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Ikeda Akihiro  池田 晃裕

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… Alternative Names

IKEDA Akihiro  池田 晃裕

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Researcher Number 60315124
Other IDs
External Links
Affiliation (Current) 2025: 崇城大学, 情報学部, 教授
Affiliation (based on the past Project Information) *help 2018 – 2019: 崇城大学, 情報学部, 准教授
2017: 九州大学, 大学院システム情報科学研究院, 助教
2016 – 2017: 九州大学, システム情報科学研究院, 助教
2015: 九州大学, 大学院システム情報科学研究院, 助教
2014 – 2015: 九州大学, システム情報科学研究科(研究院, 助教 … More
2009 – 2013: Kyushu University, 大学院・システム情報科学研究院, 助教
2007: Kyushu University, 大学院・システム情報科学研究所, 助教
2005 – 2006: 九州大学, 大学院システム情報科学研究院, 助手
2001 – 2005: 九州大学, 大学院・システム情報科学研究院, 助手
2002 – 2003: 九州大学, システム情報科学研究院, 助手 Less
Review Section/Research Field
Principal Investigator
Electron device/Electronic equipment / 電子デバイス・機器工学
Except Principal Investigator
Electron device/Electronic equipment / 電子デバイス・機器工学 / Sensitivity informatics/Soft computing / Measurement engineering
Keywords
Principal Investigator
4H-SiC / レーザドーピング / ポリイミド / 電子デバイス・機器 / アルミ / ロングパルス / コンタクト抵抗 / 拡散係数 / 表面温度 / 2色法 … More / オーミックコンタクト / パルス波形制御 / CO2レーザ / 低コンタクト抵抗 / パルス波形整形 / 発光スペクトル / SiC / KOH改質 / 無電解銅めっき / FT-IR / シランカップリング / PEN / フィルム直接めっき / バンドパスフィルタ / 高周波信号 / FPC / 無電解めっき / プラズマ改質 / マルチチップパッケージ / ポリイミドエッチング / Chip on Film / バンプレス接続 / メタルマスク / Chip on film / チップ積層 / 乗り越え配線 / ポリイミドフイルム / チップオンフィルム / MOSFET / short channel effect / KOH / V-grooved gate / 低温プラズマ酸化,窒化 / ショートシャネル効果 / 溝型ゲートMOSトランジスタ / P on P++エピタキシャルウエハ / nitridation / Plasma oxidation / Short channle effect / Anisotropic wet etching / Recessed channle MOSFET … More
Except Principal Investigator
SiC / 炭化シリコン / MEMS / μTAS / ペロブスカイト酸化物 / 酸化物触媒 / ゲート酸化 / 触媒酸化 / 熱酸化 / perovskite oxide / atomic oxygen / functional oxide / catalytic oxidation / oxidation / 4H SiC / silicon carbide / 4H-SiC / ドーピング / 電力用半導体素子 / JBS / パワーデバイス / オーミック接触 / JBSダイオード / 液中レーザー / レーザードーピング / レーザープロセッシング / flat panel display / Electronic paper / Burying / Planarization / Plastic substrate / 平面ディスプレイ / 電子ペーパー / 埋め込み / 平坦化 / プラスチック基板 / Titania / Surfactant / Electrophoretic particle / Driver circuit / Bistable / Electrophoretic Display / マイクロレンズアレー / 酸化チタン / 界面活性剤 / 電気泳動粒子 / ドライブ回路 / メモリー効果 / 電気泳動ディスプレイ / Polysilazane / DNA Analvsis / Electrophoresis / Confocal Laser Scanning Microscope / Photosensitive Glass / Microfabrication / DNAラダー / アミノ酸 / 電気浸透流 / アクリルアミドコーティング / マイクロキャピラリーチップ / ポリシラザン / DNA分析 / 電気泳動 / 共焦点走査型レーザー顕微鏡 / 感光性ガラス / 微細加工 / 感性計測評価 / 計測工学 / ソフトコンピューティング / 電子デバイス機器 / 感性情報学 / ヘテロ集積 / 先鋭バンプ / バンプ / クロコン酸 / 超音波接合 / フレキシブルエレクトロニクス / プリンティッドエレクトロニクス / 常温接合 / マイクロ接合 / インターコネクト / 3D-LSI / 三次元集積回路 / センシングデバイス / インターコネクト・パッケージのシステム化応用 / 電子デバイス・集積回路 / 感性計測 / バイオセンサ / 匂いセンサ / 味覚センサ / 分子鋳型法 Less
  • Research Projects

    (13 results)
  • Research Products

    (141 results)
  • Co-Researchers

    (20 People)
  •  In-situ temperature measurements and impurity profile control on SiC surface during wet chemical laser dopingPrincipal Investigator

    • Principal Investigator
      Ikeda Akihiro
    • Project Period (FY)
      2017 – 2019
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Sojo University
      Kyushu University
  •  Low temperature oxidation of SiC using catalytic effects of functional oxides

    • Principal Investigator
      Asano Tanemasa
    • Project Period (FY)
      2016 – 2017
    • Research Category
      Grant-in-Aid for Challenging Exploratory Research
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Investigation on mechanism of wet chemical laser doping of 4H-SiC by optical emission spectroscopyPrincipal Investigator

    • Principal Investigator
      Ikeda Akihiro
    • Project Period (FY)
      2014 – 2016
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Study on high-speed doping mechanism of wet laser processing

    • Principal Investigator
      ASANO Tanemasa
    • Project Period (FY)
      2013 – 2015
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Integrated biosensor system for taste, odor and visual senses

    • Principal Investigator
      TOKO Kiyoshi
    • Project Period (FY)
      2011 – 2013
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Sensitivity informatics/Soft computing
    • Research Institution
      Kyushu University
  •  Creation of Nano-device/CMOS Merged Three Dimensional Integrated Circuits Using Shape-Functionalized Micro-interconnect

    • Principal Investigator
      ASANO Tanemasa
    • Project Period (FY)
      2009 – 2012
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.Principal Investigator

    • Principal Investigator
      IKEDA Akihiro
    • Project Period (FY)
      2009 – 2011
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Development of Kansei Biosensor

    • Principal Investigator
      TOKO Kiyoshi (KIYOSHI Toko)
    • Project Period (FY)
      2006 – 2010
    • Research Category
      Grant-in-Aid for Scientific Research (S)
    • Research Field
      Measurement engineering
    • Research Institution
      Kyushu University
  •  バンプレス接続によるチップオンフイルムとフイルム折曲げによる3D-SiPの作製Principal Investigator

