YU Qiang 于強

… Alternative Names

干強ウキョウ

Less

Researcher Number	80242379
Other IDs
External Links
Affiliation (Current)	2025: 横浜国立大学, 大学院工学研究院, 教授
Affiliation (based on the past Project Information) *help	2012: 横浜国立大学, 大学院・工学研究院, 教授 2011 – 2012: 横浜国立大学, 工学研究院, 教授 2010: 横浜国立大学, 工学研究院, 准教授 2007: Yokohama National University, Graduate School of Engineering, Associate Professor 2006: 横浜国立大学, 大学院工学研究院, 准教授 … More 2006: 横浜国立大学, 大学院工学研究院, 助教授 2005: Yokohama National University, Faculty of Engineering, Assistant Professor, 大学院・工学研究院, 助教授 2004: 国立大学法人横浜国立大学, 大学院・工学研究院, 助教授 2001 – 2003: 横浜国立大学, 大学院・工学研究院, 助教授 2001: 横浜国立大学, 工学研究院, 助教授 1996 – 2000: Yokohama National University, Faculty of Engineering, Assistant professor, 工学部, 助教授 1993 – 1995: 横浜国立大学, 工学部, 講師 Less
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials / Materials/Mechanics of materials Except Principal Investigator Materials/Mechanics of materials / Materials/Mechanics of materials
Keywords	Principal Investigator 有限要素法 / Solder Joints / 界面破壊 / マルチ破壊モード / はんだ接合 / 応答曲面 / 統計的設計支援システム / 疲労 / 界面き裂 / はんだ接合部 … More / 低サイクル疲労 / 応力拡大係数 / 疲労き裂進展 / Strain Measurement / Finite Element Method / Fatigue Life / Creep / Low-cycle fatigue / Multi-axial stresses / 3D-Packaging Technology / 弾塑性クリープ / 熱サイクル疲労 / 電子デバイス / ひずみ計測 / 疲労寿命則 / クリープ / 多軸応力 / 3次元実装技術 / Database for Fatigue Life / Response Surface Method / Clustering analysis / Influence of the design factors / Integrated Reliability Design / Reliability Evaluation / Electronics packaging / ばらつき評価 / 設計支援システム / 疲労破壊 / 破壊モード制御 / マイクロ多層構造 / 熱疲労破壊 / 鉛フリーはんだ / 多層薄膜 / 3次元実装 / 統計的最適化 / マイクロはんだ接合 / 信頼性設計 / 構造信頼性 / 3次元実装工学 / 疲労寿命データーベース / クラスタリング / 影響度解析 / 総合信頼性設計 / 信頼性評価 / 電子実装 / Mode controlling approach / Systematic optimization / Response Surface / Statistical Design Support System / Robust optimization / Multi-objective optimization / Optimization of Design / Crash safety design of vehicle / モード制御設計 / システム設計 / マルチレベル最適化 / 衝突安全設計 / モードコントロールアプローチ / システム最適化 / ロバスト最適化 / 多目的最適化 / 最適設計 / 自動車衝突安全性 / 計算力学 / 信頼性 / 接合技術 / 応力・ひずみ分布 / 応力ひずみ分布 / せん断疲労試験 / 3点曲げ疲労試験 / CSPはんだ接合部 / 粘弾性 / き裂進展 / 疲労強度 / 接着継手 / 高温強度 / 粘弾性効果 / 界面崩壊力学 / 金属-CFRP接着継手 … More Except Principal Investigator 鉛フリーはんだ / 疲労寿命評価 / 耐震裕度 / 耐震安全裕度 / 経年配管 / 金属間化合物 / Dynamic analysis / 電子デバイス / Finite Element Method / 応力ひずみ評価 / 影響関数法 / はんだ接合部 / 熱サイクル疲労 / 低サイクル疲労 / Elasto-plastic Analysis / Life to Failure / Ratchet / Wall Thinning / Low-cycle Fatigue / Risk Assessment to Seismic Load / Aged Piping System / 設計基準 / 振動応答 / 経年劣化 / モード解析 / 弾塑性応答 / 加震試験 / 弾塑性 / 有限要素法 / 破損寿命 / ラチェット変形 / 部分減肉 / 低サイクル疲労評価 / 経年配管システム / Reliability / Eletric substrate / Thermal fatigue lifetime / Phase growth / Lead free solder / 信頼性 / 電子基板 / 熱疲労寿命 / 相成長 / Fatigue Life / Plasticity / Ratcheting / Low-cycle fatigue / Multi-fracture mode / Seismic Loading / Degraded Piping / 安全係数 / 低サイクル疲労寿命 / 振動解析 / 減肉配管 / 原子力配管 / 非線形振動 / ラチェット / 機械力学・振動 / 機械材料・材料力学 / 原子力配管系 / 耐震 / 非弾性解析 / 配管系動解析 / 延性消耗 / マルチ破壊モード / Reliability design / Intermetallic compound / Lead-free solder / Thermal fatigue / Interfacial fracture / Fracture control / Multilayer structure / Electronics packaging / 信頼性設計 / 疲労破壊 / 界面破壊 / 破壊モード制御 / マイクロ多層構造 / 電子実装 / ぜい性破壊 / 熱疲労強度 / Impact test / Static response analysis / Fracture due to impact / Impact / Electronics packages / 衝撃破壊寿命 / 衝撃破断試験 / 動的解析 / 静的解析 / 衝撃破壊 / 落下衝撃 / Mechanical Fatigue Testing Method / Thermal Cycling Fatigue Test Mehod / Manson-Coffin's Low / Thermal Fatigue Life Estimation / Lead-Free Solder Joints / マイクロ接合部 / Pbフリーはんだ / 熱疲労 / 有限要素解析 / 機械的疲労試験法 / 熱サイクル試験法 / Manson-Coffin則 / 疲労強度評価 / Pbフリーはんだマイクロ接合部 / stress-strain estimation / estimation of fatigue life / thermal fatigue / material testing machine / micro structure / 疲労強度 / 材料試験機 / マイクロ構造 / Law of crack propagation / Three-dimensional surface crack / Stress intensity factor / Influence function method / き裂進展則 / 3次元表面き裂 / 応力拡大係数 / Thermal cycle fatigue / Strength of low-cycle fatigue / Elasto-plastic creep / Solder Joints / Assembly / 低サイクル疲労強度 / 弾塑性・クリープ / 表面実装電子部品 / ELASTIC-PLASTIC AND CREEP ANALYSIS / THERMAL CYCLE FATIGUE / LOW CYCLES FATIGUE / SOLDER JOINT / SURFACE MOUND / 加速試験 / 弾塑性・クリープ解析 / はんだ接合 / 表面実装 / Honeycomb Sandwich / Fatigue Crack / Image Processing / Detection of flaws / Nondestructive Inspection / Infrared Thermography / ハニカム構造 / 疲労き裂 / 画像処理 / 欠陥検知 / 非破壊検査 / 赤外線映像装置 / 界面端はく離じん性 / フリーエッジ効果 / マイクロテスティング / 破壊力学 / 界面強度 / ダマシンプロセス / 先端LSI配線 / サブミクロン薄膜 Less

