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All Journal Article Presentation
2018 IEEE International Electron Devices Meeting (IEDM)
Volume: 2018
10.1109/iedm.2018.8614674
ECS Transactions
Volume: 77 Pages: 51-57
10.1149/07706.0051ecst
Jpn. J. Appl. Phys.
Volume: 55 Issue: 4S Pages: 04EB04-04EB04
10.7567/jjap.55.04eb04
210000146272
Journal of Applied Physics
Volume: 118
10.1063/1.4937147
Thin Solid Films
Volume: Vol.519 Pages: 4216-4219
10.1016/j.tsf.2011.02.034
Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials
Pages: 20-21
Electrochemical Society Inc., ECS Transactions
Volume: Vol.41 Pages: 137-146
Volume: 41(Invited) Pages: 137-146
Volume: Vol.50 Issue: 10 Pages: 10PD03-10PD03
10.1143/jjap.50.10pd03
Volume: 41 Pages: 265-272
Volume: 50 Issue: 10 Pages: 10PD02-10PD02
10.1143/jjap.50.10pd02
ゲートスタック研究会-材料・プロセス・評価の物理
Volume: 16 Pages: 127-130
第17回ゲートスタック研究会-材料・プロセス・評価の物理-
Pages: 77-80
Japanese Journal of Applied Physics
Volume: 51(4)
Volume: 16 Pages: 131-134
Pages: 157-160
Volume: Vol.33, No.3 Pages: 467-472
110008900164
Jpn.J.Appl.Phys.
Volume: Vol.49,No.6
Volume: Vol.33,No.3 Pages: 467-472
Appl.Phys.Express
Volume: Vol.3,No.5
10027014913
2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings
Volume: Part 2 of 3 Pages: 990-993
第15回ゲートスタック研究会-材料・プロセス・評価の物理-
Pages: 193-196
Volume: Vol.28, No.2 Pages: 129-137
Proceedings of 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
Volume: 2(3) Pages: 990-993
ECS Transaction
Volume: 33 Pages: 467-472
ゲートスタック研究会-材料・プロセス・評価の物理- 15
Pages: 175-178
JOURNAL OF APPLIED PHYSICS 106
Japanese Journal of Applied Physics 48巻
40016559583
ゲートスタック研究会-材料・プロセス・評価の物理- 第14回
Journal of Applied Physics Vol. 106, No. 12
Electrochemical Society Inc., Vienna, Austria, ECS Transactions Vol.25
Pages: 321-326
Japanese Journal of Applied Physics 48
Journal of Physics Vol. 100
Applied Physics Letters Vol. 93
Electrochemical Society Inc., Hawai, ECS Transactions Vol. 16
Pages: 171-176
Journal of Physics : Conference Series Vol. 100
Journal of Applied Physics Vol. 104, No. 11
Journal of Physics Vol.100
Journal of Applied Physics Vol. 104, No. 7
Journal of Applied Physics Vol. 104, No. 9
Progress in Surface Science Vol. 82
Pages: 3-54
Electrochemical Society Inc., Washington, ECS Transactions Vol. 11
Pages: 183-194
Japanese Journal of Applied Physics Vol. 46, No. 4B
Pages: 1895-1898
10022545462
Applied Physics Letters Vol. 90, No. 12
Microelectronics Reliability Vol. 47
Pages: 20-26
Electrochemical Society Inc., Washington, ECS Transactions Vol.11
International Journal of High Speed Electronics and Systems (to be published in)
IEEE 2006 Int. Conf. Solid-State and Integrated Circuit Technology
Pages: 368-371
応用物理学会分科会シリコンテクノロジー No.82-2
Pages: 55-60
110004757013
Journal de Physique IV Vol.132
Pages: 273-277
Applied Physics letters Vol. 89
Journal de Physique IV 132
Pages: 83-86
2006 Int. Workshop on Dielectric Thin Films for Future ULSI Device-Science and Technology-
Pages: 25-26
Journal of Electron Spectroscopy and Related Phenomena 144-147
Pages: 1063-1065
Electrochemical Society Inc.Society Inc.ECS Transactions 1
Pages: 87-95
Microelectronic Engineering 80
Pages: 98-101
Microelectronic Engineering Vol.80
Nuclear Instruments and Methods in Physics Research A 547
Pages: 50-55
ECS Transactions 1
Materials Science Forum 483-485
Pages: 585-588
Applied Physics Letters 86・8
Applied Surface Science 234
Pages: 493-496
Applied Surface Science Vol.234
Microelectronic Engineering 72
Pages: 283-287
Applied Physics Letters 84・19
Pages: 3756-3758
Applied Surface Science 234・1〜4
Pages: 197-201
10011880703
Microelectronic Engineering Vol.72
Applied Surface Science 216
Pages: 234-238
Applied Physics Letters 83
Pages: 1005-1007
120002338858
Int.J.High Speed Electronics and Systems (to be publised)
