Fukushima Takafumi 福島誉史

… Alternative Names

FUKUSHIMA Takafumi 福島誉史

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Researcher Number	10374969
Other IDs	https://orcid.org/0000-0003-2303-8178
External Links
Affiliation (Current)	2026: 東北大学, 医工学研究科, 教授 2026: 東北大学, 未来科学技術共同研究センター, 教授 2026: 東北大学, 工学研究科, 教授
Affiliation (based on the past Project Information) *help	2025 – 2026: 東北大学, 医工学研究科, 教授 2024: 東北大学, 工学研究科, 教授 2016 – 2024: 東北大学, 工学研究科, 准教授 2015: 東北大学, 工学(系)研究科(研究院), 准教授 2010 – 2014: 東北大学, 未来科学技術共同研究センター, 准教授 … More 2007 – 2009: Tohoku University, Graduate School of Engineering, Assistant Professor 2006: 東北大学, 大学院工学研究科, 助手 2005 – 2006: 東北大学, 大学院・工学研究科, 助手 Less
Review Section/Research Field	Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Electronic materials/Electric materials / Electron device/Electronic equipment / Composite materials/Surface and interface engineering Except Principal Investigator Electron device/Electronic equipment / Basic Section 21060:Electron device and electronic equipment-related / Medium-sized Section 90:Biomedical engineering and related fields / Medium-sized Section 21:Electrical and electronic engineering and related fields / Medical systems / Science and Engineering
Keywords	Principal Investigator TSV / FHE / チップレット / フレキシブルデバイス / 3D-IC / 自己組織化 / フレキシブル / 三次元実装 / 常温接合 / FOWLP … More / マイクロLEDディスプレイ / マイクロLED / ブロック高分子 / 誘導自己組織化 / 三次元集積回路 / システムオンチップ / 熱硬化性樹脂 / マイクロ・ナノ加工 / 蓄電池 / エネルギー / トレンチキャパシタ / 高分子誘電体 / DC-DCコンバータ / 絶縁破壊電圧 / ロールトゥーロール / エネルギー貯蔵 / フレキシブル集積 / 垂直配線 / システムインテグレーション / 実装工学 / フレキシブルインターコネクト / 半導体実装工学 / Cuピラー / アセンブリ / マストランスファー / 半導体パッケージング工学 / 表面張力 / 貫通配線 / 微小コンポーネント / 自己組織化実装 / ナノアセンブリ / ウェアラブルディスプレイ / 成型加工 / 半導体パッケージング / ディスプレイ / めっき / ヘテロインテグレーション / Micro-LED / ヘルスケアデバイス / フレキシブルエレクトロニクス / 低温接合 / 血管可視化シート / ウエアラブルデバイス / ナノ配線 / 染色 / ナノワイヤ / 超微細配線 / DSA / 三次元集積 / フレキシブルコイル / 高分子材料 / 応力 / マイクロXRD / PDMS / ウエハレベルパッケージ / 応力エンジニアリング / 応力解析 / 埋め込みデバイス / 無線給電 / 人工網膜 / 材料力学 / 応力制御 / 半導体パッケージ / システム集積 / チップ内蔵 / 微細配線 / 生体適合性 / ウエハレベルパッケージング / ハイドロゲル / デバイス設計・製造プロセス / 電子・電気材料 / 高密度実装 / 三次元配線 / 複合材料 / 3D LSI / ボトムアップ / 金属ナノ粒子 / 極微細配線 / ナノコンポジット / 狭ピッチ電極接合 / 三次元積層型集積回路 / ナノ相分離 / CVD / SiO2 / 気相堆積ポリイミド / 接合界面 / 接着 / ＴＳＶ / ポリイミド / 気相堆積重合 / 接合 / パッケージ / 耐熱性高分子 / セルフアセンブリ / 応用 / パッケージのシステム化 / インターコネクト / 微細接続 / 流体 / マイクロ・ナノデバイス / インターコネクト・パッケージのシステム化・応用 / アンダーフィル / 耐熱性樹脂 / システムインパッケージ / 半導体微細加工技術 / ナノフィラー … More Except Principal Investigator 三次元集積回路 / 人工網膜 / 医用システム / 生体医工学 / 半導体メモリ / 人工視覚 / 生体適合性 / 不揮発性メモリ / 半導体物性 / 半導体超微細化 / トンネル効果 / メモリ / 半導体 / チップレット / ニューラルネットワーク / SNN / STDP / トンネルFET / スパイキングニューラルネットワーク / 透明電極 / FOWLP / 人間医工学 / High Speed Data Transfer / Parallel Processing System / Optical Wave Guide / Optical Interconnection / Wafer Bonding / Three-Dimensional Integration / Multiport Shared Memory / Three-Dimensionally Stacked Processor / ウェーハ張り合わせ / 高速データ転送 / 並列処理システム / 光導波路 / 光インターコネクション / ウェーハ貼り合わせ / 三次元積層化技術 / マルチポート共有メモリ / 三次元積層型プロセッサ / 高次視覚処理 / 3次元集積回路 / 半導体神経工学 / 視覚情報処理 / 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ / Charge Injection Capacity / Cyclic Voltammetry / EEP / 埋め込み術式 / ラプラシアンフィルタ / 低消費電力 / 医用マイクロ・ナノシステム / 光電子集積システム・オン・チップ / シリコン貫通配線 / スーパーチップ / 光電子集積化 / 三次元集積化 / セルフアセンブリー / グラフォアセンブリー / 雷子デバイス / 超薄膜 / デバイス設計 / 電子デバイス / 不挿発性メモリ / High-K絶縁膜 / ナノ材料 / 電子デバイス・集積回路 / 量子ドット Less

三次元直交積層メモリ・オン・プロセッサの工学的技術基盤研究Principal Investigator
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2026 – 2028
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
人と同じ広視野・高機能視覚を有する三次元積層チップレット型完全埋植人工網膜の開発
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
トンネルFET構造による3D-NANDフラッシュメモリの超多値化
- Principal Investigator
  
  木野久志
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
Energy Storage Roll Fabrication Based on Flexible Hybrid Electronics and Advanced Microelectronics PackagingPrincipal Investigator
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2023 – 2027
- Research Category
  
  Fund for the Promotion of Joint International Research (International Collaborative Research)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Holistic Integration Engineering with Micro-assembly and WireletsPrincipal Investigator
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2022 – 2025
- Research Category
  
  Grant-in-Aid for Challenging Research (Pioneering)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of minimally invasive pixel-dispersive fully implantable retinal prosthesis with human-like viewing angle and information processing functions
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin DisplayPrincipal Investigator
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2021 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Nano-Interconnect Formation by Directed Self-Assembly with StainingPrincipal Investigator
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2020 – 2021
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of ultra-low power neural network chips using non-volatile tunnel FET memory
- Principal Investigator
  
  Kino Hisashi
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Tohoku University
Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress EngineeringPrincipal Investigator
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2019 – 2023
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (B))
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Highly Integrated Hydrogel Fabrication ChallengePrincipal Investigator
- Principal Investigator
  
  Takafumi Fukushima
- Project Period (FY)
  2018 – 2019
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of Fully Implantable and Minimally Invasive Flexible Retina Prosthesis for Reconstruction of Wide Field of Vision
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Directed Self-Assembly based Interconnect Technology for Next-Generation 3D LSIPrincipal Investigator
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2016 – 2018
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
Adhesion Study Based on Dendritic Anchor Effects on Glass/Polymer InterfacesPrincipal Investigator
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2015 – 2016
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Tohoku University
Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human vision
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Medical systems
- Research Institution
  Tohoku University
Thermally Stable Thin Polymeric Multi-Layer Fromation with ALDPrincipal Investigator
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2013 – 2014
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
Development of fully-implanted low-power retinal prosthesis system with visual information processing functions
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
眼球内埋め込み用低電力三次元積層型人工網膜システムの研究
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2010 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
A Study of 3D Integration Based on Reconfigurable BondingPrincipal Investigator
- Principal Investigator
  
  TAKAFUMI Fukushima
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2009 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Study of tunnel-injected carrier conduction mechanism of Germanium nano-device in the ultrahigh frequency region
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-AssemblyPrincipal Investigator
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2007 – 2009
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Nano-integration of Metal Nanodot Nonvolatile Memory
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2006 – 2009
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Tohoku University
ナノフィラーを含む熱硬化性樹脂の分子設計と次世代集積回路への応用Principal Investigator
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
High Performance Parallel Processor System Using Three-Dimensional Processor Chip
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2003 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

[Book] 次世代ウェアラブルデバイスに向けたフレキシブル・伸縮性エレクトロニクス技術とセンサ開発執筆担当部分: 第2章フレキシブル・伸縮性センサ・デバイス・システムの開発動向, 第９節　高集積フレキシブル・ハイブリッド・エレクトロニクス（FHE）技術2024
- Author(s)
  福島誉史
- Total Pages
  19
- Publisher
  Science & Technology
- Data Source
  KAKENHI-PROJECT-19KK0101
[Book] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Publisher
  電子材料
- Data Source
  KAKENHI-PROJECT-22360136
[Book] M&E2009
- Author(s)
  福島誉史
- Total Pages
  3
- Publisher
  工業調査会
- Data Source
  KAKENHI-PROJECT-19686022
[Book] MEMS/NEMS工学大全(執筆担当部分:第8節 "高密度三次元実装技術")2009
- Author(s)
  福島誉史
- Publisher
  テクノシステム(初版発行)
- Data Source
  KAKENHI-PROJECT-19686022
[Book] MEMS/NEMS工学大会(第8節 p.455-p.463)2009
- Author(s)
  福島誉史
- Total Pages
  9
- Publisher
  テクノシステム
- Data Source
  KAKENHI-PROJECT-19686022
[Book] M&E(自己組織化によるウェハレベル三次元集積化技術, 36(1))2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] * Bendability Enhancement of 3D Interconnections with Out-of-plane Corrugation for Flexible Hybrid Electronics2024
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 63
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19KK0101
[Journal Article] Bendability Enhancement of 3D Interconnections with Out-of-plane Corrugation for Flexible Hybrid Electronics.2024
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 63 Issue: 4 Pages: 04SP74-04SP74
- DOI
  10.35848/1347-4065/ad375f
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H04545, KAKENHI-PROJECT-22K18291
[Journal Article] 3D-IC/TSV の最新動向と自己組織化による三次元実装／ヘテロ集積2023
- Author(s)
  福島誉史
- Journal Title
  
  化学工学（ISSN: 0375-9253）
  
  Volume: 87 Pages: 33-36
- Data Source
  KAKENHI-PROJECT-22K18291
[Journal Article] Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration with μLED2023
- Author(s)
  Yuki Susumago, Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi　Fukushima
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 44 Issue: 3 Pages: 500-503
- DOI
  10.1109/led.2023.3237834
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H04951
[Journal Article] 三次元積層半導体(3D-IC)の現況と今後の展開について2023
- Author(s)
  福島誉史
- Journal Title
  
  マテリアルステージ
  
  Volume: 23 Pages: 37-43
- Data Source
  KAKENHI-PROJECT-21H04545
[Journal Article] 3D-IC/TSV の最新動向と自己組織化による三次元実装／ヘテロ集積2023
- Author(s)
  福島誉史
- Journal Title
  
  化学工学
  
  Volume: 87 Pages: 33-36
- Data Source
  KAKENHI-PROJECT-21H04545
[Journal Article] Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Source2023
- Author(s)
  Takafumi Fukushima, Tianyu Xiang, Harshit Ranjan, Niharika Tripathi, Chang Liu, Guangqi Ouyang, Randall Irwin, and Subramanian S. Iyer
- Journal Title
  
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2023)
  
  Volume: none Pages: 444-449
- DOI
  10.1109/ectc51909.2023.00080
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KK0071
[Journal Article] 3D-IC/TSV の最新動向と自己組織化による三次元実装／ヘテロ集積2023
- Author(s)
  福島誉史
- Journal Title
  
  化学工学
  
  Volume: 87 Pages: 33-36
- Data Source
  KAKENHI-PROJECT-22K18291
[Journal Article] 三次元積層半導体(3D-IC)の現況と今後の展開について2023
- Author(s)
  福島誉史
- Journal Title
  
  マテリアルステージ
  
  Volume: 23 Pages: 37-43
- Data Source
  KAKENHI-PROJECT-22K18291
[Journal Article] 常温Cu接合によるマイクロLEDアレイ積層型3D-ICの開発2023
- Author(s)
  福島誉史
- Journal Title
  
  オプトロニクス
  
  Volume: 42 Pages: 112-116
- Data Source
  KAKENHI-PROJECT-21H04545
[Journal Article] Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansion gate electrodes2022
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 15 Issue: 11 Pages: 111004-111004
- DOI
  10.35848/1882-0786/ac9d24
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] 先端半導体パッケージングの研究開発動向2022
- Author(s)
  福島誉史
- Journal Title
  
  機能材料
  
  Volume: 3 Pages: 1-9
- Data Source
  KAKENHI-PROJECT-21H04545
[Journal Article] 3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration2022
- Author(s)
  Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 19 Issue: 23 Pages: 20220363-20220363
- DOI
  10.1587/elex.19.20220363
- ISSN
  1349-2543
- Year and Date
  2022-12-10
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21H04951
[Journal Article] Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics2022
- Author(s)
  Miwa Yuki、Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Journal of Vacuum Science & Technology B
  
  Volume: 40 Issue: 5 Pages: 052202-052202
- DOI
  10.1116/6.0001836
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193, KAKENHI-PROJECT-21H04951
[Journal Article] Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics2021
- Author(s)
  M. Mariappan, Y. Susumago, K. Sumitani, Y. Imai, S. Kimura, T. Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 60 Issue: SB Pages: SBBC02-SBBC02
- DOI
  10.35848/1347-4065/abdb81
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19KK0101
[Journal Article] High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path2021
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 14 Issue: 9 Pages: 091003-091003
- DOI
  10.35848/1882-0786/ac18b0
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics2020
- Author(s)
  Takafumi Fukushima , Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, and Tetsu Tanaka,
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 10 Issue: 8 Pages: 1419-1422
- DOI
  10.1109/tcpmt.2020.3009640
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19KK0101, KAKENHI-PROJECT-18H04159
[Journal Article] A new DSA technological dawn2020
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  Impact
  
