KIM Keun-soo 金槿銖

Researcher Number	90304857
External Links
Affiliation (based on the past Project Information) *help	2011: 大阪大学, 産業科学研究所, 助教 2007 – 2009: 大阪大学, 産業科学研究所, 助教 2008: 大阪大学, 産業科学研究所, 助手 2005 – 2006: 大阪大学, 産業科学研究所, 特任助手
Review Section/Research Field	Except Principal Investigator Material processing/treatments / Metal making engineering
Keywords	Except Principal Investigator 微細接続 / 高密度実装 / 金属物性 / 信頼性 / 宇宙機器 / 酸化 / 真空 / 温度サイクル / ウィスカ / 電気接続・配線 / 配線 / インクジェット / ナノ材料

Tin whisker growth mechanism in aerospace electronics and its mitigation
- Principal Investigator
  
  SUGANUMA Katsuaki
- Project Period (FY)
  2009 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Synthesis of mono-dispersed metallic nanoparticles and its application to electronics wiring
- Principal Investigator
  
  SUGANUMA Katsuaki
- Project Period (FY)
  2005 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Metal making engineering
- Research Institution
  Osaka University

All 2012 2011 2010 2009 2008 2007 2006 2005

All Journal Article Presentation Book

[Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2009インクジェット技術大全」2008
- Author(s)
  菅沼克昭、金槿銖、和久田大介
- Publisher
  電子ジャーナル
- Data Source
  KAKENHI-PROJECT-17206077
[Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2007インクジェット技術大全」2007
- Author(s)
  菅沼克昭、金槿銖、和久田大介
- Publisher
  電子ジャーナル
- Data Source
  KAKENHI-PROJECT-17206077
[Book] Electronic Journal別冊「2007インクジェット技術大全」、電子回路形成への応用(分担執筆)2007
- Author(s)
  菅沼克昭、和久田大介、金槿銖
- Publisher
  電子ジャーナル
- Data Source
  KAKENHI-PROJECT-17206077
[Book] インクジェットプリンターの応用と材料II 第17章インクジェット技術による金属ナノ粒子インク配線(分担執筆)2007
- Author(s)
  菅沼克昭、和久田大介、金槿銖
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-17206077
[Book] インクジェット技術による金属ナノ粒子インク配線(分担執筆)、インクジェットプリンターの応用と材料II2007
- Author(s)
  菅沼克昭、和久田大介、金槿銖
- Publisher
  CMC出版
- Data Source
  KAKENHI-PROJECT-17206077
[Book] Printed Electronicsのためのナノ粒子微細配線技術2006
- Author(s)
  河染満、金槿銖、畑村眞里子、菅沼克昭
- Publisher
  粉砕
- Data Source
  KAKENHI-PROJECT-17206077
[Book] 金属ナノ粒子ペーストと微細配線技術(分担執筆)、導電性ナノフィラーと応用製品2005
- Author(s)
  菅沼克昭、金槿銖
- Publisher
  CMC出版
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/ Cu ball joints2012
- Author(s)
  K. Lee, K.-S. Kim, K. Suganuma, Y . Tsukada, K.Yamanaka, S. Kuritani, M. Ueshima
- Journal Title
  
  J.Mater.Res
  
  Volume: 26[3] Pages: 467-474
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Sn whisker growth during thermal cycling2011
- Author(s)
  K. Suganuma, A. Baated, K. -S. Kim, K.Hamasaki, N. Nemoto, T . Nakagawa, T . Yamada
- Journal Title
  
  Acta Materialia
  
  Volume: 59[1] Pages: 7255-7267
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Effect of i ntermetallic growth rate on spontaneous whisker growth from a t in coating on copper2011
- Author(s)
  A. Baated, K.-S. Kim, K. Suganuma
- Journal Title
  
  J. Mater. Sci.Mater. Electron.
  
  Volume: 22 Issue: 11 Pages: 1685-1693
- DOI
  10.1007/s10854-011-0346-5
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Whiskergrowth behavior of Sn and Sn alloy lead-free finishes2011
- Author(s)
  A. Baated, K.-S. Kim, K. Suganuma
- Journal Title
  
  J. Electron. Mater.
  
  Volume: 40[11] Pages: 2278-2289
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Influence of crystallographic orientation of Sn-Ag- Cu on electromigration in flip-chip joint2011
- Author(s)
  K. Lee, K.-S. Kim, K. Suganuma
- Journal Title
  
  Microelectron. Reliab.
  
