Tatsumi Hiroaki 巽裕章

Researcher Number	00961757
Other IDs	https://orcid.org/0000-0002-0561-3100
Affiliation (Current)	2026: 大阪大学, 接合科学研究所, 准教授
Affiliation (based on the past Project Information) *help	2026: 大阪大学, 接合科学研究所, 准教授 2024: 大阪大学, 接合科学研究所, 准教授 2022 – 2023: 大阪大学, 接合科学研究所, 講師
Review Section/Research Field	Principal Investigator Basic Section 26050:Material processing and microstructure control-related / 0401:Materials engineering, chemical engineering, and related fields
Keywords	Principal Investigator 複合材 / 半導体実装 / はんだ / 光造形３Dプリンティング（SLA） / ラティス構造 / ＳＬＡ / 光造形３Ｄプリンティング / 剛性 / ロータス型ポーラス銅 / 接合 / 熱伝導性 / ポーラス材料 / エレクトロニクス実装

Research Projects
(3 results)
Research Products
(11 results)

熱疲労を活用した低融点合金の自発的方位配向機構の解明と高信頼接合への展開Principal Investigator
- Principal Investigator
  
  巽裕章
- Project Period (FY)
  2026 – 2028
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  The University of Osaka
Development of Solder-based Composite Joints utilizing Carbon MicrolatticesPrincipal Investigator
- Principal Investigator
  
  巽裕章
- Project Period (FY)
  2023 – 2025
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Osaka University
Development of highly heat-conductive and low stiffness joint utilizing anisotropic microcomposite structurePrincipal Investigator
- Principal Investigator
  
  Tatsumi Hiroaki
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Research Activity Start-up
- Review Section
  
  0401:Materials engineering, chemical engineering, and related fields
- Research Institution
  Osaka University

All 2024 2023 2022

All Journal Article Presentation Patent

[Journal Article] Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging2022
- Author(s)
  Tatsumi Hiroaki、Nishikawa Hiroshi
- Journal Title
  
  Materials & Design
  
  Volume: 223 Pages: 111204-111204
- DOI
  10.1016/j.matdes.2022.111204
- Data Source
  KAKENHI-PROJECT-22K20480
[Patent] 熱界面構造及び該熱界面構造の形成方法2023
- Inventor(s)
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Holder
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2023-066481
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K20480
[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023
- Inventor(s)
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Holder
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Overseas
- Data Source
  KAKENHI-PROJECT-22K20480
[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023
- Inventor(s)
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Holder
  巽裕章,井手拓哉,村上政明,沼田富行
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Overseas
- Data Source
  KAKENHI-PROJECT-22K20480
[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2022
- Inventor(s)
  巽裕章、井手拓哉、村上政明、沼田富行
- Industrial Property Rights Holder
  巽裕章、井手拓哉、村上政明、沼田富行
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2022-133874
- Filing Date
  2022
- Data Source
  KAKENHI-PROJECT-22K20480
[Presentation] Balance between Volumetric Shrinkage and Mechanical Properties of Pyrolyzed Carbon Lattice2024
- Author(s)
  Yu-Yen Chen, Hiroaki Tatsumi, Hiroshi Nishikawa
- Organizer
  2024 Japan-Taiwan Workshop on Electronic Interconnection IV
- Data Source
  KAKENHI-PROJECT-23K13575
[Presentation] ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価2024
- Author(s)
  巽裕章，磯野浩，平瀬加奈，井手拓哉，西川宏
- Organizer
  第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)
- Data Source
  KAKENHI-PROJECT-22K20480
[Presentation] Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite2024
- Author(s)
  Hiroaki Tatsumi, Hiroshi Isono, Kana Hirase, Takuya Ide, Hiroshi Nishikawa
- Organizer
  2024 International Conference on Electronics Packaging (ICEP2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K20480
[Presentation] High-Thermal-Performance Power Semiconductor Module using Solder/Copper Composite Joints2023
- Author(s)
  Hiroaki Tatsumi
- Organizer
  The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K20480
[Presentation] Enhanced Thermal Conductivity in Micro Composite Structure Joints Utilizing Porous Cu Sheets2023
- Author(s)
  Hiroaki Tatsumi, Hiroshi Nishikawa
- Organizer
  The 5th International Conference on Nanojoining and Microjoining (NMJ 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K20480
[Presentation] Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage2022
- Author(s)
  Tatsumi Hiroaki、Nishikawa Hiroshi
- Organizer
  TMS2023 152nd Annual Meeting Exhibition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K20480

Tatsumi Hiroaki 巽 裕章

Research Projects

Research Products

熱疲労を活用した低融点合金の自発的方位配向機構の解明と高信頼接合への展開Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of Solder-based Composite Joints utilizing Carbon MicrolatticesPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of highly heat-conductive and low stiffness joint utilizing anisotropic microcomposite structurePrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging2022

Author(s)

Journal Title

DOI

Data Source

[Patent] 熱界面構造及び該熱界面構造の形成方法2023

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Industrial Property Number

Filing Date

Data Source

[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Filing Date

Data Source

[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Filing Date

Data Source

[Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2022

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Industrial Property Number

Filing Date

Data Source

[Presentation] Balance between Volumetric Shrinkage and Mechanical Properties of Pyrolyzed Carbon Lattice2024

Author(s)

Organizer

Data Source

[Presentation] ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価2024

Author(s)

Organizer

Data Source

[Presentation] Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite2024

Author(s)

Organizer

Data Source

[Presentation] High-Thermal-Performance Power Semiconductor Module using Solder/Copper Composite Joints2023

Author(s)

Organizer

Data Source

[Presentation] Enhanced Thermal Conductivity in Micro Composite Structure Joints Utilizing Porous Cu Sheets2023

Author(s)

Organizer

Data Source

[Presentation] Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage2022

Author(s)

Organizer

Data Source

Tatsumi Hiroaki 巽裕章