Miura Hideo 三浦英生

… Alternative Names

MIURA Hideo 三浦英生

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Researcher Number	90361112
Other IDs
External Links
Affiliation (Current)	2025: 島根大学, 学術研究院機能強化推進学系, 特任教授
Affiliation (based on the past Project Information) *help	2016 – 2023: 東北大学, 工学研究科, 教授 2021: 東北大学, 工学(系)研究科(研究院), 教授 2015 – 2016: 東北大学, 工学(系)研究科(研究院), 教授 2012 – 2013: 東北大学, 大学院工学研究科, 教授 2012 – 2013: 東北大学, 工学(系)研究科(研究院), 教授 … More 2007 – 2012: 東北大学, 大学院・工学研究科, 教授 2005 – 2006: 東北大学, 大学院工学研究科, 教授 2004 – 2005: 東北大学, 大学院・工学研究科, 教授 Less
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials / Basic Section 18010:Mechanics of materials and materials-related / Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields / Basic Section 18010:Mechanics of materials and materials-related / Mechanics of materials, Production engineering, Design engineering, and related fields Except Principal Investigator Materials/Mechanics of materials / Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields / Electron device/Electronic equipment / Science and Engineering
Keywords	Principal Investigator クリープ疲労損傷 / 電子線後方散乱回折 / 高温強度 / 機械材料・材料力学 / 材料設計 / 原子配列の秩序性 / 構造・機能材料 / 非破壊検査 / 粒界割れ / 解析・評価 … More / ナノマイクロ材料力学 / グラフェン / 原子拡散 / 信頼性 / 結晶粒界品質 / プロセス / 電子デバイス・機器 / ひずみ / 評価 / 物性 / 転移密度 / Intergranular cracking / EBSD Analysis / Creep-fatigue Damage / Heat-resistant Alloy / Strength of Materials / 結晶品質 / 歪み / 界面制御 / バイオセンサ / 分子吸着 / 原子配列の秩序生 / 電子線後方散乱解析 / クリープ疲労 / 高音強度 / 材料強度信頼性 / 原子配列秩序性 / 初期損傷評価 / 長寿命化 / 表面・界面物性 / 材料損傷 / 微小強度試験 / 可視光反射スペクトル / マイクロスケール強度試験 / 応力依存原子拡散 / 微細強化組織 / 耐熱合金 / グラフェンナノリボン / 第一原理解析 / フレキシブル基板 / ひずみセンサ / 物性・評価 / Nano-positioning / Nano-scale Measurement / Semiconductor / Nano-Indentation / Analysis of Atomic Structure / Thin Film / Reliability / Strength of nano-scale materials / 強度物性 / ナノポジショニング / ナノ計測 / 半導体 / ナノインデンテーション / 原子構造解析 / 薄膜 / ナノ強度物性 / 電子顕微鏡 / 電気・電子材料 / マイクロ・ナノデバイス / 劣化損傷 / めっき銅薄膜配線 / 薄膜デバイス / 結晶粒界 / 電子線回折 / 物性評価 / 健全性 / 界面 / 機械材料 / 電気伝導 / マイクロマシン / ナノチューブ・フラーレン / 物性理論 / リモートセンシング / 第一原理 / 分子動力学 / カーボンナノチューブ / 計測 … More Except Principal Investigator TBC / ひずみ / CNT-グラフェン複合構造 / バイオセンサ / ガスセンサ / ひずみ制御 / グラフェン / Thermally grown oxide / bond coat interface / Nano-structure / Thermal Barrier Coating / Ni base superalloy / Degradation / Gas turbine / 熱遮蔽コーティング / 熱成長酸化物 / ボンドコート界面 / ナノ組織 / 熱遮へいコーティング / Ni基超合金 / 経年劣化 / ガスタービン / 光電子集積システム・オン・チップ / シリコン貫通配線 / スーパーチップ / 光電子集積化 / 三次元集積化 / セルフアセンブリー / グラフォアセンブリー / 低電圧駆動 / 温度補償 / 静電駆動 / マイクロミラー / MEMSアクチュエータ / マイクロ・ナノデバイス / マイクロマシン / 酸化則の応力依存性 / 長寿命化 / 原子力エネルギー / 計算物理 / 表面・界面物性 / 機械材料・材料力学 / 酸化則の応力依存症 / 量子化学分子動力学 / 粒界 / 酸化特性評価 / 軽水炉発電プラント / 応力腐食割れ Less

Clarification of the Degradation Mechanism of the Strength of Heat-Resistant Alloys under Random Creep-Fatigue Load at Elevated TemperaturePrincipal Investigator
- Principal Investigator
  
  三浦英生
- Project Period (FY)
  2023
- Research Category
  
  Grant-in-Aid for JSPS Fellows
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Tohoku University
Quantitative Evaluation of residual life of heat-resistant alloy under random creep-fatigue loadings at elevated temperaturePrincipal Investigator
- Principal Investigator
  
  Miura Hideo
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Tohoku University
Construction of Production Base of Strain-Controlled Graphene Nanoribbon-Base Bio-Sensor for Detecting Multi-Molecules in LiquidPrincipal Investigator
- Principal Investigator
  
  Miura Hideo
- Project Period (FY)
  2021 – 2022
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields
- Research Institution
  Tohoku University
高温変動負荷環境における耐熱合金強度劣化損傷機構の解明と残存寿命予測技術の確立Principal Investigator
- Principal Investigator
  
  三浦英生
- Project Period (FY)
  2021
- Research Category
  
  Grant-in-Aid for JSPS Fellows
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Tohoku University
高温変動負荷環境における耐熱合金強度劣化損傷機構の解明と残存寿命予測技術の確立Principal Investigator
- Principal Investigator
  
  三浦英生
- Project Period (FY)
  2021 – 2022
- Research Category
  
  Grant-in-Aid for JSPS Fellows
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Tohoku University
Explication of the degradation mechanism of the strength of heat-resistant alloys under random loading at elevated temperatures and the establishment of the prediction method of their lifetimePrincipal Investigator
- Principal Investigator
  
  三浦英生
- Project Period (FY)
  2021 – 2022
- Research Category
  
  Grant-in-Aid for JSPS Fellows
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Tohoku University
Strain-Controlled Graphene-Nanoribbon-Base Biochemical Sensors with High Selectivity and Sensitivity
- Principal Investigator
  
  Suzuki Ken
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (B))
- Review Section
  
  Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields
- Research Institution
  Tohoku University
Degradation Analysis of Engineering Materials in Air Using White Light and Precise Optical FilterPrincipal Investigator
- Principal Investigator
  
  MIURA HIDEO
- Project Period (FY)
  2017 – 2018
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Research Field
  
  Mechanics of materials, Production engineering, Design engineering, and related fields
- Research Institution
  Tohoku University
Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of MaterialsPrincipal Investigator
- Principal Investigator
  
  Miura Hideo
- Project Period (FY)
  2016 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
原子配列の秩序性変化に着目した材料の高温初期損傷評価システムの開発Principal Investigator
- Principal Investigator
  
  三浦英生
- Project Period (FY)
  2016
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Development and Evaluation of Multi-Functional Thin-Film Devices Using Graphene Nanoribbon Under Three-Dimensional Strain FieldPrincipal Investigator
- Principal Investigator
  
  Miura Hideo
- Project Period (FY)
  2015 – 2016
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Quantitative Evaluation of the Crystallinity of Grain Boundaries in Nano ScalePrincipal Investigator
- Principal Investigator
  
  MIURA Hideo
- Project Period (FY)
  2012 – 2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Interface integrity based on the control of strain-induced anisotropic diffusionPrincipal Investigator
- Principal Investigator
  
  MIURA Hideo
- Project Period (FY)
  2010 – 2011
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2009 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Remote dynamic-strain-distribution measurement system using a nano-scale texture-controlled thin filmPrincipal Investigator
- Principal Investigator
  
  MIURA Hideo
- Project Period (FY)
  2009 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Stabilized Temperature Characteristics, High-Speed Response, and Low-Voltage Driving of Micromirror
- Principal Investigator
  
  SASAKI Minoru
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Toyota Technological Institute
Research on Mechanics and Mechanisms of Stress Corrosion Cracking Based upon Mechano-Chemical Oxidation Kinetics
- Principal Investigator
  
  SHOJI Tetsuo
- Project Period (FY)
  2005 – 2009
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Study of safety science focused on nano-structure for hot section parts of advanced gas turbines
- Principal Investigator
  
  OGAWA Kazuhiro
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Tohoku University
Measurement system of fluctuation map of strength and mechanical properties of nano-scale materials using nano-positioning techniquePrincipal Investigator
- Principal Investigator
  
  MIURA Hideo
- Project Period (FY)
  2004 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  TOHOKU UNIVERSITY

[Book] 破壊力学体系-壊れない製品設計に向けて-, 第12章2節薄膜デバイスの信頼設計2012
- Author(s)
  三浦英生, 他
- Total Pages
  536
- Publisher
  株式会社エヌ・ティー・エス
- Data Source
  KAKENHI-PROJECT-21226009
[Book] 破壊力学大系-壊れない製品設計に向けて-:第12章2節薄膜デバイスの信頼設計2012
- Author(s)
  三浦英生(分担執筆)
- Publisher
  株式会社エヌ・ティー・エス
- Data Source
  KAKENHI-PROJECT-21226009
[Book] 製品開発のための材料力学と疲労設計入門2009
- Author(s)
  鯉渕興二, 小久保邦雄, 初田俊雄, 服部敏雄, 三浦英生
- Total Pages
  169
- Publisher
  日刊工業新聞社
- Data Source
  KAKENHI-PROJECT-17106002
[Book] 機械工学便覧デザイン編β2 材料学・工業材料2006
- Author(s)
  三浦英生, 他76名
- Total Pages
  285
- Publisher
  丸善株式会社
- Data Source
  KAKENHI-PROJECT-16206013
[Book] 最新シリコンデバイスと結晶技術-先端LSIが要求するウェーハ技術の現状-2005
- Author(s)
  三浦英生, 他27名
- Total Pages
  330
- Publisher
  REALIZE Science & Engineering
- Data Source
  KAKENHI-PROJECT-16206013
[Book] Advanced Technology for Silicon Devices and Crystal Growth2005
- Author(s)
  Hideo Miura, et al.
- Total Pages
  330
- Publisher
  REALIZE Science and Engineering
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Book] 最新シリコンデバイスと結晶技術 -先端LSIが要求するウエーハ技術の現状-2005
- Author(s)
  三浦英生, 他27名
- Total Pages
  330
- Publisher
  REALIZE Science ＆ Engineering
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Acceleration of Creep-Fatigue Damage of Ni-Base Alloy by Viscoelasticity at Elevated Temperature2024
- Author(s)
  5)Hideo Miura, Ayane Yasumura, Takuma Yamawaki, Takuto Kudo, Hayato Matsuda, Le, Xu
- Journal Title
  
  Mechanics of Solids, Structures and Fluids
  
  Volume: 11
- DOI
  10.1115/imece2023-112200
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H01205
[Journal Article] Effect of Strain Rate on the Creep-Fatigue Damage of Polycrystalline Ni-Base Superalloy at Elevated Temperature2023
- Author(s)
  Koki Nakayama, Hideo Miura
- Journal Title
  
  Proc. ASME IMECE2022
  
  Volume: 12
- DOI
  10.1115/imece2022-94282
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H01205
[Journal Article] Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation2023
- Author(s)
  Lv-Yi Cheng, Run-Zi Wang, Kai-Shang Li, Hai-Long Guo, Le Xu, Ken Suzuki, Hideo Miura, Xian-Cheng Zheng, Shan-Tung Tu
- Journal Title
  
  International Journal of Fatigue
  
  Volume: 175 Pages: 107798-107798
- DOI
  10.1016/j.ijfatigue.2023.107798
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KF0003
[Journal Article] Improvement of the Sensitivity and Selectivity of Gas Molecules of Graphene-base Gas Sensor with Carbon Nanotubes under the Application of Strain2023
- Author(s)
  Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. ASME IMECE2022
  
  Volume: 12
- DOI
  10.1115/imece2022-95307
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18665, KAKENHI-PROJECT-20KK0083
[Journal Article] Microstructural evolutions and life evaluation of non-proportional creep-fatigue considering loading path and holding position effects2023
- Author(s)
  Le Xu, Run-Zi Wang, YU-Chen Wang, Lei He, Takamoto Itoh, Ken Suzuki, Hideo Miura, Xian^Cheng Zhang
- Journal Title
  
  Materials Characterization
  
  Volume: 204 Pages: 113209-113209
- DOI
  10.1016/j.matchar.2023.113209
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KF0003, KAKENHI-PROJECT-21H01205
[Journal Article] Creep-Fatigue Reliability Analysis Integrated with Surrogate Modelling: Application on Industrial Case Studies2023
- Author(s)
  Run-Zi Wang, Ken Suzuki, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
- Journal Title
  