A Study on education system for packaging reliability of next generation Sic power device.Principal Investigator
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Risk Assessment and Design Criteria ofAged Piping System under Seismir Load
- Principal Investigator
  
  SHIRATARI Masaki
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Advanced Assessment Methodology of Lead-free Solder Joints under Multi-loads in Three-dimensional Electronic PackagingPrincipal Investigator
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Development of Health Monitoring Technique in Lead Free Solder Joints of Electric Substrate by Phase Growth Parameter
- Principal Investigator
  
  MORI Takao
- Project Period (FY)
  2005 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Prefectural University
Study on Evaluation Method for Safety Margin of Degraded Piping Against Seismic Loading with Multi-Fracture Mode
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Integrated Reliability Evaluation and Design for Advanced 3D Electronics PackagingPrincipal Investigator
- Principal Investigator
  
  YU Qiang
- Project Period (FY)
  2003 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
ダマシンプロセス技術を利用したサブミクロン構造物の界面強度評価法の開発
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Reliability Design and Multi-mode Fracture Control of Micro Joint Structure in Advanced Electronics Packaging
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Optimization of multi-domain for crash safety design of vehiclePrincipal Investigator
- Principal Investigator
  
  QIANG Yu
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
金属間化合物を考慮したエレクトロニクスはんだ接合部の熱疲労強度
- Principal Investigator
  
  白鳥正樹
- Project Period (FY)
  2000 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
3点曲げ疲労試験によるCSPはんだ接合部の疲労信頼性評価に関する研究Principal Investigator
- Principal Investigator
  
  于強
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Study on Impact Strength Evaluation of Micro-Solder Joints in Mobile Electronic Units
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (B).
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Thermal Fatigue Life Estimation for Lead - Free Solder Joints
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1998 – 1999
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
金属-CFRP接着継手疲労き裂進展における接着剤粘弾性特性の影響に関する研究Principal Investigator
- Principal Investigator
  
  于強
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Development of Micro-displacement and low-load fatigue tester and fatigue-strength estimating method for micro structures
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
共晶Pb-Shはんだ材料のクリープ疲労のき裂伝ぱに関する研究Principal Investigator
- Principal Investigator
  
  于強
- Project Period (FY)
  1996
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
金属-CFRP接着継手の疲労強度評価に関する研究Principal Investigator
- Principal Investigator
  
  于強
- Project Period (FY)
  1995
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
Development of CAE System for Fatigue Strength Design of Solder Joints in Surface Mount Devices
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1995 – 1996
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
The Development of the System that Analyzes Surface Cracks by the Influence Function Method
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1995 – 1996
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Yokohama National University
DEVELOPMENT OF FLAW DETECTING SYSTEM BY INFRARED THERMOGRAPHY
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1993 – 1994
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  YOKOHAMA NATIONAL UNIVERSITY
STRENGTH EVALUATION OF THERMAL CYCLING FATIGUE FOR SURFACE-MOUNDED SOLDER JOINTS
- Principal Investigator
  