  Volume: 51[12] Pages: 2290-2297
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Influence of indium addition on electromigration behavior of solder joint2011
- Author(s)
  K. Lee, K.-S. Kim, K. Suganuma
- Journal Title
  
  J. Mater. Res.
  
  Volume: 26[20] Pages: 2624-2631
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint2011
- Author(s)
  K.Lee, K.-S.Kim, K.Suganuma
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 51[12] Pages: 2290-2297
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Whisker growth behavior of Sn and Sn alloy lead-free finishes2011
- Author(s)
  A.Baated, K.-S.Kim, K.Suganuma
- Journal Title
  
  J.Electron.Mater.
  
  Volume: 40[11] Issue: 11 Pages: 2278-2289
- DOI
  10.1007/s11664-011-1712-z
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints2011
- Author(s)
  K.Lee, K.-S.Kim, K.Suganuma, Y.Tsukada, K.Yamanaka, S.Kuritani, M.Ueshima
- Journal Title
  
  J.Mater.Res.
  
  Volume: 26[3] Pages: 467-474
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders2010
- Author(s)
  A. Baated, K.- S. Kim, K. Suganuma, S. Huang, B.Ju rcik , S. Nozawa, M. Ueshima
- Journal Title
  
  J. Mater. Sci. Mater. Electron.
  
  Volume: 21 Pages: 1066-1075
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Whisker growth from an e lectroplated zinc coating2010
- Author(s)
  A. Baated, K. -S. Kim, K. Suganuma
- Journal Title
  
  J. Mater. Res.
  
  Volume: 25[11] Pages: 2175-2182
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] 錫ウィスカ成長に及ぼす端子材の影響2010
- Author(s)
  金槿銖,菅沼克昭,寄門雄飛,李奇柱,阿龍恒,辻本雅宣
- Journal Title
  
  銅と銅合金
  
  Volume: 49 Pages: 122-115
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] 錫ウィスカ成長に及ぼす端子材の影響2010
- Author(s)
  金槿銖, 菅沼克昭, 寄門雄飛, 李奇柱, 阿龍恒, 辻本雅宣
- Journal Title
  
  銅と銅合金
  
  Volume: 49 Pages: 112-115
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Whisker growth from an electroplated zinc coating2010
- Author(s)
  A.Baated, K.S.Kim, K.Suganuma
- Journal Title
  
  J.Mater.Res.
  
  Volume: 25[11] Pages: 2175-2182
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] 錫ウィスカ抑制技術2010
- Author(s)
  金槿銖, 菅沼克昭
- Journal Title
  
  生産と技術
  
  Volume: 62[3] Pages: 16-19
- NAID
  40017219420
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] 錫ウィスカ抑制技術2010
- Author(s)
  金槿銖、菅沼克昭
- Journal Title
  
  生産と技術
  
  Volume: Vol.62、No.3 Pages: 16-19
- NAID
  40017219420
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246109
[Journal Article] Room Temperature Sintering Process of Ag Nanoparticles Paste and its Conditions2009
- Author(s)
  D. Wakuda, K.-S. Kim, K. Suganuma
- Journal Title
  
  Conditions, IEEE Trans.CPMT (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Room Temperature Sintering Process of Ag Nanoparticle Paste2009
- Author(s)
  D. Wakuda, K. -S. Kim, K. Suganuma
- Journal Title
  