  Proc. ASME IMECE2022
  
  Volume: 14
- DOI
  10.1115/imece2022-94273
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Journal Article] Surrogate-modeling-assisted creep-fatigue reliability assessment in a low-pressure turbine disc considering multi-source uncertainty2023
- Author(s)
  Run-Zi Wang, Hang-Hang Gu, Yu Liu, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
- Journal Title
  
  Reliability Engineering and System Safety
  
  Volume: 240 Pages: 109550-109550
- DOI
  10.1016/j.ress.2023.109550
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KF0003, KAKENHI-PROJECT-21H01205
[Journal Article] Change of the Effective Strength of Grain Boundaries in Ni-base Superalloy GH4169 (IN718) under Creep-Fatigue Loadings at Elevated Temperatures2023
- Author(s)
  Ayumi Nakayama, Runzi Wang, Hideo Miura
- Journal Title
  
  Proc. ASME IMECE2022
  
  Volume: 12
- DOI
  10.1115/imece2022-94701
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H01205
[Journal Article] Acceleration mechanism of the degradation of the lifetime of Ni-base superalloys under creep-fatigue loading at elevated temperatures2023
- Author(s)
  Yifan Luo, Yukako Takahashi, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
- Journal Title
  
  ournal of Fatigue & Fracture of Engineering Materials & Structures
  
  Volume: 46 Issue: 8 Pages: 14013-14013
- DOI
  10.1111/ffe.14013
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Journal Article] Quantitative evaluations of improved surface integrity in ultrasonic rolling process for selective laser melted in-situ TiB2/Al composite2022
- Author(s)
  Yi-Xin Liu, Cheng-Cheng Zhang, Run-Zi Wang, Kai-Ming Zhang, Ji Wang, Shu-Lei Yao, Hao Chen, Xian-Cheng Zhang, Hideo Miura
- Journal Title
  
  Journal of Manufacturing Processes
  
  Volume: 77 Pages: 412-425
- DOI
  10.1016/j.jmapro.2022.03.026
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21H01205
[Journal Article] Establishment of unified creep-fatigue life prediction under various temperatures and investigation of failure physical mechanism for Type 304 stainless steel2022
- Author(s)
  Le Xu, Run-Zi Wang, Lei He, Xian-Cheng Zhang, Shan-Tung Tu, Hideo Miura, Takamoto Itoh
- Journal Title
  
  Fatigue & Fracture of Engineering Materials & Structures
  
  Volume: 45 Issue: 10 Pages: 3086-3101
- DOI
  10.1111/ffe.13794
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205, KAKENHI-PROJECT-21F50350
[Journal Article] Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules2022
- Author(s)
  Masasuke Kobayashi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Micro- and Nano-Systems Engineering and Packaging
  
  Volume: 12
- DOI
  10.1115/imece2021-70172
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21K18665
[Journal Article] Tunable uniaxial, area, and volume negative thermal expansion in quartz-like and diamond-like metalorganic frameworks2022
- Author(s)
  Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki and Cong Wang
- Journal Title
  
  Royal Society of Chemistry (RSC) Advances
  
  Volume: 12 Issue: 34 Pages: 21770-21779
- DOI
  10.1039/d2ra03292a
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18665, KAKENHI-PLANNED-18H05454
[Journal Article] Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures2022
- Author(s)
  Yukako Takahashi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 12
- DOI
  10.1115/imece2021-70108
- NAID
  130008093349
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] A dual-scale modelling approach for creep-fatigue crack initiation life prediction of holed structure in a nickel-based superalloy2022
- Author(s)
  Kai-Shang Li, Lv-Yi Cheng, Yilun Xu, Run-Zi Wang, Yong Zhang, Xian-Cheng Zhang, Shan-TungTu, Hideo Miura
- Journal Title
  
  International Journal of Fatigue
  
  Volume: 154 Pages: 106522-106522
- DOI
  10.1016/j.ijfatigue.2021.106522
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21H01205, KAKENHI-PROJECT-21F50350
[Journal Article] Oxidation-involved life prediction and damage assessment under generalized creep-fatigue loading conditions based on engineering damage mechanics2022
- Author(s)
  Run-Zi Wang, Xian-Cheng, Zhang, Hang-Hang, Gu, Kai-Shang Li, Jian-Feng Wen, Hideo Miura, Ken Suzuki, Shan-Tung Tu
- Journal Title
  
  J. of Materials Research and Technology
  
  Volume: 23 Pages: 114-130
- DOI
  10.1016/j.jmrt.2022.12.094
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205, KAKENHI-PROJECT-21F50350, KAKENHI-PROJECT-23KF0003
[Journal Article] A data-driven roadmap for creep-fatigue reliability assessment and its implementation in low-pressure turbine disk at elevated temperatures2022
- Author(s)
  Run-Zi Wang, Hang-Hang Gu, Kai-Shang Li, JI Wang, Xiao-Wei Wang, Miura Hideo, Xian-Cheng Zhang, Shan-Tung Tu
- Journal Title
  
  Reliability Engineering & System Safety
  
  Volume: 225 Pages: 108523-108523
- DOI
  10.1016/j.ress.2022.108523
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205, KAKENHI-PROJECT-21F50350
[Journal Article] Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads2022
- Author(s)
  Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 12
- DOI
  10.1115/imece2021-70628
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21H01205
[Journal Article] Penta-graphene and phagraphene: thermal expansion, linear compressibility, and Poisson’s ratio2022
- Author(s)
  Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki and Cong Wang
- Journal Title
  
  Journal of Physics: Condensed Matter
  
  Volume: 34 Issue: 50 Pages: 505301-505301
- DOI
  10.1088/1361-648x/ac9c3e
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18665, KAKENHI-PLANNED-18H05454
[Journal Article] Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures2022
- Author(s)
  Goundar Jowesh Avisheik、Suzuki Ken、Miura Hideo
- Journal Title
  
  Proc. of International Conference on Electronic Packaging
  
  Volume: - Pages: 81-82
- DOI
  10.23919/icep55381.2022.9795457
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02022, KAKENHI-PROJECT-21J11599, KAKENHI-PROJECT-21K18665
[Journal Article] Evaluation of fatigue and creep-fatigue damage levels on the basis of engineering damage mechanics approach2022
- Author(s)
  Li Sun, Xian-Cheng Zhang, Run-Zi Wang, Xiao-Wei Wang, Shan-Tung Tu, Ken Suzuki, Hideo Miura
- Journal Title
  
  Journal of Fatigue
  
  Volume: 166 Pages: 103337-103337
- DOI
  10.1016/j.ijfatigue.2022.107277
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21F50350, KAKENHI-PROJECT-23KF0003, KAKENHI-PROJECT-21H01205
[Journal Article] Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies2022
- Author(s)
  Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 12 Pages: 1-7
- DOI
  10.1115/imece2021-68489
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21H01205, KAKENHI-PROJECT-20J12222
[Journal Article] Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis2021
- Author(s)
  Shin Kasama, Ken Suzuki, Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 12
- DOI
  10.1115/imece2020-23354
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique2021
- Author(s)
  Goundar Jowesh Avisheik、Xiangyu Qiao、Suzuki Ken、Miura Hideo
- Journal Title
  
  International Mechanical Engineering Congress & Exposition (IMECE 2021), Proceedings,
  
  Volume: IMECE2021 Pages: 1-6
- DOI
  10.1115/imece2021-69917
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02022, KAKENHI-PROJECT-21J11599, KAKENHI-PROJECT-21K18665, KAKENHI-PROJECT-20KK0083
[Journal Article] Multi-stage dwell fatigue crack growth behaviors in a nickel-based superalloy at elevated temperature2021
- Author(s)
  Ji Wang, Run-Zi Wang, Xian-Cheng Zhang, You-Jun Ye, Yan Cui, Hideo Miura, Shan-TungTu
- Journal Title
  
  Engineering Fracture Mechanics
  
  Volume: 253 Pages: 107859-107859
- DOI
  10.1016/j.engfracmech.2021.107859
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21F50350
[Journal Article] Theoretical study on strain-controllable gradient Schottky barrier of dumbbell-shape graphene nanoribbon for highly sensitive strain sensors2021
- Author(s)
  Qinqiang Zhang; Ken Suzuki; Hideo Miura
- Journal Title
  
  Proc. of 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
  
  Volume: 2021 Pages: 171-174
- DOI
  10.1109/sispad54002.2021.9592548
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21K18665, KAKENHI-PROJECT-21K20393
[Journal Article] Development of Highly Sensitive Strain Sensor Using Area-Arrayed Graphene Nanoribbons2021
- Author(s)
  Suzuki Ken、Nakagawa Ryohei、Zhang Qinqiang、Miura Hideo
- Journal Title
  
  Nanomaterials
  
  Volume: 11 Issue: 7 Pages: 1701-1701
- DOI
  10.3390/nano11071701
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02022, KAKENHI-PROJECT-21K20393, KAKENHI-PROJECT-20KK0083
[Journal Article] A crystal plasticity-based approach for creep-fatigue life prediction and damage evaluation in a nickel-based superalloy2021
- Author(s)
  Kai-Shang Li, Run-Zi Wang, Guang-Jian Yuan, Shun-Peng Zhu, Xian-Cheng Zhang, Shan-Tung Tu, Hideo Miura
- Journal Title
  
  International Journal of Fatigue
  
  Volume: 143 Pages: 106031-106031
- DOI
  10.1016/j.ijfatigue.2020.106031
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21F50350
[Journal Article] Cycle-dependent creep-fatigue deformation and life predictions in a nickel-based superalloy at elevated temperature2021
- Author(s)
  Lv-Yi Cheng, Run-Zi Wang, Ji Wang, Shun-Peng Zhu, Peng-Cheng Zhao, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
- Journal Title
  
  International Journal of Mechanical Sciences
  
  Volume: 206 Pages: 106628-106628
- DOI
  10.1016/j.ijmecsci.2021.106628
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21F50350
[Journal Article] Semi-quantitative creep-fatigue damage analysis based on diffraction-based misorientation mapping and the correlation to macroscopic damage evolutions2021
- Author(s)
  Run-Zi Wang, Lv-Y iCheng, Shun-Peng Zhu, Peng-Cheng Zhao, Hideo Miura, Xian-Cheng Zhang, Shan-TungTu
- Journal Title
  
  International Journal of Fatigue
  
  Volume: 149 Pages: 106227-106227
- DOI
  10.1016/j.ijfatigue.2021.106227
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-21F50350
[Journal Article] Initial Intergranular Cracking of Ni-Base Superalloys Due to the Degradation of the Crystallinity of Grain Boundaries Under Creep-Fatigue Loading2020
- Author(s)
  Suzuki Wataru、Luo Yifan、Ishihara Kenta、Suzuki Kens、Miura Hideo
- Journal Title
  
  International Conference on Theoretical, Applied and Experimental Mechanics, proceeding
  
  Volume: NO. IMECE2020 Pages: 325-331
- DOI
  10.1007/978-3-030-47883-4_58
- ISBN
  9783030478827, 9783030478834
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20J12222, KAKENHI-PROJECT-16H06357
[Journal Article] First-principles analysis of the inhibitive effect of interstitial carbon on an active dissolution of martensitic steel2020
- Author(s)
  Mariko Kadowaki, Arkapol Saengdeejin, Izumi Muto, YingChen, Hiroyuki Masuda, Hideki Katayama, Takashi Doi, Kaori Kawano, Hideo Miura, Yu Sugawara, Nobuyoshi Hara
- Journal Title
  
  Corrosion Science
  
  Volume: 163 Pages: 108251-108251
- DOI
  10.1016/j.corsci.2019.108251
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-17H01331, KAKENHI-PROJECT-18J20518, KAKENHI-PROJECT-17K06783, KAKENHI-PLANNED-18H05454
[Journal Article] Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature2020
- Author(s)
  Takahashi Yukako、Luo Yifan、Ishihara Kenta、Suzuki Shujiro、Miura Hideo
- Journal Title
  
  International Conference on Theoretical, Applied and Experimental Mechanics, proceeding
  
  Volume: NO. IMECE2020-24473 Pages: 1-6
- DOI
  10.1115/imece2020-24473
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20J12222, KAKENHI-PROJECT-16H06357
[Journal Article] Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C2020
- Author(s)
  Ishihara Kenta、Luo Yifan、Miura Hideo
- Journal Title
  
  International Conference on Theoretical, Applied and Experimental Mechanics, proceeding
  
  Volume: NO. IMECE2020-23738 Pages: 1-6
- DOI
  10.1115/imece2020-23738
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20J12222, KAKENHI-PROJECT-16H06357
[Journal Article] Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C2019
- Author(s)
  Wataru Suzuki , Kenta Ishihara , Ryo Kikuchi , Ken Suzuki , Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 10
- DOI
  10.1115/imece2019-11210
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Theoretical Study of the Edge Effect of Dumbbellshape Graphene Nanoribbon with a Dual Electronic Properties by First-principle Calculations2019
- Author(s)
  Qinqiang Zhang ; Takuya Kudo ; Jowesh Gounder ; Ying Chen ; Ken Suzuki ; Hideo Miura
- Journal Title
  