    • Principal Investigator
      池田 晃裕
    • Project Period (FY)
      2005 – 2007
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      Kyushu University
  •  Establishment of LSI chip burying and wiring technology to plastic substrate using MEMS technology

    • Principal Investigator
      HATTORI Reiji
    • Project Period (FY)
      2003 – 2005
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Electron device/Electronic equipment
    • Research Institution
      KYUSHU UNIVERSITY
      The University of Tokyo
  •  異方性ウエットエッチングを用いた溝型ゲートMOSトランジスタの作製Principal Investigator

    • Principal Investigator
      池田 晃裕
    • Project Period (FY)
      2002 – 2004
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      電子デバイス・機器工学
    • Research Institution
      Kyushu University
  •  Study on scaling theory of on-chip electrophoretic micro-capillary and its miniaturization and optimization

    • Principal Investigator
      KUROKI Yukinori
    • Project Period (FY)
      2001 – 2004
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      電子デバイス・機器工学
    • Research Institution
      KYUSHU UNIVERSITY
  •  Development of electrophoretic display with high reflectivity and high contrast

    • Principal Investigator
      HATTORI Reiji
    • Project Period (FY)
      2001 – 2004
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      電子デバイス・機器工学
    • Research Institution
      KYUSHU UNIVERSITY
      The University of Tokyo

All 2019 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 2007 2006 2005 2004 Other

All Journal Article Presentation Patent

  • [Journal Article] High-concentration, Room Temperature, and Low-cost Excimer Laser Doping for 4H-SiC Power Device Fabrication2019

    • Author(s)
      K. Imokawa, T. Kikuchi, D. Nakamura, A. Ikeda
    • Journal Title

      Materials Science Forum

      Volume: 963 Pages: 403-406

    • DOI

      10.4028/www.scientific.net/msf.963.403

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Journal Article] Formation of low resistance contacts to p-type 4H-SiC using laser doping with an Al thin-film dopant source2019

    • Author(s)
      K. Okamoto, T. Kikuchi, A. Ikeda, H. Ikenoue, T. Asano
    • Journal Title

      Japanese Journal of Appied Physics

      Volume: 58 Issue: SD Pages: SDDF13-SDDF13

    • DOI

      10.7567/1347-4065/ab12c3

    • NAID

      210000156255

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16H02342, KAKENHI-PROJECT-17K06387
  • [Journal Article] Increasing Laser-Doping Depth of Al in 4H-SiC by Using Expanded-Pulse Excimer Laser2019

    • Author(s)
      A. Ikeda, T. Shimokawa, H. Ikenoue, T. Asano
    • Journal Title

      Materials Science Forum

      Volume: 963 Pages: 412-415

    • DOI

      10.4028/www.scientific.net/msf.963.412

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Journal Article] Evaluation of effective length of the enhanced oxidation of active oxygen produced using SrTi_{x} Mg_{1-x}O_{3-δ} catalyst for low-temperature oxidation2018

    • Author(s)
      Sun Hsiang Fang、Ikeda Akihiro、Asano Tanemasa
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 57 Issue: 4S Pages: 04FB09-04FB09

    • DOI

      10.7567/jjap.57.04fb09

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Journal Article] Increased doping depth of Al in wet-chemical laser doping of 4H-SiC by expanding laser pulse2017

    • Author(s)
      A. Ikeda, D. Marui, R. Sumina, H. Ikenoue, T. Asano
    • Journal Title

      Materials Science in Semiconductor Processing

      Volume: 印刷中 Pages: 193-196

    • DOI

      10.1016/j.mssp.2016.11.036

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-26420309, KAKENHI-PROJECT-17K06387, KAKENHI-PROJECT-16H02342
  • [Journal Article] Enhanced Low-Temperature Oxidation of 4H-SiC Using SrTi_{1-x}Mg_{x}O_{3-δ}2017

    • Author(s)
      Li Li、Ikeda Akihiro、Asano Tanemasa
    • Journal Title

      Materials Science Forum

      Volume: 897 Pages: 356-359

    • DOI

      10.4028/www.scientific.net/msf.897.356

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Journal Article] Extremely Enhanced Diffusion of Nitrogen in 4H-SiC Observed in Liquid-Nitrogen Immersion Irradiation of Excimer Laser2016

    • Author(s)
      A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Journal Title

      Material Science Forum

      Volume: 821-823 Pages: 448-445

    • DOI

      10.4028/www.scientific.net/msf.821-823.448

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-26420309, KAKENHI-PROJECT-25289105
  • [Journal Article] Al Doping from Laser Irradiated Al Film Deposited on 4H-SiC2016

    • Author(s)
      Akihiro Ikeda, Rikuho Sumina, Hiroshi Ikenoue, Tanemasa Asano
    • Journal Title

      Materials Science Forum

      Volume: 858 Pages: 527-530

    • DOI

      10.4028/www.scientific.net/msf.858.527

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16H02342, KAKENHI-PROJECT-26420309
  • [Journal Article] Enhanced oxidation of Si using low-temperature oxidation catalyst SrTi_{1-x}Mg_xO_{3-d}2016

    • Author(s)
      Li Li, Akihiro Ikeda, Tanemasa Asano
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 55 Issue: 6S1 Pages: 06GJ05-06GJ05

    • DOI

      10.7567/jjap.55.06gj05

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Journal Article] Enhanced thermal oxidation using SrTi_{1-x}Mg_xO_{3-d} catalyst and its application to 4H-SiC,2016

    • Author(s)
      Li Li, Akihiro Ikeda, Tanemasa Asano
    • Journal Title

      Workshop Digest of Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices

      Volume: - Pages: 442-445

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Journal Article] Al Doping from Laser Irradiated Al Film Deposited on 4H-SiC2016

    • Author(s)
      A. Ikeda, R.Sumina, H. Ikenoue, T. Asano
    • Journal Title

      Material Science Forum

      Volume: 824

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Journal Article] Al doping of 4H-SiC by laser irradiation to coated Al film and its application2016

    • Author(s)
      A. Ikeda, R.Sumina, H. Ikenoue, T. Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 55 Issue: 4S Pages: 04ER07-04ER07

    • DOI

      10.7567/jjap.55.04er07

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-26420309, KAKENHI-PROJECT-25289105, KAKENHI-PROJECT-16H02342
  • [Journal Article] Low temperature oxidation of 4H-SiC using oxidation catalyst SrTi_{1-x}Mg_xO_{3-d}2016

    • Author(s)
      Li Li, Akihiro Ikeda, Tanemasa Asano
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 55 Issue: 10 Pages: 108001-108001

    • DOI

      10.7567/jjap.55.108001

    • Peer Reviewed / Acknowledgement Compliant / Open Access
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Journal Article] Nitrogen doping of 4H-SiC by KrF excimer laser irradiation in liquid nitrogen2015

    • Author(s)
      A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 54 Issue: 4S Pages: 04DP02-04DP02

    • DOI

      10.7567/jjap.54.04dp02

    • NAID

      210000145089

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-25289105, KAKENHI-PROJECT-26420309
  • [Journal Article] Aluminum doping of 4H-SiC by irradiation of excimer laser in aluminum chloride solution2014

    • Author(s)
      D. Marui, A. Ikeda, K. Nishi, H. Ikenoue, T. Asano
    • Journal Title

      Jpn. J. Appl. Phys.