  Volume: February Issue: SG Pages: 1-3
- DOI
  10.35848/1347-4065/ab75b8
- Data Source
  KAKENHI-PROJECT-19KK0101
[Journal Article] 129.RDL-First FOWLP技術を利用したハイドロゲルフレキシブル基板上への配線形成2020
- Author(s)
  髙橋　則之, 煤孫　祐樹, 木野　久志, 田中　徹福島　誉史
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J103-C Pages: 183-185
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K18841
[Journal Article] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 59 Issue: SB Pages: SBBA04-SBBA04
- DOI
  10.7567/1347-4065/ab4f3c
- NAID
  210000157397
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] High-Thermoresistant Temporary Bonding　Technology for Multichip-to-Wafer　3-D Integration With Via-Last TSVs2019
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 9 Issue: 1 Pages: 181-188
- DOI
  10.1109/tcpmt.2018.2871764
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter2019
- Author(s)
  Miao Xiong, Zhiming Chen, Yingtao Ding , Hisashi Kino , Takafumi Fukushima , and Tetsu Tanaka
- Journal Title
  
  IEEE TRANSACTIONS DEVICE LETTERS
  
  Volume: 40 Issue: 1 Pages: 95-98
- DOI
  10.1109/led.2018.2884452
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  IEEE Journal of the Electron Devices Society
  
  Volume: 7 Pages: 1225-1231
- DOI
  10.1109/jeds.2019.2936180
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Study of Al-doped ZnO Transparent Stimulus Electrodefor Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip2018
- Author(s)
  Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Journal Title
  
  Sensors and Materials
  
  Volume: 30 Pages: 225-234
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018
- Author(s)
  菅原陽平, 木野久志, 福島誉史, 田中徹
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J101-C Pages: 58-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] 半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に2017
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Journal Title
  
  表面技術
  
  Volume: 67(8) Pages: 410-420
- NAID
  130005875872
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15K14139
[Journal Article] 半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に2017
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Journal Title
  
  表面技術
  
  Volume: 67(8) Pages: 410-420
- NAID
  130005875872
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-16H04323
[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 12 Pages: 5065-5072
- DOI
  10.1109/ted.2017.2767598
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] 半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に2016
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  表面技術
  
  Volume: 67 Pages: 414-420
- NAID
  130005875872
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016
- Author(s)
  T. Fukushima, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  ECS Transactions
  
  Volume: 75 Issue: 9 Pages: 285-290
- DOI
  10.1149/07509.0285ecst
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] 三次元集積用テンポラリー接着剤の特性とウエハエッジの影響2016
- Author(s)
  福島誉史、マリアッパンムルゲサン、裵志哲、李相勲、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会誌C
  
  Volume: J99-C Pages: 493-500
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC07-04EC07
- DOI
  10.7567/jjap.55.04ec07
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC2016
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC03-04EC03
- DOI
  10.7567/jjap.55.04ec03
- NAID
  210000146283
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: 7 Issue: 10 Pages: 184-184
- DOI
  10.3390/mi7100184
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246, KAKENHI-PROJECT-15K14139
[Journal Article] Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration2015
- Author(s)
  Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Journal of Microelectromechanical Systems
  
  Volume: 25 Issue: 1 Pages: 91-100
- DOI
  10.1109/jmems.2015.2480787
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015
- Author(s)
  Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 37 Issue: 1 Pages: 81-83
- DOI
  10.1109/led.2015.2502584
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Applications of three-dimensional LSI2015
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, and Tetsu Tanaka
- Journal Title
  
  MRS BULLETIN
  
  Volume: 40 Issue: 3 Pages: 242-247
- DOI
  10.1557/mrs.2015.33
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology2014
- Author(s)
  K.-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, C. Nagai, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: - Pages: 669-672
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] Reconfigured-Wafer-to-Wafer 3D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film2014
- Author(s)
  Takafumi Fukushima, Ji Cheol Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.61, No.2 Issue: 2 Pages: 533-539
- DOI
  10.1109/ted.2013.2294831
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014
- Author(s)
  Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 61 Issue: 2 Pages: 540-546
- DOI
  10.1109/ted.2013.2295463
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060, KAKENHI-PROJECT-25820133
[Journal Article] Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration2014
- Author(s)
  M. Murugesan , T. Fukushima, J.C. Bea, Y. Sato, H. Hashimoto, K.W. Lee , and M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: 61 Pages: 374-377
- DOI
  10.1109/iedm.2014.7047054
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25630118
[Journal Article] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration2013
- Author(s)
  Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee,Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Proc. of IEEE 63rd ECTC
  
  Volume: 63 Pages: 891-896
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (JJAP)
  
  Volume: 52 Issue: 4S Pages: 04CB09-04CB09
- DOI
  10.7567/jjap.52.04cb09
- NAID
  210000141985
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI2012
- Author(s)
  Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE ELECTRON DEVICES LETTERS
  
  Volume: Vol.33 Issue: 2 Pages: 221-223
- DOI
  10.1109/led.2011.2174608
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] New Chip -to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 789-792
- DOI
  10.1109/iedm.2012.6479157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs2012
- Author(s)
  M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 657-660
- DOI
  10.1109/iedm.2012.6479124
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate-an alternative method to wire bonding2012
- Author(s)
  M Murugesan, T Fukushima, K Kiyoyama, J C Bea, T Tanaka and M Koyanagi
- Journal Title
  
  JOURNAL of Micromechanics and Microengineering
  
  Volume: Vol.22(8) Issue: 8 Pages: 085033-085033
- DOI
  10.1088/0960-1317/22/8/085033
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Low-Resistance Cu-Sn Electroplated　Evaporated Microbumps for 3D Chip Stacking2012
- Author(s)
  M. MURUGESAN, Y. OHARA, T. FUKUSHIMA, T. TANAKA, and M. KOYANAGI
- Journal Title
  
  Journal of ELECTRONIC MATERIALS
  
  Volume: Vol.41(4) Issue: 4 Pages: 720-729
- DOI
  10.1007/s11664-012-1949-1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration2012
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Proc. of IEEE 62nd Electronic Components and Technology Conference
  
  Volume: - Pages: 393-398
- DOI
  10.1109/ectc.2012.6248860
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 58 Issue: 3 Pages: 748-757
- DOI
  10.1109/ted.2010.2099870
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術2011
- Author(s)
  大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 394-401
- NAID
  110008761542
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PAC KAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 1 Pages: 1873-1884
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] MultichipSelf-Assembly Technology for AdvancedDie-to-Wafer 3-D Integration toPrecisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, YukiOhara, Mariappan Murugesan, JichoelBea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: Vol. 1 Pages: 1873-188
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-ChelBea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Pages: 49-68
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.58 Pages: 748-757
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価2011
- Author(s)
  木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 411-418
- NAID
  110008761544
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Evaluation of Cu Diffusion from Cu Through-Silicon Via (TSV) in 3-D LSI by Transient Capacitance Measurement2011
- Author(s)
  J-C.Bea, K.W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: Volume 32 Issue: 7 Pages: 940-942
- DOI
  10.1109/led.2011.2141109
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: 2 Pages: 49-68
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] 三次元集積化技術とヘテロインテグレーション2011
- Author(s)
  小柳光正, 福島誉史, 李康旭, 田中徹
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C(招待論文) Pages: 355-364
- NAID
  110008761537
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010
- Author(s)
  岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: Vol.J93-C Pages: 493-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integratedcircuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, J.-C.Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  APL
  
  Volume: vol.96 Pages: 154105-154105
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2010
- Author(s)
  Y. Pei, C. Yin, T. Kojima, J. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  IEEE Transactions on Nanotechnology (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: 96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  電子材料
  
  Volume: 49 Pages: 17-24
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsuma Koyanagi
- Journal Title
  
  ECS (Electrochemical Society) Transactions
  
  Volume: Vol.33 Pages: 71-90
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application2010
- Author(s)
  Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (未定, 印刷中)
- NAID
  40017176042
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Surface-tensiondriven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: VOL.96 Issue: 15
- DOI
  10.1063/1.3328098
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, K. -W. Lee, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letters Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module2010
- Author(s)
  Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
  
  Volume: Vol.19 Pages: 1284-1291
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 極限集積化を目指すスーパーチップ2010
- Author(s)
  小柳光正、福島誉史、李康旭、田中徹
- Journal Title
  
  電子情報通信学会誌
  
  Volume: Vol.93(招待論文) Pages: 918-922
- NAID
  110007880868
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Investigation of Effects of Post-Deposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application2010
- Author(s)
  Y. Pei, T. Kojima, T. Hiraki, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (in print)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010
- Author(s)
  岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: J93-C Pages: 493-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2010
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: Vol.2 Pages: 49-68
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010
- Author(s)
  岩田永司, 福島誉史 , 大原悠希, 李康旭, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会和文誌C
  
  Volume: J93-C Pages: 493-502
- Data Source
  KAKENHI-PROJECT-22360136
[Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  電子材料
  
  Volume: Vol.49 Pages: 17-24
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters 96(accepted)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F.Inoue, M.Koyanagi, T.Fukushima, K.Yamamoto, S.Tanaka, Z.wang, S.Shingubara
- Journal Title
  
  ECS Transactions 16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Applied Physics Letters 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory Characteristics of Metal-Oxide-Semiconductor Capacitor with High Density Cobalt Nanodots Floating Gate and HfO2 Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Applied Physics Letters 95
  
  Pages: 33118-33118
- NAID
  120003728303
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Electrical Characterization of MOS Memory Devices with Self-Assembled Tungsten Nano-Dots Dispersed in Silicon Nitride2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  ECS Trans. 18
  
  Pages: 33-37
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE IEDM Technical Digest
  
  Pages: 349-352
- NAID
  110008001112
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Characteristics of copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W. -C. Jeong, K. Kiyoyama, K. -W. Lee, A. Noriki, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.48,No.4
- NAID
  210000066668
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 104-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Journal Title
  
  Proceedings of the IEEE Vol.97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 三次元積層型チップのためのSi貫通ビア(Tsv)形成技術2009
- Author(s)
  福島誉史
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 105-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 Vol.12
  
  Pages: 105-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F. Inoue, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. wang, S. Shingubara
- Journal Title
  
  ECS Transactions Vol.16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Characteristics of copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W.-C.Jeong, K.Kiyoyama, K.-W.Lee, A.Noriki, M.Murugesan, T.Fukushima, T.Tanaka, M.Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066668
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Characteristicsof copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W.-C. Jeong, K. Kiyoyama, K.-W. Lee, A. Noriki, M. Murugesan, T. Fukushima, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics C157-1C157-4
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19360153
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Appl. Phys. Lett. 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System2009
- Author(s)
  Kenji Makita, Kouji Kiyoyama, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066588
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] MOSFET Nonvolatile Memory with High Density Tungsten Nanodots Floating Gate Formed by Self-Assembled Nanodot Deposition2009
- Author(s)
  Y Pei, C Yin, J C Bea, H Kino, T Fukushima, T Tanaka, M Koyanagi
- Journal Title
  
  Semiconductor Science and Technology 24
  
  Pages: 45022-45022
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory Characteristics of Metal-Oxide-Semiconductor Capacitor with High Density Cobalt Nanodots Floating Gate and HfO2 Blocking Dielectric2009
- Author(s)
  Y. Pei, C. Yin, T. Kojima, M. Nishijima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 95
  
  Pages: 33118-33118
- NAID
  120003728303
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: VOL.48 Issue: 4S Pages: 04C113-04C113
- DOI
  10.1143/jjap.48.04c113
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  MITSUMASA KOYANAGI, TAKAFUMI FUKUSHIMA, TETSU TANAKA
- Journal Title
  
  Proceedings of THE IEEE 97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride2008
- Author(s)
  Y. Pei, M. Nishijima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 93
  
  Pages: 113115-113117
- NAID
  120002338347
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate2008
- Author(s)
  Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya. Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2936-2940
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy2008
- Author(s)
  M. Murugesan, J.C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Journal Title
  
  Journal of Applied Physics 104
  
  Pages: 74316-74316
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] "Electrical Characterization of Metal-Oxide-Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots2008
- Author(s)
  Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 47
  
  Pages: 2680-2683
- NAID
  210000064565
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Appl. Phys. Lett. 93
  
  Pages: 113115-113117
- NAID
  120002338347
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 499-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史
- Journal Title
  
  応用物理学会分科会シリコンテクノロジー「多層配線」特集号 No.99
  
  Pages: 34-37
- NAID
  110006935847
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Heterogeneous Multi-Chip Module Integration Technology Using SelfAssembly Method2008
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  International Electron Devices Meeting(IEDM) Technical Digest
  
  Pages: 499-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy2008
- Author(s)
  M. Murugesan, J.C. Bea, C.-K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, and M. Koyanagi
- Journal Title
  
  JOURNAL OF APPLIED PHYSICS 104
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19360153
[Journal Article] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  応用物理学会分科会シリコンテクノロジー「多層配線」特集号 No.99
  
  Pages: 34-37
- NAID
  110006935847
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Electrical Characterization of Metal-Oxide-Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots2008
- Author(s)
  Yanli Pei, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Jpn. J. Appl. Phys. 47
  
  Pages: 2680-2683
- NAID
  210000064565
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs2008
- Author(s)
  H. Kikuchi, Y. Yamada, A.M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2801-2806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  IEEE International Electron Devices Meeting
  
  Pages: 985-988
- NAID
  120002070107
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 985-988
- NAID
  120002070107
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 985-988
- NAID
  120002070107
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Magnetic Nanodot Memory with FePt Nanodots2007
- Author(s)
  C. Yin, M. Murugesan, J. Bea, M. Oogane, T. Fukushima, T. Tanaka, M. Miyao, S. Samukawa, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 46
  
  Pages: 2167-2171
- NAID
  10022547399
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi, Fukushima
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Tech. Dig.
  