  2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
  
  Volume: 2019 Pages: 141-144
- DOI
  10.1109/sispad.2019.8870398
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-19J12755
[Journal Article] Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging2019
- Author(s)
  Yutaro Nakoshi, Ken Suzuki and Hideo Miura
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 58 Issue: SB Pages: SBBC04-SBBC04
- DOI
  10.7567/1347-4065/ab00f4
- NAID
  210000135441
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors2019
- Author(s)
  Ryota Mizuno , Genta Nakauchi , Ken Suzuki , Hideo Miura
- Journal Title
  
  Micro- and Nano-Systems Engineering and Packaging
  
  Volume: 10
- DOI
  10.1115/imece2019-11106
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons2019
- Author(s)
  Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
- Journal Title
  
  Micro- and Nano-Systems Engineering and Packaging
  
  Volume: 10
- DOI
  10.1115/imece2019-11107
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-19J12755
[Journal Article] Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures2019
- Author(s)
  Yan Liang , Yifan Luo , Ken Suzuki , Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 9
- DOI
  10.1115/imece2019-11186
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors2019
- Author(s)
  Jowesh Avisheik Goundar , Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
- Journal Title
  
  Micro- and Nano-Systems Engineering and Packaging
  
  Volume: 10
- DOI
  10.1115/imece2019-11076
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-19J12755
[Journal Article] Superdense microbands strengthening of textured low alloy ferritic steel2018
- Author(s)
  Lei Cheng, Qingwu Cai, Jinlong Lv, Wei Yu, Hideo Miura,
- Journal Title
  
  Journal of Alloys and Compounds
  
  Volume: 746 Pages: 482-489
- DOI
  10.1016/j.jallcom.2018.02.297
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Effects of prior microstructures and deformation parameters on the ultra-refining uniformity of Ti-Mo ferritic steel2018
- Author(s)
  Lei Cheng, Wei Yu, Qingwu Cai, Jinlong Lv, Hideo Miura
- Journal Title
  
  Materials Science and Engineering: A
  
  Volume: 733 Pages: 108-116
- DOI
  10.1016/j.msea.2018.07.006
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K18817
[Journal Article] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films2018
- Author(s)
  Yutaro Nakoshi, Hideo Miura
- Journal Title
  
  Materials: Genetics to Structures
  
  Volume: 12
- DOI
  10.1115/imece2018-87278
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Coarsening of nanoscale (Ti,Mo)C precipitates in different ferritic matrixes2018
- Author(s)
  Lei Cheng, Qingwu Cai, Wei Yu, Jinlong Lv, Hideo Miura,
- Journal Title
  
  Materials Characterization
  
  Volume: 142 Pages: 195-202
- DOI
  10.1016/j.matchar.2018.05.034
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films2018
- Author(s)
  Ken Suzuki, Yiqing Fan, Yifan Lio, Hideo Miura
- Journal Title
  
  Simulation of Semiconductor Processes and Devices
  
  Volume: 2018 Pages: 88-91
- DOI
  10.1109/sispad.2018.8551672
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Disappearance of Martensitic Strengthened-Micro-Texture in Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018
- Author(s)
  Taichi Shinozaki, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Key Engineering Materials
  
  Volume: 774 Pages: 31-35
- DOI
  10.4028/www.scientific.net/kem.774.31
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357, KAKENHI-PROJECT-17K18817
[Journal Article] Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal2018
- Author(s)
  Guoxiong Zheng, Yifan Luo and Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 9
- DOI
  10.1115/imece2018-87264
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018
- Author(s)
  Yifan Luo, Hideo Miura
- Journal Title
  
  Mechanics of Solids, Structures, and Fluids
  
  Volume: 9
- DOI
  10.1115/imece2018-87368
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading2018
- Author(s)
  Wataru Suzuki, Akari Sawase, Ken Suzuki, *Hideo Miura
- Journal Title
  
  Structural Integrity
  
  Volume: 5 Pages: 227-232
- DOI
  10.1007/978-3-319-91989-8_49
- ISBN
  9783319919881, 9783319919898
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Stress-Induced Change of the Microstructure and Strength of Modified 9Cr-1Mo Steel Under Fatigue and Creep Loadings at Elevated Temperatures2017
- Author(s)
  Taichi Shinozaki, Ken Suzuki, Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: 9
- DOI
  10.1115/imece2017-70494
- NAID
  130006726909
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings2017
- Author(s)
  Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki and Hideo Miura
- Journal Title
  
  Advances in Fracture and Damage Mechanics
  
  Volume: XVI Pages: 31-34
- DOI
  10.4028/www.scientific.net/kem.754.31
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K18817
[Journal Article] Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films2017
- Author(s)
  Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: 9
- DOI
  10.1115/imece2017-70302
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Highly Sensitive Strain Sensor Using Dumbbell-Shape Graphene Nanoribbon2017
- Author(s)
  Qinqiang Zhang, Meng Yang, Ken Suzuki and Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: 10
- DOI
  10.1115/imece2017-70318
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Evaluation of Damage Evolution in Nickel-Base Heat-Resistant Alloy Under Creep-Fatigue Loading Conditions2017
- Author(s)
  Ken Suzuki, Takuya Murakoshi, Hiroki Sasaki, Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: I
- DOI
  10.1115/imece2017-72139
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K18817
[Journal Article] Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings2017
- Author(s)
  Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki and Hideo Miura
- Journal Title
  
  Key Engineering Materials
  
  Volume: 754 Pages: 31-34
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections2017
- Author(s)
  Takeru Kato; Ken Suzuki; Hideo Miura
- Journal Title
  
  Journal of Electronic Packaging
  
  Volume: 139(2) Issue: 2
- DOI
  10.1115/1.4036442
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation2017
- Author(s)
  Koki Isobe, Ken Suzuki and Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: 10
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Largely Deformable and Highly Sensitive Strain Sensor Using Carbon Nanomaterials2017
- Author(s)
  Kanji Yumoto, Ken Suzuki and Hideo Miura
- Journal Title
  
  ASME 2017 International Mechanical Engineering Congress and Exposition
  
  Volume: 10
- DOI
  10.1115/imece2017-70388
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Crystallinity-induced Degradation of the Lifetime of Advanced Interconnections2016
- Author(s)
  Takeru Kato, Ken Suzuki, Hideo Miura
- Journal Title
  
  ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings
  
  Volume: IMECE2016
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Control of the nucleation and quality of graphene grown by low-pressure chemical vapor deposition with acetylene2016
- Author(s)
  Meng Yang, Shinichirou Sasaki, Masato Ohnishi, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Applied Surface Science
  
  Volume: 366 Pages: 219-226
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K13824
[Journal Article] Highly-sensitive Graphene Nano-Ribbon-Base Strain Sensor2016
- Author(s)
  Shinichirou Sasaki, Ken Suzuki, Meng Yang, Hideo Miura
- Journal Title
  
  ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings
  
  Volume: IMECE2016
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K13824
[Journal Article] Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries2016
- Author(s)
  Takuya Murakoshia, Taichi Shinozakia, Ken Suzukib and Hideo Miura
- Journal Title
  
  Structural Integrity Procedia
  
  Volume: 2 Pages: 1383-1390
- DOI
  10.1016/j.prostr.2016.06.176
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Crystallinity Control of Electroplated Interconnections for Improving Their Stability and Lifetime2016
- Author(s)
  Jiatong Liu, Ken Suzuki, Hideo Miura
- Journal Title
  
  ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings
  
  Volume: IMECE2016
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Electronic properties and strain sensitivity of CVD-grown graphene with acetylene2016
- Author(s)
  Meng Yang, Shinichirou Sasaki, Masato Ohnishi, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 1-9
- DOI
  10.7567/jjap.55.04ep05
- NAID
  210000146412
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-15K13824, KAKENHI-PROJECT-15J07910
[Journal Article] MICROSCOPIC ANALYSIS OF THE INITIATION OF HIGH-TEMPERATURE DAMAGE OF NI-BASED HEAT-RESISTANT ALLOY2016
- Author(s)
  Takuya Murakoshi, Ken Suzuki, Isamu Nonaka, Hideo Miura
- Journal Title
  
  ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings
  
  Volume: IMECE2016
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] ATOMIC DIFFUSION CONTROL IN NI-BASE SUPER ALLOY FOR IMPROVING ITS HIGH TEMPERATURE STRENGTH2016
- Author(s)
  Motoki Takahashi, Ken Suzuki, Hideo Miura
- Journal Title
  
  ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings
  
  Volume: IMECE2016
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-16H06357
[Journal Article] Quantitative evaluation of orbital hybridization in carbon nanotubes under radial deformation using π-orbital axis vector2015
- Author(s)
  Masato Ohnishi, Ken Suzuki, and Hideo Miura
- Journal Title
  
  AIP Advances
  
  Volume: 5
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-15K13824
[Journal Article] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three- Dimensional Electronic Packaging2013
- Author(s)
  Ken Suzuki, Ryosuke Furuya, Fumiaki Endo and Hideo Miura
- Journal Title
  
  Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS
  
  Volume: 査読有 Pages: 864-865
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Improvement of the Reliability of Thin- Film Interconnections Based on the Control of the Crystallinity of the Thin Films2013
- Author(s)
  Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  
  Volume: No. 73149 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Stress-induced Migration of Electroplated Copper Thin Film Interconnections Depending on Thermal History2013
- Author(s)
  Ken Suzuki and Hideo Miura, Osamu Asai, Naoki Saito and Naokazu Murata
- Journal Title
  
  Proc. of IEEE SISPAD 2013
  
  Pages: 396-399
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections2013
- Author(s)
  Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE 62^<nd> Electronic Components and Technology Conference
  
  Pages: 1153-1158
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films2013
- Author(s)
  Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  
  Volume: 12 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films2013
- Author(s)
  Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE 63rd ECTC
  
  Volume: Vol.63 Pages: 635-640
- DOI
  10.1109/ectc.2013.6575640
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for Through-Silicon Vias2013
- Author(s)
  Ken Suzuki, Naokazu Murata, Naoki Saito, Ryosuke Furuya, Osamu Asai, and Hideo Miura
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: vol. 52
- NAID
  210000141977
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] mprovement of Crystallographic Quality of Electroplated Copper Thin- Film Interconnections for Through-Silicon Vias2013
- Author(s)
  Ken Suzuki, Naokazu Murata, Naoki Saito, Ryosuke Furuya, Osamu Asai, and Hideo Miura
- Journal Title
  
  JAPANESE JOURNAL OF APPLIED PHYSICS
  
  Volume: 52
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Micro-Texture Dependence of Stress-induced Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration2013
- Author(s)
  Ken Suzuki, Osamu Asai, Ryosuke Furuya, Jaeuk Sung, Naokazu Murata, and Hideo Miura
- Journal Title
  
  Proc. of 18th International Conference on Simulation of Semiconductor Processes and Devices
  
  Volume: 18 Pages: 264-267
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging2013
- Author(s)
  Ken Suzuki, Ryosuke Furuya, Fumiaki Endo and Hideo Miura
- Journal Title
  
  Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS
  
  Volume: G7 Pages: 864-865
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films2013
- Author(s)
  Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE the 63rd Eelectronic Components and Technology Conference
  
  Volume: 63 Pages: 635-640
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS2013
- Author(s)
  Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc. of ASME IMECE2013
  
  Volume: 2013-73150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films2013
- Author(s)
  Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE ECTC2013
  
  Pages: 635-640
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] 半導体実装用めっき銅薄膜強度物性の微細組織依存性2013
- Author(s)
  遠藤史明，古屋亮輔，鈴木研，三浦英生
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: J96-C Pages: 400-408
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Micro-Texture Dependence of Stress -induced Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration2013
- Author(s)
  Ken Suzuki, Osamu Asai, Ryosuke Furuya, Jaeuk Sung, Naokazu Murata, and Hideo Miura
- Journal Title
  
  Proc. of the 18^<th> International Conference on Simulation of Semiconductor Processes and Devices
  
  Volume: No. P18 Pages: 264-267
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Change of the Electronic Conductivity of CNTs and Graphene Sheets Caused by Three-dimensional Strain Field2012
- Author(s)
  M.Ohnishi, H.Kawakami, Y.Suzuki, K.Suzuki,H.Miura
- Journal Title
  
  Proc. of Nanotech 2012
  
  Volume: Vol.1 Pages: 260-263
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps2012
- Author(s)
  Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
- Journal Title
  
  J. of Electronic Packaging
  
  Volume: VOL.134(2) Issue: 2
- DOI
  10.1115/1.4006142
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections2012
- Author(s)
  Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE 62nd Electronic Components and Technology Conference
  
  Volume: - Pages: 1153-1158
- DOI
  10.1109/ectc.2012.6248981
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] ANISOTROPIC STRAIN-FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES2012
- Author(s)
  Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc. of ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)
  
  Volume: 1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] カーボンナノチューブ応用二次元ひずみ分布計測センサの試作2012
- Author(s)
  鈴木悠介，大橋悠輔，大西正人，鈴木研，三浦英生
- Journal Title
  