  IEEE Transactions on Components and Packaging Technologies (未定)(印刷中)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Preparation of Ag nanorods with high yield by polyol process2009
- Author(s)
  J.T. Jiu, K. Murai, D.-S. Kim, K.-S. Kim, K. Suganuma
- Journal Title
  
  Materials Chemistry and Physics 114
  
  Pages: 333-338
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] インクジェット技術による製造革新2008
- Author(s)
  菅沼克昭, 和久田大介, 金槿銖
- Journal Title
  
  月刊ディスプレイ 14[6]
  
  Pages: 41-47
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent2008
- Author(s)
  D. Wakuda, K.-S. Kim, K. Suganuma
- Journal Title
  
  IEEE Polytronic 2008 Conference Garmisch-Partenkirchen, Germany, August
  
  Pages: 17-20
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Room temperature sintering of Ag nanoparticles by drying of the solvent2008
- Author(s)
  D. Wakuda, K. -S. Kim, K. Suganuma
- Journal Title
  
  Scripta Materialia 59
  
  Pages: 649-652
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Room temperature sintering of Ag nanoparticles by drying of the solvent2008
- Author(s)
  D. Wakuda, K.-S. Kim, K. Suganuma
- Journal Title
  
  Scripta Materialia 59[6]
  
  Pages: 649-652
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] 常温焼結Ag粒子ペーストの性質と常温接合2008
- Author(s)
  和久田大介, 金槿銖, 菅沼克昭
- Journal Title
  
  エレクトロニクス実装学会 (MES2008)
  
  Pages: 147-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] インクジェット技術による製造革新2008
- Author(s)
  菅沼克昭、和久田大介、金槿銖
- Journal Title
  
  月刊ディスプレイ 14[6]
  
  Pages: 41-47
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent2008
- Author(s)
  D. Wakuda, K. -S. Kim, K. Suganuma
- Journal Title
  
  Proc. IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen, Germany
  
  Pages: 17-20
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] 常温焼結Ag粒子ペーストの性質と常温接合2008
- Author(s)
  和久田大介, 金槿銖, 菅沼克昭
- Journal Title
  
  エレクトロニクス実装学会マイクロエレクトロシンポジウム2008論文集 18
  
  Pages: 147-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Low Temperature Printing Wiring with Ag Salt Pastes2006
- Author(s)
  M.Kawazome, K.Suganuma, M.Hatamura, K.-S.Kim, S.Horie, A.Hirasawa, H.Tanaami
- Journal Title
  
  39th International Symposium on Microelectronics (IMAPS2006)
  
  Pages: 1050-1055
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Tanaami, Low Temperature Printing Wiring with Ag Salt Pastes, 39th International Symposium on Microelectronics(IMAPS2006), Bringing Together the Entire Microelectronics Supply Chain!2006
- Author(s)
  M. Kawazome, K. Suganuma, M. Hatamura, K.-S. Kim, S. Horie, A. Hirasawa, H. Tanaami
- Journal Title
  
  San Diego October 8-12
  
  Pages: 1050-1055
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17206077
[Journal Article] Printed Electronicsのためのナノ粒子微細配線技術2006
- Author(s)
  河染満, 金槿銖, 畑村眞里子, 菅沼克昭
- Journal Title
  