      Volume: 53 Issue: 6S Pages: 06JF03-06JF03

    • DOI

      10.7567/jjap.53.06jf03

    • NAID

      210000144101

    • Peer Reviewed / Acknowledgement Compliant
    • Data Source
      KAKENHI-PROJECT-25289105, KAKENHI-PROJECT-26420309
  • [Journal Article] Formation of pn junction in 4H-SiC by irradiation of excimer laser in phosphoric solution2014

    • Author(s)
      D. Marui, K. Nishi, A. Ikeda, H. Ikenoue, T. Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 53

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Journal Article] n- and p-type doping of 4H-SiC by wet-chemical laser processing2014

    • Author(s)
      K. Nishi, A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Journal Title

      Materials Science Forum

      Volume: 778-780 Pages: 645-648

    • DOI

      10.4028/www.scientific.net/msf.778-780.645

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Journal Article] Development of a portable taste sensor with a lipid/polymer membrane2013

    • Author(s)
      Y. Tahara, K. Nakashi, K. Ji, A. Ikeda, K. Toko
    • Journal Title

      Sensors

      Volume: vol. 13, No.1 Issue: 1 Pages: 1076-1084

    • DOI

      10.3390/s130101076

    • NAID

      120005647841

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Journal Article] Phosphorus Doping into 4H-SiC by Irradiation of Excimer Laser in Phosphoric Solution2013

    • Author(s)
      K. Nishi, A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 52 Issue: 6S Pages: 06GF02-06GF02

    • DOI

      10.7567/jjap.52.06gf02

    • NAID

      210000142360

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Journal Article] Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump2013

    • Author(s)
      L. Qiu, A. Ikeda, K. Noda, S. Nakai, and T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: 52 Issue: 4S Pages: 04CB10-04CB10

    • DOI

      10.7567/jjap.52.04cb10

    • NAID

      210000141986

    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Development of a Multichannel Taste Sensor Chip for a Portable Taste Sensor2012

    • Author(s)
      Y. Tahara, Y. Maehara, J. Ke, A. Ikeda and K. Toko
    • Journal Title

      2012 IEEE SENSORS Proceedings

      Volume: 2012 Pages: 414-417

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Journal Article] Low-Temperature Bonding of LSI Chips to PEN Film Using Au Cone Bump for Heterogeneous Integration2012

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference 2011

      Pages: 1-5

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnec-tions2012

    • Author(s)
      A.Ikeda, N.Watanabe, T.Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference 2011

      Pages: 1-4

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] 自己組織化単分子膜を用いた銅とはんだのフラックスレス接合の研究2012

    • Author(s)
      池田晃裕,仲原清顕,仇立靖,浅野種正
    • Journal Title

      電子情報通信学会論文誌C

      Volume: J95-C Pages: 304-304

    • NAID

      110009543930

    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections2012

    • Author(s)
      Akihiro Ikeda, Naoya Watanabe Tanemasa Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference

      Volume: (CD-ROM)

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Development of multichannel taste sensor chip for a portable taste sensor2012

    • Author(s)
      Y. Tahara, Y. Maehara, K. Ji, A. Ikeda, K. Toko
    • Journal Title

      The proceedings of 2012 IEEE Sensors

      Pages: 414-417

    • DOI

      10.1109/icsens.2012.6411197

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Journal Article] 自己組織化単分子膜を用いた銅とはんだのフラックスレス接合の研究2012

    • Author(s)
      池田晃裕
    • Journal Title

      電子情報通信学会論文誌C

      Volume: J95-C Pages: 304-311

    • NAID

      110009543930

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections2012

    • Author(s)
      A. Ikeda, N. Watanabe, T. Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump2012

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, and T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: 51 Issue: 4S Pages: 04DB04-04DB04

    • DOI

      10.1143/jjap.51.04db04

    • NAID

      210000072104

    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump2011

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 787-788

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: Vol.50

    • NAID

      210000070770

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Micro-joining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump2011

    • Author(s)
      Takanori Shuto, Naoya Watanabe, Akihiro Ikeda Tanemasa Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: Vol.50

    • NAID

      210000070770

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, and T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: 50 Issue: 6S Pages: 06GM05-06GM05

    • DOI

      10.1143/jjap.50.06gm05

    • NAID

      210000070770

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Room-Temperature Cu-Cu Bonding in Ambient Air Achieved by Using Cone Bump2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, and T. Asano
    • Journal Title

      Appl. Phys. Express

      Volume: 4 Issue: 1 Pages: 16501-16501

    • DOI

      10.1143/apex.4.016501

    • NAID

      10027782759

    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics2011

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, Tanemasa Asano
    • Journal Title

      Proceedings of the 61st Electronic Components and Technology Conference

      Pages: 1770-1774

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
    • Journal Title

      Proceedings of the 61st ECTC

      Pages: 1770-1774

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Fjexible Electronics2011

    • Author(s)
      Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano
    • Journal Title

      Proceedings of the 61st Electronic Components and Technology Conference

      Pages: 1770-1774

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Depositionon Small-Area Al Pads2010

    • Author(s)
      A. Ikeda, K. Kajiwara, N. Watanabe, and T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: 49 Issue: 8S1 Pages: 08JA05-08JA05

    • DOI

      10.1143/jjap.49.08ja05

    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump2010

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
    • Journal Title

      Proceedings of IDW'10, The 17th International Display Workshops

      Pages: 1717-1720

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections2010

    • Author(s)
      A. IKEDA, K. KAJIWARA, N. WATANABE, T. ASANO
    • Journal Title

      Proceedings of IEEE TENCON 2010

      Pages: 21-24

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump2010

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimahi, T. Asano
    • Journal Title

      Proceedings of The 17th international Display Workshops

      Pages: 1717-1720

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Direct Bonding of LSI Chips to Flexible Substrate Using Compliant Bump2010

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda T.Higashimachi, T.Asano
    • Journal Title