  SHIRATORI Masaki
- Project Period (FY)
  1993 – 1994
- Research Category
  
  Grant-in-Aid for Developmental Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  YOKOHAMA NATIONAL UNIVERSITY

All 2012 2011 2010 2007 2006 2005 2004 2001 Other

All Journal Article Presentation Book Patent

[Book] パワーデバイスの実装技術の研究動向2010
- Author(s)
  于強、山際正憲、安澤貴志
- Publisher
  株式会社エヌ・ティー・エス
- Data Source
  KAKENHI-PROJECT-22360047
[Book] パワーデバイスの実装技術の研究動向2010
- Author(s)
  干強、山際正憲、安澤貴志
- Publisher
  株式会社エヌ・ティー・エス
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] PWB Micro-Structural Influences over Drop Reliability in MobileDevices2010
- Author(s)
  Takayoshi Katahira, MasatoFujita, Qiang Yu
- Journal Title
  
  Journal of Solid Mechanics and MaterialsEngineering
  
  Volume: Vol.4 Pages: 24-28
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] PWB Micro-Structural Influences over Drop Reliability in Mobile Devices2010
- Author(s)
  Takayoshi Katahira, Masato, Fujita, Qiang Yu
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering
  
  Volume: Vo1.4 Pages: 24-28
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] Reliability Evaluation on Deterioration of Power Device Using Coupled Electrica1- Therma1-Mechanical Analysis2010
- Author(s)
  Takashi Anzawa, Qiang Yu, Masanori Yamagiwa Tadahiro Shibutani, Masaki Shiratori
- Journal Title
  
  Journal of Electronic Packaging(ASME JEP)
  
  Volume: 132
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] Reliability Evaluation on Deterioration of Power Device Using CoupledElectrical-Thermal-Mechanical Analysis2010
- Author(s)
  Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, TadahiroShibutani, Masaki Shiratori
- Journal Title
  
  Journal of Electronic Packaging(ASME JEP), 132, Iss.3 Selected Paper(ThETA2)
  
  Volume: v6.132, N.3 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360047
[Journal Article] Delamination Evaluation Approach for Bimaterial Structure Considering Interfacial Layer2007
- Author(s)
  Yu, Q.
- Journal Title
  
  Proceedings of ASME IMECE2007
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation Technique for The Failure Life Scatter of Lead-Free Solder Joints in Electronic Device2007
- Author(s)
  Miyauchi, H., Yu, Q., Shibutani, T., Shiratori, M
- Journal Title
  
  Proceedings of the THERMINIC 2007
  
  Pages: 32-37
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Low - cycle fatigue reliability evaluation for lead - free solders in vehicle electronics devices2007
- Author(s)
  Yu, Q., Shibutani, T., Tanaka, A. Koyama, T., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Low-cycle fatigue reliability evaluation for lead-free solders in vehicle electronics devices2007
- Author(s)
  Yu, Q.
- Journal Title
  
  Proceedings of ASME 2007 InterPack
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Study of the electrical contact resistance of multi-contact MEMS relays fabricated using the MetalMUMPs process2007
- Author(s)
  于強他4名
- Journal Title
  
  Journal of Micromechanics and Microengineering 16・-
  
  Pages: 1189-1194
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Mechanism of Damage Process on Si3N4/Cu Interface in Nanoscratch Test2007
- Author(s)
  Shibutani, T., Yu, Q, Shiratori, M., Akai, T
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering Vol.1, No.3
  
  Pages: 322-331
- NAID
  110004071282
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] A Study on Evaluation Technique for the Fatigue Life Scatter of Lead-Free Solder Joints2007
- Author(s)
  于強
- Journal Title
  
  Proceedings of ASME IMECE2007
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation Method of Interaction Relation between Design Factors And Simple Assessment Approach for BGA Package Reliability2007
- Author(s)
  Kondo, S., Yu, Q., Shibutani, T., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads2007
- Author(s)
  于強
- Journal Title
  
  Proceedings of Inter PACK 2007
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Delamination Evaluation Approach for Bimaterial Structure Considering Interfacial Layer2007
- Author(s)
  Yu, Q., Shibutani, T., Shiratori, M., Matsuzaki, T., Matsumoto, T
- Journal Title
  
  Proceedings of the 2007 ASME IMECE2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints2007
- Author(s)
  于強
- Journal Title
  
  Microelectronics Reliability 48
  
  Pages: 431-437
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads2007
- Author(s)
  Tosaka, A. Yu, Q., Shibutani, T., Kondo, S., Shiratori, M
- Journal Title
  
  Proceedings of ASME InterPACK2007
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls2007
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹
- Journal Title
  
  Journal of Electronic Packaging 129・1
  
  Pages: 71-75
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls2007
- Author(s)
  Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  Journal of Electronic Packaging Vol.129, No.1
  
  Pages: 71-75
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Stress Relaxation Method2006
- Author(s)
  Tanimura, T., Yu, Q., Shibutani, T., Jin, J.C., Shiratori, M
- Journal Title
  
