CHONAN Yasunori 長南安紀

… Alternative Names

長南安紀チョウナンヤスノリ

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Researcher Number	30363740
Affiliation (Current)	2025: 秋田県立大学, システム科学技術学部, 助教
Affiliation (based on the past Project Information) *help	2012: 秋田県立大学, システム科学技術学部, 助教
Review Section/Research Field	Except Principal Investigator Structural/Functional materials
Keywords	Except Principal Investigator 配線評価用TEG / パルスめっき技術 / 配線抵抗率 / 添加剤フリーめつき技術 / 超高純度めっき材料 / ULSI / 微細構造 / 微量不純物 / Cuの高純度化 / TEG … More / 分子動力学シミュレーション / 革新的高導電性 / 超高純度めっき材 / 添加剤フリー / Cu 配線 / 収差補正STEM / クレヴァス / Ru膜 / 添加剤フリーめっき / 収差補正TEM / 粒界不純物 / 抵抗率 / 超高純度硫酸銅 / Cu配線 / LSI / 情報材料 / 電子 Less

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.
- Principal Investigator
  
  ONUKI Jin (OONUKI Jin)
- Project Period (FY)
  2008 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Ibaraki University

All 2010 2008 Other

All Journal Article Presentation

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K. P. Khoo, N. Ishikawa, Y.Chonan, T.Kimura, H. Akahoshi
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 157巻
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy2010
- Author(s)
  J.Onuki, K.P.Khoo, Y.Sasajima, Y.Chonan, T.Kimura
- Journal Title
  
  J.Appl.Phys.
  
  Volume: 108巻 Pages: 0443021-0443027
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K.P.Khoo, N.Ishikawa, Y.Chonan, T.Kimura, H.Akahoshi
- Journal Title
  
  J.Electrochem.Soc 157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy2010
- Author(s)
  J.Onuki, K.P.Khoo, Y.Sasajima, Y.Chonan, T.Kimura
- Journal Title
  
  J.Appl.Phys. 108
  
  Pages: 0443021-7
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K.P.Khoo, N.Ishikawa, Y.Chonan, T.Kimura, H.Akahoshi
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate andshort time annealing utilizing misorientation energy2010
- Author(s)
  J.Onuki, K.P.Khoo, Y.SasajimaY.Chonan, T.Kimura
- Journal Title
  
  J.Appl.Phys.
  
  Volume: 108 Pages: 0443021-0443027
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Void Generation during the annealing process of narrow copper wires
- Author(s)
  Y. Sasajima, T. Akabane, T. Nagai, J. Onuki and Y. Chonan
- Journal Title
  
  Journal of Applied Physics (印刷中)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Presentation] Void Generation during Annealing Process of Very Narrow Copper Wires2008
- Author(s)
  Y. Sasajimal, T. Akabane, T. Nagai, Y Chonan and J. Onuki
- Organizer
  The IUMRS International Conference in Asia 2008
- Place of Presentation
  Nagoya
- Data Source
  KAKENHI-PROJECT-20226014

1. ONUKI Jin (70315612)

# of Collaborated Projects: 1 results

# of Collaborated Products: 8 results
2. MIMURA Koji (00091752)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. ISHIKAWA Nobuhiro (00370312)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
4. KONDO Kazuo (50250478)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. INAMI Takashi (20091853)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. ITO Shinji (50370317)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. UCHIKOSHI Masahito (60447191)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. OHTA Hiromichi (70168946)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. NAGANO Takatoshi (70343621)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. KIMURA Takashi (70370319)

# of Collaborated Projects: 1 results

# of Collaborated Products: 6 results
11. SASAJIMA Yasushi (80187137)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
12. AOYAMA Takashi (80363737)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. TASHIRO Suguru (90272111)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
14. 一色実 (20111247)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

CHONAN Yasunori 長南 安紀

長南 安紀 チョウナン ヤスノリ

Research Projects

Research Products

Co-Researchers

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy2010

Author(s)

Journal Title

Data Source

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy2010

Author(s)

Journal Title

Data Source

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate andshort time annealing utilizing misorientation energy2010

Author(s)

Journal Title

Data Source

[Journal Article] Void Generation during the annealing process of narrow copper wires

Author(s)

Journal Title

Data Source

[Presentation] Void Generation during Annealing Process of Very Narrow Copper Wires2008

Author(s)

Organizer

Place of Presentation

Data Source

CHONAN Yasunori 長南安紀

長南安紀チョウナンヤスノリ