  Pages: 985-988
- NAID
  120002070107
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Effect of Ion Implantation Damage on Elevated Source/Drain Formation for Ultrathin Body Silicon on Insulator Metal Oxide Semiconductor Field-Effect Transistor2006
- Author(s)
  K. Oh, T. Sakaguchi, T. Fukushima, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.45
  
  Pages: 2965-2969
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration2006
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics (JJAP) 45(4B)
  
  Pages: 3030-3035
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-17760245
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration2006
- Author(s)
  Takafumi FUKUSHIMA
- Journal Title
  
  Japanese Journal of Applied Physics Vol. 45, No. 4B
  
  Pages: 3030-3035
- NAID
  10022540983
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Analysis of GOI-MOSFET with High-k Gate Dielectric and Metal Gate Fabricated by Ge Condensation Technique2006
- Author(s)
  M. Park, J. Bea, T. Fukushima, M. Koyanagi
- Journal Title
  
  Surface and Interface Analysis 38,12-13
  
  Pages: 1720-1724
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration2006
- Author(s)
  Takafumi FUKUSHIMA
- Journal Title
  
  Japanese Journal of Applied Physics Vol.45,No.4B
  
  Pages: 3032-3035
- NAID
  10022540983
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration2006
- Author(s)
  Takafumi Fukushima, Yusuke Yamada, Hirokazu Kikuchi, Mitsumasa Koyanagi
- Journal Title
  
  Japan Journal of Applied Physics (JJAP) 45(4B)(In press)
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-17760245
[Journal Article] Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology2006
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  Manuscript of International Conference on Electronics Packaging (ICEP)
  
  Pages: 220-224
- Data Source
  KAKENHI-PROJECT-17760245
[Journal Article] Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application2006
- Author(s)
  H. Choi, M. Park, T. Fukushima, M. Koyanagki
- Journal Title
  
  Japanese Journal of Applied Physics 45
  
  Pages: 2984-2986
- NAID
  10022542578
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration2006
- Author(s)
  Takafumi FUKUSHIMA
- Journal Title
  
  Japanese Journal of Applied Physics Vol. 45
  
  Pages: 3030-3035
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Self-Assembly Technique2005
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Tech. Dig.
  
  Pages: 359-362
- NAID
  120002070106
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Self-Assembly Technique2005
- Author(s)
  T.Fukushima, Y.Yamada, H.Kikuchi, M.Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 359-362
- NAID
  120002070106
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration2005
- Author(s)
  Takafumi Fukushima, Yusuke Yamada, Hirokazu Kikuchi, Mitsumasa Koyanagi
- Journal Title
  
  Extended Abstracts of SSDM International Conf.on Solid State Devices and Materials
  
  Pages: 64-65
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-17760245
[Journal Article] New Three-Dimensional Integration Technology Using Self-Assembly Technique2005
- Author(s)
  Takafumi Fukushima
- Journal Title
  
  IEEE International Electron Device Meeting (IEDM) Tech. Dig.
  
  Pages: 359-362
- NAID
  120002070106
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration2005
- Author(s)
  Takafumi Fukushima, Yusuke Yamada, Mitsumasa Koyanagi, et al.
- Journal Title
  