  日本機械学会論文集（A編）
  
  Volume: 78 Pages: 689-693
- NAID
  130002050294
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Stress-induced Migration of Electroplated Copper Thin Film Interconnections Depending on Thermal History2012
- Author(s)
  Ken Suzuki and Hideo Miura, Osamu Asai, Naoki Saito and Naokazu Murata
- Journal Title
  
  Proc. of IEEE SISPAD2012
  
  Volume: 1 Pages: 396-399
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] めっき銅薄膜配線ストレスマイグレーション支配因子の解明2012
- Author(s)
  齋藤直樹，村田直一，玉川欣治，鈴木研，三浦英生
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: J95-C Pages: 351-357
- NAID
  110009543936
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Change of the Electronic Conductivity of CNTs and Graphene Sheets Caused by Three-dimensional Strain Field2012
- Author(s)
  M.Ohnishi, H.Kawakami, Y.Suzuki, K.Suzuki, and H.Miura
- Journal Title
  
  Proc. of IEEE Nanotech 2012
  
  Volume: 1 Pages: 260-263
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] カーボンナノチューブ応用二次元ひずみ分布計測センサの試作2012
- Author(s)
  鈴木悠介,大橋悠輔,大西正人,鈴木研,三浦英生
- Journal Title
  
  日本機械学会論文集(A編)
  
  Volume: 78巻 Pages: 689-693
- NAID
  130002050294
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections2012
- Author(s)
  Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of IEEE 62nd Electronic Components and Technology Conference
  
  Volume: 1 Pages: 1153-1158
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656077
[Journal Article] Change of the Electronic Conductivity of CNTs and Graphene Sheets Caused by an Anisotropic Three-dimensional Strain Field2012
- Author(s)
  Masato Ohnishi, Ken Suzuki and Hideo Miura
- Journal Title
  
  Proc. of IEEE SISPAD2012
  
  Volume: 1 Pages: 86-89
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] ANISOTROPIC STRAIN- FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES2012
- Author(s)
  Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki,Hideo Miura
- Journal Title
  
  Proc. of ,ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)
  
  Volume: No.87347 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Strain Dependence of the Electronic Conductivity of Carbon Nanotubes and Graphene Sheets2011
- Author(s)
  Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011
  
  Pages: 508-509
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-dispersed Resin2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems
  
  Volume: IPACK52062 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes- Dispersed Resin under Strain2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki,and Hideo Miura
- Journal Title
  
  Proc. of ASME InterPACK2011
  
  Volume: No.52064 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin under strain2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems
  
  Volume: IPACK52064 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Change of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets Caused by a Three-Dimensional Strain Field2011
- Author(s)
  Masato Ohnishi, Ken Suzuki, Hideo Miura, Yusuke Suzuki, Yusuke Ohashi
- Journal Title
  
  Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems
  
  Volume: IPACK52057 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets2011
- Author(s)
  Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition
  
  Volume: IMECE2010-37277 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Two-Dimensional Strain- Distribution Sensor Using Carbon Nanotube2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki and Hideo Miura
- Journal Title
  
  Proc. of International Conference on Advanced Technology in Experimental Mechanics 2011
  
  Volume: No.OS20-3-2 Pages: 1-8
- NAID
  130002050294
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] カーボンナノチューブ電気伝導特性に及ぼすひずみの影響2011
- Author(s)
  鈴木悠介, 大西正人, 鈴木研, 三浦英生
- Journal Title
  
  日本機械学会論文集(A編)
  
  Volume: 77 Pages: 91-95
- NAID
  130000874066
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Change of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets Caused by a Three-Dimensional Strain Field2011
- Author(s)
  Masato Ohnishi, Ken SuzukiHideo Miura, , Yusuke Suzuki, and Yusuke Ohashi
- Journal Title
  
  Proc. of ASME InterPACK2011 , Multi Physics Based Reliability
  
  Volume: No.52057 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] カーボンナノチューブ電気伝導特性に及ぼすひずみの影響2011
- Author(s)
  鈴木悠介,大西正人,鈴木研,三浦英生
- Journal Title
  
  日本機械学会論文集(A編)
  
  Volume: 77巻 Pages: 91-95
- NAID
  130000874066
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Stress-induced anisotropic diffusion of component elements in the stacked thin-film multi-layer structures2011
- Author(s)
  Tomohiro Sano, Naokazu Murata, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of International Conference on Advanced Technology in Experimental Mechanics
  
  Volume: OS20
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Stress-induced anisotropic diffusion of component elements in the stacked thin-film multi-layer structures2011
- Author(s)
  Tomohiro Sano, Naokazu Murata, Ken Suzuki, and Hideo Miura
- Journal Title
  
  Proc. of International Conference on Advanced Technology in Experimental Mechanics
  
  Volume: No.OS20 Pages: 1-9
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Remote Strain Sensor using Carbon Nanotube-Dispersed Resin2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011
- NAID
  130002050294
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANIS OTROPIC DIFFUSION OF COMPONENT ELEMENTS2011
- Author(s)
  Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
- Journal Title
  
  Proc.of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS&EXPOSITION 2011
  
  Volume: IMECE2011
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS2011
- Author(s)
  Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
- Journal Title
  
  Proc. of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS & EXPOSITION 2011
  
  Volume: No.IMECE2011-62411 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Journal Title
  
  Proc.of日本機械学会M&M2011
  
  Volume: 8 Pages: 1-3
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Journal Title
  
  Proc. of日本機械学会M & M2011
  
  Volume: Vol.8 Pages: 1-3
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Development of Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin2011
- Author(s)
  Ken Suzuki, Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Hideo Miura
- Journal Title
  
  Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011
  
  Pages: 504-505
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER2010
- Author(s)
  Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 12^<th> International Conference on Electronics Materials and Packaging
  
  Pages: 131-136
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures2010
- Author(s)
  Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of the 60^<th> Electronic Components and Technology Conference
  
  Pages: 1951-1956
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures2010
- Author(s)
  Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of the 60^<th> Electronic Components and Technology Conference
  
  Pages: 1951-1956
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] High-Temperature Damages of Ni-Base Superalloy Caused by the Change of Nanotexture Due to Strain-Induced Anisotropic Diffusion2010
- Author(s)
  Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition
  
  Volume: IMECE2010-37284
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors2010
- Author(s)
  Ken SUZUKI, Yoichi TAKEDA, and Hideo Miura
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering
  
  Volume: Vol.4 Pages: 1644-1653
- NAID
  130000420993
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets2010
- Author(s)
  Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki,and Hideo Miura
- Journal Title
  
  Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition
  
  Volume: No.37277 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] High-Temperature Damages of Ni-Base Superalloy Caused by the Change of Nanotexture Due to Strain-Induced Anisotropic Diffusion2010
- Author(s)
  Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition
  
  Volume: No.IMECE2011-37284 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Remote Non-contact Strain Sensor Using Carbon Nanotube-dispersed Resin2010
- Author(s)
  Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of IMPACT Conference 2010
  
  Volume: AS015 Pages: 1-4
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Quantum Chemical Molecular Dynamics Simulation of Oxidation Process on Clean Metal Surface in High Temperature Water2010
- Author(s)
  K. Suzuki, N. K. Das, T. Shoji, and H. Miura
- Journal Title
  
  Proc. of 2010 MATERIALS RESEARCH SOCIETY SPRING MEETING
  
  Volume: Vol.Y6 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures2010
- Author(s)
  Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 11th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems
  
  Pages: 641-646
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors2010
- Author(s)
  Ken SUZUKI, Yoichi TAKEDA, Hideo MIURA
- Journal Title
  
  Journal of Solid Mechanics and Materials Engineering
  
  Volume: 4 Pages: 1644-1653
- NAID
  130000420993
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors2010
- Author(s)
  Ken SUZUKI, Yoichi TAKEDA, Hideo Miura
- Journal Title
  
  Journal of Solid Mechanics and Materials Engine Bring
  
  Volume: 4 Pages: 1644-1653
- NAID
  130000420993
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Quantum Chemical Molecular Dynamics Simulation of Oxidation Process on Clean Metal Surface in High Temperature Water.2010
- Author(s)
  K.Suzuki, N.K.Das, T.Shoji, H.Miura
- Journal Title
  
  2010MATERIALS RESEARCH SOCIETY SPRING MEETING
  
  Volume: Y6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22656028
[Journal Article] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures2010
- Author(s)
  Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems
  
  Pages: 641-646
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS2010
- Author(s)
  Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
- Journal Title
  
  Proc.of 12^<th> International Conference on Electronics Materials and Packaging
  
  Pages: 117-123
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] マイクロスケールひずみセンサを用いた三次元フリップチップ実装構造内局所残留応力測定に関する研究2009
- Author(s)
  佐々木拓也, 三浦英生
- Journal Title
  
  日本機械学会論文集(A編) 75
  
  Pages: 831-838
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structure2009
- Author(s)
  Seongcheol Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura
- Journal Title
  
  Transaction of the Japan Institute of Electronics Packaging 2
  
  Pages: 91-97
- NAID
  130000254840
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Simultaneous Realization of Stabilized Temperature Characteristics and Low-Voltage Driving of Micromirror Using Thin Film Torsion Bar of Tensile Poly-Si2009
- Author(s)
  Minoru Sasaki, Masayuki Fujishima, Kazuhiro Hane, Hideo Miura
- Journal Title
  
  IEEE Journal of Selected Topics in Quantum Electronics Vol.15
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19016003
[Journal Article] Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope2009
- Author(s)
  Hideo Miura
- Journal Title
  
  NDT & E International 42
  
  Pages: 188-192
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE- DISPERSED RESIN2009
- Author(s)
  Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki,and Hideo Miura
- Journal Title
  
  Proceedings of the ASME 2009 Inter PACK Conference
  
  Volume: No.89146 Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope2009
- Author(s)
  Hideo Miura
- Journal Title
  
  NDT&E International 42巻
  
  Pages: 188-192
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] 積層フリップチップ実装構造の残留応力低減構造に関する研究2009
- Author(s)
  上田啓貴, 佐々木拓也, 三浦英生
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 519-525
- NAID
  110007339289
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] ピエゾ抵抗ひずみセンサを用いたフリップチップ実装構造内局所2軸残留応力分布の測定2009
- Author(s)
  佐々木拓也, 上田啓貴, 三浦英生
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 623-628
- NAID
  110007465806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Multi-walled Carbon Nanotube-Dispersed Resin Films for Remote Strain Measurement2009
- Author(s)
  Katsuya Ohsaki, Hideo Miura
- Journal Title
  
  Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials E8-5
  
  Pages: 1126-1127
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Creep Damage Process of Ni-Base Superalloy Caused by Stress-Induced Anisotropic Atomic Diffusion2009
- Author(s)
  Ken Suzuki, Hiroyuki Itoh, Tatsuya Inoue, and Hideo Miura
- Journal Title
  
  J. of Solid Mechanics and Materials Engineering 3
  
  Pages: 487-497
- NAID
  130000106326
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] Creep and fatigue damages of Ni-base-superalloy caused by strain-induced anisotropic diffusion of component elements2009
- Author(s)
  Hideo Miura
- Journal Title
  
  Key Engineering Materials 417-418
  
  Pages: 261-264
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope2009
- Author(s)
  Hideo Miura, Kuniaki Akahoshi, Ken Suzuki
- Journal Title
  
  NDT&E International 42巻
  
  Pages: 188-192
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] Multi-walled Carbon Nanotube- Dispersed Resin Films for Remote Strain Measurement2009
- Author(s)
  Katsuya Ohsaki, Hideki Fuji, Masato Ohnishi, Ken Suzuki,and Hideo Miura
- Journal Title
  
  Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials
  
  Pages: 1126-1127
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope2009
- Author(s)
  Hideo Miura, Kuniaki Akahoshi, and Ken Suzuki
- Journal Title
  
  NDT & E International 42
  
  Pages: 188-192
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] IN-LINE EVALUTION METHOD OF THE INTRINSIC STRESS OF THIN FILMS USED FOR TRANSISTOR STRUCTURES2009
- Author(s)
  Hiroki Kishi, Hideo Miura
- Journal Title
  
  Proc.of the ASME 2009 Inter PACK Conference IP09-89145
  
  Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE-DISPERSED RESIN2009
- Author(s)
  Katsuya Ohsaki, Hideo Miura
- Journal Title
  
  Proc.of the ASME 2009 Inter PACK Conference IP09-89146
  
  Pages: 1-6
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] Fatigue Strength of Electroplated Copper Thin Films under Uni-axial Stress2009
- Author(s)
  Naokazu Murata, Kinji Tamakawa, ken Suzuki, and Hideo Miura
- Journal Title
  
  J. of Solid Mechanics and Materials Engineering 3
  
  Pages: 498-506
- NAID
  130000106327
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] Degradation of Interface Integrity Between a High-k Dielectric Thin Film and a Gate Electrode Due To Excess Oxygen in the Film2009
- Author(s)
  Hideo Miura, Ken Suzuki
- Journal Title
  