  Proceedings of EMAP 2006
  
  Pages: 658-666
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard2006
- Author(s)
  Yu, Q., Shibutani, T., Kobayashi, Y., Shiratori, M
- Journal Title
  
  Proceedings of ITherm 2006
  
  Pages: 1024-1030
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Stress-Induced Tin Whisker Initiation Under Contact Loading2006
- Author(s)
  Shibutani, T., Yu, Q., Yamashita, T., Shiratori, M
- Journal Title
  
  IEEE Transactions on Electronics Packaging Manufacturing Vol.29, No.4
  
  Pages: 259-264
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test2006
- Author(s)
  Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  JSME International Journal, Series A Vol.49, No.3
  
  Pages: 397-402
- NAID
  110004999080
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Stress-Induced Tin Whisker Initiation Under Contact Loading2006
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹他1名
- Journal Title
  
  IEEE Transactions on Electronics Packaging Manufacturing 29・4
  
  Pages: 259-264
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Study of the electrical contact resistance of multi-contact MEMS relays fabricated using the MetaIMUMPs process2006
- Author(s)
  Almeid, L, Ramadoss, R., Jackson, R., Ishikawa, K., Yu, Q
- Journal Title
  
  Journal of Micromechanics and Microengineering Vol.16
  
  Pages: 1189-1194
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Easy reliability design approach for solder joint BGA package considering correlation of each design factor2006
- Author(s)
  Yu, Q., Shibutani, T., Jin, J.C., Kondo, S., Shiratori, M
- Journal Title
  
  Proceedings of ITherm 2006
  
  Pages: 900-905
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] 応力緩和法を用いたはんだの弾塑性・クリープ・粘塑性の物性値取得の効率化2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  エレクトロニクス実装学会誌 10・1
  
  Pages: 52-61
- NAID
  110006152001
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Easy reliability design approach for solder joint BGA package considering correlation of each design factor2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System
  
  Pages: 900-905
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Modeling with Structure of Resins in Electronic Components2006
- Author(s)
  Yu, Q
- Journal Title
  
  Proceedings of THERMINIC2006
  
  Pages: 107-111
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Low Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronic Devices2006
- Author(s)
  于強, 澁谷忠弘, 白鳥正樹他2名
- Journal Title
  
  Proc. of the New Methods of Damage and Failure Analysis of Structural Parts
  
  Pages: 103-110
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Tri-state multi-contact lateral MEMS relay with high mechanical reliability2006
- Author(s)
  Yamada, S., Ishikawa, K., Yu, Q., Ramadoss, R., Almeida, L
- Journal Title
  
  Proceedings of EMAP 2006
  
  Pages: 957-969
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Easy reliability design approach for solder BGA package considering correlation of each design factor2006
- Author(s)
  Yu, Q.
- Journal Title
  
  Proceedings of ITherm2006
  
  Pages: 900-905
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Study on Whisker Outbreak on Tin Plating by Contact Force2006
- Author(s)
  Yamashita, T., Shibutani, T., Yu, Q., Shiratori, M
- Journal Title
  
  Proceedings of the 2006 ASME IMECE2006
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard2006
- Author(s)
  Yu, Q.
- Journal Title
  
  Proceedings of ITherm2006
  
  Pages: 1024-1030
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] CAPアプローチを用いたコンセプト設計支援技術2006
- Author(s)
  于強他2名
- Journal Title
  
  自動車技術会No.06-06シンポジウム
  
  Pages: 1-3
- Data Source
  KAKENHI-PROJECT-18360055
[Journal Article] Modeling with Structure of Resins in Electronic Components2006
- Author(s)
  Yu, Q., Shibutani, T., Shiratori, M., Matsumoto, T
- Journal Title
  
  Proceedings of Therm 2006
  
  Pages: 107-111
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360056
[Journal Article] Mechanism of Damage Process on the Si3N4/Cu Interface in Nanoscratch Test2005
- Author(s)
  Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Takeshi Akai
- Journal Title
  
  Transactions of the JSME Vol.71, No.706
  
  Pages: 884-890
- NAID
  110004071282
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノインデンテーションクリープ試験による低融点材料の拡散クリープ特性評価2005
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹
- Journal Title
  
  日本機械学会論文集A編 71・710
  
  Pages: 1285-1291
- NAID
  110004999080
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] 実装信頼性評価・設計におけるシミュレーション技術とその応用2005
- Author(s)
  于強, 白鳥正樹
- Journal Title
  
  電子情報通信学会論文誌C J88-C・11
  
  Pages: 851-858
- NAID
  110003496097
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Thermal Fatigue Assessment of Lead - Free Solder Joints2005
- Author(s)
  Qiang Yu
- Journal Title
  
  Proc.of the International Workshop on Thermal Investigation of ICs and Systems
  
  Pages: 204-211
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers2005
- Author(s)
  Koji Ishikawa, Takahiro Miki, Hiroki Mamiya, Qiang Yu
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging Vol.8, No.2
  