      Dig.Papers 23rd International Microprocesses and Nanotechnology Conference

      Volume: 23

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads2010

    • Author(s)
      A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Journal Title

      Jpn.J.Appl.Phys

      Volume: Vol.49

    • NAID

      210000069047

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads2010

    • Author(s)
      A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 49

    • NAID

      210000069047

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads2010

    • Author(s)
      A. Ikeda, K. Kajiwara, N. Watanabe, T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: Vol.49

    • NAID

      210000069047

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections2010

    • Author(s)
      A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Journal Title

      Proceedings of IEEE TENCON 2010

      Pages: 2191-2195

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Direct Connection of LSI Chips to Polyethylene Naphthalate Using Au Cone Bump2010

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
    • Journal Title

      Proceedings of the 17th International Display Workshops

      Pages: 1717-1720

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections2010

    • Author(s)
      A Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Journal Title

      Proceeding of the IEEE Region 10 Conference (TENCON) 2010

      Pages: 2191-2195

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] 同一基板上マルチチャネル型味覚センサチップの開発2010

    • Author(s)
      田原祐助, 池田晃裕, 羽原正秋, 都甲潔
    • Journal Title

      電子情報通信学会技術報告

      Volume: 110 Pages: 37-40

    • NAID

      110008106396

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18106009
  • [Journal Article] Lows Threshold Blue Emission from First-Order Organic DFB Laser Using 2, 7-bis[4-(N-carbazole)phenylvinyl]-9, 9'-Spirobifluorene as Active Gain Medium2009

    • Author(s)
      M.Hirade, H.Nakanotani, R.Hattori, A.Ikeda, M.Yahiro, C.Adachi
    • Journal Title

      Molecular Crystals and Liquid Crystals 504

      Pages: 1-8

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Compliant Bump Technology for Back-Side Illuminated CMOS Image Sensor2009

    • Author(s)
      T.Asano, N.Watanabe, I.Tsunoda, Y.Kimiya, K.Fukunaga, M.Handa, H.Arao, Y.Yamaji, M.Aoyagi, T.Higashimachi, K.Tanaka, T.Takao, K.Matsumura, A.Ikeda, Y.Kuroki, T.Tsurushima
    • Journal Title

      Proc. 2009 Int. Electronic Components and Techn ology Conference"

      Pages: 40-45

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package2009

    • Author(s)
      Akihiro Ikeda, Atsushi Sakamoto, Reiji Hattori, Yukinori Kuroki
    • Journal Title

      Thin Solid Films 517

      Pages: 1740-1745

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Integration of Compliant Bump with Through-Si-Via Technology andn It s Application to Backside Illuminated CMOS Image Sensor2009

    • Author(s)
      T.Asano, N.Watanabe, I.Tsunoda, T.Takao, K.Tanaka, T.Hiagashimachi, Y.Yamaji, M Aoyagi, T.Kyotani, H.Arao, Y .Kimiya, K.Fukunaga, A.Ikeda, Y.Kuroki, T.Tsurushima
    • Journal Title

      Proc. 2009 Int. Conf. Electronics Packaging

      Pages: 185-190

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Journal Article] Compliant Bump Technology for Back-Side IIIuminated CMOS Image Sensor2009

    • Author(s)
      T.Asano, N.Watanabe, A.Ikeda, et al.
    • Journal Title

      Proceedings of 59th Electronic Components and technology Conference

      Pages: 40-45

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Journal Article] Effects of Electroless Ni/Sn Bump Formation Using Hydrogen-Plasma Reflow on the Electrical Characteristics of MOSFETs2007

    • Author(s)
      Akihiro, Ikeda, et. al.
    • Journal Title

      Proceeding of 9th Electronics Packaging Technology Conference(EPTC 2007)

      Pages: 926-930

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] Argon-hydrogen plasma cleaning effect on electroless Ni plating for under bump metallurgy of solder bump2007

    • Author(s)
      Akihiro, Ikeda, et. al.
    • Journal Title

      Proceeding of International Symposium on Dry Process

      Pages: 65-66

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] Uniformity of an Electroless Plated Ni on a Pad Connected to Different Siza Pads or a Pn Junction for Under Bump Metallurug in a Flip-Chip Assembly2007

    • Author(s)
      Akihiro, Ikeda, et. al.
    • Journal Title

      IEEE Transactions on Components and Packaging Technologies Vol.30,No.3

      Pages: 494-499

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] Si貫通電極形成のためのディープエッチングと側壁酸化膜の形成2006

    • Author(s)
      池田晃裕, et a1.
    • Journal Title

      電応研テクニカルレポート 16・1

      Pages: 23-25

    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] Mobility change of MOSFETs in a chip-stacked multichip package2006

    • Author(s)
      Akihiro Ikeda, et al.
    • Journal Title

      Electronics and Communications in Japan (Part II : Electronics) 89・7

      Pages: 1-8

    • NAID

      210000169079

    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package2005

    • Author(s)
      Akihiro Ikeda, et al.
    • Journal Title

      Proc. IEEE 43rd International Reliability Physics Symposium

      Pages: 578-579

    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package2005

    • Author(s)
      A.Ikeda, Y.Kuroki, et al.
    • Journal Title

      Proceeding of 43rd IEEE Reliability Physics Symposium (to be published)

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Journal Article] チップスタック型マルチチップ実装におけるMOSFETの移動度の変動について2005

    • Author(s)
      池田晃裕, et al.
    • Journal Title

      電子情報通信学会論文誌 C Vol.J88-C・No.11

      Pages: 866-873

    • NAID

      110003496099

    • Data Source
      KAKENHI-PROJECT-17760281
  • [Journal Article] A Recessed Channel MOSFET with Plasma-grown Silicon Oxynitride Gate Dielectric2005

    • Author(s)
      Rohana Perera, Akihiro Ikeda, Yukinori Kuroki
    • Journal Title

      Research Reports on Information Science and Electrical Engineering of Kyushu University Vol.10, No.1(to be published)

    • NAID

      110001131570

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Journal Article] Recessed Channel MOSFET Using Low Temperature Plasma Gate Oxide on P on P+ Epitaxial Si Wafer2004

    • Author(s)
      Akihiro Ikeda, Rohana Perera, Yukinori Kuroki
    • Journal Title

      Abstract of 7th Asia Pacific Conference on Plasma Science and Technology & 17th Symposium on Plasma Science for Materials

      Pages: 76-76

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Journal Article] Mass-production fabrication of miniaturized plastic chip devices for biochemical applications2004