  Proc.of 2009 IEEE International Reliability Physics Symposium 4A. 6
  
  Pages: 376-381
- NAID
  120002070092
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21246021
[Journal Article] An Optically flat micromirror using stretched membrane with crystallization-induced stress2008
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, Hideo Miura
- Journal Title
  
  Journal of Optics A : Pure and Applied Optics Vol.10
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19016003
[Journal Article] Optically flat micromirror using stretched membrane with crystallization-induced stress2008
- Author(s)
  M. Sasaki, T. Sasaki, K. Hane, H. Miura
- Journal Title
  
  Journal of Optics A 10
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19016003
[Journal Article] 三次元フリップチップ実装構造における薄化チップの局所変形と残留応力2007
- Author(s)
  三浦英生
- Journal Title
  
  (社)電子情報通信学会信学技報 CPM2006-140
  
  Pages: 67-72
- NAID
  110006202417
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] 三次元フリッブチッブ実装構造における薄化チップの局所変形と残留応力2007
- Author(s)
  三浦英生
- Journal Title
  
  (社)電子情報通信学会信学技報 CPM2006-140
  
  Pages: 67-72
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Local Deformation and Residual Stress of Thinned Stacked Silicon Chip Mounted Using Flip Chip Technology2007
- Author(s)
  Hideo Miura
- Journal Title
  
  IEICE Technical Report Vol.CPM2006-140
  
  Pages: 67-72
- NAID
  110006202417
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] エレクトロニクス実装構造信頼性の分析・計測技術2006
- Author(s)
  三浦英生
- Journal Title
  
  エレクトロニクス実装学会誌 9・3
  
  Pages: 152-156
- NAID
  110004724977
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Noncontact and nondestructive inspection method for aged thermal barrier coatings Patent2006
- Author(s)
  Kazuhiro Ogawa, Hideo Miura, Tetsuo Shoji, Mikiko Suzuki
- Journal Title
  
  Right holder : Tohoku Technoarch Co., Ltd Application number: 2006-132395
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360046
[Journal Article] ナノスケールの材料力学2006
- Author(s)
  三浦英生
- Journal Title
  
  日本機械学会論文集 72・717A
  
  Pages: 595-601
- NAID
  110004731569
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Fluctuation mechanism of Mechanical Properties of Electroplated Copper Thin Films Used for Three-Dimensional Electronic Modules2006
- Author(s)
  Hideo Miura
- Journal Title
  
  Asian Pacific Conference on Fracture and Strength of Materials (CDROM)
  
  Pages: 1-4
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] ナノスケールの材料力学2006
- Author(s)
  三浦英生
- Journal Title
  
  日本機械学会論文集A編 72・717
  
  Pages: 595-601
- NAID
  110004731569
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Mechanics and Materials in Nano-Scale2006
- Author(s)
  Hideo Miura
- Journal Title
  
  Transactions of the Japan Society of Mechanical Engineers Vol.72, No.717A
  
  Pages: 595-601
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Degradation Mechanism Analysis of Structural Materials in Operating Energy Conversion Systems : Computational Chemistry Study2006
- Author(s)
  K.Suzuki, H.Ito, M.Kubo, H.Miura, A.Miyamoto, T.Shoji
- Journal Title
  
  Proceeding of The 4th International Symposium on Nanotechnology
  
  Pages: 130-131
- Data Source
  KAKENHI-PROJECT-17106002
[Journal Article] Experimental Methods for Reliability Evaluation of Electronic Packages and Modules2006
- Author(s)
  Hideo Miura
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging Vol.9, No.3
  
  Pages: 152-156
- NAID
  110004724977
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] フリップチップ実装におけるSiチップ内の局所残留応力評価2005
- Author(s)
  上田啓貴, 三浦英生
- Journal Title
  
  電子情報通信学会論文誌 Vol.J88-C, No.11
  
  Pages: 859-865
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Local Thermal Deformation and Residual Stress of a Thin Si Chip Mounted on a Substrate Using An Area-Arrayed Flip Chip Structure2005
- Author(s)
  Hideo Miura, Nobuki Ueta, Yuhki Sato
- Journal Title
  
  2005 International Symposium on Electronics Materials and Packaging
  
  Pages: 220-225
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Mechanical Reliability Issues of LSI Chips in Multi Devices Sub-assembly (MDS) Structures2004
- Author(s)
  H.Miura
- Journal Title
  
  Proceedings of 2004 ASME International Mechanical Engineering Congress and RD&D Expo (CD-ROM)
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Mechanical Reliability Issues of LSI Chips in Multi Devices Sub-assembly (MDS) Structures2004
- Author(s)
  H.Miura
- Journal Title
  
  Proceedings of 2004 ASME International Mechanical Engineering Congress and RD＆D Expo IMECE-6250(CDROM)
  
  Pages: 1-6
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Journal Article] Mechanical Reliability Issues of LSI Chips in Multi Devices Sub-assembly (MDS) Structures2004
- Author(s)
  H.Miura
- Journal Title
  
  Proceedings of 2004 ASME International Mechanical Engineering Congress and RD＆D Expo No.IMECE-62500(CDROM)
  