  Pages: 108-115
- NAID
  110001845084
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead-free solder joints2005
- Author(s)
  Qiang Yu, Jae-Chul Jin, Do-Seop Kim, Masaki Shiratori
- Journal Title
  
  Materials Transactions 46・11
  
  Pages: 2316-2321
- NAID
  10016868672
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Extraction Method for Physical Principles and Application to Static Behavior of Vehicle Suspension System2005
- Author(s)
  Qiang Yu et al.
- Journal Title
  
  Review of Automotive Engineering 26・4
  
  Pages: 439-446
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] Simulation Technologies and Applications for Reliability Assessment and Design of Electronics Packaging2005
- Author(s)
  Qiang Yu, Masaki Shiratori
- Journal Title
  
  IEICE Transactions on Electronics Vol.J88-C, No.11
  
  Pages: 851-858
- NAID
  110003496097
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead-free solder joints2005
- Author(s)
  Qiang Yu, Jae-Chul Jin, Do-Seop Kim, Masaki Shiratori
- Journal Title
  
  Materials Transactions Vol.46, No.11
  
  Pages: 2316-2321
- NAID
  10016868672
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 実装信頼性評価・設計におけるシミュレーション技術とその応用2005
- Author(s)
  干強, 白鳥正樹
- Journal Title
  
  電子情報通信学会論文誌C Vol.J88-C・11
  
  Pages: 851-858
- NAID
  110003496097
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints2005
- Author(s)
  Jin, J.C., Yu, Q., Shibutani, T., Abe, H., Shiratori, M.
- Journal Title
  
  Key Engineering Materials 297-300
  
  Pages: 1822-1827
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers2005
- Author(s)
  石川浩嗣, 三木隆弘, 間宮宏樹, 干強
- Journal Title
  
  エレクトロニクス実装学会誌 8・2
  
  Pages: 108-115
- NAID
  110001845084
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead free solder joints2005
- Author(s)
  Yu, Q., Jin, J.C., Kim, D.S., Shiratori, M.
- Journal Title
  
  Materials Transactions 46・11
  
  Pages: 2316-2321
- NAID
  10016868672
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノスクラッチ試験によるSi3N4/Cu薄膜界面損傷機構2005
- Author(s)
  澁谷忠弘, 干強, 白鳥正樹, 赤井武志
- Journal Title
  
  日本機械学会論文集(A編) 71・706
  
  Pages: 884-890
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Early-Stage Analysis for MEMS Structural Optimization II : Its Application to Microrelay Reliability2005
- Author(s)
  Qiang Yu, et al.
- Journal Title
  
  Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (IPACK2005-73049)
  
  Pages: 1-6
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005
- Author(s)
  Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
- Journal Title
  
  Key Engineering Materials Vols.297-300
  
  Pages: 1822-1827
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005
- Author(s)
  Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
- Journal Title
  
  Key Engineering Materials 297-300
  
  Pages: 1822-1827
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] ナノスクラッチ試験によるSi_3N_4/Cu薄膜界面損傷機構2005
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹他
- Journal Title
  
  日本機械学会論文集A編 71・706
  
  Pages: 864-890
- NAID
  110004999024
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Study of Influence of the Design Factors on the Reliability of BGA Solder Joints2004
- Author(s)
  Yu, Q., Jin, J.C., Abe, H., Shiratori, M.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 343-349
- NAID
  110002489081
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints2004
- Author(s)
  Kim, D.S., Yu, Q., Shibutani, T., Sadakata, N, Inoue, T.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 325-329
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints2004
- Author(s)
  Jin, J.C., Yu, Q., Abe, H., Shiratori, M.
- Journal Title
  
  Proc.of the Asian Pacific Conference for Fracture and Strength (APCFS2004)
  
  Pages: 103-103
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] An Integrated AWG Multi/Demultiplexer with MEMS-VOA Shutters2004
- Author(s)
  Ishikawa, K., Yu, Q.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 523-528
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価2004
- Author(s)
  澁谷忠弘, 于強, 白鳥正樹, 鶴賀哲
- Journal Title
  
  材料別冊第53巻・第8号
  
  Pages: 850-855
- NAID
  110006266334
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Contribution to Car Frontal Frame Structure Design2004
- Author(s)
  M.Zatek, Z.Poruba, Yu, Q.
- Journal Title
  
  Proc.of the Third China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems(CJK OSM3)
  
  Pages: 239-244
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] Response Surface Method Using Hierarchical Clustering2004
- Author(s)
  Yusuke Kageyama, Qiang Yu
- Journal Title
  
  Transactions of the JSME Vol.70, No.695
  
  Pages: 953-961
- NAID
  110004998785
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価2004
- Author(s)
  澁谷忠弘, 干強, 白鳥正樹, 鶴賀哲
- Journal Title
  
