ドーピング / 核磁気共鳴 / ^<31>P核スピン / 同位体組成制御 / スピンフリーシリコン / シリコン / 量子コンピューティング / 低電力アーキテクチャ / ヘテロジーニアスマルチコアプロセッサ / チップ間誘導結合 / 計算機アーキテクチャ / 情報工学 / 性能、電力自動調整 / System In Package / 熱解析 / 電力制御 / チップ間ネットワーク / チップ間接続技術 Less

Ultra Small Wireless Systems for Internet for EverythingPrincipal Investigator
- Principal Investigator
  
  Kuroda Tadahiro
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  The University of Tokyo
Stacking methods with chip bridges for a building block computing system
- Principal Investigator
  
  AMANO HIDEHARU
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 60040:Computer system-related
- Research Institution
  Keio University
A Study on Building-Block Computing Systems using Inductive Coupling Interconnect
- Principal Investigator
  
  Hideharu Amano
- Project Period (FY)
  2013 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Computer system
- Research Institution
  Keio University
A Study on Wide Bandwidth and Low Power Inductive-Coupling Inter-Chip Wireless CommunicationPrincipal Investigator
- Principal Investigator
  
  KURODA Tadahiro
- Project Period (FY)
  2004 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Keio University
Basic Research on Silicon Quantum Computation Based on Isotope Control and Neutron Irradiation
- Principal Investigator
  
  MATSUMOTO Satoru
- Project Period (FY)
  2001 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  Keio University

All 2022 2021 2018 2017 2016 2015 2014 2013 2012 2007 2006 2005 2004

All Journal Article Presentation

[Journal Article] A 5-GHz 0.15-mm2 Collision-Avoiding RFID Employing Complementary Pass-Transistor Adiabatic Logic With an Inductively Connected External Antenna in 0.18-μm CMOS2022
- Author(s)
  S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda
- Journal Title
  
  IEEE Solid-State Circuits Letters (SSC-L)
  
  Volume: 5 Pages: 268271-268271
- DOI
  10.1109/lssc.2022.3223079
- Data Source
  KAKENHI-PROJECT-20H00234
[Journal Article] A bonding-less 5-GHz RFID module using inductive coupling between IC and antenna2022
- Author(s)
  Miura Reiji、Shibata Saito、Usui Masahiro、Shiba Kota、Kosuge Atsutake、Hamada Mototsugu、Kuroda Tadahiro
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 61
- DOI
  10.35848/1347-4065/ac4ce2
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20H00234
[Journal Article] Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface2018
- Author(s)
  Akio Nomura, Yusuke Matsushita, Junichiro Kadomoto, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano
- Journal Title
  
  International Journal of Network and Computing
  
  Volume: Vol.8 No.1
- NAID
  130006309780
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces,2016
- Author(s)
  T.Kagami, H.Matsutani, M.Koibuchi, Y.Take, T.Kuroda, H.Amano
- Journal Title
  
  IEEE Transactions on VLSI Systems
  
  Volume: Vol.24, No.2 Issue: 2 Pages: 493-506
- DOI
  10.1109/tvlsi.2015.2418216
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel2015
- Author(s)
  L. Hsu, J. Kadomoto, S. Hasegawa, A. Kosuge, Y. Take, and T. Kuroda
- Journal Title
  
  IEICE Trans. Fundamentals
  
  Volume: E98.A Issue: 12 Pages: 2584-2591
- DOI
  10.1587/transfun.E98.A.2584
- NAID
  130005112004
- ISSN
  0916-8508, 1745-1337
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network2015
- Author(s)
  Y.Take, T.Kuroda
- Journal Title
  
  IEICE Trans. Electron.
  
  Volume: E98.C Issue: 4 Pages: 322-332
- DOI
  10.1587/transele.E98.C.322
- NAID
  130005061831
- ISSN
  0916-8524, 1745-1353
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] 近接場結合を用いたLSIモジュールの三次元集積2014
- Author(s)
  岡田晃、小菅敦丈、黒田忠広
- Journal Title
  
  電子情報通信学会論文誌
  
  Volume: J97-C,No.11 Pages: 378-385
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface 3D NoC2013
- Author(s)
  N.Miura, Y.Koizumi, Y.Take, H.Matsutani, T.Kuroda, H.Amano, R.Sakamoto, M.Namiki, K.Usami, M.Kondo, H.Nakamura
- Journal Title
  
  IEEE Micro
  
  Volume: Vol.33, Issue 6 Issue: 1 Pages: 6-15
- DOI
  10.1109/mm.2013.12
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs2013
- Author(s)
  H.Zhang, H.Matsutani, Y.Take, T.Kuroda, H.Amano
- Journal Title
  
  IEICE Trans. Inf. & Syst.
  