  Pages: 1-6
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Patent] 半導体装置の製造方法2009
- Inventor(s)
  小藤直行, 三浦英生
- Industrial Property Rights Holder
  (株)日立製作所
- Filing Date
  2009-06-04
- Data Source
  KAKENHI-PROJECT-21246021
[Patent] 経年劣化した熱遮へいコーティングの非接触非破壊検査手法2006
- Inventor(s)
  小川和洋, 三浦英生, 庄子哲雄, 鈴木美紀子
- Industrial Property Rights Holder
  東北テクノアーチ
- Industrial Property Number
  2006-132395
- Filing Date
  2006-05-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360046
[Patent] Semiconductor Device and Process for Producing The Same2005
- Inventor(s)
  N. Ishi-tsuka, H. Miura, S. Ikeda
- Industrial Property Rights Holder
  Renesas Technology Corp.
- Filing Date
  2005-04-19
- Acquisition Date
  2005-09-08
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Patent] Semiconductor Device and Process for Producing The Same2005
- Inventor(s)
  N.Ishitsuka, H.Miura, S.Ikeda, et al.
- Industrial Property Rights Holder
  Renesas Technology Corp.
- Filing Date
  2005-04-19
- Acquisition Date
  2005-09-08
- Data Source
  KAKENHI-PROJECT-16206013
[Patent] 半導体装置およびその製造方法2004
- Inventor(s)
  岩崎富生, 三浦英生, 石塚典男
- Industrial Property Rights Holder
  ルネサステクノロジー(株)
- Filing Date
  2004-07-30
- Acquisition Date
  2006-11-28
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16206013
[Presentation] High Strain-Rate-induced Acceleration of Creep-Fatigue Damage in Ni-base Superalloys at Elevated Temperature2023
- Author(s)
  Hideo MIURA
- Organizer
  ESIA17 FESI/CSIC International Conference
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Presentation] Degradation of Integrity of Thin-Film Interfaces in Advanced Electronic Devices Caused by Point Defects and Strain2023
- Author(s)
  Hideo MIURA
- Organizer
  Advanced Technology in Experimental Mechanics 2023
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Presentation] Prediction of the Generation of Intergranular Cracking in Stainless Steels under Creep Loading at Elevated Temperatures2022
- Author(s)
  Hideo Miura
- Organizer
  ASME IMECE2022
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Presentation] Theoretical study on strain-controllable electron transport properties of dumbbell-shape graphene nanoribbon2022
- Author(s)
  Ken Suzuki, Qinqiang Zhang, Hideo Miura
- Organizer
  5th World Congress on Computational Mechanics & 8th Asian Pacific Congress on Computational Mechanics
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Point Defect-Induced Variation of Electronic Properties and Reliability of Oxides for High Performance Devices2022
- Author(s)
  Hideo MIURA
- Organizer
  The 12th International Conference on High-Performance Ceramics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18665
[Presentation] Strain-induced acceleration of the degradation of the crystallinity around grain boundaries in stainless steels under creep load at elevated temperature2022
- Author(s)
  Hideo Miura
- Organizer
  2022 International Symposium on Structural Integrity
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Presentation] Substrate Material Effects on the Electronic Band Structure of Graphene and the Adsorption Properties of Gas Molecules on its Surface2022
- Author(s)
  Kenryu Hasegawa, Meng Yin, Xiang Qiao, Ken Suzuki, Hideo Miura
- Organizer
  17th Asia-Pacific Conference on Fracture and Strength (APCFS2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] First-Principles Analysis on the Strain-Induced Variation of Adsorption Behavior of Gas Molecules on Graphene2022
- Author(s)
  Meng Yin，Ken Suzuki and Hideo Miura
- Organizer
  ASME VVUQ2022: Verification, Validation, and Uncertainty Quantification Symposium
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Strain-induced Change of Adsorption Behavior of Gas Molecules on Graphene: A first principles study2022
- Author(s)
  Meng Yin, Ken Suzuki, Hideo Miura
- Organizer
  15th World Congress on Computational Mechanics & 8th Asian Pacific Congress on Computational Mechanics
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Strain-Induced Change of Molecule Adsorption on a Graphene-Base Gas Sensor2021
- Author(s)
  Xiangyu Qiao, Qinqiang Zhang, Yin Meng, Wangyang Fu, Ken Suzuki, and Hideo Miura
- Organizer
  2021 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Improvement of Photosensitivity of Dumbbell-Shape GNR Structure by Applying Hetero Metallic Interconnection Structure2021
- Author(s)
  Jowesh Avisheik Goundar, Qinqiang Zhang, Ken Suzuki, and Hideo Miura
- Organizer
  2021 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Acceleration Mechanism of the Degradation of the Strength of Heat-Resistant Alloys under Creep-Fatigue Loading at Elevated Temperatures2021
- Author(s)
  Hideo Miura
- Organizer
  International Symposium on Structural Integrity
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21F50350
[Presentation] Acceleration Mechanism of the Degradation of the Strength of Heat-Resistant Alloys under Creep-Fatigue Loading at Elevated Temperatures2021
- Author(s)
  Hideo Miura
- Organizer
  2021 International Symposium on Structural Integrity
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H01205
[Presentation] Acceleration Mechanism of the Degradation of the Strength of Heat-Resistant Alloys under Creep-Fatigue Loading at Elevated Temperatures2021
- Author(s)
  Hideo Miura
- Organizer
  2021 International Symposium on Structural Integrity (ISSI2021)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Strain Sensitivity of Electron Transport Properties of Dumbbell-Shape Graphene Nanoribbon and Its Application to Mobile Photovoltaic Devices2021
- Author(s)
  Hideo Miura
- Organizer
  3rd Global Summit on Physics 2021, Prague, Chez Republic
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18665
[Presentation] Photovoltaic Properties of Dumbbell-shape Graphene Nanoribbons for Solar Cells2020
- Author(s)
  Hideo Miura
- Organizer
  The International Conference on Smart Energy Systems (SES'20)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] A First-principles Study on the Strain-induced Localized Electronic Properties of Dumbbell-shape Graphene Nanoribbon for Highly Sensitive Strain2020
- Author(s)
  Qinqiang Zhang, Ken Suzuki, and Hideo Miura
- Organizer
  International Conference on Simulation of Semiconductor Processes and Devices
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20KK0083
[Presentation] Initial Intergranular Cracking of Ni-base Superalloys due to the Degradation of the Crystallinity of Grain Boundaries under Creep-Fatigue Loading2020
- Author(s)
  Hideo Miura
- Organizer
  International Conference on Theoretical, Applied, Experimental Mechanics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Electro and Stress-Induced Migration of Various Thin Film Interconnections2020
- Author(s)
  Hideo Miura
- Organizer
  IEEE IMPACT-EMAP 2020
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature2020
- Author(s)
  Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Creep-Fatigue Loadings at Elevated Temperatures2019
- Author(s)
  Luo,Y, Suzuki,K, Miura,H
- Organizer
  International Conference of Advanced Technology in Experimental Mechanics 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] A First Principle Study on the Localized Electronic Band Structure of a Single Long Graphene Nanoribbon with Graphene Electrodes2019
- Author(s)
  Qinqiang Zhang, Ken Suzuki, Hideo Miura
- Organizer
  ISMP-EMAP2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Non-destructive Measurement of the Change of Micro Texture of Alloys Using Reflectance Spectrum Analysis of Visible lights2019
- Author(s)
  Kasama,S, Suzuki,K, Miura,H
- Organizer
  International Conference of Advanced Technology in Experimental Mechanics 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] 金属元素固有反射スペクトルを用いた構造材料劣化損傷非破壊検査技術2019
- Author(s)
  笠間　新，鈴木　研，三浦　英生
- Organizer
  日本機械学会東北学生会第49回卒業研究発表講演会
- Data Source
  KAKENHI-PROJECT-17K18817
[Presentation] Initial grain-boundary cracking of Ni-base superalloys under creep-fatigue loadings at 750℃2019
- Author(s)
  K.Ishihara, W.Suzuki, Y.Luo, K.Suzuki, and H.Miura
- Organizer
  International Conference on the Mechanical Behavior of Materials
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] めっき銅薄膜配線の機械特性とEM耐性の結晶粒界品質依存性2019
- Author(s)
  三浦　英生
- Organizer
  日本電子情報通信学会シリコン材料・デバイス材料研究会
- Invited
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Molecular Dynamics Analysis of Grain Boundary Cracking Caused by Accumulation of Vacancies and Dislocations2019
- Author(s)
  Ryo KIKUCHI, Yiqing FAN, Ken SUZUKI and Hideo MIURA
- Organizer
  10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Clarification of the Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Temperature2019
- Author(s)
  Yifan Luo, Ken Suzuki and Hideo Miura
- Organizer
  10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Grain Boundary Cracking in Ni-base Alloy 617 Under Creep-fatigue Loading at Elevated Temperatures2019
- Author(s)
  Ishihara,K, Suzuki,W, Luo,Y, Suzuki,K, Miura,H
- Organizer
  International Conference of Advanced Technology in Experimental Mechanics 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Grain Boundary Cracking of SUS316L under Creep Loading at Elevated Temperatures2019
- Author(s)
  Yukako Takahasi, Ken Suzuki and Hideo Miura
- Organizer
  10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Non-destructive evaluation of degradation of materials using reflectance spectrum of metallic elements2019
- Author(s)
  Shin Kasama, Ken Suzuki, Hideo Miura
- Organizer
  ZJU-TU Workshop on Advanced Materials and Manufacture
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K18817
[Presentation] Photoresponsivity of a Graphene Nanoribbon based Field Effect Transistor for the Development of a Multi-Junction Solar Cell using a Single Material2019
- Author(s)
  Jowesh Goundar, Ken Suzuki, Hideo Miura
- Organizer
  ISMP-EMAP2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Development of a flexible pressure distribution sensor using multi-walled carbon nanotubes2019
- Author(s)
  K.Suzuki, R.Osada, H.Miura
- Organizer
  30th International Conference on Diamond and Carbon Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Molecular Analysis of Accumulation of Vacancies and Dislocations around a Grain Boundary under Creep Loading at Elevated Temperature2019
- Author(s)
  Yiqing Fan, Ryo Kikuchi, Ken Suzuki, and Hideo Miura
- Organizer
  10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Multi-Channel Dumb-bell shaped Graphene Nanonribbon Structure to Elucidate Electronic Fluctuations for an Enhanced Performance2019
- Author(s)
  Jowesh Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
- Organizer
  IEEE 2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Quantitative Visualization of Atomic-Scale Degradation of Heat-resistant Alloys under Creep-Fatigue Loadings at Elevated Temperature2019
- Author(s)
  Yifan LUO, Wataru SUZUKI, Kenta ISHIHARA, Yan LIANG, Ken SUZUKI, Hideo MIURA
- Organizer
  2019 Global Research Efforts on Energy and Nanomaterials
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Micro texture Dependence of Mechanical Damage Mechanism of Electroplated Gold Thin Film Used for Semiconductor Device Interconnections2019
- Author(s)
  Genta Nakauchi, Ken Suzuki, Hideo Miura
- Organizer
  ISMP-EMAP2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Mechano-chemical Degradation Analysis of Heat-resistant Alloys at Elevated Temperatures in Nano-scale2019
- Author(s)
  Hideo Miura
- Organizer
  International Conference on Chemical Physics and Materials Science
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon2018
- Author(s)
  Qinqiang Zhang, Ken Suzuki, Hideo Miura
- Organizer
  IEEE 20th International Conference on Electronic Materials And Packaging
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Evaluation of the Degradation of the Strength of Grain Boundaries in Ni-Base Superalloy under Creep-Fatigue Loadings at Elevated Temperatures2018
- Author(s)
  Wataru Suzuki, Ken Suzuki, Hideo Miura
- Organizer
  15th Asia-Pacific Conference on Fracture and Strength
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Crystallinity-induced Variation of the Strength of a Grain and a Grain Boundary2018
- Author(s)
  Hideo Miura
- Organizer
  EUROPEAN ADVANCED MATERIALS CONGRESS
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation of the Strength of a Grain and a Grain Boundary Due to the Accumulation of the Structural Defects of Crystal2018
- Author(s)
  Guoxiong Zheng, Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress & Exposition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films2018
- Author(s)
  Yutaro Nakoshi, Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress & Exposition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Initial Damage Mechanism of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures2018
- Author(s)
  Yan LIANG, Ken Suzuki, Hideo Miura
- Organizer
  15th Asia-Pacific Conference on Fracture and Strength
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Observation of the Change of Micro Texture of Ni-base Alloy under Creep Loadings by Scanning a Laser Beam2018
- Author(s)
  Hideo Miura
- Organizer
  Asia-Pacific Conference on Fracture and Strength 2018
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K18817
[Presentation] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018
- Author(s)
  Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress & Exposition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement2018
- Author(s)
  Yifan Luo, Ken Suzuki, Hideo Miura
- Organizer
  15th Asia-Pacific Conference on Fracture and Strength
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement2018
- Author(s)
  Y. Luo, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Photosensitivity of Monolayer Graphene-Base Field Effect Transistor2018
- Author(s)
  Jowesh A. Goundar, Ken Suzuki, Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress & Exposition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation of the strength of a grain boundary in Ni-base superalloy under creep-fatigue loading2018
- Author(s)
  Hideo Miura
- Organizer
  1st International Conference on Theoretical, Applied, Experimental
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Variation of the Strength and Fracture Mode of a Grain and a Grain Boundary in Polycrystalline Copper Thin Films2018
- Author(s)
  Guoxiong Zheng, Ken Suzuki, Hideo Miura
- Organizer
  International Microsystems, Packaging, Assembly and Circuits Technology conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons2018
- Author(s)
  Takuya Kudo, Ken Suzuki, Hideo Miura
- Organizer
  IEEE 20th International Conference on Electronic Materials And Packaging
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections2018
- Author(s)
  Hideo Miura
- Organizer
  IEEE 20th International Conference on Electronic Materials And Packaging
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Variation of the Strength of a Grain and a Grain Boundary Caused by Atomic-Scale Crystallinity2018
- Author(s)
  Hideo Miura
- Organizer
  1st CityU-TU Joint Workshop on Advanced Materials and Manufacture
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Quantitative Characterization of the Crystallinity of Polycrystalline Materials by Applying Electron Back-Scatter Diffraction2018
- Author(s)
  Hideo Miura
- Organizer
  22nd International Conference on Advanced Materials and Nanotechnology
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures2018
- Author(s)
  Zhi Wang, Ken Suzuki, Hideo Miura
- Organizer
  International Microsystems, Packaging, Assembly and Circuits Technology conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Development of an Embedded Micro Scale Stress Sensor for Electronic Devices2018
- Author(s)
  Ryota Mizuno, Ken Suzuki, Hideo Miura
- Organizer
  5th Asia-Pacific Conference on Fracture and Strength
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Evaluation of atomic scale damages of advanced materials based on the order of atom arrangement2017
- Author(s)
  Hideo Miura
- Organizer
  11th International Conference on Advanced Materials and Processing, Research & Reviews
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Atomic-scale structural control of Graphene　nano-ribbon for smart sensor applications2017
- Author(s)
  Hideo Miura
- Organizer
  2nd Inteanational Nanotechnology Conference & Expo
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Lifetime Estimation of Thin-Film Interconnections Based on Their Crystallinity2017
- Author(s)
  Hideo Miura
- Organizer
  19th International Conference on Electronics Materials and Packaging
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings2017
- Author(s)
  Hideo Miura
- Organizer
  16th International Conference on Fracture and Damage Mechanics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K18817
[Presentation] ATOMIC SCALE DEGRADATION OF THE INITIAL STRENGTHENED MICRO TEXTURE OF HEAT-RESISTANT ALLOYS UNDER CREEP AND FATIGUE LOADINGS2017
- Author(s)
  Miura H
- Organizer
  14th International Conference on Fracture
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Local Crystallinity-Induced Deterioration of the Lifetime of Thin-Film Interconnections2017
- Author(s)
  Hideo Miura
- Organizer
  IEEE International Interconnect Technology Conference
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Degradation of crystallinity and properties of advanced functional materials caused by anisotropic local diffusion of component atoms under severe operating conditions2016
- Author(s)
  Hideo Miura
- Organizer
  6th International Conference and Exhibition on Materials Science and Engineering
- Place of Presentation
  Atlanta, USA
- Year and Date
  2016-09-12
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] Graphene Nano-Ribbon-base Highly Sensitive Strain Sensor2016
- Author(s)
  Hideo Miura
- Organizer
  International Conference and Exhibition on Nanomedicine & Nanotechnology
- Place of Presentation
  Baltimore, USA
- Year and Date
  2016-10-12
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K13824
[Presentation] Flexible Strain Sensor Using Graphene Nano-Ribbon2016
- Author(s)
  Hideo Miura
- Organizer
  2016 International Conference on Innovative and Smart Materials
- Place of Presentation
  Singapore, Singapore
- Year and Date
  2016-12-26
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K13824
[Presentation] Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries2016
- Author(s)
  Hideo Miura
- Organizer
  21st European Conference on Fracture
- Place of Presentation
  Catania, Italy
- Year and Date
  2016-06-20
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H06357
[Presentation] 原子配列の秩序性に基づく結晶粒界品質評価と材料強度支配因子の検討2016
- Author(s)
  三浦　英生
- Organizer
  マルチスケール材料力学シンポジウム
- Place of Presentation
  富山大学
- Year and Date
  2016-05-27
- Invited
- Data Source
  KAKENHI-PROJECT-16H02303
[Presentation] Graphene Nano-ribbon for a Smart Strain Senso2016
- Author(s)
  Hideo Miura
- Organizer
  2nd Annual World Congress of Smart Materials-2016
- Place of Presentation
  Singapore
- Year and Date
  2016-03-04
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K13824
[Presentation] Miniaturization-Induced Variation of Physical and Chemical Properties of Micro and Nano-Scale Materials and Structures2015
- Author(s)
  Hideo Miura
- Organizer
  7th Electronic Materials and Packaging Conference
- Place of Presentation
  Portland, USA
- Year and Date
  2015-09-01
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K13824
[Presentation] Micro-Structure Dependence of Strong Anisotropic Mechanical Properties of Poly-Crystalline Thin Films2014
- Author(s)
  Masaru Gotoh, Ken Suzuki, and Hideo Miura
- Organizer
  1st INSA de Lyon-Tohoku Univ. Mini-Workshop
- Place of Presentation
  Lyon, France
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Improvement of Device Performance in 3D Modules by Optimizing Mechanical Stress and Strain Fields2013
- Author(s)
  Hideo Miura
- Organizer
  2^<nd> Annual World Congress of Emerging Info Tech 2013
- Place of Presentation
  Dalian, China
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Improvement of Device Performance in 3D Modules by Optimizing Mechanical Stress and Strain Fields2013
- Author(s)
  Hideo Miura
- Organizer
  2nd Annual World Congress of Emerging Info Tech 2013
- Place of Presentation
  Dalian, China
- Invited
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films2013
- Author(s)
  Hideo Miura
- Organizer
  The 63rd Electronic Components and Technology Conference
- Place of Presentation
  Las Vegas, NV, USA
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Effect of Microtexture in Electroplated Copper Thin Films on Their Thermal Conductivity2013
- Author(s)
  Rittinon Pornvitoo, Osamu Asai, Ken Suzuki, Hideo Miura
- Organizer
  15th International Conference on Electronic Materials and Packing
- Place of Presentation
  Seoul, Korea
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection2013
- Author(s)
  Chuanhong Fan, Osamu Asai, Ryosuke Furuya, Ken Suzuki, Hideo Miura
- Organizer
  ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Presentation
  Burlingame, CA, USA
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] QUANTITATIVE EVALUATION OF THE CRYSTALLINITY OF GRAIN BOUNDARIES IN POLYCRYSTALLINE MATERIALS2012
- Author(s)
  Hideo Miura
- Organizer
  ASME 2012 International Mechanical Engineering Congress & Exposition
- Place of Presentation
  Houston, TX, USA
- Year and Date
  2012-11-14
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Mechanical and Electrical Reliability of Copper Interconnections for 3DIC2012
- Author(s)
  Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  Osaka
- Year and Date
  2012-01-31
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Mechanics, Strength and Reliability of Materials in Nano- and Micro Scales2012
- Author(s)
  Hideo Miura
- Organizer
  2nd Annual World Congress of Nanoscience and Nanotechnology 2012
- Place of Presentation
  Qingdao, China
- Invited
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] High Temperature Damages Process of Nickel-base Superalloy Caused by the Strain-induced Anisotropic Diffusion of Component Elements, The 3rd Tohoku Univ.-Technische Unv.2012
- Author(s)
  Ken Suzuki, Tomohiro Sano, and Hideo Miura
- Organizer
  Darmstadt Mini-Workshop
- Place of Presentation
  Darmstadt, Germany
- Year and Date
  2012-03-12
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Residual Stress in 3DICs by Controlling the Structures and Mechanical Properties of 3D Interconnections2012
- Author(s)
  Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  Osaka
- Year and Date
  2012-01-31
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Anisotropic Strain-Field-induced Change of the Electronic Conductivity of Graphene Sheets and Carbon Nanotubes2012
- Author(s)
  Hideo Miura
- Organizer
  13th International Conference on Thermal,Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- Place of Presentation
  LIsbon, Portugal
- Invited
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] QUANTITATIVE EVALUATION OF THE CRYSTALLINITY OF GRAIN BOUNDARIES IN POLYCRYSTALLINE MATERIALS2012