    • Author(s)
      T.Fujimura, A.Ikeda, et al.
    • Journal Title

      Proceeding of Device and Process Technologies for MEMS, Microelectronics, and Photonics III Vol.5276

      Pages: 392-399

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Journal Article] Simulated Characteristics of Deep-submicrometer Recessed Channel epi-MOSFETs2004

    • Author(s)
      Rohana Perera, Akihiro Ikeda, Yukinori Kuroki
    • Journal Title

      Research Reports on Information Science and Electrical Engineering of Kyushu University Vol.9, No.2

      Pages: 67-72

    • NAID

      110000948899

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Journal Article] Design and Measurements of Test Element Group Wafer Thinned to 10μm for 3D System in Package2004

    • Author(s)
      Akihiro Ikeda, et al.
    • Journal Title

      Proc.IEEE Internal Conference on Microelectronic Test Structures Vol.17

      Pages: 161-164

    • Data Source
      KAKENHI-PROJECT-14750266
  • [Patent] 不純物導入装置、不純物導入方法及び半導体素子の製造方法2015

    • Inventor(s)
      池田晃裕,池上浩,浅野種正,井口研一,中澤治雄,関康和
    • Industrial Property Rights Holder
      九州大学,富士電機(株)
    • Industrial Property Rights Type
      特許
    • Patent Publication Number
      2016-157911
    • Filing Date
      2015-08-28
    • Acquisition Date
      2016-09-01
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Patent] レーザドーピング装置及びレーザドーピング方法2015

    • Inventor(s)
      大久保智幸,池上浩,池田晃裕,浅野種正,若林理
    • Industrial Property Rights Holder
      ギガフォトン,九州大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2015-03-30
    • Overseas
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Patent] 不純物導入装置、不純物導入方法及び半導体素子の製造方法2015

    • Inventor(s)
      池田晃裕,池上浩,浅野種正 井口研一,中澤治雄,関康和
    • Industrial Property Rights Holder
      富士電機,九州大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2015-035615
    • Filing Date
      2015-02-25
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Patent] レーザドーピング装置及びレーザドーピング方法2015

    • Inventor(s)
      大久保智幸,池上浩,池田晃裕,浅野種正,若林理
    • Industrial Property Rights Holder
      九州大学,ギガフォトン(株)
    • Industrial Property Rights Type
      特許
    • Filing Date
      2015-03-23
    • Acquisition Date
      2016-09-29
    • Overseas
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Patent] 不純物導入装置、不純物導入方法及び半導体素子の製造方法2015

    • Inventor(s)
      池田晃裕,池上浩,浅野種正 井口研一,中澤治雄,関康和
    • Industrial Property Rights Holder
      富士電機,九州大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2015-035615
    • Filing Date
      2015-02-25
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Patent] 不純物導入方法及び半導体素子の製造方法2014

    • Inventor(s)
      池上浩,池田晃裕,浅野種正 井口研一、中澤治雄、関康和、松村徹
    • Industrial Property Rights Holder
      富士電機,九州大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2014-174567
    • Filing Date
      2014-08-23
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Patent] 不純物導入方法及び半導体素子の製造方法2014

    • Inventor(s)
      池上浩,池田晃裕,浅野種正,井口研一,中澤治雄,関康和,松村徹
    • Industrial Property Rights Holder
      九州大学,富士電機(株)
    • Industrial Property Rights Type
      特許
    • Patent Publication Number
      2016-051737
    • Filing Date
      2014-08-28
    • Acquisition Date
      2016-04-11
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Patent] 不純物導入方法及び半導体素子の製造方法2014

    • Inventor(s)
      池上浩,池田晃裕,浅野種正 井口研一、中澤治雄、関康和、松村徹
    • Industrial Property Rights Holder
      富士電機,九州大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2014-174567
    • Filing Date
      2014-08-28
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Room Temperature Processing of Low Resistance Contacts to p-type 4H-SiC using Laser Doping2019

    • Author(s)
      K. Okamoto, A. Ikeda, T. Kikuchi, H. Ikenoue, A. Asano
    • Organizer
      International Conference on Silicon Carbide and Related Materials 2019
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] Laser doping for 4H-SiC power-device fabrication with laser pulse-duration controller2019

    • Author(s)
      T. Kikuchi, K. Imokawa, A. Ikeda, D. Nakamura, T. Asano, H. Ikenoue
    • Organizer
      LiM 2019 - Lasers in Manufacturing
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] Formation of Low Resistance Contacts to p-type 4H-SiC by Using Laser Doping with Al Thin-Film Dopant Source2018

    • Author(s)
      K. Okamoto, T. Kikuchi, A. Ikeda, H. Ikenoue and T. Asano
    • Organizer
      31th International Microprocesses and Nanotechnology conference (MNC 2018)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] Low-temperature, high-concentration laser doping of nitrogen to 4H-SiC for low-contact-resistance fabrication2018

    • Author(s)
      T. Kikuchi, K. Imokawa, A. Ikeda, D. Nakamura, T. Asano, H. Ikenoue
    • Organizer
      2018 International Conference on Solid State Devices and Materials (SSDM 2018)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] Increasing Laser-Doping Depth of Al in 4H-SiC by Using Expanded-Pulse Excimer Laser2018

    • Author(s)
      A. Ikeda, T. Shimokawa , H. Ikenoue, T. Asano
    • Organizer
      European Conference on Silicon Carbide and Related Materials (ECSCRM 2018)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] High-concentration, Room Temperature, and Low-cost Excimer Laser Doping for 4H-SiC Power Device Fabrication2018

    • Author(s)
      K. Imokawa, T. Kikuchi, D. Nakamura, A. Ikeda, T. Asano, H. Ikenoue
    • Organizer
      European Conference on Silicon Carbide and Related Materials (ECSCRM 2018)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] 4H-SiC中へのAlのレーザドーピングおけるドープ領域の調査2017

    • Author(s)
      池田 晃裕,角名 陸歩,筒井 良太,池上 浩,浅野 種正
    • Organizer
      第64回応用物理学会春季学術講演会
    • Place of Presentation
      横浜
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Improved doping performance of laser Al doping in 4H-SiC by substrate heating2017

    • Author(s)
      A. Ikeda, R. Sumina, R. Tsutsui, A. Suwa, H. Ikenoue, T. Asano
    • Organizer
      ICSCRM 2017
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K06387
  • [Presentation] SiNx膜レーザーアブレーションによる4H-SiCへの窒素ドーピングと窒素拡散機構に関する研究2016