  The 2005 International Conference on Solid State Devices and Materials
  
  Pages: 64-65
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Self-Assembly Technique2005
- Author(s)
  Takafumi Fukushima, Yusuke Yamada, Hirokazu Kikuchi, Mitsumasa Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 359-362
- NAID
  120002070106
- Data Source
  KAKENHI-PROJECT-17760245
[Patent] 東北大学, 半導体装置の製造方法、半導体装置を備えた装置の製造方法、半導体装置、半導体装置を備えた装置2020
- Inventor(s)
  福島誉史, 田中徹, 木野久志, 煤孫祐樹
- Industrial Property Rights Holder
  福島誉史, 田中徹, 木野久志, 煤孫祐樹
- Industrial Property Rights Type
  特許
- Filing Date
  2020
- Overseas
- Data Source
  KAKENHI-PROJECT-19KK0101
[Patent] 半導体装置およびその製造方法2014
- Inventor(s)
  小柳光正、福島誉史、李康旭、田中徹
- Industrial Property Rights Holder
  小柳光正、福島誉史、李康旭、田中徹
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-098449
- Filing Date
  2014-05-12
- Data Source
  KAKENHI-PROJECT-25630118
[Patent] 半導体装置2014
- Inventor(s)
  鈴木拓、北村康宏、浅見一志、小柳光正、福島誉史、李康旭
- Industrial Property Rights Holder
  東北大学、(株)デンソー
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-053473
- Filing Date
  2014-03-17
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] 半導体装置2014
- Inventor(s)
  鈴木拓、北村康宏、浅見一志、小柳光正、福島誉史、李康旭
- Industrial Property Rights Holder
  東北大学、㈱デンソー
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-053473
- Filing Date
  2014-03-17
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] 素子の実装方法および光モジュール2012
- Inventor(s)
  小柳光正、田中徹、福島誉史、伊藤有香
- Industrial Property Rights Holder
  国立大学法人東北大学、住友ベークライト株式会社
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2012-202275
- Filing Date
  2012-09-14
- Data Source
  KAKENHI-PROJECT-22360136
[Patent] チップ支持基板、それを用いた三次元集積回路及びそれらの製造方法並びにアセンブリ装置2012
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  国立大学法人東北大学
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2012-209003
- Filing Date
  2012-09-23
- Data Source
  KAKENHI-PROJECT-22360136
[Patent] 自己組織化機能を用いた三次元集積回路の製造方法及び製造装置2009
- Inventor(s)
  小柳光正, 福島誉史, 杉山雅彦
- Industrial Property Rights Holder
  東北大学, 東京エレクトロン
- Industrial Property Number
  2009-095241
- Filing Date
  2009-04-06
- Data Source
  KAKENHI-PROJECT-19686022
[Patent] 一括保持トレイ及び三次元集積回路製造装2009
- Inventor(s)
  小柳光正、福島誉史、杉山雅彦
- Industrial Property Rights Holder
  東京エレクトロン株式会社
- Industrial Property Number
  2009-095241
- Filing Date
  2009-04-06
- Data Source
  KAKENHI-PROJECT-19686022
[Patent] 自己組織化機能を用いた三次元集積回路の製造方法2009
- Inventor(s)
  小柳光正, 福島誉史, 杉山雅彦
- Industrial Property Rights Holder
  東北大学, 東京エレクトロン
- Industrial Property Number
  2009-070769
- Filing Date
  2009-03-23
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Fine-pitch Chip-to-Wafer Hybrid Bonding2025
- Author(s)
  Takafumi Fkushima
- Organizer
  IEEE Hybrid Bonding Symposium
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Via-last TSV を用いたシャトルチップ 3D-IC 化のためのテンポラリー接着技術 (Temporary Bonding Technology for Transformation of Shuttle Chips to 3D-IC Using Via-last TSV)2025
- Author(s)
  冨永晃洋, 申家屹, 劉暢†, 田中徹, 福島誉史
- Organizer
  第39回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 自己ナノ粒子化を利用した Cu-Cu ハイブリッド接合技術の研究 (A Study for Cu-Cu Hybrid Bonding Technology by Self-nanoparticulation)2025
- Author(s)
  川島凌太朗, 坂本浩捷, 八甫谷明彦, 田中文悟, 田中徹, 福島誉史
- Organizer
  第39回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Die-Level 3D-IC Fabrication Technology for 3D Heterogeneous Chiplet Integration (異種チップレット三次元集積のためのダイレベル 3D-IC 作製技術)2025
- Author(s)
  申家屹, 劉暢, 田中徹, 福島誉史
- Organizer
  第72回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Cu-Cu Direct Interconnection2024
- Author(s)
  福島誉史
- Organizer
  Standards Summit Topic 2: Packaging Architecture & Materials, セミコンジャパン(SEMI Japan)主催
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 先端3D実装の現状・新展開とTohoku CHIPSの紹介2024
- Author(s)
  福島誉史
- Organizer
  一般社団法人日本実装技術振興協会主催　第225回WEB定例講演会（プログラムテーマ『未来の産業を担う三次元積層半導体（3D-IC）』
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Tohoku CHIPS (Center for Holistic Integration and Packaging Systems)の研究活動2024
- Author(s)
  福島誉史
- Organizer
  先端システム技術研究組合RaaS (Research as a Service) NEDOプロジェクト四半期 Meeting
- Invited
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] Multichip-to-Wafer Mini-LED Bonding Technology for Photobiomodulation Sheet Devices Using Flexible FOWLP2024
- Author(s)
  X. Guo, T. Hoshi, D. Nishiguchi, C. Liu, T. Tanaka, and T. Fukushima
- Organizer
  IEEE Components, Packaging and Manufacturing Technology (CPMT) Symposium Japan (ICSJ)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Temporary Adhesive Effect on Multichip Thinning for Rapid Prototyping of 3D-IC from 2D-IC Fabricated in Foundry Shuttle Services2024
- Author(s)
  A. Tominaga, J. Shen, C. Liu, A. Shinoda, T. Tanaka, and T. Fukushima
- Organizer
  IEEE 3D Systems Integration Conference (3DIC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 3D-IC Fabrication with TSV at the die level from 2D-IC2024
- Author(s)
  Takafumi Fkushima
- Organizer
  The Semiconductor Wafer Test Conference (SWTest) Asia 2024
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] FOWLPと三次元実装技術で創るiFHE(インモールド・フレキシブル・ハイブリッド・エレクトロニクス)2024
- Author(s)
  福島誉史
- Organizer
  一般社団法人エレクトロニクス実装学会（JIEP）主催 JIEP最先端実装技術シンポジウム
- Invited
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] ハイブリッド接合によるDRAMチップ積層に向けた自己組織化実装技術の基礎検討2024
- Author(s)
  福島誉史
- Organizer
  一般社団法人エレクトロニクス実装学会関西支部『JFK; Jisso Festa in Kansai; (関西ワークショップ)』
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible Fan-Out Wafer-Level Packaging with Tiny Cu Pillar Assembly2024
- Author(s)
  A. Shinoda, C. Liu, A. Tominaga, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  The 73rd Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] 3Dパッケージング・チップレット集積化技術の最新動向2024
- Author(s)
  福島誉史
- Organizer
  特定非営利活動法人サーキットネットワーク（通称：C-NET）主催　第24回定期講演会（講演会テーマ：電子立国ニッポンの復活に向けて(PartⅣ)～救世主となる半導体の動向～）
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] ECTC2024ハイライト　～論文委員の分析も交えて～2024
- Author(s)
  福島誉史
- Organizer
  一般社団法人エレクトロニクス実装学会　３Ｄ・チップレット研究会　第５回公開研究会
- Invited
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] 16-Layer 3D Stacking Based on Self-Assembly Technology for HBM Application2024
- Author(s)
  Z. Du, H. Kikuchi, H. Hishinuma, M. Murugesan, T. Tanaka, and T. Fukushima
- Organizer
  IEEE 3D Systems Integration Conference (3DIC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] チップレットや3Dパッケージ技術など最新技術の解説2024
- Author(s)
  福島誉史
- Organizer
  SJ2024半導体後工程・パッケージング技術教育講座B．若手技術者に向けた後工程概論Ⅱ（最新パッケージ技術), セミコンジャパン(SEMI Japan)主催
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] チップレット集積から見た材料への要求2024
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会　材料環境技術委員会主催　公開研究会「世界をリードする3Dパッケージの材料技術」
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Hybrid Bonding Technology for Next-Generation 3D-IC/Chiplets2024
- Author(s)
  Takafumi Fkushima
- Organizer
  The Semiconductor Wafer Test Conference (SWTest) Asia 2024
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC2024
- Author(s)
  J. Shen, C. Liu, T. Tanaka, and T. Fukushima
- Organizer
  IEEE 3D Systems Integration Conference (3DIC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Liquid Surface Tension-Driven Chip Self-Assembly Technology With Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM2024
- Author(s)
  Z. Du, H. Kikuchi, H. Hishinuma, T. Tanaka, and T. Fukushima
- Organizer
  The 73rd Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] チップレット/ヘテロ集積を中心とする先端半導体パッケージング技術の動向2024
- Author(s)
  福島誉史
- Organizer
  公益社団法人化学工学会エレクトロニクス部会主催研究会「情報爆発と省エネの両立に向けた半導体デバイス・プロセスの新潮流」
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Technology Advancements in Microelectronic Packaging with Heterogeneous 3D Chiplet Integration and Hybrid Bonding2024
- Author(s)
  Takafumi Fkushima
- Organizer
  The 21st International SoC (System on a Chip) Conference (ISOCC 2024) Sapporo (Japan)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Structural Strategies for Bendable Multi-Layer Interconnections Based on Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics2024
- Author(s)
  C. Liu, J. Shen, A. Shinoda, H. Zhang, T. Tanaka, and T. Fukushima
- Organizer
  2024 Advanced Metallization Conference 2024 (ADMETA Plus 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] Feasibility Study of Self-Assembly Technology for DRAM Chip Stacking Using Hybrid Bonding (ハイブリッド接合を用いたDRAMチップ積層のための自己組織化実装技術の基礎検討)” 第38回エレクトロニクス実装学会講演大会, pp.201-202, 2024年3月,2024
- Author(s)
  Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第38回エレクトロニクス実装学会講演大会
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] 3Dパッケージング・チップレット集積化技術の最新動向2024
- Author(s)
  福島誉史
- Organizer
  特定非営利活動法人サーキットネットワーク（通称：C-NET）主催　第24回定期講演会（講演会テーマ：電子立国ニッポンの復活に向けて(PartⅣ)～救世主となる半導体の動向～）
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 先端半導体パッケージング工学最前線2024
- Author(s)
  福島誉史
- Organizer
  公益社団法人高分子学会　ポリマーフロンティア２１
- Invited
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] Simulation and Fabrication of Highly Bendable Advanced 3D Corrugated Interconnects Using Flexible FOWLP2024
- Author(s)
  H. Zhang, C. Liu, J. Shen, T. tanaka, and T. Fukushima
- Organizer
  IEEE Components, Packaging and Manufacturing Technology (CPMT) Symposium Japan (ICSJ)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] 3D-IC and Hybrid Bonding Activity in Tohoku CHIPS#2024
- Author(s)
  Takafumi Fkushima
- Organizer
  The 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (ISMP-IRSP 2024)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Tohoku CHIPS (Center for Holistic Integration and Packaging Systems)の活動：東北大学300mmウエハラインGINTIの紹介、シャトルチップの三次元実装、セルフアセンブリ、ECTC2024で東北大学が発表した8件の論文や学会の動向など2024
- Author(s)
  福島誉史
- Organizer
  大阪大学産業科学研究所 F3D実装協働研究所２０２４年度第２回先端半導体パッケージWG研究会
- Invited
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] 半導体実装技術、先端パッケージング・システム集積の動向2024
- Author(s)
  福島誉史
- Organizer
  日本学術振興会先進薄膜界面機能創成第R025委員会
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Reconfigured Wafer-to-Wafer 3D Integration with Meta Bonding Technologies2024
- Author(s)
  Takafumi Fkushima
- Organizer
  IEEE International Interconnect Technology Conference (IITC2024)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] * 3D Interconnect Technology with Serpentine and Trapezoidal Corrugation Using a Flexible Photosensitive Dielectric to Strengthen the Bendability of FHE2024
- Author(s)
  C. Liu, J. Shen, A. Shinoda, H. Zhang, T. Tanaka, and T. Fukushima
- Organizer
  Proceedings of the 73rd Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] ハイブリッド接合を用いたDRAMチップ積層のための自己組織化実装技術の基礎検討2024
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会(JIEP)　修善寺ワークショップ(WS)
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 高い画像認識性能を有する三次元積層人工網膜チップの作製2024
- Author(s)
  篠田敦志, 劉暢, 冨永晃洋, 田中徹, 福島誉史
- Organizer
  第38回エレクトロニクス実装学会講演大会
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] 先端3D実装の現状・新展開とTohoku CHIPSの紹介2024
- Author(s)
  福島誉史
- Organizer
  一般社団法人日本実装技術振興協会主催　第225回WEB定例講演会（プログラムテーマ『未来の産業を担う三次元積層半導体（3D-IC）』
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] チップレット集積から見た材料への要求2024
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会　材料環境技術委員会主催　公開研究会「世界をリードする3Dパッケージの材料技術」
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging2023
- Author(s)
  Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  The 71st Electronic Components and Technology Conference (ECTC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Smart Skin Display の要素技術研究III: 銅ピラーのアセンブリによるTXV 形成とフレキシブル配線の細線化2023
- Author(s)
  篠田敦志, 煤孫祐樹, 劉暢, 星匡朗, 申家屹，木野久志, 田中徹, 福島誉史
- Organizer
  2023年第70回応用物理学会春季学術講演会講演予稿集 (2023 上智大学　四谷キャンパス+オンライン)
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Flexible FOWLP-based 3D Heterogeneous Integration for Biomedical/Healthcare FHE Application2023
- Author(s)
  Takafumi Fukushima
- Organizer
  Materials Research Society-Taiwan International Conference (2023 MRSTIC)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] 銅ピラーのアセンブリを用いたFOWLPによるTXV形成と曲げ特性の強化2023
- Author(s)
  篠田敦志, 冨永晃洋, 木野久志, 田中徹, 福島誉史
- Organizer
  第84回応用物理学会秋季学術講演会講演
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Technology Trends in Advanced Semiconductor Packaging and 3D-IC / Chiplet2023
- Author(s)
  Takafumi Fukushima
- Organizer
  15th International Electronic Cooling Technology Workshop
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] * High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2023
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] 短TATを実現する3D-ICのラピッドプロトタイピングと最新技術2023
- Author(s)
  福島誉史
- Organizer
  くまもと3D連携コンソーシアム第2回オープンセミナー
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] チップレット/ヘテロ集積を中心とする先端半導体パッケージング技術の動向2023
- Author(s)
  福島誉史
- Organizer
  公益社団法人化学工学会エレクトロニクス部会主催研究会「情報爆発と省エネの両立に向けた半導体デバイス・プロセスの新潮流」
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] Smart Skin Displayの要素技術研究Ⅰ Cuめっき直接接合を用いたマイクロLEDと3D-ICの常温積層2023
- Author(s)
  煤孫祐樹，星匡朗，劉暢，申家屹，篠田敦志，木野久志，田中徹，福島誉史
- Organizer
  第70回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Negative-Thermal-Expansion Gate Electrode to Introduce Tensile Strain into the Channel of MOSFETs for Mobility Enhancement2023
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] 短TATを実現する3D-ICのラピッドプロトタイピングと最新技術2023
- Author(s)
  福島誉史
- Organizer
  くまもと3D連携コンソーシアム第2回オープンセミナー
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Flexible FOWLP-based 3D Heterogeneous Integration for Biomedical/Healthcare FHE Application2023
- Author(s)
  Takafumi Fukushima
- Organizer
  Materials Research Society-Taiwan International Conference (2023 MRSTIC)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Technology Trends in Advanced Semiconductor Packaging and 3D-IC / Chiplet2023
- Author(s)
  Takafumi Fukushima
- Organizer
  15th International Electronic Cooling Technology Worksho
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 東北大発　三次元集積・三次元実装の最新技術動向と中工程の重要性2023
- Author(s)
  福島誉史
- Organizer
  半導体セミナー（みやぎ高度電子機械産業振興協議会とエレクトロニクス実装学会が共催
- Invited
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] FOWLP-based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display2023
- Author(s)
  Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  IEEE Components, Packaging and Manufacturing Technology (CPMT) Symposium Japan (ICSJ)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last2023
- Author(s)
  J. Shen, C. Liu, T. Hoshi, A. Shinoda, H. Kino, T. Tetsu, M. Murugesan, M. Koyanagi, and T. Fukushima
- Organizer
  IEEE 3D System Integration Conference (3DIC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] A 3D Super Chip Concept to Build a New Era of Chiplets and Heterogeneous Integration2023
- Author(s)
  Takafumi Fukushima
- Organizer
  2023 International Conference on Electronics Packaging (ICEP 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Flexible FOWLP-based 3D Heterogeneous Integration for Biomedical/Healthcare FHE Application2023
- Author(s)
  Takafumi Fukushima
- Organizer
  Materials Research Society-Taiwan International Conference (2023 MRSTIC)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] ハイドロゲルFHEデバイスのためのRDL-first Multichip-to-Wafer集積技術2023
- Author(s)
  星匡朗, 西口大智, 木野久志, 田中徹, 福島誉史
- Organizer
  第84回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 人の視覚情報処理機能を有する三次元積層人工網膜チップの作製と評価2023
- Author(s)
  大西青葉，番場崚太郎，岸本凌平，木野久志，福島誉史，田中徹
- Organizer
  第70回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Integration Technology for Smart Skin Display II: Bendability Enhancement of Multi-level Metallization on a PDMS Elastomer2023
- Author(s)
  Cho Ryu, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第70回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics (FHE) Using Wafer-Level Packaging2023
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Tak Fukushima
- Organizer
  The 4th UCLA CHIPS Workshop (CHIPS: Center for Heterogeneous Integration and Performance Scaling
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] 東北大発　三次元集積・三次元実装の最新技術動向と中工程の重要性2023
- Author(s)
  福島誉史
- Organizer
  半導体セミナー（みやぎ高度電子機械産業振興協議会とエレクトロニクス実装学会が共催）
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources2023
- Author(s)
  Tak Fukushima*, Niharika Tripathi, Harshit Ranjan, Tianyu Xiang, Chang Liu, Guangqi Ouyang, Randall Irwin, and Subramanian S. Iyer
- Organizer
  The 4th UCLA CHIPS Workshop (CHIPS: Center for Heterogeneous Integration and Performance Scaling
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23KK0071
[Presentation] A 3D Super Chip Concept to Build a New Era of Chiplets and Heterogeneous Integration2023
- Author(s)
  Takafumi Fukushima
- Organizer
  2023 International Conference on Electronics Packaging (ICEP 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18291
[Presentation] A Finite Element Study of Stretchable Corrugated Interconnections on Chiplet-Embedded Flexible Hybrid Electronics2022
- Author(s)
  Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Flex2022
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement2022
- Author(s)
  M Mariappan, K Mori, M Sawa, E Sone, Mitsumasa Koyanagi, and Takafumi Fukushima
- Organizer
  IEEE 72nd Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] 高QOL人工網膜チップのための明暗順応機能の設計と評価2022
- Author(s)
  中村皓平，梁耀淦, 杜邦，王勝イ，有賀優太，井上文太，木野久志，福島誉史，清山浩司，田中徹
- Organizer
  第83回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] 先端半導体パッケージング技術で創るインモールド・フレキシブル・ハイブリッド・エレクトロニクス(iFHE)2022
- Author(s)
  福島　誉史
- Organizer
  エレクトロニクス実装学会(JIEP) 　電子部品・実装技術委員会プリンタブルデバイス研究会主催
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] In-mold Flexible Hybrid Electronics (iFHE) Based on Holistic System Integration with FOWLP, 3D-IC/TSV, and Chiplets2022
- Author(s)
  Takafumi Fukushima
- Organizer
  The 20th International Symposium on the Physics of Semiconductors and Applications (ISPSA 2022), Session 8. Industrial semiconductor applications (ISA),
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 埋込型医療機器向け無線給電の設計2022
- Author(s)
  清山浩司, 福島誉史, 木野久志, 田中徹
- Organizer
  2022年度　電子情報通信学会総合大会
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet- Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment2022
- Author(s)
  M Mariappan, S. Fukuzumi, T. Shibata, H. Hashimoto, J. Bea, Mitsumasa Koyanagi, and Takafumi Fukushima
- Organizer
  IEEE 72nd Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip2022
- Author(s)
  Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
- Organizer
  2022 IEEE Biomedical Circuits and Systems Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration2022
- Author(s)
  Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 三次元実装／TSV を基盤としたヘテロインテグレーション技術の研究開発動向2022
- Author(s)
  福島誉史
- Organizer
  2022年度　電子情報通信学会総合大会
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration2022
- Author(s)
  Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  2022 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Liu Chang, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  2022 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] 人工網膜の高性能化に向けた三次元積層人工網膜チップの作製2022
- Author(s)
  大西青葉，番場崚太郎，田中文悟，岸本凌平，木野久志，福島誉史，田中徹
- Organizer
  第83回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs2022
- Author(s)
  Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi. Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  IEEE 72nd Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] A Finite Element Study of Stretchable Corrugated Interconnections on Chiplet-Embedded Flexible Hybrid Electronics2022
- Author(s)
  Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Flex2022 (2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices2022
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2022 IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs2022
- Author(s)
  Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display2022
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Tak Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis2022
- Author(s)
  Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2022 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet- Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Liu Chang, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  2022 International Conference on Solid State Devices and Materials (SSDM), 715-716(2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems2022
- Author(s)
  Toshiaki Shirasaka, Tadashi Okuda, Tomoaki Shibata, Satoshi Yoneda, Daisaku Matsukawa, Mariappan Murugesan, Mitsumasa Koyanagi, and Takafumi Fukushima
- Organizer
  IEEE 72nd Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] Design and Evaluation of Light and Dark Adaptation Functions for High QOL Artificial Vision Chip2022
- Author(s)
  Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
- Organizer
  2022 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] A Finite Element Study of Highly Flexible 3D Corrugated Interconnections for Advanced FHE with Embedded Chiplets2022
- Author(s)
  Liu Chang, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  FLEX Conference & Exhibition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04951
[Presentation] 新たな実装技術で創るフレキシブルデバイス「インモールド・フレキシブル・ハイブリッド・エレクトロニクス(iFHE)」2022
- Author(s)
  福島　誉史
- Organizer
  一般社団法人日本電子回路工業会（JPCA）主催「電子機器トータルソリューション展2022 （旧JPCA Show 2022）
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices2022
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2022 IEEE International Interconnect Technology Conference (IITC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] Die-first and RDL-first FOWLP Processing for Flexible Hybrid Electronics2021
- Author(s)
  Takafumi Fukushima, Yuki Susumago, Noriyuki Takahashi, Hisashi Kino, and Tetsu Tanaka
- Organizer
  IMAPS (International Microelectronics Assembly and Packaging Society) 17th International Conference on Device Packaging, 2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets2021
- Author(s)
  Tomo Odashima, Yuki Susumago, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, and T. Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021
- Author(s)
  Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第68回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Flexible In-Mold Electronics: Advanced FHE Technologies and Applications2021
