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All Journal Article Presentation
Proc. of 12th IEEE CPMT Symposium Japan (ICSJ2023)
Volume: - Pages: 113-116
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume: 11 Issue: 6 Pages: 931-943
10.1109/tcpmt.2021.3079159
Proc. of 2021 International Conference on Electronics Packaging (ICEP)
Volume: -
Proc. of The 35th International Technical Conference on Circuits/Systems, Computers and Communications
Volume: - Pages: 141-144
Journal of The Japan Institute of Electronics Packaging
Volume: 23 Issue: 6 Pages: 539-542
10.5104/jiep.23.539
130007894820
Volume: 10 Issue: 5 Pages: 895-907
10.1109/tcpmt.2020.2973182
Proc. of The IEEE 2019 International 3D Systems Integration Conference
Volume: 1 Pages: 1-5
10.1109/3dic48104.2019.9058777
電子情報通信学会技術研究報告
Volume: 118 Pages: 119-124
Volume: 117 Pages: 13-18
Volume: 118 Pages: 131-136
Proc. of IEEE CPMT Symposium Japan 2018
Volume: 1 Pages: 189-192
10.1109/icsj.2018.8602560
IEICE Trans. Inf. & Syst.
Volume: E101.D Issue: 8 Pages: 2053-2063
10.1587/transinf.2018EDP7093
130007429462
Volume: 116 Pages: 105-110
Volume: 115 Pages: 13-18
Volume: 115 Pages: 31-36
WRTLT2014
Volume: - Pages: 49-54
Volume: E96.D Issue: 9 Pages: 1986-1993
10.1587/transinf.E96.D.1986
130003370987
Proc. IEEE 22nd Asian Test Symposium
Volume: - Pages: 79-84
10.1109/ats.2013.23