    • Author(s)
      小島 遼太, 池上 浩, 諏訪 輝, 池田 晃裕, 中村 大輔, 浅野 種正, 岡田 龍雄
    • Organizer
      第63回応用物理学会春季学術講演会
    • Place of Presentation
      東京都
    • Year and Date
      2016-03-21
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] 堆積薄膜へのレーザ照射による4H-SiCへのAlのドーピング特性2016

    • Author(s)
      角名 陸歩, 池田 晃裕, 池上 浩, 浅野 種正
    • Organizer
      第63回応用物理学会春季学術講演会
    • Place of Presentation
      東京都
    • Year and Date
      2016-03-21
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Improvement in contact resistance of 4H-SiC by excimer laser doping using silicon nitride films2016

    • Author(s)
      R. Kojima, H. Ikenoue, T. Suwa, A. Ikeda, Daisuke Nakamura, T. Asano, Tatsuo Okada
    • Organizer
      SPIE Photonics West
    • Place of Presentation
      San Francisco
    • Year and Date
      2016-02-15
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] SiNx膜レーザーアブレーションによる4H-SiCへの窒素ドーピング及び電気特性評価2016

    • Author(s)
      小島 遼太, 池上 浩, 諏訪 輝, 池田 晃裕, 中村 大輔, 浅野 種正, 岡田 龍雄
    • Organizer
      レーザー学会学術講演会第 36 回年次大会
    • Place of Presentation
      名古屋市
    • Year and Date
      2016-01-10
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Increased Doping Depth of Al in Wet- chemical Laser Doping of 4H-SiC by Expanding Laser Pulse2016

    • Author(s)
      A. Ikeda, D. Marui, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      7th International Symposium on Control of Semiconductor Interfaces and International SiGe Technology and Device Meeting
    • Place of Presentation
      名古屋
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] 堆積薄膜へのレーザ照射による4H-SiCへのAlのドーピング特性2016

    • Author(s)
      角名 陸歩, 池田 晃裕, 池上 浩, 浅野 種正
    • Organizer
      第63回応用物理学会春季学術講演会
    • Place of Presentation
      東京
    • Year and Date
      2016-03-21
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] SiNx膜レーザーアブレーションによる4H-SiCへの窒素ドーピングと窒素拡散機構に関する研究2016

    • Author(s)
      小島 遼太, 池上 浩, 諏訪 輝, 池田 晃裕, 中村 大輔, 浅野 種正, 岡田 龍雄
    • Organizer
      第63回応用物理学会春季学術講演会
    • Place of Presentation
      東京
    • Year and Date
      2016-03-21
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Thickness dependence of doping characteristic in Al doping into 4H-SiC by laser irradiation to deposited Al film2016

    • Author(s)
      R. Sumina, A. Ikeda, H. Ikenoue, T. Asano
    • Organizer
      Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices
    • Place of Presentation
      函館
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Enhanced Oxidation of 4H-SiC Using SrTi_{1-x}Mg_xO_{3-d} Catalyst2016

    • Author(s)
      Akihiro Ikeda
    • Organizer
      European Conference on Silicon Carbide & Related Materials
    • Place of Presentation
      Halkidiki, Greece
    • Year and Date
      2016-09-26
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Presentation] SiNx膜レーザーアブレーションによる4H-SiCへの窒素ドーピング及び電気特性評価2016

    • Author(s)
      小島 遼太, 池上 浩, 諏訪 輝, 池田 晃裕, 中村 大輔, 浅野 種正, 岡田 龍雄
    • Organizer
      レーザー学会学術講演会第 36 回年次大会
    • Place of Presentation
      名古屋
    • Year and Date
      2016-01-10
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Enhanced thermal oxidation using SrTi_{1-x}Mg_xO_{3-d} catalyst and its application to 4H-SiC2016

    • Author(s)
      Akihiro Ikeda
    • Organizer
      Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices
    • Place of Presentation
      Hakodate, Japan
    • Year and Date
      2016-07-04
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K14258
  • [Presentation] Effects of Substrate Heating on Al Doping Performed by Irradiating Laser Beam to Al Film on 4H-SiC2016

    • Author(s)
      A. Ikeda, R. Tsutsui, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      European Conference on Silicon Carbide & Related Materials
    • Place of Presentation
      Halkidiki, Greece
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Improvement in contact resistance of 4H-SiC by excimer laser doping using silicon nitride films2016

    • Author(s)
      R. Kojima, H. Ikenoue, T. Suwa, A. Ikeda, Daisuke Nakamura, T. Asano, Tatsuo Okada
    • Organizer
      SPIE Photonics West
    • Place of Presentation
      San Francisco
    • Year and Date
      2016-02-15
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Local nitrogen doping in 4H-SiC by laser irradiation in atmospheric-pressure plasma2015

    • Author(s)
      R. Kojima, H. Ikenoue, Yosuke Watanabe, A. Ikeda, Daisuke Nakamura, T. Asano, T. Okada
    • Organizer
      SPIE Photonics West
    • Place of Presentation
      サンフランシスコ
    • Year and Date
      2015-02-11
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Local nitrogen doping in 4H-SiC by laser irradiation in atmospheric-pressure plasma2015

    • Author(s)
      R. Kojima, H. Ikenoue, Yosuke Watanabe, A. Ikeda, Daisuke Nakamura, T. Asano, T. Okada
    • Organizer
      SPIE Photonics West
    • Place of Presentation
      サンフランシスコ
    • Year and Date
      2015-02-11
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] 堆積Al薄膜へのレーザー照射による4H-SiCへのAlドーピング2015

    • Author(s)
      角名 陸歩, 池田 晃裕, 浅野 種正
    • Organizer
      薄膜材料デバイス研究会
    • Place of Presentation
      京都
    • Year and Date
      2015-10-30
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Al doping from laser irradiated Al film deposited on 4H‐SiC2015

    • Author(s)
      A. Ikeda, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      16th International Conference on Silicon Carbide and Related Materials
    • Place of Presentation
      Giardini Naxos
    • Year and Date
      2015-10-05
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Al Doping of 4H-SiC by Laser Irradiation to Coated Film and Its Application to Junction Barrier Schottky Diode2015

    • Author(s)
      A. Ikeda, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      Int. Conf. Solid State Devices and Materials
    • Place of Presentation
      札幌
    • Year and Date
      2015-09-28
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] 堆積Al薄膜へのレーザー照射による4H-SiCへのAlドーピング2015

    • Author(s)
      角名 陸歩, 池田 晃裕, 池上 浩, 浅野 種正
    • Organizer
      薄膜材料デバイス研究会
    • Place of Presentation
      京都市
    • Year and Date
      2015-10-30
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Al doping from laser irradiated Al film deposited on 4H‐SiC2015