- Author(s)
  Hideo Miura
- Organizer
  ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)
- Place of Presentation
  Houston, TX, USA
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] カーボンナノチューブやグラフェンシートの電子バンド構造に及ぼす三次元ひずみ場の影響解析2012
- Author(s)
  鈴木研,大西正人,三浦英生
- Organizer
  応用物理学会分科会シリコンテクノロジー
- Place of Presentation
  東京
- Year and Date
  2012-11-15
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Mechanics, Strengthand Reliability of Materials in Nano-and Micro Scales2012
- Author(s)
  Hideo Miura
- Organizer
  2^<nd> Annual World Congress of Nanoscience and Nanotechnology 2012
- Place of Presentation
  Qingdao, China
- Year and Date
  2012-10-26
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Anisotropic Strain-Field-induced Change of the Electronic Conductivity of Graphene Sheets and Carbon Nanotubes2012
- Author(s)
  Hideo Miura
- Organizer
  13^<th> International Conference on Thermal,Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- Place of Presentation
  Lisbon, Portugal
- Year and Date
  2012-04-16
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] High Temperature Damages Process of Nickel-base Superalloy Caused by the Strain-induced Anisotropic Diffusion of Component Elements2012
- Author(s)
  Ken Suzuki, Tomohiro Sano, Hideo Miura
- Organizer
  The 3^<rd> Tohoku Univ.-Technische Unv.Darmstadt Mini-Workshop
- Place of Presentation
  Darmstadt, Germany
- Year and Date
  2012-03-12
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Mechanics, Strength and Reliability of Materials in Nano- and Micro Scales2012
- Author(s)
  Hideo Miura
- Organizer
  2^<nd> Annual World Congress of Nanoscience and Nanotechnology 2012
- Place of Presentation
  Qingdao, China
- Year and Date
  2012-10-27
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Mechanics, Strength and Reliability of Materials in Nano- and Micro Scales2012
- Author(s)
  Hideo Miura
- Organizer
  2nd Annual World Congress of Nanoscience and Nanotechnology 2012
- Place of Presentation
  Qingdao, China
- Invited
- Data Source
  KAKENHI-PROJECT-24656077
[Presentation] Effect of the Crystallinity of Electroplated Copper Thin Films on Their Mechanical Properties2011
- Author(s)
  Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura
- Organizer
  13^<th> International Conference on Electronics Materials and Packaging
- Place of Presentation
  Kyoto
- Year and Date
  2011-12-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会M&M2010材料力学カンファレンス
- Place of Presentation
  Fukuoka, Japan(招待講演)
- Year and Date
  2011-07-16
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Monitoring Method of Residual Stress in a Substrate During Thin Film Processing2011
- Author(s)
  Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Electronics Packaging (ICEP 2011)
- Place of Presentation
  Nara
- Year and Date
  2011-04-14
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Advanced Technology in Experimental Mechanics 2011
- Place of Presentation
  Kobe, Japan
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS2011
- Author(s)
  Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
- Organizer
  ASEM 2011 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS & EXPOSITION
- Place of Presentation
  Denver, USA
- Year and Date
  2011-11-15
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会M & M2010材料力学カンファレンス
- Place of Presentation
  Fukuoka, Japan
- Year and Date
  2011-07-16
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] 異相界面近傍の応力起因異方原子拡散に基づくNi基超合金微視組織構造の破壊2011
- Author(s)
  佐々木大和, 鈴木研, 三浦英生
- Organizer
  本機械学会M & M2010材料力学カンファレンス
- Place of Presentation
  Nagaoka, Japan
- Year and Date
  2011-10-11
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin under Strain2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, MasatoOhnishi, Ken Suzuki, Hideo Miura
- Organizer
  ASME Inter PACK 2011
- Place of Presentation
  Portland, Oregon, USA
- Year and Date
  2011-07-11
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin under Strain2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  ASME InterPACK2011
- Place of Presentation
  Portland, USA
- Year and Date
  2011-07-06
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS2011
- Author(s)
  Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
- Organizer
  ASEM 2011 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS&EXPOSITION
- Place of Presentation
  Denver, USA
- Year and Date
  2011-11-15
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Effect of the 3D Alignment of Flip Chip Bumps on the Distribution of the Local Residuals Stress in Stacked Silicon Chips2011
- Author(s)
  Kota Nakahira, Hideo Miura
- Organizer
  13^<th> International Conference on Electronics Materials and Packaging
- Place of Presentation
  Kyoto(招待講演)
- Year and Date
  2011-12-15
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] ナノスケールでの材料力学と新材料・最先端デバイスの創成2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会材料力学カンファレンスM&M2011
- Place of Presentation
  小倉,福岡(招待講演)
- Year and Date
  2011-07-18
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps2011
- Author(s)
  Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
- Organizer
  ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems (InterPACK2011)
- Place of Presentation
  Portland, Oregon, USA
- Year and Date
  2011-07-07
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Change of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets Caused by a Three-Dimensional Strain Field2011
- Author(s)
  Masato Ohnishi, Ken Suzuki, Hideo Miura, Yusuke Suzuki, Yusuke Ohashi
- Organizer
  ASME InterPACK2011
- Place of Presentation
  Portland, USA
- Year and Date
  2011-07-07
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Measurement of the Residual Stress in Nano-Scale Transistors2011
- Author(s)
  Hironori Tago, Kota Nakahira, Ken Suzuki, Hideo Miura
- Organizer
  13^<th> International Conference on Electronics Materials and Packaging
- Place of Presentation
  Kyoto
- Year and Date
  2011-12-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Remote Strain Sensor using Carbon Nanotube-Dispersed Resin2011
- Author(s)
  Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Advanced Technology in Experimental Mechanics 2011
- Place of Presentation
  Kobe, Japan
- Year and Date
  2011-09-21
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Development of Two-Dimensional Strain-Distribution Sensor UsingCarbon Nanotube-Dispersed Resin2011
- Author(s)
  Ken Suzuki, Yusuke Suzuki, YusukeOhashi, Masato Ohnishi, and Hideo Miura
- Organizer
  International Conference on SOLID STATE DEVICES ANDMATERIALS2011
- Place of Presentation
  Nagoya,Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-dispersed Resin2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, MasatoOhnishi, Ken Suzuki, and Hideo Miura
- Organizer
  ASME InterPACK2011
- Place of Presentation
  Portland,Oregon, USA
- Year and Date
  2011-07-10
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Stress-induced anisotropic diffusion of component elements in the stacked thin-film multi-layer structures2011
- Author(s)
  Tomohiro Sano, Naokazu Murata, Ken Suzuki, and Hideo Miura
- Organizer
  International Conference on Advanced Technology in Experimental Mechanics
- Place of Presentation
  Kobe, Japan
- Year and Date
  2011-09-21
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Strain Dependence of the Electronic Conductivity of Carbon Nanotubes and Graphene Sheets2011
- Author(s)
  Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on SOLID STATE DEVICES AND MATERIALS
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会材料力学カンファレンスM&M2011
- Place of Presentation
  小倉,福岡(招待講演)
- Year and Date
  2011-07-17
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-dispersed Resin2011
- Author(s)
  Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  ASME InterPACK2011
- Place of Presentation
  Portland, USA(招待講演)
- Year and Date
  2011-07-08
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会M&M2011
- Place of Presentation
  福岡
- Year and Date
  2011-07-17
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] 多結晶材料の結晶粒界品質測定と材料強度信頼性評価への適用2011
- Author(s)
  三浦英生
- Organizer
  日本学術振興会先端材料強度129委員会
- Place of Presentation
  Tokyo, Japan
- Year and Date
  2011-06-24
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Development of Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin2011
- Author(s)
  Ken Suzuki, Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Hideo Miura
- Organizer
  International Conference on SOLID STATE DEVICES AND MATERIALS
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections2011
- Author(s)
  Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura
- Organizer
  第61回Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Florida, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Masato Ohnishi, Ken Suzuki, and Hideo Miura, "Change of the Electronic Conductivity of CNTs and Graphene Sheets Caused by Three-dimensional Deformation2011
- Author(s)
  Masato Ohnishi, Ken Suzuki, Hideo Miura
- Organizer
  13^<th> International Conference on Electronics Materials and Packaging
- Place of Presentation
  Kyoto, Japan
- Year and Date
  2011-12-15
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] ナノ・マイクロスケールの材料力学と強度信頼性2011
- Author(s)
  三浦英生
- Organizer
  日本機械学会材料力学カンファレンス(M&M2011)
- Place of Presentation
  Fukuoka(基調講演)
- Year and Date
  2011-07-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Stress-Induced and Electro-migration of Electroplated Copper Thin Films Used for 3D Integration2011
- Author(s)
  Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
- Organizer
  ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems (InterPACK2011)
- Place of Presentation
  Portland, Oregon, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Mechanical Reliability of Three-dimensionally Stacked LSIs2011
- Author(s)
  Hideo Miura
- Organizer
  International Conference on Materials for Advanced Technologies
- Place of Presentation
  Suntec, Singapore(招待講演)
- Year and Date
  2011-06-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 多結晶材料の結晶粒界品質測定と材料強度信頼性評価への適用2011
- Author(s)
  三浦英生
- Organizer
  日本学術振興会先端材料強度129委員会
- Place of Presentation
  Tokyo, Japan(招待講演)
- Year and Date
  2011-06-24
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Evaluation of the Change of the Residual Stress in Nano-scale Transistors During the Deposition and Fine Patterning Processes of Thin Films2011
- Author(s)
  Hideo Miura
- Organizer
  12^<th> IEEE International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- Place of Presentation
  Linz, Austria(招待講演)
- Year and Date
  2011-04-19
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 異相界面の環境誘起劣化損傷の原子レベルシミュレーション2010
- Author(s)
  三浦英生, 鈴木研
- Organizer
  日本材料学会破壊力学部門公開委員会
- Place of Presentation
  Sapporo, Japan
- Year and Date
  2010-03-21
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS2010
- Author(s)
  Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
- Organizer
  12^<th> International Conference on Electronics Materials and Packaging, Proceedings
- Place of Presentation
  Singapore Singapore
- Year and Date
  2010-10-27
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Improvement of the Interface Integrity between a High-k Dielectric Film and a Metal Gate Electrode by Controlling Point Defects and Residual Stress2010
- Author(s)
  Ken Suzuki, Tatsuya Inoue, Hideo Miura
- Organizer
  15^<th> International Conference on Simulation of Semiconductor Processes and Devices
- Place of Presentation
  Bologna, Italy
- Year and Date
  2010-09-05
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Mechanical Reliability of 3D Stacked Silicon Chips2010
- Author(s)
  Hideo Miura
- Organizer
  The 9^<th> International Symposium on Microelectronics and Packaging
- Place of Presentation
  Seoul.Korea
- Year and Date
  2010-10-04
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures2010
- Author(s)
  Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
- Organizer
  11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems
- Place of Presentation
  Bordeaux, France
- Year and Date
  2010-04-28
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures2010
- Author(s)
  Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Electronics Packaging 2010
- Place of Presentation
  Sapporo, Japan
- Year and Date
  2010-05-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 異相界面の環境誘起劣化損傷の原子レベルシミュレーション2010
- Author(s)
  三浦英生, 鈴木研
- Organizer
  日本材料学会破壊力学部門公開委員会
- Place of Presentation
  Sapporo, Japan
- Year and Date
  2010-05-21
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] 異相界面近傍の応力起因異方原子拡散に基づくNi基超合金微視組織構造の破壊2010
- Author(s)
  佐々木大和, 鈴木研, 三浦英生
- Organizer
  日本機械学会M&M2010材料力学カンファレンス
- Place of Presentation
  Nagaoka, Japan
- Year and Date
  2010-10-11
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] High-Temperature Damages of Ni-Base Superalloy Caused by the Change of Nanotexture Due to Strain-Induced Anisotropic Diffusion2010
- Author(s)
  Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, and Hideo Miura
- Organizer
  ASME International Mechanical Engineering Congress and Exposition
- Place of Presentation
  Vancouver, Canada
- Year and Date
  2010-11-16
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures2010
- Author(s)
  Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura
- Organizer
  International Conference on Electronics Packaging 2010
- Place of Presentation
  札幌
- Year and Date
  2010-05-13
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Creep and Fatigue Damages of Nickel-Base Superalloy Based on the Strain-Induced Anisotropic Diffusion of Component Elements2010
- Author(s)
  Ken Suzuki and Hideo Miura
- Organizer
  International Conference on Fracture and Strength ICFS 2010
- Place of Presentation
  Sendai, Japan
- Year and Date
  2010-10-06
- Data Source
  KAKENHI-PROJECT-22656028
[Presentation] 異相界面の環境誘起劣化損傷の原子レベルシミュレーション2010
- Author(s)
  三浦英生, 鈴木研
- Organizer
  日本材料学会破壊力学部門公開委員会
- Place of Presentation
  札幌
- Year and Date
  2010-05-21
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACK ED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS2010
- Author(s)
  Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
- Organizer
  12^<th> International Conference on Electronics Materials and Packaging, Proceedings
- Place of Presentation
  Singapore, Orcharsd Hotel
- Year and Date
  2010-10-27
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Mechanical Reliability of 3D Stacked Silicon Chips2010
- Author(s)
  Hideo Miura
- Organizer
  The 9^<th> International Symposium on Microelectronics and Packaging
- Place of Presentation
  Seoul, Korea
- Year and Date
  2010-10-04
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] マイクロひずみ分布センサチップによる実装応力(ひずみ)の評価2010
- Author(s)
  三浦英生
- Organizer
  エレクトロニクス実装学会2010ワークショップ
- Place of Presentation
  静岡
- Year and Date
  2010-10-29
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Quantum Chemical Molecular Dynamics Simulation of Oxidation Process on Clean Metal Surface in High Temperature Water2010
- Author(s)
  Ken Suzuki, Hideo Miura
- Organizer
  第133回破壊力学部門委員会講演会
- Place of Presentation
  札幌
- Year and Date
  2010-05-12
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] マイクロひずみ分布センサチップによる実装応力(ひずみ)の評価2010
- Author(s)
  三浦英生
- Organizer
  エレクトロニクス実装学会2010ワークショップ
- Place of Presentation
  Shizuoka,Japan
- Year and Date
  2010-10-28
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Remote Non-contact Strain Sensor Using Carbon Nanotube-dispersed Resin2010
- Author(s)
  Yusuke Suzuki, Masato Ohnishi, KenSuzuki, and Hideo Miura
- Organizer
  IMPACT Conference 2010
- Place of Presentation
  Taipei Taiwan
- Year and Date
  2010-10-21
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Creep and fatigue damages of Ni-base-superalloy caused by strain-induced anisotropic diffusion of component elements2009
- Author(s)
  Hideo Miura
- Organizer
  8th International Conference on Fracture and Damage Mechanics
- Place of Presentation
  St. George's Bay, Maltai
- Year and Date
  2009-09-09
- Data Source
  KAKENHI-PROJECT-17106002
[Presentation] MEMSの実装と構造強度信頼性2009
- Author(s)
  三浦英生
- Organizer
  第39回信頼性・保全シンポジウム
- Place of Presentation
  東京
- Year and Date
  2009-07-13
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Effect of Micro-Texture of Electroplated Copper Thin Flms on Their Mechanical and Electrical Properties2009
- Author(s)
  Hideo Miura
- Organizer
  IEEE International Conf.on Electronic Materials and Packaging 2009
- Place of Presentation
  Taipei, Taiwan
- Year and Date
  2009-10-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Multi-walled Carbon Nanotube-Dispersed Resin Films for Remote Strain Measurement2009
- Author(s)
  Ken Suzuki,Katsuya Ohsaki, and Hideo Miura
- Organizer
  2009 International Conference on SolidState Devices and Materials
- Place of Presentation
  Sendai,Japan
- Year and Date
  2009-10-08
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Effect of Micro-Texture of Electroplated Copper Thin-Films on Their Mechanical and Electrical Reliability2009
- Author(s)
  三浦英生
- Organizer
  IMPACT Conference 2009 and International 3D IC Conference
- Place of Presentation
  Taipei,台湾
- Year and Date
  2009-10-23
- Data Source
  KAKENHI-PROJECT-21246021
[Presentation] Control of the Growth of the Intermetallic Compound for mechanical and electrical reliability of fine bump joints2009
- Author(s)
  Hideo Miura
- Organizer
  The ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-07-22
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Creep and fatigue damages of Ni-base-superalloy caused by strain-induced anisotropic diffusion of component elements2009
- Author(s)
  Hideo Miura
- Organizer
  8th International Conference on Fracture and Damage Mechanics
- Place of Presentation
  St.George's Bay, Malta
- Year and Date
  2009-09-09
- Data Source
  KAKENHI-PROJECT-17106002
[Presentation] NDE & T for Ni-base superalloy using a scanning blue laser microscope2009
- Author(s)
  Hideo Miura
- Organizer
  The 1^<st> International Workshop on Evaluation of Environmental Degradation of Materials and Proactive Aging Management
- Place of Presentation
  東京
- Year and Date
  2009-06-05
- Data Source
  KAKENHI-PROJECT-17106002
[Presentation] Stabilization of Temperature Characteristics of Micromirror for Low-Voltage Driving Using Thin Film Torsion Bar of Tensile Poly-Si2008
- Author(s)
  Minoru Sasaki, Masayuki Fujishima, Kazuhiro Hane, Hideo Miura
- Organizer
  Program of 2008 IEEE/LEOS Int. Conf. Optical MEMS and Nanophotonics
- Place of Presentation
  Freiburg, Germany
- Year and Date
  2008-08-13
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Micromirror Using Thin Film Torsion Bar with Crystallization-Induced Stress2008
- Author(s)
  Minoru Sasaki, Masayuki Fujishima, Hideo Miura, Kazuhiro Hane
- Organizer
  The 2nd International Symposium on Next-Generation Actuators Leading Breakthroughs
- Place of Presentation
  Makuhari, Japan
- Year and Date
  2008-04-17
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] 格子欠陥とひずみの相互作用に基づく材質劣化機構解析と実証研究(招待講演)2008
- Author(s)
  三浦英生
- Organizer
  日本材料学会
- Place of Presentation
  東北大学
- Year and Date
  2008-07-25
- Data Source
  KAKENHI-PROJECT-17106002
[Presentation] Optically Flat Micromirror Designs Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, and Hideo Miura
- Organizer
  Proceedings of 2007 IEEE/LEOS Annual Meeting Conference, ThC2
- Place of Presentation
  Florida, USA
- Year and Date
  2007-10-25
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Optically Flat Micromirror Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, and Hideo Miura
- Organizer
  Proceedings of Optical MEMS & Nanophotonics 2007, International Conference on Optical MEMS and Nanophotonics, MC3
- Place of Presentation
  Hualien, Taiwan
- Year and Date
  2007-08-13
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Optically Flat Micromirror Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, Hideo Miura
- Organizer
  International Conference on Optical MEMS and Nanophotonics
- Place of Presentation
  Hualien, Taiwan
- Year and Date
  2007-08-13
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Optically Flat Micromirror Designs Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, Hideo Miura
- Organizer
  Proceedings of 2007 IEEE LEOS Annual Meeting Conference, ThC2, pp.709-710.
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2007-10-25
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Optically Flat Micromirror Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, Hideo Miura
- Organizer
  Proceedings of The 4th Public Symposium on Next-Generation Actuators Leading Breakthroughs
- Place of Presentation
  Okinawa, Japan
- Year and Date
  2007-11-19
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] Optically Flat Micromirror Using Stretched Membrane with Crystallization-Induced Stress2007
- Author(s)
  Minoru Sasaki, Takashi Sasaki, Kazuhiro Hane, Hideo Miura
- Organizer
  Proceedings of The 4th Public Symposium on Next-Generation Actuators Leading Breakthroughs, pp.49-52
- Place of Presentation
  Okinawa, Japan
- Year and Date
  2007-11-19
- Data Source
  KAKENHI-PROJECT-19016003
[Presentation] MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING
- Author(s)
  Fumiaki Endo, Hideo Miura
- Organizer
  ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)
- Place of Presentation
  Houston, TX, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] エレクトロニクス実装における力学的信頼性の検討課題
- Author(s)
  三浦　英生
- Organizer
  第2回新生デバイス実装研究会
- Place of Presentation
  アクア博多（福岡）
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections
- Author(s)
  Hideo Miura
- Organizer
  IEEE 62nd Electronic Components and Technology Conference
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnections Embedded in a Silicon Substrate
- Author(s)
  Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
- Organizer
  ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Presentation
  Burlingame, California, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Effect of Microtexture in Electroplated Copper Thin Films on Their Thermal Conductivity
- Author(s)
  Rittinon Pornvitoo, Osamu Asai, Ken Suzuki, Hideo Miura
- Organizer
  15th International Conference on Electronic Materials and Packing
- Place of Presentation
  Seoul, Korea
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films
- Author(s)
  Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Improvement of Device Performance in 3D Modules by Optimizing Mechanical Stress and Strain Fields
- Author(s)
  Hideo Miura
- Organizer
  2nd Annual World Congress of Emerging Info Tech 2013
- Place of Presentation
  Dalian, China
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging
- Author(s)
  Ken Suzuki, Ryosuke Furuya, Fumiaki Endo and Hideo Miura
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection
- Author(s)
  Chuanhong Fan, Hideo Miura
- Organizer
  IEEE 14th International Conference on Electronic Materials and Packaging (EMAP 2012)
- Place of Presentation
  Hong Kong, China
- Data Source
  KAKENHI-PROJECT-21226009