  材料 53・8
  
  Pages: 850-855
- NAID
  110006266334
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The Examination of the Drop impact Test Method2004
- Author(s)
  Yu, Q., Watanabe, K., Tsurusawa, T., Shiratori, M., Kakino, M., Fujisawa, N.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 336-342
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Evaluation of Crack Initiation at the Corner of the Interface between Sub-Micron Films on the Basis of Fracture Mechanics Concept2004
- Author(s)
  Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Tetsu Tsuruga
- Journal Title
  
  J.Soc.Mat.Sci.Japan Vol.53, No.8
  
  Pages: 850-855
- NAID
  110006266334
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 階層的クラスタリングに基づく応答曲面法2004
- Author(s)
  影山雄介, 干強
- Journal Title
  
  日本機械学会論文集(A編) 70・695
  
  Pages: 953-961
- NAID
  110004998785
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] Evaluation of interface strength between thin films fabricated on a silicon substrate for mixed mode of fracture2004
- Author(s)
  Shibutani, T., Tsuruga, T., Yu, Q., Shiratori, M.
- Journal Title
  
  Proc.of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004)
  
  Pages: 192-198
- Data Source
  KAKENHI-PROJECT-16360049
[Journal Article] Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint2004
- Author(s)
  Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging Vol.7, No.2
  
  Pages: 161-169
- NAID
  110002525974
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] 鉛フリーはんだ接合部の応力・非線形ひずみ振幅評価に及ぼす硬化則の影響2004
- Author(s)
  金道燮, 干強, 澁谷忠弘, 白烏正樹
- Journal Title
  
  エレクトロニクス実装学会誌 7-2
  
  Pages: 161-169
- NAID
  110001235346
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15360048
[Journal Article] The Effect of Intermetalic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints2001
- Author(s)
  M. Shiratori, Qiang Yu and Do-seop Kim
- Journal Title
  
  APCFS & ATEM'01
  
  Pages: 935-940
- Data Source
  KAKENHI-PROJECT-12450046
[Journal Article] The Effect of Intermetallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints2001
- Author(s)
  Qiang Yu, Do-seop Kim and M. Shiratori
- Journal Title
  
  InterPACK'01
  
  Pages: 1-8
- Data Source
  KAKENHI-PROJECT-12450046
[Journal Article] 統計的設計支援システムを用いた有限要素法によるCSPパッケージの熱疲労信頼性評価2001
- Author(s)
  加賀靖久, 于強, 白鳥正樹
- Journal Title
  
  エレクトロニクス実装学会誌 4・3
  
  Pages: 225-230
- NAID
  110001238806
- Data Source
  KAKENHI-PROJECT-12450046
[Journal Article] 応答曲面法およびベイズ理論に基づく構造信頼性設計手法の提案2001
- Author(s)
  廣畑賢治, 于強, 白鳥正樹, 他
- Journal Title
  
  日本機械学会論文集A編 67・660
  
  Pages: 35-42
- NAID
  110002369928
- Data Source
  KAKENHI-PROJECT-12450046
[Journal Article] 機械構造部品の安全性設計・予防保全における信頼姓工学適用 4.電子部品実装における保証試験と信頼性評価2001
- Author(s)
  于強, 白鳥正樹
- Journal Title
  
  材料別冊 50・4
  
  Pages: 447-451
- Data Source
  KAKENHI-PROJECT-12450046
[Journal Article] BGAはんだ接合部の形状予測と残留応力評価2001
- Author(s)
  酒井秀久, 于強, 白鳥正樹, 他
- Journal Title
  