    • Author(s)
      A. Ikeda, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      16th International Conference on Silicon Carbide and Related Materials
    • Place of Presentation
      Giardini Naxos
    • Year and Date
      2015-10-05
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Al Doping of 4H-SiC by Laser Irradiation to Coated Film and Its Application to Junction Barrier Schottky Diode2015

    • Author(s)
      A. Ikeda, R. Sumina, H. Ikenoue, T. Asano
    • Organizer
      SSDM 2015
    • Place of Presentation
      札幌市
    • Year and Date
      2015-09-28
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] 表面に堆積したAl薄膜へのレーザ照射による4H-SiCへのp型ドーピング2015

    • Author(s)
      池田 晃裕、角名 陸歩、池上 浩、浅野 種正
    • Organizer
      第62回応用物理学会春季学術講演会
    • Place of Presentation
      平塚市
    • Year and Date
      2015-03-14
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Nitrogen doping of 4H-SiC by excimer laser irradiation in liquid nitrogen2014

    • Author(s)
      A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      2014 Int'l. Conf. Solid State Devices and Materials
    • Place of Presentation
      つくば市
    • Year and Date
      2014-09-09
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] 溶液中レーザー照射でAl をドーピングした4H-SiC のコンタクト抵抗の評価2014

    • Author(s)
      吉田瞭太, 池田晃裕, 丸井大地, 池上浩, 浅野種正
    • Organizer
      平成26年度応用物理学会九州支部学術講演会
    • Place of Presentation
      大分市
    • Year and Date
      2014-12-06
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Nitrogen doping of 4H-SiC by excimer laser irradiation in liquid nitrogen2014

    • Author(s)
      A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      SSDM 2014
    • Place of Presentation
      つくば市
    • Year and Date
      2014-09-09
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] KrFエキシマレーザーの液体窒素中照射による4H-SiCへのNのドーピング2014

    • Author(s)
      丸井大地,池田晃裕,池上浩,浅野種正
    • Organizer
      第75回 応用物理学会秋季学術講演会
    • Place of Presentation
      札幌市
    • Year and Date
      2014-09-17
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Extremely Enhanced Diffusion of Nitrogen in 4H-SiC Observed in Liquid-Nitrogen Immersion Irradiation of Excimer Laser2014

    • Author(s)
      A. Ikeda, D. Mrui, H. Ikenoue, T. Asano
    • Organizer
      10th European Conference on Silicon Carbide and Related Materials
    • Place of Presentation
      Grenoble, France
    • Year and Date
      2014-09-22
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] Extremely Enhanced Diffusion of Nitrogen in 4H-SiC Observed in Liquid-Nitrogen Immersion Irradiation of Excimer Laser2014

    • Author(s)
      A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      10th European Conference on Silicon Carbide and Related Materials
    • Place of Presentation
      グルノーブル
    • Year and Date
      2014-09-22
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] 大気圧窒素プラズマ中レーザー照射による4H-SiC中への窒素ドーピング2014

    • Author(s)
      小島遼太,池上浩,渡邊陽介,池田晃裕,中村大輔,浅野種正,岡田龍雄
    • Organizer
      第75回 応用物理学会秋季学術講演会
    • Place of Presentation
      札幌市
    • Year and Date
      2014-09-17
    • Data Source
      KAKENHI-PROJECT-26420309
  • [Presentation] ポータブル味覚センサの開発2012

    • Author(s)
      田原祐助, 前原義弘, 籍可, 池田晃裕, 都甲潔
    • Organizer
      2012年電気学会センサ・マイクロマシン部門総合研究会(E部門京都大学総合研究会)
    • Place of Presentation
      京都大学
    • Year and Date
      2012-06-12
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Presentation] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections2012

    • Author(s)
      A. Ikeda, N. Watanabe, T. Asano
    • Organizer
      IEEE International 3D System Integration Conference
    • Place of Presentation
      吹田市
    • Year and Date
      2012-02-01
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] Design of miniaturized taste sensor chip with lipid/polymer membranes2012

    • Author(s)
      Y. Tahara, Y. Maehara, K. Ji, A. Ikeda, K. Toko
    • Organizer
      IEEE Sensors 2012
    • Place of Presentation
      Taipei International Convention Center, Taipei, Taiwan
    • Year and Date
      2012-10-29
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Presentation] High Frequency Signal Transmission Characteristics of Cone Bump Interconnec-tions2012

    • Author(s)
      Akihiro Ikeda
    • Organizer
      IEEE International 3D System Integration Confere nee 2011 (3DIC2011)
    • Place of Presentation
      Osaka
    • Year and Date
      2012-01-30
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Phosphorus Doping of 4H-SiC by KrF Excimer Laser Irradiation in Phosphoric Solution2012

    • Author(s)
      A. Ikeda, K. Nishi, and T. Asano
    • Organizer
      Ext. Abstr. International Conference on Solid State Devices and Materials 2012
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, and T. Asano
    • Organizer
      Proceedings of 3D Systems Integration Conference 2011
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda and T. Asano
    • Organizer
      Proceedings of the 61st Electronic Components and Technology Conference 2011
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] 味覚センサの小型化を目指したセンサチップの性能評価2011

    • Author(s)
      田原祐助, 前原義弘, 池田晃裕, 羽原正秋, 都甲潔
    • Organizer
      第58回応用物理学関係連合講演会
    • Place of Presentation
      神奈川工科大学(厚木市)
    • Year and Date
      2011-03-24
    • Data Source
      KAKENHI-PROJECT-18106009
  • [Presentation] Room temperature bonding of LSI chips on PEN film using mechanical caulking of Au cone bump2011

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, and T. Asano
    • Organizer
      Ext. Abstr. International Conference on Solid State Devices and Materials 2011
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] コンプライアントバンプを用いたかしめ接合によるPENフィルム上へのLSIチップの常温実装2011

    • Author(s)
      首藤高徳, 渡辺直也, 池田晃裕, 浅野種正
    • Organizer
      秋季第72回応用物理学会学術講演会
    • Place of Presentation
      山形大学
    • Year and Date
      2011-09-02
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] コンプライアントバンプを用いたかしめ接合によるPENフィルム上へのLSIチップの常温実装2011

    • Author(s)
      首藤高徳,渡辺直也,池田晃裕,浅野種正
    • Organizer
      第72回応用物理学会学術講演会
    • Place of Presentation
      東京都
    • Year and Date
      2011-09-02
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] High frequency signal transmission characteristics of cone bump interconnections2011

    • Author(s)
      A. Ikeda, N. Watanabe, and T. Asano
    • Organizer
      Proceedings of 3D Systems Integration Conference 2011
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump2010

