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Miura Yoshinao  三浦 喜直

ORCIDConnect your ORCID iD *help
Researcher Number 90828287
Affiliation (Current) 2025: 国立研究開発法人産業技術総合研究所, エネルギー・環境領域, 主任研究員
Affiliation (based on the past Project Information) *help 2020 – 2022: 国立研究開発法人産業技術総合研究所, エネルギー・環境領域, 主任研究員
Review Section/Research Field
Principal Investigator
Basic Section 21050:Electric and electronic materials-related
Keywords
Principal Investigator
絶縁化 / 外周構造 / 高耐圧化 / GaNパワーデバイス / 硼素 / イオン注入 / 硼素イオン注入 / 電界緩和 / 終端構造 / 高耐圧 / 縦型パワーデバイス / 窒化ガリウム
  • Research Projects

    (1 results)
  • Research Products

    (12 results)
  • Co-Researchers

    (2 People)
  •  Study of boron-implanted resistive crystal layers to enhance avalanche ruggedness of ultra-low loss GaN power devicesPrincipal Investigator

    • Principal Investigator
      Miura Yoshinao
    • Project Period (FY)
      2020 – 2022
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Review Section
      Basic Section 21050:Electric and electronic materials-related
    • Research Institution
      National Institute of Advanced Industrial Science and Technology

All 2023 2022 2021

All Journal Article Presentation Patent

  • [Journal Article] Wafer-scale Fabrication of Vertical GaN p-n Diodes with Graded JTE Structures Using Multiple-zone Boron Implantation2022

    • Author(s)
      Miura Yoshinao、Hirai Hirohisa、Nakajima Akira、Harada Shinsuke
    • Journal Title

      Proc. of International Symposium on Power Semiconductor Devices and ICs

      Volume: 2022 Pages: 329-332

    • DOI

      10.1109/ispsd49238.2022.9813654

    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Journal Article] Wafer-scale Fabrication of Vertical GaN p-n Diodes with Graded JTE Structures Using Multiple-zone Boron Implantation2022

    • Author(s)
      Yoshinao Miura, Hirohisa Hirai, Akira Nakajima, and Shinsuke Harada
    • Journal Title

      Proc. Int. Symp. Power Semiconductor Devices and IC’(ISPSD))

      Volume: -

    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Journal Article] A New JTE Technique for Vertical GaN Power Devices by Conductivity Control Using Boron Implantation into p-Type Layer2022

    • Author(s)
      Miura Yoshinao、Hirai Hirohisa、Nakajima Akira、Harada Shinsuke
    • Journal Title

      Proc. of International Symposium on Power Semiconductor Devices and ICs

      Volume: 2021 Pages: 343-346

    • DOI

      10.23919/ispsd50666.2021.9452219

    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Journal Article] A New JTE Technique for Vertical GaN Power Devices by Conductivity Control Using Boron Implantation into p-Type Layer2021

    • Author(s)
      Yoshinao Miura, Hirohisa Hirai, Akira Nakajima, and Shinsuke Harada
    • Journal Title

      Proc. Int. Symp. Power Semiconductor Devices and IC’(ISPSD))

      Volume: - Pages: 354-357

    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Patent] 半導体装置および半導体装置の製造方法2023

    • Inventor(s)
      三浦喜直、中島昭、沈旭強、平井悠久、原田信介
    • Industrial Property Rights Holder
      国立研究開発法人産業技術総合研究所
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2023-515445
    • Filing Date
      2023
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Patent] 半導体装置および半導体装置の製造方法2022

    • Inventor(s)
      三浦喜直、中島昭、沈旭強、平井悠久、原田信介
    • Industrial Property Rights Holder
      国立研究開発法人産業技術総合研究所
    • Industrial Property Rights Type
      特許
    • Filing Date
      2022
    • Overseas
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Patent] 半導体装置および半導体装置の製造方法2021

    • Inventor(s)
      三浦喜直 中島昭 沈旭強 平井悠久 原田信介
    • Industrial Property Rights Holder
      国立研究開発法人産業技術総合研究所
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2021-072595
    • Filing Date
      2021
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Presentation] A New JTE Technique for Vertical GaN Power Devices by Conductivity Control Using Boron Implantation into p-Type Layer2022

    • Author(s)
      Y. Miura, H. Hirai, A. Nakajima, and S. Harada
    • Organizer
      ISPSD2021
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Presentation] 硼素イオン注入による伝導度制御p型GaNエピ層を用いた縦型素子用JTE構造の設計2022

    • Author(s)
      三浦喜直、平井悠久、中島昭、原田信介
    • Organizer
      第9回先進パワー半導体分科会
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Presentation] Wafer-scale Fabrication of Vertical GaN p-n Diodes with Graded JTE Structures Using Multiple-zone Boron Implantation2022

    • Author(s)
      Y. Miura, H. Hirai, A. Nakajima, and S. Harada
    • Organizer
      ISPSD2022
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Presentation] Wafer-scale Fabrication of Vertical GaN p-n Diodes with Graded JTE Structures Using Multiple-zone Boron Implantation2022

    • Author(s)
      Yoshinao Miura, Hirohisa Hirai, Akira Nakajima, and Shinsuke Harada
    • Organizer
      Int. Symp. Power Semiconductor Devices and IC’(ISPSD)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-20K04590
  • [Presentation] A New JTE Technique for Vertical GaN Power Devices by Conductivity Control Using Boron Implantation into p-Type Layer2021

    • Author(s)
      Yoshinao Miura, Hirohisa Hirai, Akira Nakajima, and Shinsuke Harada
    • Organizer
      Int. Symp. Power Semiconductor Devices and IC’(ISPSD)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-20K04590
  • 1.  沈 旭強 (50272381)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 2.  中島 昭 (60450657)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 9 results

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