  Volume: E96.D Issue: 12 Pages: 2753-2764
- DOI
  10.1587/transinf.E96.D.2753
- NAID
  130003385446
- ISSN
  0916-8532, 1745-1361
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25220002
[Journal Article] 3-D NoC with Inductive-Coupling Links for Building-Block SiPs2012
- Author(s)
  Yasuhiro Take
- Journal Title
  
  IEEE Transactions on Computers (TC)
  
  Volume: (掲載決定) Issue: 3 Pages: 748-763
- DOI
  10.1109/tc.2012.249
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-12J06775, KAKENHI-PROJECT-23800053, KAKENHI-PROJECT-25220002
[Journal Article] A 0.14pJ/b Inductive-coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping2007
- Author(s)
  N.Miura, H.Ishikuro, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE International Solid-State Circuits Conference (ISSCC'07), Dig. Tech. Papers Feb.
  
  Pages: 264-265
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Crosstalk Countermeasures for High-Density Inductive-CouplingChannel Array2007
- Author(s)
  N.Miura, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE Journal of Solid-State Circuits (JSSC), Vol.42,No.1
  
  Pages: 410-421
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] A 1Tb/s 3W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link2007
- Author(s)
  N.Miura, T.Kuroda 他
- Journal Title
  
  IEEE Journal of Solid-State Circuits (JSSC), Vol.42,No.1
  
  Pages: 111-122
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Daisy Chain for Power Reduction in Iductive-Coupling CMOS Link2006
- Author(s)
  M.Inoue, N.Miura, T.Kuroda 他
- Journal Title
  
  Symposium on VLSI Circuits, Dig. Tech. Papers Jun
  
  Pages: 80-81
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Perspective of Low-Power and High-Speed Wireless Inter-Chip Communications for SiP Integration2006
- Author(s)
  T.Kuroda
- Journal Title
  
  European Solid-State Circuits Conference Sep.
  
  Pages: 3-3
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Perspective of Low-Power and High-Speed Wireless Inter-Chip Communications for SiP Integration2006
- Author(s)
  T.Kuroda, N.Miura
- Journal Title
  
  European Solid-State Circuits Conference Sep.
  
  Pages: 3-6
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Perspective of Low-Power and High-Speed Wireless Inter-Chip Communications for SiP Integration2006
- Author(s)
  T.Kuroda 他
- Journal Title
  
  European Solid-State Circuits Conference
  
  Pages: 3-3
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect for 3-D-Stacked System in a Package2006
- Author(s)
  M.Miura, D.Mizoguchi, M.Inoue, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE Journal of Solid-State Circuits (JSSC) 41・1
  
  Pages: 23-34
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] A 1Tb/s 3W Inductive-Coupling Transceiver for Inter-Chip Clock and Data Link2006
- Author(s)
  N.Miura, D.Mizoguchi, M.Inoue, K.Niitsu, Y.Nakagawa, M.Tago, M.Fukaishi, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE International Solid-State Circuits Conference (ISSCC'06), Dig.Tech. Papers
  
  Pages: 424-425
- NAID
  110004737633
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] 1Tb/s 3W チップ間誘導結合クロックデータトランシーバ2006
- Author(s)
  三浦典之, 黒田忠広, 他
- Journal Title
  
  電子情報通信学会技報 Vol.106,No.71
  
  Pages: 95-100
- NAID
  110004737633
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Measurement of Inductive Coupling in Wireless Superconnect2005
- Author(s)
  D.Mizoguchi, N.Miura, Y.Yoshida, N.Yamagishi, T.Kuroda
- Journal Title
  
  International Conference on Solid State Devices and Materials (SSDM'05) Sep.
  
  Pages: 670-671
- NAID
  10022542878
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Power Reduction in High-Speed Inter-Chip Data Communications2005
- Author(s)
  T.Kuroda
- Journal Title
  
  IEEE 6th International Conference on ASIC (ASICON 2005)
  
  Pages: 3-3
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] 195Gb/s 1.2W電力制御機能付き3次元積層型誘導結合無線超配線2005
- Author(s)
  三浦典之, 溝口大介, 井上眞梨, 桜井貴康, 黒田忠広
- Journal Title
  
  電子情報通信学会技報 105・96
  
  Pages: 45-50
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Design of Transceiver Circuits for NRZ Signaling in Inductive Inter-chip Wireless Superconnect2005
- Author(s)
  D.Mizoguchi, N.Miura, M.Inoue, T.Kuroda
- Journal Title
  
  2005 International Conference on Integrated Circuit Design and Technology (ICICDT) May
  
  Pages: 59-62
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Power Reduction in High-Speed Inter-Chip Data Communications2005
- Author(s)
  T.Kuroda
- Journal Title
  
  IEEE 6^<th> International Conference on ASIC (ASICON 2005) Oct.
  