- Author(s)
  Takafumi Fukushima
- Organizer
  2021FLEX
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] In-Mold Flexible Hybrid Electronics (FHE) Based on Advanced Wafer-Level Packaging with Chiplets2021
- Author(s)
  Takafumi Fukushima
- Organizer
  The 34th International Microprocesses and Nanotechnology Conference (MNC 2021)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 東北大発3D-IC 試作製造拠点GINTI の取り組みと多様化する先端半導体パッケージングの動向2021
- Author(s)
  福島　誉史
- Organizer
  日本実装技術振興協会主催　第213 回定例講演会『先端半導体後工程（More than Moore）技術』
- Invited
- Data Source
  KAKENHI-PROJECT-20K20992
[Presentation] Wafer-Level 3D Wrinkling Interconnect Formation for Scalable Flexible In-Mold Electronics2021
- Author(s)
  Shuta Nagata and Takafumi Fukushima
- Organizer
  Flex2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] ホリスティック・システム・インテグレーションに向けた三次元実装の技術動向と課題2021
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会(JIEP)　先端ファブリケーション研究会主催　第8回公開研究会
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE2021
- Author(s)
  Takafumi Fukushima
- Organizer
  The 2021 Symposia on VLSI Technology and Circuits, Technology / Circuits Joint Focus Session
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021
- Author(s)
  Zhe Wang, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第68回応用物理学会春季学術講演予稿集
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Hydrogel-Based FHE Patch Using RDL-first FOWLP for UV Sterilization2021
- Author(s)
  Noriyuki Takahashi and Takafumi Fukushima
- Organizer
  Flex2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] スマートスキンディスプレイの提案とマイクロLEDの常温Cu直接接合技術2021
- Author(s)
  煤孫祐樹, 王喆, 小田島輩, 荒山俊亮, 星匡朗, 木野久志, 田中徹, 福島誉史
- Organizer
  第82回応用物理学会秋季学術講演会講演予稿集
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] UV-LED内蔵ハイドロゲルフレキシブル基板を用いた殺菌絆創膏の作製と評価2021
- Author(s)
  高橋則之, 煤孫祐樹, 王喆, 小田島輩, 木野久志, 田中徹, 福島誉史
- Organizer
  第68回応用物理学会春季学術講演予稿集
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] 半導体事業を牽引する3D実装の技術動向とホリスティック実装工学の歩み2021
- Author(s)
  福島　誉史
- Organizer
  よこはま高度実装技術コンソーシアム(YJC)主催　第52回YJC実装技術セミナー
- Invited
- Data Source
  KAKENHI-PROJECT-20K20992
[Presentation] インモールド・フレキシブル・ハイブリッド・エレクトロニクス（FHE）と医療応用2021
- Author(s)
  福島　誉史
- Organizer
  NEDIA 第8回電子デバイスフォーラム京都(2021)
- Invited
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] 3D-IC/TSVの最新動向と自己組織化による三次元実装／ヘテロ集積2021
- Author(s)
  福島　誉史
- Organizer
  化学工学会エレクトロニクス部会先端技術シンポジウム: 次世代半導体の展望　～原理と製造技術～
- Invited
- Data Source
  KAKENHI-PROJECT-20K20992
[Presentation] Heterogeneous, 3D, & Flexible System Integration Technology Based on Chiplet-on-Wafer Assembly2021
- Author(s)
  福島誉史
- Organizer
  電子実装工学研究所（IMSI）接合界面創成技術研究会(LTB-3D 研究会　旧学振191研究会）
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE2021
- Author(s)
  福島誉史
- Organizer
  IEEE Solid-State Circuits Society (SSCS) Kansai Chapter 主催「2021 Symposia on VLSI Technology 国内報告会」
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] チップレットを基盤とした三次元集積の技術動向とフレキシブルデバイスの高集積化2021
- Author(s)
  福島誉史
- Organizer
  システムデバイスロードマップ委員会(SDRJ)主催　2021年度第4回Beyond CMOS & More Than Moore合同委員会
- Invited
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display2021
- Author(s)
  Yuki Susumago, Tomo Odashima, Masatsugu Ichikawa, Hiroki Hanaoka, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] iFHE: In-Mold Flexible Hybrid Electronics Using Fan-Out Wafer-Level Packaging with Chiplets2021
- Author(s)
  Takafumi Fukushima
- Organizer
  2021 Materials Research Society Taiwan International Conference (MRSTIC2021)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] チップレット内蔵インモールドエレクトロニクス用フレキシブル基板の細線化2021
- Author(s)
  小田島輩, 煤孫祐樹, 王喆, 木野久志, 田中徹, 福島誉史
- Organizer
  第82回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  N. Takahashi, Y. Susumago, S. Lee, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  Proceedings of the 69th Electronic Components and Technology Conference (ECTC 2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD2020
- Author(s)
  M. Murugesan, Y. Susumago, T. Odashima, H. Kino, T. Tanaka, K. Sumitani, Y. Imai, S. Kimura, and T. Fukushima
- Organizer
  The 2020 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Die-Level Cu-CMP　Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration2020
- Author(s)
  Shuai Liu, Kousei Kumahara, Yuki Miwa , Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly2020
- Author(s)
  Takafumi Fukushima
- Organizer
  4th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  N. Takahashi, Y. Susumago, S. Lee, H. Kino, T. Tanaka, and T. Fukushima,
- Organizer
  The 69th Electronic Components and Technology Conference (ECTC 2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukishima
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave/SpO2 Monitoring2020
- Author(s)
  Tomo Odashima, Yuki Susumago, Qian Zhengyang, Noriyuki Takahashi, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  The 2020 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices2020
- Author(s)
  Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 先端ウエハレベルパッケージング技術による新構造FHEの開発2020
- Author(s)
  福島誉史
- Organizer
  コンバーティングテクノロジー総合展2020」新機能性材料展 / JFlex / 3次元表面加飾技術展セミナー
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion2020
- Author(s)
  Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] インモールドエレクトロニクス用フレキシブル三次元波状配線の作製2020
- Author(s)
  永田柊太, 木野久志, 田中徹, 福島誉史
- Organizer
  第81回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration2020
- Author(s)
  Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Directed Self-Assembly Technology with Block Co-polymer/Metal Nanocomposites for Ultrafine-Feature Metallization2020
- Author(s)
  Takafumi Fukushima
- Organizer
  2020 MRS (Material Research Society) Virtual Spring/Fall Meeting & Exhibit, Symposium CT07
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K20992
[Presentation] Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  The 2019 IEEE 69th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of 3D-IC Embedded Flexible Hybrid System2019
- Author(s)
  S. Lee, Y. Susumago, Z. Qian, N. Takahashi, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 誘導自己組織化による極微細三次元配線形成技術2019
- Author(s)
  福島　誉史
- Organizer
  応用物理学会・シリコンテクノロジー分科会多層配線委員会および電子情報通信学会・シリコン材料・デバイス研究会（SDM）「配線・実装技術と関連材料技術」研究会
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] Study of Transparent Electrodes for 3D-Stacked Retinal Prosthesis2019
- Author(s)
  Michael Proffitt, Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino, Hiroshi Tomita
- Organizer
  2019 MRS Spring Meeting
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 多段階励起による発光現象を用いた光遺伝学用神経プローブの作製2019
- Author(s)
  浦山翔太、島智大、張博文、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Hydrogel-based Flexible Hybrid Electronics Technology for Biomedical Application2019
- Author(s)
  N. Takahashi, Y. Susumago, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] FOWLP-based Flexible Hybrid Sensor Systems with Dieletsand 3D-IC2019
- Author(s)
  Takafumi Fukushima
- Organizer
  The 18th International Symposium on Microelectronics and Packaging and 21st International Conference on Electronic Materials and Packaging (ISMP-EMAP 2019)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] RDL-first FOWLPによるハイドロゲル用いたFHEのためのチップ内蔵技術2019
- Author(s)
  高橋則之、煤孫祐樹、木野久志、田中徹、福島誉史
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] New Flexible Hybrid Electronics Technologies for Biomedical Application2019
- Author(s)
  Takafumi Fukushima
- Organizer
  EMN Meeting on Flexible Electronics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Technology Platform Development of Multichip-to-Wafer 3D Integration (2)- SiO2 Liner Technology for Low Temperature TSV Process -2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Y. Susumago, Achille Jacquemond, N. Takahashi, H. Kino, T. Tanaka, T. Fukushima
- Organizer
  International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] マイクロLED埋め込み型フレキシブルオプト神経プローブの開発2019
- Author(s)
  島智大, 煤孫裕樹, 張博文, 浦山翔太, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] チップ内蔵フレキシブル・ハイブリッド・エレクトロニクスの電気特性評価2019
- Author(s)
  煤孫祐樹, Qian Zhengyang, 髙橋則之, 木野久志, 田中徹, 福島誉史
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Multichip-to-Wafer三次元集積化基盤技術の開発 (1)－テンポラリ接着剤を用いた一括チップ薄化技術－2019
- Author(s)
  李晟豪、梁ザイ、三輪侑紀、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] New Flexible Hybrid Electronics (FHE) Using Advanced Wafer-Level Packaging Technology2019
- Author(s)
  Takafumi Fukushima
- Organizer
  International Congress on Advanced Materials Sciences and Engineering 2019 (AMSE-2019)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Annealing Effect on Room-Temperature-Deposited SiO2 Liner for Multichip-to-Wafer 3D Integration Process2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Hisashi Kino,Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] RDL-first FOWLPによるハイドロゲル用いたFHEのためのチップ内蔵技術2019
- Author(s)
  髙橋則之, 煤孫祐樹, 木野久志, 田中徹, 福島誉史
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Y. Susumago, Achille Jacquemond, N. Takahashi, H. Kino, T. Tanaka, T. Fukushima
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Room Temperature SiO2 Liner Technology for Multichip-to-Wafer 3D Integration with Via-last TSV2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC 2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs2019
- Author(s)
  Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] ハイドロゲルを用いたフレキシブル・ハイブリッド・エレクトロニクス作製2019
- Author(s)
  髙橋則之, 煤孫祐樹, 木野久志, 田中徹, 福島誉史
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Mechanical Characterization of FOWLP Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  2019 International Conference on Electronics Packaging ICEP 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer三次元集積に向けたマイクロバンプ接合技術2019
- Author(s)
  熊原宏征、三輪侑紀、李晟豪、梁ザイ、木野久志、福島誉史、田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] ハイドロゲルを用いたフレキシブル・ハイブリッド・エレクトロニクス作製2019
- Author(s)
  高橋則之、煤孫祐樹、木野久志、田中徹、福島誉史
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] 高密度電極接続を用いた三次元集積のための低背マイクロバンプ接合評価2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 熊原宏征, 木野久志, 福島誉史, 田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Investigation of the Underfill with Negative-Thermal- Expansion Material to Suppress Mechanical Stress in 3D Integration System2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara,Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer 三次元集積化基盤技術の開発 (3) ―異種機能集積化に向けたマイクロバンプ接合技術―2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 6th International Workshop on Low Temperature Bonding for 3D Integration
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018
- Author(s)
  李晟豪, 菅原陽平, 伊藤誠人, 木野久志, 福島誉史, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 三次元実装とフレキシブルハイブリッドエレクトロニクスに(FHE)向けた取り組み2018
- Author(s)
  福島　誉史
- Organizer
  第155回有機エレクトロニクス研究センター講演会
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] テンポラリー接合を用いたマルチリシック集積化技術2018
- Author(s)
  福島誉史
- Organizer
  日本学術振興会産学協力研究委員会接合界面創成技術第191委員会
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] 三次元実装とフレキシブルハイブリッドエレクトロニクスに(FHE)向けた取り組み2018
- Author(s)
  福島　誉史
- Organizer
  第155回有機エレクトロニクス研究センター講演会
- Invited
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] 3D Interconnection by Directed Self-Assembly (DSA) with Metal/Block-Copolymer Nanocomposites2018
- Author(s)
  Takafumi Fukushima
- Organizer
  Kick-off Symposium for World Leading Research Centers - Materials Science and Spintronics -
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] 日本学術振興会産学協力研究委員会情報科学用有機材料学振142委員会2018
- Author(s)
  福島　誉史
- Organizer
  先端三次元積層LSIから高集積FHEへの展開
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies2018
- Author(s)
  Takafumi Fukushima
- Organizer
  International Conference on Manipulation, Automation and Robotics at Small Scales
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 高集積フレキシブルデバイスシステム作製のための応力緩衝層の評価2018
- Author(s)
  煤孫祐樹, Achille Jacqumond, 高橋則之, 木野久志, 田中徹, 福島誉史
- Organizer
  第79回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs2018
- Author(s)
  H. Kino, S. Lee, Y. Sugawara, T. Fukushima, T. Tanaka
- Organizer
  21st IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 先端三次元積層LSIから高集積FHEへの展開2018
- Author(s)
  福島　誉史
- Organizer
  日本学術振興会産学協力研究委員会情報科学用有機材料学振142委員会
- Invited
- Data Source
  KAKENHI-PROJECT-18K18841
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 Japan-Taiwan Workshop on Electronic Interconnection Ⅱ
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 人工知能チップの開発に向けた自己組織化ヘテロ集積技術2018
- Author(s)
  福島　誉史
- Organizer
  東北大学NICHe戦略セミナーシリーズ（第３回）『考える』イメージ・センサーの将来
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] DRAMセルアレイを用いた3D-IC内部Cu汚染の高精度評価2018
- Author(s)
  谷川星野, 福島誉史, 木野久志, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 自己組織化TSV/3次元実装と高集積フレキシブル・ハイブリッド・エレクトロニクス（FHE）技術2018
- Author(s)
  福島　誉史
- Organizer
  189回定例会　日本実装技術振興協会高密度実装技術部会
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] Ultrawide range square wave impedance analysis circuit with ultra-slow Ring-Oscillator using gate-induced drain-leakage current2017
- Author(s)
  Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Temporary Bonding and De-bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si2017
- Author(s)
  M. Murugesan, T. Fukushima and M. Koyanagi
- Organizer
  2017 IEEE 67th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D-IC Technology and Its Application to Fully Implantable Retinal Prosthesis2017
- Author(s)
  Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino
- Organizer
  14th International Conference on Flow Dynamics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017
- Author(s)
  Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 IEEE 67th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017
- Author(s)
  Miao Xiong,Yangyang Yan, Yingtao Ding，Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 矩形波インピーダンス計測のためのGIDL電流を用いた低周波リングオシレータの設計と評価2017
- Author(s)
  竹澤好樹, 下川賢士, 銭正よう, 福島奨, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Experimental Evaluation of Stimulus Current Generator with Laplacian Edge-enhancement for 3-D Stacked Retinal Prosthesis Chip2017
- Author(s)
  Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator2017
- Author(s)
  Yoshiki Takezawa, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Directed Self-Assembly Patterning for 3D LSI2017
- Author(s)
  T. Fukushimaand M. Koyanagi
- Organizer
  INC 2017 Workshop
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 三次元積層人工網膜チップのためのラプラシアンエッジ強調機能を有する刺激電流生成回路の評価2017
- Author(s)
  下川賢士, 銭正よう, 竹澤好樹, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D integration and TSV2016
- Author(s)
  福島誉史
- Organizer
  UCLA visiting seminor
- Place of Presentation
  ロサンゼルス（米国）
- Invited
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration2016
- Author(s)
  Kangwook Lee, Chisato Nagai, Jichel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Suresh Ramalingam and Xin Wu
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価2016
- Author(s)
  谷川星野, 木野久志, 福島誉史, 田中徹
- Organizer
  2016年第63回応用物理学会春季学術講演会
- Place of Presentation
  東京工業大学　大岡山キャンパス、東京都
- Year and Date
  2016-03-19
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016
- Author(s)
  福島誉史
- Organizer
  The Electrochemical Society
- Place of Presentation
  ホノルル（米国）
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04323
[Presentation] Influence of Cu-TSVs, CuSn-and PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, and Tetsu Tanaka
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価2016
- Author(s)
  菅原陽平、木野久志、福島誉史、李康旭、小柳光正、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique2016
- Author(s)
  Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  2016 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan
- Year and Date
  2016-09-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価2016
- Author(s)
  下川賢士、後藤大輝、木野久志、福島誉史、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016
- Author(s)
  福島誉史
- Organizer
  The Electrochemical Society
- Place of Presentation
  ホノルル(米国)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies　Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino,
- Organizer
  ECTC: IEEE Electronic Components and Technology Conference
- Place of Presentation
  USA（Las Vegas）
- Year and Date
  2016-06-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2016 IEEE International Reliability Physics Symposium(IRPS 2016)
- Place of Presentation
  Pasadena Convention Center, Pasadena, USA
- Year and Date
  2016-04-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価2015
- Author(s)
  菅原　陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Consideration of Microbump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 高分子材料を用いた三次元集積技術2015
- Author(s)
  福島誉史
- Organizer
  第41回YJC実装技術セミナー
- Place of Presentation
  神奈川県　横浜市　横浜国立大学
- Year and Date
  2015-06-11
- Invited
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] 気相堆積重合によるポリイミド薄膜の形成とシリコン貫通配線への応用2015
- Author(s)
  福島誉史, マリアッパンムルゲサン, 裵志哲, 李康旭, 小柳光正
- Organizer
  第64回高分子討論会
- Place of Presentation
  宮城県　仙台市　東北大学　川内キャンパス
- Year and Date
  2015-09-10
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] Transfer and Non-transfer Stacking Technologies Based on Chip-to-wafer Self-assembly for High-throughput and High-precision Alignment and Microbump Bonding2015
- Author(s)
  Takafumi FUKUSHIMA, Taku SUZUKI, Hideto HASHIGUCHI, Chisato NAGAI, Jichoel BEA, Hiroyuki HASHIMOTO, Mariappan MURUGESAN, Kang-Wook LEE, Tetsu TANAKA, Kazushi ASAMI, Yasuhiro KITAMURA, and Mitsumasa KOYANAGI
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Mitigating Thermo Mechanical Stress in High-density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via micro-RS and micro-XRD Study2015
- Author(s)
  M. Murugesan, J.C. Bea, H. Hashimoto, K.W. Lee, and M. Koyanagi, T. Fukushima, and T. Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array2015
- Author(s)
  Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors2015
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究2015
- Author(s)
  木野久志, 橋口日出登, 谷川星野, 菅原陽平, 池ヶ谷俊介, 福島誉史, 小柳光正, 田中徹
- Organizer
  第25回マイクロエレクトロニクスシンポジウム MES2015
- Place of Presentation
  大阪大学吹田キャンパス、大阪府、吹田市
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価2015
- Author(s)
  谷川星野、木野久志、福島誉史、小柳光正、田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Reconfigured Multichip-on-wafer (mCoW) Cu/oxide Hybrid Bonding Technology for Ultra-high Density 3D Integration Using Recessed Oxide, Thin Glue Adhesive, and Thin Metal Capping Layers2015
- Author(s)
  Kangwook Lee, Chisato Nagai, Ai Nakamura, H. Aizawa, H. Hashiguchi, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向2015
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第32回「センサ・マイクロマシンと応用システム」シンポジウム
- Place of Presentation
  朱鷺メッセ　新潟コンベンションセンター、新潟県、新潟市
- Year and Date
  2015-10-28
- Invited
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV2015
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications2015
- Author(s)
  Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, and Kang-Wook Lee
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Development of Highly-Reliable　Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges2015
- Author(s)
  Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 気相堆積重合ポリイミドを用いたＴＳＶライナー形成2014
- Author(s)
  福島誉史
- Organizer
  シリコンテクノロジー分科会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] 三次元集積化におけるTSV作製プロセスがトランジスタ特性に及ぼす影響評価2014
- Author(s)
  菅原陽平, 谷川星野, 橋口日出登, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  平成26年電気学会全国大会
- Place of Presentation
  愛媛大学（松山）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System2013
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2013
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSI とヘテロインテグレーション2013
- Author(s)
  李康旭, 福島誉史, 田中徹, 小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京工業大学, Japan
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013
- Author(s)
  木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス（京田辺）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding2013
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center（大阪）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  63rd Electronic Components and Technology Conference 2013
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSIとヘテロインテグレーション2013
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Revisiting the Silicon-Lattice in the High-Density 3D-LSIs in the Perspective of Device Reliability2013
- Author(s)
  85. M. Murugesan, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
- Place of Presentation
  米国、Washington DC
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization2013
- Author(s)
  165. T. Fukushima, M. Murugesan, J. Bea, K.W. Lee, M. Koyanagi
- Organizer
  Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  福岡
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor2013
- Author(s)
  K.Kiyoyama, Y.Sato, H.Hashimoto, K-W Lee, T.Fukushima, T.Tanaka, and M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2013
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T. Fukushima, K-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE Electrical Components Technology Conference (ECTC)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013
- Author(s)
  H. Kino, T. Fukushima, K. -W. Lee, M. Koyanagi, T. Tanaka
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk（福岡）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 機能性液体を用いた自己組織化チップ実装技術2013
- Author(s)
  伊藤有香,福島誉史,李康旭,長木浩司,田中徹,小柳光正
- Organizer
  第27回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  仙台
- Year and Date
  2013-03-14
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced MetallizationConference 2012
- Place of Presentation
  東京
- Year and Date
  2012-10-23
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A. Noriki, K. W. Lee, J. Bea, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Year and Date
  2012-09-26
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assemblywith Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012International Conference on Solid StateDevices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Year and Date