  粉砕 50
  
  Pages: 27-31
- NAID
  130007495280
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling2011
- Author(s)
  J.-L.Jo, K.-S.Kim, K.Suganuma
- Organizer
  MS&T 2011, TMS
- Place of Presentation
  米国オハイオ
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling2011
- Author(s)
  J.-L. Jo, K.-S. Kim, K. Suganuma
- Organizer
  MS&T 2011, Ohio USA
- Place of Presentation
  Ohio, USA
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Electromigration behavior of Sn-In lead-free solder alloy under high current stress2011
- Author(s)
  K. Lee, K.-S. Kim, K. Suganuma
- Organizer
  2011 TMS Annual Meeting & Exhibition
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Whisker growth behavior in a high vacuum with thermal cycling2011
- Author(s)
  K.S.Kim, J.L.Jo, K.Lee, A.Baated, K.Suganuma
- Organizer
  2011 TMS Annual Meeting
- Place of Presentation
  San Diego, USA(招待)
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Whisker growth behavior in a high vacuum with thermal cycling2011
- Author(s)
  K.-S. Kim, J.-L. Jo, K.-J. Lee, A. Baated, K.Suganuma, N. Nemoto, T. Nakagawa, Toshiyuki Yamada
- Organizer
  2011 TMS Annual Meeting & Exhibition
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] 亜鉛ウィスカの発生及びそのメカニズム2010
- Author(s)
  阿龍恒, 金槿銖, 菅沼克昭
- Organizer
  エレクトロニクス実装学会
- Place of Presentation
  芝浦工業大学(東京都)
- Year and Date
  2010-03-10
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Intermetallic growth rate effects on spontaneous whisker growth from Tin coating on Copper2010
- Author(s)
  A.Baated, K.S.Kim, K.Suganuma
- Organizer
  International Conference on Electronics Packaging
- Place of Presentation
  札幌
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Tin Whisker Growth in Vacuum Thermal Cycling2010
- Author(s)
  K.Suganuma, A.Baated, S.Kim, K.S.Kim, N.Nemoto, T.Nakagawa, T.Yamada
- Organizer
  139th TMS Annual Meeting & Exhibition
- Place of Presentation
  シアトル(アメリカ)
- Year and Date
  2010-02-15
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] 錫ウィスカ成長に及ぼす端子材の影響2009
- Author(s)
  金槿銖, 李奇柱, アローハン, 濱崎恭子, 菅沼克昭, 辻本雅宣, 寄門雄飛
- Organizer
  第49回銅及び銅合金技術研究会講演大会
- Place of Presentation
  京都テルサ(京都府)
- Year and Date
  2009-11-11
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Room temperature whiskers, thermal cycling whiskers and alloying effects2009
- Author(s)
  K. Suganuma, K.S. Kim, Y. Shimada, K. Yamamoto, T. Kudoh, N. Nakamura, H. Oshima, S. Hayashi
- Organizer
  3rd International Symposium on Tin Whiskers
- Place of Presentation
  Lyngby
- Year and Date
  2009-06-23
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Snウィスカ成長に及ぼすSnめっき構造と表面コート層の影響2009
- Author(s)
  金槿銖, 濱崎恭子, 李奇柱, アローハン, 菅沼克昭, 辻本雅宣
- Organizer
  マイクロエレクトロニクスシンポジウム(MES2009)
- Place of Presentation
  福岡大学(福岡県)
- Year and Date
  2009-09-10
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] 常温焼結Ag粒子ペーストを用いた低温接合の検討2009
- Author(s)
  和久田大介, 金槿銖, 菅沼克昭
- Organizer
  エレクトロニクス実装学会
- Place of Presentation
  横浜
- Year and Date
  2009-03-12
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Room Temperature Whiskers, Thermal cycling Whiskers and Alloying Effects2009
- Author(s)
  K.Suganuma, K.S.Kim, Y.Shimada, K.Yamamoto, T.Kudoh, N.Nakamura, H.Oshima, S.Hayashi
- Organizer
  3^<rd> International Symposium on Tin Whiskers
- Place of Presentation
  リンビー(デンマーク)
- Year and Date
  2009-06-23
- Data Source
  KAKENHI-PROJECT-21246109
[Presentation] Synthesis of Ag nanorods and application to soft die attaching2008
- Author(s)
  J. Jiu, K. Murai, K.S. Kim, K. Suganuma
- Organizer
  7th IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics
- Place of Presentation
  Germany
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Room Temperature Sintering Mechanism of Ag Nanoparticle Paste2008
- Author(s)
  Daisuke Wakuda, Chang-Jae Kim, Keun-Soo Kim, Katsuaki Suganuma
- Organizer
  IEEE 2nd Electronics System-Integration Technology Conference
- Place of Presentation
  ロンドン
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure2008
- Author(s)
  S. S. Kim, K.-S. Kim, K. Suganuma, H. Tanaka
- Organizer
  2nd Electronics System-Integration Technology Conference(ESTC 2008), University of Greenwich
- Place of Presentation
  London, UK
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Room Temperature Sintering Mechanism of Ag Nanoparticle Paste2008
- Author(s)
  D. Wakuda, C.-J. Kim, K.-S. Kim, and K. Suganuma
- Organizer
  IEEE 2nd Electronics System-Integration Technology Conference
- Place of Presentation
  Greenwich, UK
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent2008
- Author(s)
  D. Wakuda, K.-S. Kim, K. Suganuma
- Organizer
  IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen
- Place of Presentation
  Germany
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Large-sacel synthesis of micrometer-scale single-crystal gold nanosheets by polyol process2008
- Author(s)
  J. Jiu, K. Suganuma, K.-S. Kim, T. Nemoto, T. Ogawa, S. Isoda
- Organizer
  2008 International Materials Research Conference
- Place of Presentation
  Chongqing, China
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent2008
- Author(s)
  D. Wakuda, K. -S. Kim, K. Suganuma
- Organizer
  IEEE Polytronic 2008 Conference
- Place of Presentation
  Garmisch-Partenkirchen
- Data Source
  KAKENHI-PROJECT-17206077
[Presentation] Low Temperature Printing Wiring with Ag Salt Pastes2006
- Author(s)
  M. Kawazome, K. Suganuma, M. Hatamura, K.-S. Kim, S. Horie, A. Hirasawa, and H. Tanaami
- Organizer
  39th International Symposium on Microelectronics (IMAPS2006), Bringing Together the Entire Microelectronics Supply Chain!
- Place of Presentation
  San Diego
- Data Source
  KAKENHI-PROJECT-17206077