    • Author(s)
      (3)T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
    • Organizer
      23rd International Microprocesses and Nanotechnology Conference
    • Place of Presentation
      福岡市
    • Year and Date
      2010-10-10
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections2010

    • Author(s)
      A. IKEDA, K. KAJIWARA, N. WATANABE, T. ASANO
    • Organizer
      IEEE TENCON 2010
    • Place of Presentation
      福岡市
    • Year and Date
      2010-11-23
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] Direct Connection of LSI Chips to Polyethylene Naphthalate Using Au Cone Bump2010

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
    • Organizer
      7th International Display Workshops (IDW'10)
    • Place of Presentation
      福岡
    • Year and Date
      2010-12-02
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Direct Connection of LSI Chips to Polyethylene Naphthalate Using Au Cone Bump2010

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, and T. Asano
    • Organizer
      Proceedings of the 17th International Display Workshops
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Direct Bonding of LSI Chips to Flexible Substrate Using Compliant Bump2010

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
    • Organizer
      23rd International Microprocesses and Nanotechnology Conference (MNC 2010)
    • Place of Presentation
      北九州
    • Year and Date
      2010-11-10
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Direct Bonding of LSI Chips to Flexible Substrate Using Compliant Bump2010

    • Author(s)
      T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, and T. Asano
    • Organizer
      Dig. Papers International Microprocesses and Nanotechnology Conference 2010
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections2010

    • Author(s)
      A Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Organizer
      IEEE Region 10 Conference (TENCON) 2010
    • Place of Presentation
      福岡
    • Year and Date
      2010-11-22
    • Data Source
      KAKENHI-PROJECT-21246061
  • [Presentation] Ar/H2 plasma cleaning effect on electroless Ni plating for micro-bump formation2009

    • Author(s)
      A. Ikeda, K. Kajiwara, N. Watanabe, T. Asano
    • Organizer
      INTERNATIONAL SYMPOSIUM ON DRY PROCESS
    • Place of Presentation
      韓国,釜山
    • Year and Date
      2009-09-25
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] プラスチック基板を用いた味覚センサチップの評価2009

    • Author(s)
      池田晃裕, 羽原正秋, 都甲潔
    • Organizer
      応用物理学会九州支部学術講演会
    • Place of Presentation
      熊本大学(熊本市)
    • Year and Date
      2009-11-22
    • Data Source
      KAKENHI-PROJECT-18106009
  • [Presentation] Ar/H2 plasma cleaning effect on electroless Ni plating for micro-bump formation2009

    • Author(s)
      A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
    • Organizer
      31st International Symposium on Dry Process
    • Place of Presentation
      韓国・釜山
    • Year and Date
      2009-09-25
    • Data Source
      KAKENHI-PROJECT-21760260
  • [Presentation] Characteristic of pn Junction Formed in 4H-SiC by using Excimer-laser Processing in Phosphoric Solution

    • Author(s)
      A. Ikeda, K. Nishi, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      13th International Workshop on Junction Technology
    • Place of Presentation
      Kyoto
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Aluminum Doping of 4H-SiC using Chemical Wet Laser Processing

    • Author(s)
      D. Marui, K. Nishi, A. Ikeda, H. Ikenoue, T. Asano
    • Organizer
      26th International Microprocesses and Nanotechnology Conference
    • Place of Presentation
      Sapporo
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Formation of pn junction in 4H-SiC by irradiation of excimer laser in phosphoric solution

    • Author(s)
      K. Nishi, A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      2013 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices
    • Place of Presentation
      Seoul
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] 参照電極一体型味覚センサチップの開発

    • Author(s)
      前原義弘,田原祐助,池田晃裕,都甲 潔
    • Organizer
      平成23年度応用物理学会九州支部学術講演会
    • Place of Presentation
      鹿児島大学
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Presentation] ポータブル味覚センサの開発

    • Author(s)
      田原祐助,前原義弘,籍 可,池田晃裕,都甲 潔
    • Organizer
      2012年電気学会センサ・マイクロマシン部門総合研究会(E部門総合研究会)
    • Place of Presentation
      京都大学
    • Data Source
      KAKENHI-PROJECT-23240029
  • [Presentation] n- and p-type doping of 4H-SiC by wet-chemical laser processing

    • Author(s)
      K. Nishi, A. Ikeda, D. Marui, H. Ikenoue, T. Asano
    • Organizer
      International Conference on Silicon Carbide and Related Materials 2013
    • Place of Presentation
      Miyazaki
    • Data Source
      KAKENHI-PROJECT-25289105
  • [Presentation] Design of miniaturized taste sensor chip with lipid/polymer membranes

    • Author(s)
      Y. Tahara, Y. Maehara, J. Ke, A. Ikeda, K. Toko
    • Organizer
      IEEE Sensors 2012
    • Place of Presentation
      Taipei International Convention Center, Taipei, Taiwan
    • Data Source
      KAKENHI-PROJECT-23240029
  • 1.  ASANO Tanemasa (50126306)
    # of Collaborated Projects: 5 results
    # of Collaborated Products: 74 results
  • 2.  KUROKI Yukinori (40234596)
    # of Collaborated Projects: 4 results
    # of Collaborated Products: 0 results
  • 3.  HATTORI Reiji (60221503)
    # of Collaborated Projects: 4 results
    # of Collaborated Products: 0 results
  • 4.  HAYASHI Kenshi (50202263)
    # of Collaborated Projects: 3 results
    # of Collaborated Products: 0 results
  • 5.  TOKO Kiyoshi (50136529)
    # of Collaborated Projects: 2 results
    # of Collaborated Products: 11 results
  • 6.  HABARA Masaaki (70372745)
    # of Collaborated Projects: 2 results
    # of Collaborated Products: 3 results
  • 7.  NAKASHI Kenichi (50237252)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 8.  NODA Kazutoshi (60357746)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 9.  ETOH shinichi (80380591)
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    # of Collaborated Products: 0 results
  • 10.  IZUMI Ryusuke (00423492)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 11.  TANAKA Koichiro (40253570)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 2 results
  • 12.  HIGASHMACHI Takao (50461611)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 13.  SHIDOJI Kazunori (50243853)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 14.  ONODERA Takeshi (50336062)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 15.  HIROSE Nobuyuki (40467410)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 16.  TAHARA Yusuke (80585927)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 8 results
  • 17.  IKENOUE Hiroshi (70413862)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 19 results
  • 18.  LI Xiaohong (30326459)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 4 results
  • 19.  TAKAO Takayuki
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 20.  LI li
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 4 results

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