  Pages: 3-3
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Power Reduction in High-Speed Inter-Chip Data Communications2005
- Author(s)
  T.Kuroda
- Journal Title
  
  IEEE 6th International Conference on ASIC (ASICON 2005) Oct.
  
  Pages: 3-7
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Analysis and Design of Inductive Coupling and Transceiver Circuit for Inductive Inter-Chip Wireless Superconnect2005
- Author(s)
  N.Miura, D.Mizoguchi, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE Journal of Solid-State Circuits (JSSC) 40・4
  
  Pages: 829-837
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] 誘導結合チップ間無線超配線用インダクタおよび送受信回路の解析と設計2004
- Author(s)
  三浦典之, 溝口大介, ユスミラズ・ビンティ・ユスフ, 桜井貴康, 黒田忠広
- Journal Title
  
  電子情報通信学会技報 104・248
  
  Pages: 73-78
- NAID
  110003316471
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Non-Contact Inter-Chip Data Communications Technology for System in a Package2004
- Author(s)
  T.Kuroda
- Journal Title
  
  Proc.of IEEE International Conference on Solid-State and Integrated Circuits Technology (ICSICT04)
  
  Pages: 1347-1347
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] A 195Gb/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme2004
- Author(s)
  N.Miura, D.Mizoguchi, M.Inoue, H.Tsuji, T.Sakurai, T.Kuroda
- Journal Title
  
  IEEE International Solid-State Circuits Conference (ISSCC'05), Dig.Tech.Papers
  
  Pages: 264-265
- NAID
  10016437445
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] A 1.2Gb/s/pin Wireless Superconnect Based on Inductive Inter-Chip Signaling2004
- Author(s)
  D.Mizoguchi, Y.Yusof, N.Miura, T.Sakurai, T.Kuroda
- Journal Title
  
  電子情報通信学会技報 104・67
  
  Pages: 31-36
- NAID
  110003316505
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Analysis and Design of Transceiver Circuit and Inductor Layout for Inductive Inter-chip Wireless Superconnect2004
- Author(s)
  N.Miura, D.Mizoguchi, Y.Yusof, T.Sakurai, T.Kuroda
- Journal Title
  
  Symposium on VLSI Circuits, Dig.Tech.Papers
  
  Pages: 246-249
- NAID
  110003316471
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Non-Contact Inter-Chip Data Communications Technology for System in a Package2004
- Author(s)
  T.Kuroda
- Journal Title
  
  Proc. of IEEE International Conference on Solid-State and Integrated Circuits Technology (ICSICT' 04)
  
  Pages: 1347-1347
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Non-Contact Inter-Chip Data Communications Technology for System in a Package (invited)2004
- Author(s)
  T.Kuroda
- Journal Title
  
  Proc.IEEE International Conference on Solid-State and Integrated Circuits Technology(ICSICT'04)
  
  Pages: 1347-1352
- Data Source
  KAKENHI-PROJECT-16206037
[Journal Article] Cross Talk Countermeasures in Inductive Inter-Chip Wireless Superconnect2004
- Author(s)
  N.Mura, D.Mizoguchi, T.Sakurai, T.Kuroda
- Journal Title
  
  Proc.IEEE Custom Integrated Circuits Conference (CICC'04)
  
