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Takagi Hideki  高木 秀樹

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… Alternative Names

高木 秀樹  タカギ ヒデキ

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Researcher Number 00357344
Other IDs
Affiliation (Current) 2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 首席研究員
Affiliation (based on the past Project Information) *help 2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 首席研究員
2018: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 副研究センター長
2017: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 総括研究主幹
2016: 国立研究開発法人産業技術総合研究所, 集積マイクロシステム研究センター, 総括研究主幹
Review Section/Research Field
Except Principal Investigator
Basic Section 26030:Composite materials and interfaces-related / Production engineering/Processing studies
Keywords
Except Principal Investigator
接合界面 / ダイヤモンド / Ga2O3 / GaN / 界面熱抵抗 / デバイス設計・製造プロセス / 電子・電気材料 / マイクロ・ナノデバイス / 封止 / 平滑化 … More / 気密封止 / 表面平滑化 / MEMS / 微細加工 / MEMS / 実装 / マイクロデバイス / 常温接合 Less
  • Research Projects

    (2 results)
  • Research Products

    (3 results)
  • Co-Researchers

    (5 People)
  •  異種材料間でのフォノン輸送効率化に支配的な要因の明確化

    • Principal Investigator
      松前 貴司
    • Project Period (FY)
      2025 – 2027
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      National Institute of Advanced Industrial Science and Technology
  •  Room temperature metal bonding for highly hermetic sealing of microdevice

    • Principal Investigator
      Kurashima Yuichi
    • Project Period (FY)
      2016 – 2018
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Production engineering/Processing studies
    • Research Institution
      National Institute of Advanced Industrial Science and Technology

All 2019 2018 2017

All Journal Article Presentation

  • [Journal Article] Room-temperature Au?Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns2018

    • Author(s)
      Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
    • Journal Title

      Microelectronic Engineering

      Volume: 189 Pages: 1-5

    • DOI

      10.1016/j.mee.2017.12.004

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16K06034
  • [Presentation] Auメッキ封止枠を用いた常温気密封止接合 ―剥離転写法によるメッキ表面の平滑化―2019

    • Author(s)
      倉島優一 松前貴司 日暮栄治 高木秀樹
    • Organizer
      2019年度精密工学会春季大会学術講演会
    • Data Source
      KAKENHI-PROJECT-16K06034
  • [Presentation] Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air2017

    • Author(s)
      Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
    • Organizer
      2017 5th International Workshop on Low Temperature Bonding For 3d Integration
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K06034
  • 1.  Kurashima Yuichi (70408730)
    # of Collaborated Projects: 2 results
    # of Collaborated Products: 3 results
  • 2.  鈴木 健太 (60709509)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 3.  松前 貴司 (10807431)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 4.  八木 貴志 (10415755)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 5.  山下 雄一郎 (60462834)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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