  エレクトロニクス実装学会誌 4・7
  
  Pages: 581-589
- NAID
  130004062879
- Data Source
  KAKENHI-PROJECT-12450046
[Patent] 製品熱疲労寿命検知センサー2011
- Inventor(s)
  于強, 高木寛二
- Industrial Property Rights Holder
  于強, 高木寛二
- Industrial Property Number
  2011-281467
- Filing Date
  2011-12-22
- Data Source
  KAKENHI-PROJECT-22360047
[Patent] 熱疲労寿命検知センサー2011
- Inventor(s)
  于強、高木寛二
- Industrial Property Rights Holder
  共有
- Industrial Property Number
  2011-281467
- Filing Date
  2011-12-22
- Data Source
  KAKENHI-PROJECT-22360047
[Patent] 小型熱衝撃試験機2010
- Inventor(s)
  干強、臼井重徳、篠原俊朗、八坂慎一、篠原主勲
- Industrial Property Rights Holder
  共有
- Filing Date
  2010-07-28
- Data Source
  KAKENHI-PROJECT-22360047
[Patent] 小型熱衝撃試験機2010
- Inventor(s)
  于強、臼井重徳、篠原俊朗、八坂慎一、篠原主勲
- Industrial Property Rights Holder
  共有
- Filing Date
  2010-07-28
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Effect of crystal grain size on fatigue characteristics of lead free solder joints2012
- Author(s)
  T. Akutsu, Q. Yu
- Organizer
  New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  オストラバ（チェコ）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A study on Evaluation Method of New Packaging Structure for High-Temperature Power Device2012
- Author(s)
  Akihiro Higuchi, Qiang Yu, Toshikaza Oshidari, Mingliang Cui
- Organizer
  EMAP2012
- Place of Presentation
  香港（中国）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Effect of crystal grain size on fatigue characteristics of lead free solder joints2012
- Author(s)
  T,Akutsu, Q. Yu
- Organizer
  Proc. of New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  Ostrava(Czech)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Evaluation of Thermal Deformation of the Sealing Resin Considering the Effect of Curing Process on Mechanical Property2012
- Author(s)
  Y. Yoshida, Q. Yu
- Organizer
  New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  オストラバ（チェコ）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Precision Evaluation for Thermal Fatigue Life in Power Cycling Using Coupled Electrica1-Therma1-Structural Analysis2012
- Author(s)
  T,Takahashi, Q. Yu
- Organizer
  Proc. of New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  0strava(Czech)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on the Thermal Fatigue Evaluation of Ni Plating in SiC2012
- Author(s)
  A. Hirose, Q Yu, T. Ishikawa
- Organizer
  New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  オストラバ（チェコ）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrical-Thermal-Mechanical Analysis2012
- Author(s)
  Yasutaka Yamada, Qiang Yu, Tomohiro Takahashi, Yusuke Takagi
- Organizer
  EMAP2012
- Place of Presentation
  香港（中国）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Precision Evaluation for Thermal Fatigue Life in Power Cycling Using Coupled Electrical-Thermal-Structural Analysis2012
- Author(s)
  T. Takahashi, Q. Yu
- Organizer
  New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  オストラバ（チェコ）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on Evaluation Method of new Packaging Structure for High-Temperature Power Device2012
- Author(s)
  Akihiro Higuchi, Qiang Yu, Toshikazu Oshidari, Mingliang Cui
- Organizer
  EMAP2012
- Place of Presentation
  HongKong(China)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Investigation of Thermal Fatigue Life Scatter of IVH in PWB2012
- Author(s)
  Kunihiro Takenaka, Qiang Yu
- Organizer
  Itherm2012
- Place of Presentation
  サンディエゴ（米国）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition2012
- Author(s)
  Tomohiko Takeda, Qiang Yu, Hiroyuki Sato
- Organizer
  Itherm2012
- Place of Presentation
  サンディエゴ（米国）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Evaluation of Thermal Deformation of the Sealing Resin Considering the Effect of Curing Process on Mechanical Property2012
- Author(s)
  Y. Yoshida, Q. Yu
- Organizer
  Proc. of New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  Ostrava(Czech)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on the Thermal Fatigue Evaluation of Ni Plating in SiC2012
- Author(s)
  A. Hirose, Q Yu, T. Ishikawa
- Organizer
  Proc. of New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  Ostrava(Czech)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliable Evaluation Method for Solder Joints in Vehicle Electronics Devices Considering the Actual Use Conditions2012
- Author(s)
  Satoru Okuyama, Qiang Yu, Ttakahiro Akutsu
- Organizer
  Itherm2012
- Place of Presentation
  SanDiego(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrica1-Therma1-Mechanical Analysis2012
- Author(s)
  Yasutaka Yamada, Qiang Yu, Tomohiro, Takahashi, Yusuke Takagi
- Organizer
  EMAP2012
- Place of Presentation
  HongKong(China)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Investigation of Thermal Fatigue Life Scatter of IVH in PWB2012
- Author(s)
  Kunihiro Takenaka, Qiang Yu
- Organizer
  Itherm2012
- Place of Presentation
  San Diego(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on Reliability of Nano-Metal Pastes in High Temperature Resistant of Power Devices2012
- Author(s)
  M.Cui, T. Oshidari, Q. Yu
- Organizer
  New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  オストラバ（チェコ）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliable Evaluation Method for Solder Joints in Vehicle Electronics Devices Considering the Actual Use Conditions2012
- Author(s)
  Satoru Okuyama, Qiang Yu, Takahiro Akutsu
- Organizer
  Itherm2012
- Place of Presentation
  サンディエゴ（米国）
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on Reliability of Nano-Metal Pastes in High Temperature Resistant of Power Devices2012
- Author(s)
  M,Cui, T. Oshidari, Q. Yu
- Organizer
  Proc. of New Methods of Damage and Failure Analysis of Structural Parts
- Place of Presentation
  0strava(Czech)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition2012
- Author(s)
  Tomohiko Takeda, Qiang Yu, Hiroyuki Sato
- Organizer
  Itherm2012
- Place of Presentation
  San Diego(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints2011
- Author(s)
  Takahiro Akutsu, Qiang Yu
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-06
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties2011
- Author(s)