  2012-09-26
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  T. Fukushima
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  Tokyo, Japan
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国
- Year and Date
  2012-04-12
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High Density Cu-TSVs and Reliability Issues2012
- Author(s)
  M.Murugesan, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 先端三次元積層型 LSI の技術動向と展望2012
- Author(s)
  福島誉史
- Organizer
  SEMI Forum Japan 2012
- Place of Presentation
  大阪
- Year and Date
  2012-06-13
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
- Organizer
  the Electro Chemical Society (ESC) Meeting
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A.Noriki, K.W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High-Bandwidth Data Transmission of New Transceiver Module Through Optical Interconnection2012
- Author(s)
  Y.Ito, S.Terada, S.Arai, K.Choki, T.Fukushima, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C Bea, T. Tanaka, and M. Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] W/Cu TSVs for 3D-LSI with Minimum Thermo-Mechanical Stress2012
- Author(s)
  M.Murugesan, H.Hashiguchi, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  千里ライフサイエンスセンター(大阪)
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Wafer-Level 3D Integration TechnologyUsing Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国
- Year and Date
  2012-04-12
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Self-Assembly-Based 3D IntegrationTechnologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Temporary Bonding Strength Control forSelf-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 先端三次元積層型LSIの技術動向と展望2012
- Author(s)
  福島誉史
- Organizer
  SEMI Forum Japan 2012
- Place of Presentation
  大阪
- Invited
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 先端三次元積層型LSIの技術動向と展望2012
- Author(s)
  福島誉史
- Organizer
  TSV/3次元積層化技術セミナー
- Place of Presentation
  大阪
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Novel Detachable Bonding Process with Wettability Control of Bonding Surface for Versatile Chip-Level 3D Integration2012
- Author(s)
  Y.Ohara, K.-W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  東京
- Year and Date
  2012-10-23
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国ソウル
- Invited
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] A Very Low Area ADC for 3-D Stacked CMOS Image Processing System2012
- Author(s)
  K.Kiyoyama, K.W.Lee, T.Fukushima, H.Naganuma, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  第25回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  横浜国立大学
- Year and Date
  2011-03-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011
- Author(s)
  T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  第61回Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Florida, USA
- Year and Date
  2011-06-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of 5 μm Diameter Backside Cu TSV Technology for 3D LSI2011
- Author(s)
  Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Conference on Electronics Packaging 2011 (ICEP2011)
- Place of Presentation
  Nara, Japan
- Year and Date
  2011-04-14
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] シリコン貫通光配線を用いた三次元光電子集積化技術2011
- Author(s)
  乗木暁博, 李康旭, 裴志哲, 福島誉史, 田中徹, 小柳光正
- Organizer
  J PCA Show 2011/ラージエレクトロニクスショー2011/2011マイクロエレクトロニクスショー/JISSO PROTEC2011
- Place of Presentation
  東京
- Year and Date
  2011-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  電子通信学会エレクトロニクスソサイエティ大会
- Place of Presentation
  札幌(特別講演)
- Year and Date
  2011-09-14
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D LSI Technology and Reliability Issues2011
- Author(s)
  T.Tanaka, J.Bea, M.Murugesan, K.Lee, T.Fukushima, M.Koyanagi
- Organizer
  2011 Symposium on VLSI Technology
- Place of Presentation
  Kyoto, Japan(招待)
- Year and Date
  2011-06-16
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer2011
- Author(s)
  M.Murugesan, H.Nohira, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid state Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  Workshop ICRA (IEEE Int. Conf. on Robotics and Automation)
- Place of Presentation
  中国
- Year and Date
  2011-05-09
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  Workshop ICRA (IEEE Int.Conf.on Robotics and Automation)
- Place of Presentation
  Shanghai (China)(招待講演)
- Year and Date
  2011-05-09
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Performance of Low-Loss and Low-Cost Optoelectronic Module with Polynorbornene Waveguide for 10-Gbps Data Transmission2011
- Author(s)
  Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials
- Place of Presentation
  Nagoya
- Year and Date
  2011-09-28
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Chip Stacking Technologies and Hetero System Integration2011
- Author(s)
  福島誉史
- Organizer
  SEMIテクノロジーシンポジウム(STS)2011
- Place of Presentation
  幕張メッセ(招待講演)
- Year and Date
  2011-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis2011
- Author(s)
  Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011
- Author(s)
  T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Florida (USA)
- Year and Date
  2011-06-02
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  台湾
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA) 12^<th> International Conference in Asia
- Place of Presentation
  Taipei, Taiwan(招待講演)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Chip Stacking Technologies and Hetero System Integration2011
- Author(s)
  福島誉史
- Organizer
  SEMIテクノロジーシンポジウム(STS)2011
- Place of Presentation
  幕張メッセ(千葉)(招待講演)
- Year and Date
  2011-12-08
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  第25回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  神奈川
- Year and Date
  2011-03-08
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術2011
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011
- Author(s)
  福島誉史,岩田永司,李康旭,田中徹,小柳光正
- Organizer
  第25回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京
- Year and Date
  2011-03-08
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  Taipei (Taiwan)(招待講演)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 高集積微細デバイスにおける今後の信号伝達/配線技術:シリコン貫通光インターコネクション(TSPV)を用いた光電子三次元2011
- Author(s)
  福島誉史, 乗木暁博, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI2011
- Author(s)
  H.Kino, M.Murugesan, K.-W.Lee, J.-C.Bea, C.Miyazaki, H.Kobayashi, H.Shimamoto, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Efficient Unidirectional Optical Coupler for Through Silicon Photonic Via in Optoelectronic 3D-LSI2011
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials
- Place of Presentation
  Nagoya
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIに用いるシリコン貫通光配線のFDTD解析2011
- Author(s)
  乗木暁博, 李康旭, Jichoel Bea, 福島誉史, 田中徹, 小柳光正
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学
- Year and Date
  2011-09-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光・電気刺激に対する網膜応答記録用フレキシブルケーブル電極の作製2011
- Author(s)
  木暮爾, 渡辺慶朋, 笹木悠一郎, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of Wafer-Level3D System Integration Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, andM. Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  台湾
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs2011
- Author(s)
  H.Hashiguchi, M.Murugesan, J.C.Bea, K.W.Lee, T.Fukushima, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D Chip Stacking Technologies and Hetero System Integration2011
- Author(s)
  福島誉史
- Organizer
  SEMI テクノロジーシンポジウム(STS)2011
- Place of Presentation
  千葉
- Year and Date
  2011-12-08
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 電極間クロストークを抑制した人工網膜用ピラー型刺激電極アレイの開発2011
- Author(s)
  渡辺慶朋, 木暮爾, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Density 3D LSI Technology using W/Cu Hybrid TSVs2011
- Author(s)
  M.Murugesan, H.Kino, A.Hashiguchi, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM2011)
- Place of Presentation
  WashingtonD.C, USA
- Year and Date
  2011-12-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  センサ・マイクロマシンと応用システムシンポジウム
- Place of Presentation
  東京(招待講演)
- Year and Date
  2011-09-26
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元積層時の局所応力がMOSFETの特性に与える影響2011
- Author(s)
  木野久志, Murugesan Mariappan, Jichel Bea, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-09-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011
- Author(s)
  Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop ICRA (IEEE Int.Conf.on Robotics and Automation) 2011 MEMS assembly and packaging : trends and challenges for robotics in the microscale
- Place of Presentation
  Shanghai, China(招待講演)
- Year and Date
  2011-05-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011
- Author(s)
  T. Fukushima, Y. Ohara, M. Murugesan, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  Electronic Components and Technology Conference(ECTC)
- Place of Presentation
  USA
- Year and Date
  2011-06-02
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  Taipei (Taiwan)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術2011
- Author(s)
  岩田永司,福島誉史,李康旭,田中徹,小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM)第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 機能性高分子を用いた次世代集積回路の作製技術と人工網膜への応用2010
- Author(s)
  福島誉史
- Organizer
  第55回高分子夏季大学
- Place of Presentation
  秋保温泉岩沼屋(仙台)
- Year and Date
  2010-07-14
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] バッチ式Die-to-Wafer三次元集積化技術2010
- Author(s)
  福島誉史、李康旭、小柳光正
- Organizer
  関西ワークショップ2010
- Place of Presentation
  京都(招待講演)
- Year and Date
  2010-07-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  K.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  218th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Las Vegas, USA(招待講演)
- Year and Date
  2010-10-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society(EDS)Japan Chapter 総会・2009 International Electron Devices Meeting(IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration2010
- Author(s)
  Eiji Iwata, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] A study of Charge Retention Characteristics of Metal Nanodots Memory2010
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  第57回応用物理学関係連合講演会2010年春季
- Place of Presentation
  神奈川県平塚市東海大学
- Year and Date
  2010-03-17
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application2010
- Author(s)
  Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  China Semiconductor Technology International Conference 2010 (CSTIC2010)
- Place of Presentation
  Shanghai, China.
- Year and Date
  2010-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A. Noriki, K.-W. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010(3DIC)
- Place of Presentation
  ドイツ, ミュンヘン
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for ReconfiguredWafer-to-Wafer 3D Integration2010
- Author(s)
  T. Fukushima, E. Iwata, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  60th Electronic Components and TechnologyConference (ECTC)
- Place of Presentation
  USA
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] A study of Charge Retention Characteristics of Metal Nanodots Memory2010
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  第57回応用物理学関係連合講演会2010年春季
- Place of Presentation
  東海大学
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010
- Author(s)
  T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D-LSI/TSVの技術動向と新領域への展開2010
- Author(s)
  田中徹, 福島誉史, 李康旭, 小柳光正
- Organizer
  Semi Forum Japan 2010 TSV/3次元実装セミナー
- Place of Presentation
  グランキューブ大阪(招待講演)
- Year and Date
  2010-06-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010
- Author(s)
  T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
- Organizer
  IEEE International3D System Integration Conference (3DIC)
- Place of Presentation
  ドイツ
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 機能性高分子を用いた次世代集積回路の作製技術と人工網膜への応用2010
- Author(s)
  福島誉史,小柳光正
- Organizer
  第55回高分子夏季大学
- Place of Presentation
  仙台
- Year and Date
  2010-07-14
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010
- Author(s)
  T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  ドイツ(ミュンヘン)
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] ファインピッチ金属マイクロバンプを有するチップの自己組織化積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  第71回応用物理学会学術講演会
- Place of Presentation
  長崎大学(長崎)
- Year and Date
  2010-09-15
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society (EDS) Japan Chapter総会・2009 International Electron Devices Meeting (IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A.Noriki, K.-W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration2010
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2010-01-20
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM) 第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration2010
- Author(s)
  T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  60^<th> Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  米国(ラスベガス)
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] 東北大学における三次元積層技術とヘテロインテグレーション2010
- Author(s)
  李康旭,福島誉史,田中徹,小柳光正
- Organizer
  JPCA Show 2010アカデミックプラザ
- Place of Presentation
  東京
- Year and Date
  2010-06-04
- Data Source
  KAKENHI-PROJECT-22360136
[Presentation] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI2010
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding2010
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  IEEE Custom Integrated Circuits Conference (CICC)
- Place of Presentation
  San Jose, USA(招待講演)
- Year and Date
  2010-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 東北大学における三次元積層技術とヘテロインテグレーション2010
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  JPCA Show 2010 (pp.99-104)
- Place of Presentation
  アカデミックプラザ,東京ビッグサイト(招待講演)
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration2010
- Author(s)
  T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 金属マイクロバンプ接合を介した自己組織化チップ積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第57回応用物理学関係連合講演会
- Place of Presentation
  平塚
- Year and Date
  2010-03-19
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application2010
- Author(s)
  裴艶麗, 開達郎, 小島俊哉, 福島誉史, 田中徹, 小柳光正
- Organizer
  China Semiconductor Technology International Conference(CSTIC2010)
- Place of Presentation
  Shanghai, China
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 自己組織化によるヘテロインテグレーション技術2009
- Author(s)
  福島誉史
- Organizer
  第12回低温接合による3D集積化研究会
- Place of Presentation
  東京
- Year and Date
  2009-04-22
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化を用いた高密度実装技術とスーパーチップインテグレーション"2009
- Author(s)
  福島誉史
- Organizer
  10回半導体パッケージング技術展専門技術セミナー
- Place of Presentation
  東京
- Year and Date
  2009-01-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2009 (3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] メタルナノドットメモリの電荷保持特性に関する研究2009
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 田中徹, 小柳光正
- Organizer
  第70回応用物理学関係連合講演会2009年秋季
- Place of Presentation
  富山大学
- Year and Date
  2009-09-10
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Magnetic Nano-Dots Nonvolatile Memory with Resonant Magnetic Tunneling Effect2009
- Author(s)
  JiChel Bea, M.Murugesan, C.-K.Yin, H.Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  第56回応用物理学会学術講演会 2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-01
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Super Chip Integration Technology for ThreeDimensionally Stacked Retinal Prosthesis Chips2009
- Author(s)
  Takafumi Fukushima
- Organizer
  Smart System Integration Conference 2009
- Place of Presentation
  ブリュッセル(ベルギー)
- Year and Date
  2009-03-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M. Murugesan, J.C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W.C. Jeong, H. Kino, A. Noriki, K.W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference (ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Synthesis and characterization of magnetic nano-dots for on-chip inductors2009
- Author(s)
  M. Murugesan, W. -C. Jeong, K. Kiyoyama, K. -W. Lee, J. -C. Bea, C. -K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  第56回応用物理学会学術講演会2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-02
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 3D Integration Technology and 3D Integrated Systems(Invited)2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Optoelectronic Multichip Module with Optical Interconnection(Invited)2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  12th IEEE International Symposium on Microwave and Optical Technology(ISMOT-2009)
- Place of Presentation
  Indiaニューデリー
- Year and Date
  2009-12-18
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] ThreeDimensional Integration Technology to Achieve Super Chip2009
- Author(s)
  Takafumi Fukushima
- Organizer
  SEMICON Korea
- Place of Presentation
  ソウル(韓国)
- Year and Date
  2009-01-21
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] High-Performance MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  10th Non-Volatile Memory Technology Symposium (NVMTS 2009)
- Place of Presentation
  Portland, OR, USA.
- Year and Date
  2009-10-27
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  T. Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society (ECS) Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Magnetic Nano-Dots Nonvolatile Memory with Resonant Magnetic Tunneling Effect2009
- Author(s)
  JiChel Bea, M. Murugesan, C. -K. Yin, H. Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  第56回応用物理学会学術講演会2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-01
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Super Chip Integration Technology for Three-Dimensionally Stacked Retinal Prosthesis Chips2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Smart System Integration Conference 2009
- Place of Presentation
  ブリュッセル(ベルギー)
- Year and Date
  2009-03-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  M. Koyanagi, T. Fukushima, T. Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  ISTC/CSTIC 2009
- Place of Presentation
  Shanghai, China
- Year and Date
  2009-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Three-Dimensional Integration Technology to Achieve Super Chip2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  SEMICON Korea
- Place of Presentation
  ソウル(韓国)
- Year and Date
  2009-01-21
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリー伝を用いた新しいヘテロインテグレーション技術(VLSI特集)(招待講演)2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会
- Place of Presentation
  東京
- Year and Date
  2009-07-21
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE International 3D System Integration Conference 2009(3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] A Co-Nanodots Nonvolatile Memory with High-k Blocking Oxide for Implantable Biomedical Devices2009
- Author(s)
  C.K. Yin, Y.L. Pei, T. Kojima, T. Fukushima, M. Koyanagi, T. Tanaka
- Organizer
  9th International Symposium on Nano-Biomedical Engineering
- Place of Presentation
  Sendai, Japan.
- Year and Date
  2009-03-28
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Development of a New Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Tanafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Proc.of IEEE International 3D System Integration Conference(3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Synthesis and characterization of magnetic nano-dots for on-chip inductors2009
- Author(s)
  M.Murugesan, W.-C.Jeong, K.Kiyoyama, K.-W.Lee, J.-C.Bea, C.-K.Yin, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  第56回応用物理学会学術講演会 2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-02
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M.Murugesan, J.C.Bea, T.Fukushima, T.Konno, K.Kiyoyama, W.C.Jeong, H.Kino, A.Noriki, K.W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference(ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2009 IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  ボルチモア(USA)
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] High-k絶縁膜を有するタングステンナノドットフローティングゲートMOSキャパシタのメモリ特性2009
- Author(s)
  裴艶麗, 西嶋雅彦, 福島誉史, 田甲徹, 小柳光正
- Organizer
  第69回応用物理学関係連合講演会2008年秋季
- Place of Presentation
  中部大学
- Year and Date
  2009-09-03
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon(SOS)2009
- Author(s)
  K-W Lee, A.Noriki, K.Kiyoyama, S.Kanno, R.Kobayashi, W-C Jeong, J-C Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology(Invited)2009
- Author(s)
  Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  Vienna, Austria
- Year and Date
  2009-10-06
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 自己組織化による三次元LSIチップの高精度位置合わせ技術2009
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第70回応用物理学会学術講演会
- Place of Presentation
  富山
- Year and Date
  2009-09-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化を用いた高密度実装技術とスーパーチップインテグレーション2009
- Author(s)
  福島誉史
- Organizer
  10回半導体パッケージング技術展専門技術セミナー
- Place of Presentation
  東京
- Year and Date
  2009-01-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] High-Performance MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  10^<th> Non-Volatile Memory Technology Symposium(NVMTS 2009)
- Place of Presentation
  Portland, OR, USA
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module2009
- Author(s)
  A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K. -W. Lee, J. -C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  2009 International Conference on Solid State Devices and Materials
- Place of Presentation
  仙台
- Year and Date
  2009-10-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会多層配線システム研究委員会(共催:電子情報通信学会、シリコン材料・デバイス研究会(SDM)
- Place of Presentation
  東京
- Year and Date
  2008-02-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima
- Organizer
  2008 IEEE International Electron Devices Meeting
- Place of Presentation
  San Francisco、米国
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19360153
[Presentation] Self-Assembly for Heterogeneous Integration with Lateral Interconnections Extending over MEMS and LSI Chips2008
- Author(s)
  Takayuki Konno, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリーを用いた3次元集積化技術2008
- Author(s)