1. SUGANUMA Katsuaki (10154444)

# of Collaborated Projects: 2 results

# of Collaborated Products: 58 results
2. INOUE Masahiro (60291449)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 山口俊郎 (40167698)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. NEMOTO Norio

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
5. NAKAGAWA Tsuyoshi

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results

KIM Keun-soo 金 槿銖

Research Projects

Research Products

Co-Researchers

Tin whisker growth mechanism in aerospace electronics and its mitigation

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Synthesis of mono-dispersed metallic nanoparticles and its application to electronics wiring

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2009インクジェット技術大全」2008

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Data Source

[Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2007インクジェット技術大全」2007

Author(s)

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Data Source

[Book] Electronic Journal別冊「2007インクジェット技術大全」、電子回路形成への応用(分担執筆)2007

Author(s)

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Data Source

[Book] インクジェットプリンターの応用と材料II 第17章インクジェット技術による金属ナノ粒子インク配線(分担執筆)2007

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[Book] インクジェット技術による金属ナノ粒子インク配線(分担執筆)、インクジェットプリンターの応用と材料II2007

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[Book] Printed Electronicsのためのナノ粒子微細配線技術2006

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[Book] 金属ナノ粒子ペーストと微細配線技術(分担執筆)、導電性ナノフィラーと応用製品2005

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[Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/ Cu ball joints2012

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[Journal Article] Sn whisker growth during thermal cycling2011

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[Journal Article] Effect of i ntermetallic growth rate on spontaneous whisker growth from a t in coating on copper2011

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DOI

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[Journal Article] Whiskergrowth behavior of Sn and Sn alloy lead-free finishes2011

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[Journal Article] Influence of crystallographic orientation of Sn-Ag- Cu on electromigration in flip-chip joint2011

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[Journal Article] Influence of indium addition on electromigration behavior of solder joint2011

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[Journal Article] Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint2011

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[Journal Article] Whisker growth behavior of Sn and Sn alloy lead-free finishes2011

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DOI

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[Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints2011

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KIM Keun-soo 金槿銖