  Yuji Nishimura, Qiang Yu
- Organizer
  InterPACK2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue life of Solder Joint in Power-Devices2011
- Author(s)
  Shiqiang Zhao, Qiang Yu, Akaeda Hiroki
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-08
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on the Thermal Defo rmation and the Mechanical Propertie s due to Curing Process Of the Encap sulation Resin2011
- Author(s)
  Sato Hiroyuki, Qiang Yu, Sone, Ryusuke
- Organizer
  InterPACK2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition and Effects on Package2011
- Author(s)
  Tomohiko Takeda, Qiang Yu
- Organizer
  EPTC2011
- Place of Presentation
  シンガポール
- Year and Date
  2011-12-07
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis2011
- Author(s)
  Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-08
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions2011
- Author(s)
  Liu Shilin, Qiang Yu, Michael Pecht
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-07
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Measureme nt Methods for Curing Properties of Resin Considering Process Condition and Effects on Package2011
- Author(s)
  Tomohiko Takeda, Qiang Yu
- Organizer
  EPTC2011
- Place of Presentation
  Singapore
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints2011
- Author(s)
  Takahiro Akutsu, Qiang Yu
- Organizer
  InterPACK2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Masahi ro Kobayashi, Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrica1- Therma1-Structural Analysis2011
- Author(s)
  Tomohiro Takahashi, Qiang Yu
- Organizer
  InterPA CK2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Toshikazu Oshidari, Hiromi Sugihara, A Study on Reliability of High-Temperature Joint in Pack aging Structure2011
- Author(s)
  Takayuki lshikawa, Qiang Yu
- Organizer
  InterPACK2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions2011
- Author(s)
  Liu Shilin, Qiang Yu, Michae1 Pecht
- Organizer
  InterPAC K2011
- Place of Presentation
  San Francisco(USA)
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on Reliability of High-Temperature Joint in Packaging Structure2011
- Author(s)
  Takayuki Ishikawa, Qiang Yu, Toshikazu Oshidari, Hiromi Sugihara
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-07
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin2011
- Author(s)
  Sato Hiroyuki, Qiang Yu, Sone Ryusuke
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-08
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties2011
- Author(s)
  Yuji Nishimura, Qiang Yu
- Organizer
  InterPACK2011
- Place of Presentation
  ポートランド・アメリカ
- Year and Date
  2011-07-08
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Astudy on reliability of NI plating in a high temperature power device2010
- Author(s)
  Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, QiangYu
- Organizer
  ITherm2010
- Place of Presentation
  ラスベガス・アメリカ
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead FreeSolder Joints2010
- Author(s)
  Takahiro AKUTSU, Qiang YU, Yuji
- Organizer
  EPTC2010
- Place of Presentation
  シンガポール
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Characteristics and mechanism of surface roughness generated insubstrate used for vehicle power device2010
- Author(s)
  H.AKAEDA, Q.Yu
- Organizer
  New Methods of damage and Failure Analysis ofStructural Parts
- Place of Presentation
  オストラバ・.チェコ
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Precision Evaluation for Thermal Fatigue Life of Power Module using Coupled Electrical-Thermal-Mechanical Analysis2010
- Author(s)
  Tomohiro TAKAHASHI, Qiang YU
- Organizer
  EPTC2010
- Place of Presentation
  シンガポール
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation for Specifying Fatigue Mode in Power Device2010
- Author(s)
  M,Kobayashi, Q. Yu
- Organizer
  THERMINIC2010
- Place of Presentation
  Macao
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Reliability Evaluation for Specifying Fatigue Mode in Power Device2010
- Author(s)
  M.Kobayashi, Q.Yu
- Organizer
  THERMINIC2010
- Place of Presentation
  バルセロナ・スペイン
- Year and Date
  2010-10-08
- Data Source
  KAKENHI-PROJECT-22360047
[Presentation] Elastic-lastic-reep Analysis of Sn-3.0Ag-0.5Cu Solder Joints
- Author(s)
  Yasuhiro, Ejiri, Hiroshi, Minami, Toshihiko, Sayama, Takeshi, Takayanagi, Yoshiyuki, Okamoto, Takao, Mon
- Organizer
  JSME 20th Computational Mechanics Conference
- Place of Presentation
  Ritsumeikan University Kyotanabe
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17560075

1. SHIRATORI Masaki (60017986)

# of Collaborated Projects: 16 results

# of Collaborated Products: 48 results
2. SHIBUTANI Tadahiro (10332644)

# of Collaborated Projects: 7 results

# of Collaborated Products: 35 results
3. OGASAWARA Nagahisa (60262408)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
4. TAKADA Hajime (20154792)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. MORI Takao (30275078)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. KOBAYASHI Hayato

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. OKUMOTO Hiroshi

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

YU Qiang 于 強

干 強 ウ キョウ

Research Projects

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Co-Researchers

A Study on education system for packaging reliability of next generation Sic power device.Principal Investigator

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Advanced Assessment Methodology of Lead-free Solder Joints under Multi-loads in Three-dimensional Electronic PackagingPrincipal Investigator

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Integrated Reliability Evaluation and Design for Advanced 3D Electronics PackagingPrincipal Investigator

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Optimization of multi-domain for crash safety design of vehiclePrincipal Investigator

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3点曲げ疲労試験によるCSPはんだ接合部の疲労信頼性評価に関する研究Principal Investigator

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金属-CFRP接着継手疲労き裂進展における接着剤粘弾性特性の影響に関する研究Principal Investigator

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YU Qiang 于強

干強ウキョウ