  福島誉史, 小柳光正
- Organizer
  九州学術研究都市第8回産学連携フェア
- Place of Presentation
  小倉
- Year and Date
  2008-10-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Memory Characterization of MOS Memory Device with High Density Self-Assembled Tungsten Nanodots Floating Gate and HfO2 Blocking Dielectric2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan.
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 3D System Integration Technology and 3D Systems2008
- Author(s)
  T. Fukushima
- Organizer
  Materials for Advanced Metallization Conference 2008 (MAM 2008)
- Place of Presentation
  Dresden, Germany
- Year and Date
  2008-03-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using SelfAssembly Method2008
- Author(s)
  Takafumi Fukushima
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  サンフランシスコ(米国)
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] MEMS-半導体横方向配線技術I:フレキシブル基板へのLSIチップのセルフアセンブリ2008
- Author(s)
  福島誉史, 今野隆行, 田中徹, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会
- Place of Presentation
  船橋
- Year and Date
  2008-03-28
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D System Integration Technology and 3D Systems2008
- Author(s)
  T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  Materials for Advanced Metallization Conference 2008 (MAM 2008)
- Place of Presentation
  Dresden(Germany)
- Year and Date
  2008-03-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Multichip SelfAssembly Technique on Flexible Polymeric Substrate2008
- Author(s)
  Takafumi Fukushima
- Organizer
  The 59 th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  フロリダ(米国)
- Year and Date
  2008-05-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリーを用いた3次元集積化技術2008
- Author(s)
  福島誉史
- Organizer
  九州学術研究都市第8回産学連携フェア
- Place of Presentation
  小倉(福岡)
- Year and Date
  2008-10-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] system integration technology and 3D systems2008
- Author(s)
  Takafumi, FUKUSHIMA
- Organizer
  MAM2008(Materials for Advanced Metallization3D Workshop)
- Place of Presentation
  Dresden, Germany
- Year and Date
  2008-03-02
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] シリコン窒化膜中に埋め込んだタングステンナノドットフローティングゲートMOSキャパシタのメモリ特性2008
- Author(s)
  裴艶麗, 福島誉史, 田中徹, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会2008年春季
- Place of Presentation
  日本大学
- Year and Date
  2008-03-27
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Chip Self-Assembly Technique for 3D LSI Fabrication2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  3D System Integration Technology Conference (3D-SIC) 2008
- Place of Presentation
  東京
- Year and Date
  2008-05-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Memory Characterization of MOS Memory Device with High Density Self-Assembled Tungsten Nanodots Floating Gate and HfO2 Blocking Dielectric2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  サンフランシスコ(米国)
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D system integration technology and 3D systems2008
- Author(s)
  Takafumi, FUKUSHIMA
- Organizer
  MAM2008 (Materials for Advanced Metallization Workshop)
- Place of Presentation
  Dresden, Germany
- Year and Date
  2008-03-02
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] FM/I/Nano-Dot FM構造でのスピン電子の磁気トンネル効果2008
- Author(s)
  〓志哲, Murugesan Mariappan, Cheng KuanYin, 福島誉史, 田中徹, 寒川誠二, 河野省三, 佐道泰造, 宮尾正信, 名取研二, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会2008春季
- Place of Presentation
  日本大学
- Year and Date
  2008-03-30
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史
- Organizer
  応用物理学会シリコンテクノロジー分科会多層配線システム研究委員会(共催:電子情報通信学会、シリコン材料・デバイス研究会(SDM)
- Place of Presentation
  機械振興会館,東京
- Year and Date
  2008-02-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] MEMS-半導体横方向配線技術I:フレキシブル基板へのLSIチップのセルフアセンブリ2008
- Author(s)
  福島誉史
- Organizer
  第55回応用物理学関係連合講演会
- Place of Presentation
  日本大学理工学部船橋キャンパス
- Year and Date
  2008-03-28
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Characterization of Metal Nanodots Nonvolatile Memory2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  シリコン材料・デバイス研究会
- Place of Presentation
  東京
- Year and Date
  2008-06-10
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] A New Nano-System with Three-Dimensional Structure for Real Time Parallel Image Processing2008
- Author(s)
  T. Fukushima, M. Koyanagi
- Organizer
  the 5th International Conference on Mechanical Science based on Nanotechnology
- Place of Presentation
  Sendai
- Year and Date
  2008-03-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] ThreeDimensional Integration Technology Based on SelfAssembled Chipto-Wafer Stacking2008
- Author(s)
  Takafumi Fukushima
- Organizer
  2008 Materials Research Society (MRS) Fall Meeting
- Place of Presentation
  ボストン(米国)
- Year and Date
  2008-12-01
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] A New Nano-System with Three-Dimensional Structure for Real Time Parallel Image Processing2008
- Author(s)
  T. Fukushima
- Organizer
  the 5th International Conference on Mechanical Science based on Nanotechnology
- Place of Presentation
  Sendai International Center, Sendai
- Year and Date
  2008-03-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Chip SelfAssembly Technique for 3D LSI Fabrication2008
- Author(s)
  Takafumi Fukushima
- Organizer
  3D System Integration Technology Conference (3D-SIC) 2008
- Place of Presentation
  東京
- Year and Date
  2008-05-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride2008
- Author(s)
  Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  MRS 2008 Spring Meeting
- Place of Presentation
  San Francisco, USA.
- Year and Date
  2008-03-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Multichip Self-Assembly Technique on Flexible Polymeric Substrate2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  The 59th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  フロリダ(米国)
- Year and Date
  2008-05-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化ウエーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史
- Organizer
  応用物理学会シリコンテクノロジー分科会多層配線システム研究委員会(共催:電子情報通信学会、シリコン材料・デバイス研究会)(SDM)
- Place of Presentation
  機械振興会館、東京
- Year and Date
  2008-02-08
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Tapered Through-Si Via Formation for Optical Interposer with 3D ICs and Buried Vertical-Cavity Surface-Emitting Laser / Photo Diode Chips2008
- Author(s)
  Makoto Fujiwara, Akihiro Noriki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology using Self-Assembly Method2008
- Author(s)
  T. Fukushima
- Organizer
  2008 IEEE International Electron Devices Meeting
- Place of Presentation
  San Francisco, USA
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19360153
[Presentation] Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 Materials Research Society (MRS) Fall Meeting
- Place of Presentation
  ボストン(米国)
- Year and Date
  2008-12-01
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] キャビティ構造を有するMEMSチップのセルフアセンブリ2008
- Author(s)
  今野隆行, 小林吏悟, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Characteristics of Magnetic Film Inductors with FePt Nano-Dots2008
- Author(s)
  W. -C. Jeong, K. Kiyoyama, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba
- Year and Date
  2008-09-26
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 三次元LSIを搭載した光インターポーザのためのテーパTSVの形成2008
- Author(s)
  乗木暁博, 藤原誠, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D system integration technology and 3D systems2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Advanced Metallization Conference (AMC) 2008
- Place of Presentation
  サンディエゴ(米国)
- Year and Date
  2008-09-23
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  T. Fukushima
- Organizer
  57th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Reno, Nevada, USA
- Year and Date
  2007-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology Based on Chip-to-Wafer Bonding with Through-Si Vias(TSV)2007
- Author(s)
  Takafumi Fukushima
- Organizer
  2nd 3DIntegration by Low-temperature Bonding Technology
- Place of Presentation
  Tokyo, Univ. of Tokyo
- Year and Date
  2007-09-18
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Self-Assembly Process for Chip-to-Water Three-Dimensional Integration2007
- Author(s)
  Takafumi, Fukushima
- Organizer
  Electronic Components and Technooogy Conference (ECTC)
- Place of Presentation
  Reno, USA
- Year and Date
  2007-05-28
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi, FUKUSHIMA
- Organizer
  IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo, Univ. of Tokyo
- Year and Date
  2007-11-08
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  T. Fukushima
- Organizer
  1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo Univ. Tokyo
- Year and Date
  2007-11-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology Based on Chip-to-Wafer Bonding with Through-Si Vias (TSV)2007
- Author(s)
  Takafumi, Fukushima
- Organizer
  3D Integration by Low-temperature Bonding Technology
- Place of Presentation
  Tokyo, Univ. of Tokyo
- Year and Date
  2007-09-18
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] 3次元実装技術2007
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  エレクトロニクス実装学会/材料技術委員会公開研究会「次世代インテリジェント実装材料」
- Place of Presentation
  東京
- Year and Date
  2007-11-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  Takafumi, Fukushima
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany, USA
- Year and Date
  2007-10-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  T. Fukushima
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany, New York, USA
- Year and Date
  2007-10-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo
- Year and Date
  2007-11-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3次元実装技術2007
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会/材料技術委員会公開研究会「次世代インテリジェント実装材料」
- Place of Presentation
  東京,国立オリンピック記念青少年総合センター
- Year and Date
  2007-11-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  Takafumi Fukushima
- Organizer
  The 57th Electronic Components and Technology Conference(ECTC)
- Place of Presentation
  Reno, Nevada, USA
- Year and Date
  2007-05-31
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany (USA)
- Year and Date
  2007-10-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 三次元実装技術2007
- Author(s)
  福島誉史
- Organizer
  エレクトロニクス実装学会/材料技術委員会公開研究会
- Place of Presentation
  東京、国立オリンピック記念青少年総合センター
- Year and Date
  2007-11-29
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi Fukushima
- Organizer
  1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo, Univ. of Tokyo
- Year and Date
  2007-11-09
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington DC, USA
- Year and Date
  2007-12-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Investigation of FePt Nano-Dots Fabricated by Self-Assembled Nano-Dot Deposition Method Using X-ray Photoelectron Spectroscopy2007
- Author(s)
  M. Murugesan, J.C. Bea, C-K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  The 2007 International Conference on Solid State Device and Materials
- Place of Presentation
  Tsukuba, Japan
- Year and Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Fabrication of Magnetic Tunnel Junction with FePt Nanodots for Magnetic Nanodot Memory2007
- Author(s)
  Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 6th International Semiconductor Technology Conference (ISTC 2007) (Invited speech)
- Place of Presentation
  Shanghai, China.
- Year and Date
  2007-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot2007
- Author(s)
  Yanli Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 2007 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba, Japan.
- Year and Date
  2007-09-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method2007
- Author(s)
  Woo-Cheol Jeong, Mungi Park, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Pusan-Tohoku "21COE" Joint Workshop on Mechanical Science based on Nanotechnology
- Place of Presentation
  Pusan, Korea.
- Year and Date
  2007-01-08
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 3D Integration Technology Based on Chip-to-Water Bonding with Through-Si Vias (TSV)2007
- Author(s)
  Takafumi, Fukushima
- Organizer
  3D Integration by Low-temperature Bonding Technology
- Place of Presentation
  Tokyo, University of Tokyo
- Year and Date
  2007-09-18
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
- Organizer
  57th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Reno (USA)
- Year and Date
  2007-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 金属ナノドットフローティングゲートMOSキャパシタのメモリ特性2007
- Author(s)
  裴艶麗, 福島誉史, 田中徹, 小柳光正
- Organizer
  第68回応用物理学会学術講演会2007秋
- Place of Presentation
  北海道工業大学
- Year and Date
  2007-09-06
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  Takafumi Fukushima
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany, New York, USA
- Year and Date
  2007-10-11
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi, FUKUSHIMA
- Organizer
  IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo University of Tokyo
- Year and Date
  2007-11-08
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method2007
- Author(s)
  C.K. Yin, H. Choi, J.C. Bea, M. Murugesan, J.H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi
- Organizer
  NSTI Nanotech 2007 10th Annual
- Place of Presentation
  Santa Clara, USA.
- Year and Date
  2007-03-23
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Fundamental Microstructure and Magnetic Properties of Self-Assembled FePt Nano-Dot Film Annealed by using Magnetic Field Annealing2007
- Author(s)
  J.C. Bea, M. Murugesan, C. -K. Yin, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  The Fifth Nanotechnology Symposium, JAPAN NANO 2007
- Place of Presentation
  Tokyo, Japan.
- Year and Date
  2007-02-20
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Evaluation of FePt nano-dots by X-ray photoelectron spectroscopy2007
- Author(s)
  M. Murugesan, J.C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  第68回応用物理学会学術講演会2007秋
- Place of Presentation
  北海道工業大学
- Year and Date
  2007-09-07
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  Takafumi, Fukushima
- Organizer
  Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Reno, USA
- Year and Date
  2007-05-28
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi. Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington DC(USA)
- Year and Date
  2007-12-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology2006
- Author(s)
  Takafumi, Fukushima
- Organizer
  International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  Tokyo Shinagawa Prince Hotel
- Year and Date
  2006-04-20
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology2006
- Author(s)
  Takafumi, Fukushima
- Organizer
  International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  Tokyo Sinagawa Prince Hotel
- Year and Date
  2006-04-20
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration2005
- Author(s)
  Takafumi Fukushima,
- Organizer
  International Conference on Solid State Device and Materials <SSDM>
- Place of Presentation
  Kobe, International Conference Center
- Year and Date
  2005-09-13
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration2005
- Author(s)
  Takafumi Fukushima
- Organizer
  International Conference on Solid State Device and Materials (SSDM)
- Place of Presentation
  Kobe, International Conference Center
- Year and Date
  2005-09-13
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] 三次元ヘテロ集積化技術とスーパーチップ
- Author(s)
  小柳光正,福島誉史,李康旭,田中徹
- Organizer
  スマートプロセス学会電子デバイス実装研究委員会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology, The IEEE International Conference on 3D System Integration (3D IC)
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, H.-Y. Son, M.-S. Suh, K.-Y.Byun, N.-S. Kim, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International Conference on 3D System Integration (3D IC)
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Tiny VCSEL Chip Self-Assembly for Advanced　Chip-to-Wafer 3D and Hetero Integration
- Author(s)
  Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 光電子集積三次元LSIのための高効率光カップラの検討
- Author(s)
  乗木暁博，李康旭，裵志哲, 福島誉史，田中徹，小柳光正
- Organizer
  2012年第73回応用物理学会秋季学術講演会
- Place of Presentation
  愛媛大学・松山大学（愛媛）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Characterization and Reliability of 3-D LSI and SiP
- Author(s)
  K-W Lee, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2013
- Place of Presentation
  Washington D.C., USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価
- Author(s)
  菅原陽平，橋口日出登，谷川星野，木野久志，福島誉史，李康旭，小柳光正，田中徹
- Organizer
  第75回応用物理学会秋季学術講演会
- Place of Presentation
  北海道大学札幌キャンパス、北海道、札幌市
- Year and Date
  2014-09-17 – 2014-09-20
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  San Francisco, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
- Author(s)
  Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  the 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Orlando, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
- Author(s)
  Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 高分子材料を用いた三次元集積技術III：気相堆積ポリイミドTSVライナーの形成と特性評価
- Author(s)
  福島誉史，Murugesan Mariappan，裵　志哲，橋本宏之，佐藤　優，李　康旭，小柳光正
- Organizer
  エレクトロニクス実装学会　第29回春季講演大会
- Place of Presentation
  東京大学（東京都文京区本郷7-3-1）
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] 3D Integration and Reliability Challenges
- Author(s)
  Mitsumasa Koyanagi, Mariappan Murugesan, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  224th Electrochemical Society (ECS) Meeting
- Place of Presentation
  San Francisco, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration
- Author(s)
  H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
- Place of Presentation
  The University of Tokyo, Hongo, Tokyo, Japan
- Year and Date
  2014-07-15 – 2014-07-16
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIのための高効率光カップラの作製(Fabrication of Unidirectional Optical Coupler for Opto-Electronic 3-D LSI)
- Author(s)
  乗木暁博，李康旭，裵志哲，福島誉史，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly
- Author(s)
  H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K..-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  International Conference on Solid State Devices and Materials (SSDM2014)
- Place of Presentation
  Tsukuba International Congress Center EPOCHAL TSUKUBA, Tsukuba, Ibaraki, Japan
- Year and Date
  2014-09-08 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層
- Author(s)
  橋口日出登，福島誉史，裵　志哲，Murugesan Mariappan，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 自己組織化静電仮接合を用いたC2W三次元集積化技術(Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding)
- Author(s)
  橋口日出登，福島誉史，裵志哲，Mariappan Murugesan，木野久志，李康旭，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Jicheol Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 62nd Electronic Components and Technology Conference
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Heterogeneous 3D Integration Technology and New 3D LSIs
- Author(s)
  M. Koyanagi, K-W Lee, T. Fukushima and T. Tanaka
- Organizer
  IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2012)
- Place of Presentation
  Xi’an, China
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] C2W三次元集積のための自己組織化静電仮接合の評価
- Author(s)
  橋口日出登, 福島誉史, 裵志哲, 木野久志, 李康旭, 田中徹, 小柳光正
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  Seoul, Korea
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation
- Author(s)
  Takafumi Fukushima, Murugesan Mariappan, Jichoel Bea, Kang-Wook Lee, and Mitsumasa Koyanagi
- Organizer
  International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば国際会議場（つくば市竹園2-20-3）
- Year and Date
  2014-09-09 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 先端三次元積層型LSIの技術動向と展望
- Author(s)
  福島誉史
- Organizer
  SEMI Forum Japan 2012 ：TSV/3次元積層化技術セミナー（１）－いよいよ量産へ、ここまで来たTSV技術－
- Place of Presentation
  グランキューブ大阪（大阪）
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques
- Author(s)
  Takafumi Fukushima, Kang Wook Lee, Jicheol Bea, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Honolulu, Hawaii, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K.-W. Lee, T.Tanaka, and M. Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Effects of Electro-less Ni Layer as Barrier/Seed　Layers for High Reliable and Low Cost Cu TSV1
- Author(s)
  K.W. Lee, C. Nagai, A. Nakamura, J.C. Bea, M. Murugesan, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Hetero-Integration Technology for Innovative Convergence Systems
- Author(s)
  K-W. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  Electronics Packaging Symposium
- Place of Presentation
  Binghamton, NY, USA
- Year and Date
  2014-10-08 – 2014-10-09
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Challenges in 3D Integration
- Author(s)
  Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  223th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Toronto, Canada,
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元LSIとヘテロインテグレーション
- Author(s)
  李康旭,福島誉史,田中徹,小柳光正
- Organizer
  半導体・集積路技術シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International Conference on 3D System Integration (3D IC)
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly-Based 3D Integration Technologies
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京大学（東京）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ
- Author(s)
  伊藤有香，福島誉史，Murugesan Mariappan，裵　志哲，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
- Author(s)
  H. Hashiguchi, T. Fukushima, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 International Conference on Electronics Packaging (ICEP2014)
- Place of Presentation
  Toyama International Convention Center, Toyama, Toyama, Japan
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Development of 3D Integration Technologies and Recent Challenges
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012: 22nd Asian　Session
- Place of Presentation
  東京大学（東京）
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
- Author(s)
  H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060