1. SUZUKI Ken (40396461)

# of Collaborated Projects: 9 results

# of Collaborated Products: 160 results
2. WANG RUNZI

# of Collaborated Projects: 4 results

# of Collaborated Products: 5 results
3. OGAWA Kazuhiro (50312616)

# of Collaborated Projects: 3 results

# of Collaborated Products: 1 results
4. SHOJI Tetsuo (80091700)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
5. HANE Kazuhiro (50164893)

# of Collaborated Projects: 2 results

# of Collaborated Products: 11 results
6. MIYAMOTO Akira (50093076)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
7. KUBO Momoji (90241538)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
8. SASAKI Minoru (70282100)

# of Collaborated Projects: 1 results

# of Collaborated Products: 11 results
9. KUMAGAI Shinya (70333888)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. FUKUSHIMA Takafumi (10374969)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. TANAKA Testu (40417382)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. PEI Yanli (70451622)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. KIYOYAMA Kouji (60412722)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. GAO Wei (70270816)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. SASAGAWA Kazuhiko (50250676)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
17. KOMAZAKI Shin-ichi (70315646)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
18. TAMAKAWA Kinji (30005368)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
19. SATO Yasumoto (30396460)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
20. DAVEY THERESA (10816987)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
21. 陳迎 (40372403)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
22. Yang Meng

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
23. Sasaki Shin-ichiro

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
24. Murakoshi Takuya

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
25. Shinozaki Taichi

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
26. Sakamoto Hayato

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
27. Suzuki Wataru

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
28. Sawase Akari

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
29. Kasama Shin

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
30. 岩崎富生

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
31. Cheng Lei

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
32. Cai Qingwu

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results

Miura Hideo 三浦 英生

MIURA Hideo 三浦 英生

Research Projects

Research Products

Co-Researchers

Clarification of the Degradation Mechanism of the Strength of Heat-Resistant Alloys under Random Creep-Fatigue Load at Elevated TemperaturePrincipal Investigator

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Quantitative Evaluation of residual life of heat-resistant alloy under random creep-fatigue loadings at elevated temperaturePrincipal Investigator

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Construction of Production Base of Strain-Controlled Graphene Nanoribbon-Base Bio-Sensor for Detecting Multi-Molecules in LiquidPrincipal Investigator

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高温変動負荷環境における耐熱合金強度劣化損傷機構の解明と残存寿命予測技術の確立Principal Investigator

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高温変動負荷環境における耐熱合金強度劣化損傷機構の解明と残存寿命予測技術の確立Principal Investigator

Principal Investigator

Project Period (FY)

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Research Institution

Explication of the degradation mechanism of the strength of heat-resistant alloys under random loading at elevated temperatures and the establishment of the prediction method of their lifetimePrincipal Investigator

Principal Investigator

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Research Institution

Strain-Controlled Graphene-Nanoribbon-Base Biochemical Sensors with High Selectivity and Sensitivity

Principal Investigator

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Degradation Analysis of Engineering Materials in Air Using White Light and Precise Optical FilterPrincipal Investigator

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Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of MaterialsPrincipal Investigator

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原子配列の秩序性変化に着目した材料の高温初期損傷評価システムの開発Principal Investigator

Principal Investigator

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Development and Evaluation of Multi-Functional Thin-Film Devices Using Graphene Nanoribbon Under Three-Dimensional Strain FieldPrincipal Investigator

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Quantitative Evaluation of the Crystallinity of Grain Boundaries in Nano ScalePrincipal Investigator

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Interface integrity based on the control of strain-induced anisotropic diffusionPrincipal Investigator

Principal Investigator

Project Period (FY)

Miura Hideo 三浦英生

MIURA Hideo 三浦英生

[Book] 破壊力学体系-壊れない製品設計に向けて-, 第12章2節薄膜デバイスの信頼設計2012

[Book] 機械工学便覧デザイン編β2 材料学・工業材料2006