  Pages: 99-102
- Data Source
  KAKENHI-PROJECT-16206037
[Presentation] A Low-power RFID with 100kbps Data Rate Employing High-speed Power Clock Generator for Complementary Pass-transistor Adiabatic Logic2022
- Author(s)
  S. Shibata, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda
- Organizer
  29th IEEE International Conference on Electronics Circuits and Systems (ICECS 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] A 5.2GHz RFID Chip Contactlessly Mountable on FPC at Any 90-Degree Rotation and Face Orientation2022
- Author(s)
  R. Miura, S. Shibata, M. Usui, A. Kosuge, M. Hamada, and T. Kuroda
- Organizer
  27th Asia and South Pacific Design Automation Conference (ASP-DAC'22)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna2022
- Author(s)
  S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda
- Organizer
  IEEE 48th European Solid-State Circuits Conference (ESSCIRC 2022)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] A Bonding-less 5-GHz RFID Module Using a 300um x 500um IC Chip2021
- Author(s)
  R. Miura, S. Shibata, M. Usui, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda
- Organizer
  JSAP International Conference on Solid State Devices and Materials (SSDM'21)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] An on-chip antenna with an area of 0.9 square millimeters for RFID applications in the 5.8 GHz - 24 GHz range2021
- Author(s)
  E. Charlot, M. Hamada, and T. Kuroda
- Organizer
  IEICE 2020 International Symposium on Antennas and Propagation (ISAP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna2021
- Author(s)
  S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda
- Organizer
  IEEE Asian Solid-State Circuits Conference (A-SSCC'21)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H00234
[Presentation] A practical collision avoidance method for an inter-chip bus with wireless inductive through chip interface2017
- Author(s)
  A.Nomura, J.Kadomoto, TKuroda, H.Amano
- Organizer
  The 5th International Symposium on Computing and Networking
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002
[Presentation] An Inductive Coupting Link for 3-D network-on-Chips2017
- Author(s)
  J.Kadomoto, H.Amano, T.Kuroda
- Organizer
  International SoC Design Conference
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002
[Presentation] Building Block multi-chip systems using inductive coupling through chip interface2017
- Author(s)
  H.Amano, T.Kuroda, H.Nakamura, K.Usami, M.Kondo, H.Matsutani, M.Namiki
- Organizer
  International SoC Design Conference
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002
[Presentation] Near-Field Coupling Integration Technology2016
- Author(s)
  Tadahiro Kuroda
- Organizer
  10th IEEE/ACM International Symposium on Networks-on-Chip
- Place of Presentation
  奈良春日野国際フォーラム（奈良県・奈良市）
- Year and Date
  2016-08-31
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002
[Presentation] Near-Field Coupling Integration Technology for Internet of Things2015
- Author(s)
  T.Kuroda
- Organizer
  IEEE International SoC Design Conference (ISOCC)
- Place of Presentation
  Gyeongju, Korea
- Year and Date
  2015-11-02
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002
[Presentation] Cirucuit and Device Interactions for 3D Integration Using Inductive Coupling2014
- Author(s)
  T.Kuroda
- Organizer
  2014 IEEE International Electron Devices Meetings (IEDM'14)
- Place of Presentation
  San Francisco USA
- Year and Date
  2014-12-15
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25220002

1. Hideharu Amano (60175932)

# of Collaborated Projects: 3 results

# of Collaborated Products: 6 results
2. 並木美太郎 (10208077)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
3. 中村宏 (20212102)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
4. 宇佐美公良 (20365547)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
5. 近藤正章 (30376660)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
6. MATSUTANI Hiroki (70611135)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
7. MATSUMOTO Satoru (00101999)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. ETO Mikio (00221812)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. KUWANO Hiroshi (10051525)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. MAKABE Toshiaki (60095651)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. NAKANO Nobuhiko (40286638)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. SANADA Yukitoshi (90293042)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. 鯉渕道紘 (40413926)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. 石黒仁揮 (80433738)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Kuroda Tadahiro 黒田 忠広

KURODA Tadahiro 黒田 忠広

Research Projects

Research Products

Co-Researchers

Ultra Small Wireless Systems for Internet for EverythingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

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Stacking methods with chip bridges for a building block computing system

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A Study on Building-Block Computing Systems using Inductive Coupling Interconnect

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A Study on Wide Bandwidth and Low Power Inductive-Coupling Inter-Chip Wireless CommunicationPrincipal Investigator

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Basic Research on Silicon Quantum Computation Based on Isotope Control and Neutron Irradiation

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[Journal Article] A 5-GHz 0.15-mm2 Collision-Avoiding RFID Employing Complementary Pass-Transistor Adiabatic Logic With an Inductively Connected External Antenna in 0.18-μm CMOS2022

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[Journal Article] A bonding-less 5-GHz RFID module using inductive coupling between IC and antenna2022

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[Journal Article] Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface2018

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[Journal Article] Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces,2016

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[Journal Article] A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel2015

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[Journal Article] Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network2015

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[Journal Article] 近接場結合を用いたLSIモジュールの三次元集積2014

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[Journal Article] A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface 3D NoC2013

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Kuroda Tadahiro 黒田忠広

KURODA Tadahiro 黒田忠広