1. TANAKA Tetsu (40417382)

# of Collaborated Projects: 15 results

# of Collaborated Products: 353 results
2. KIYOYAMA Kouji (60412722)

# of Collaborated Projects: 10 results

# of Collaborated Products: 18 results
3. KINO Hisashi (10633406)

# of Collaborated Projects: 9 results

# of Collaborated Products: 112 results
4. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 8 results

# of Collaborated Products: 235 results
5. BEA Jichel (40509874)

# of Collaborated Projects: 7 results

# of Collaborated Products: 16 results
6. TOMITA Hiroshi (40302088)

# of Collaborated Projects: 6 results

# of Collaborated Products: 1 results
7. MURUGESAN Mariappan (10509699)

# of Collaborated Projects: 5 results

# of Collaborated Products: 14 results
8. PEI Yanli (70451622)

# of Collaborated Projects: 3 results

# of Collaborated Products: 32 results
9. SUGANO Eriko (70375210)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
10. HANE Kazuhiro (50164893)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
11. 橋本宏之 (80589432)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
12. MIURA Hideo (90361112)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. LEE KANGWOOK (90534503)

# of Collaborated Projects: 1 results

# of Collaborated Products: 16 results
14. SAMUKAWA Seiji (30323108)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. Onishi Masaki (20618615)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. MOSSAD Ali Atif (80436097)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
17. 栗野浩之 (70282093)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
18. 沈正七 (00333849)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
19. 長井千里 (70718353)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
20. 大山俊幸 (30313472)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
21. 梶原一宏 (10779937)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
22. 宮川宣明

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Fukushima Takafumi 福島 誉史

FUKUSHIMA Takafumi 福島 誉史

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三次元直交積層メモリ・オン・プロセッサの工学的技術基盤研究Principal Investigator

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Energy Storage Roll Fabrication Based on Flexible Hybrid Electronics and Advanced Microelectronics PackagingPrincipal Investigator

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Holistic Integration Engineering with Micro-assembly and WireletsPrincipal Investigator

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Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin DisplayPrincipal Investigator

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Nano-Interconnect Formation by Directed Self-Assembly with StainingPrincipal Investigator

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Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress EngineeringPrincipal Investigator

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Highly Integrated Hydrogel Fabrication ChallengePrincipal Investigator

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Directed Self-Assembly based Interconnect Technology for Next-Generation 3D LSIPrincipal Investigator

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Adhesion Study Based on Dendritic Anchor Effects on Glass/Polymer InterfacesPrincipal Investigator

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Fukushima Takafumi 福島誉史

FUKUSHIMA Takafumi 福島誉史