Bea Jichel ベジチョル

… Alternative Names

ベジチョルベジチョル

BEA Jichel 裵志哲

〓志哲ベジチョル

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Researcher Number	40509874
Other IDs
Affiliation (based on the past Project Information) *help	2022 – 2023: 東北大学, 未来科学技術共同研究センター, 特任准教授 2021: 東北大学, 未来科学技術共同研究センター, 准教授 2018 – 2019: 東北大学, 未来科学技術共同研究センター, 准教授 2011 – 2017: 東北大学, 未来科学技術共同研究センター, 助教
Review Section/Research Field	Except Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Electronic materials/Electric materials / Electron device/Electronic equipment / Composite materials/Surface and interface engineering
Keywords	Except Principal Investigator TSV / FHE / チップレット / 3D-IC / マイクロLED / フレキシブルデバイス / フレキシブル集積 / 垂直配線 / システムインテグレーション / 実装工学 … More / フレキシブルインターコネクト / 半導体実装工学 / Cuピラー / アセンブリ / マストランスファー / 半導体パッケージング工学 / 表面張力 / 貫通配線 / 微小コンポーネント / 自己組織化実装 / ナノアセンブリ / ウェアラブルディスプレイ / 成型加工 / 半導体パッケージング / マイクロLEDディスプレイ / ディスプレイ / めっき / Micro-LED / ヘルスケアデバイス / フレキシブルエレクトロニクス / 常温接合 / FOWLP / 三次元実装 / ヘテロインテグレーション / システム集積 / チップ内蔵 / 微細配線 / 生体適合性 / ウエハレベルパッケージング / ハイドロゲル / CVD / SiO2 / 気相堆積ポリイミド / 接合界面 / 接着 / デバイス設計・製造プロセス / 電子・電気材料 / 自己組織化 / 高密度実装 / 三次元配線 / 複合材料 / 3D LSI / ボトムアップ / 金属ナノ粒子 / ブロック高分子 / 極微細配線 / ナノコンポジット / 熱硬化性樹脂 / 狭ピッチ電極接合 / 三次元積層型集積回路 / ナノ相分離 / 誘導自己組織化 / スマートセンサ情報システム / システムオンチップ / 半導体物性 / 先端機能デバイス / 電子デバイス・機器 / ＴＳＶ / ポリイミド / 気相堆積重合 / 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ Less

Holistic Integration Engineering with Micro-assembly and Wirelets
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Challenging Research (Pioneering)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin Display
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2021 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Highly Integrated Hydrogel Fabrication Challenge
- Principal Investigator
  
  Takafumi Fukushima
- Project Period (FY)
  2018 – 2019
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Directed Self-Assembly based Interconnect Technology for Next-Generation 3D LSI
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2016 – 2018
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
Stereo-Vision Image Sensor LSI Fabricated by 3D Heterogeneous Integration Technology
- Principal Investigator
  
  KOYANAGI MITSUMASA
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Adhesion Study Based on Dendritic Anchor Effects on Glass/Polymer Interfaces
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2015 – 2016
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Tohoku University
Thermally Stable Thin Polymeric Multi-Layer Fromation with ALD
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2013 – 2014
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

All 2017 2016 2015 2014 2013 2012 2011 Other

All Journal Article Presentation

[Journal Article] 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration2017
- Author(s)
  Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 7 Pages: 2912-2918
- DOI
  10.1109/ted.2017.2705562
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 12 Pages: 5065-5072
- DOI
  10.1109/ted.2017.2767598
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: 7 Issue: 10 Pages: 184-184
- DOI
  10.3390/mi7100184
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246, KAKENHI-PROJECT-15K14139
[Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015
- Author(s)
  Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 37 Issue: 1 Pages: 81-83
- DOI
  10.1109/led.2015.2502584
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration2014
- Author(s)
  M. Murugesan , T. Fukushima, J.C. Bea, Y. Sato, H. Hashimoto, K.W. Lee , and M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: 61 Pages: 374-377
- DOI
  10.1109/iedm.2014.7047054
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25630118
[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Presentation] Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications2016
- Author(s)
  Kangwook. Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra- fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration2016
- Author(s)
  K.W. Lee, C.Nagai, J.C. Bea, T. Fukushima, R. Suresh, and X. Wu, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies　Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino,
- Organizer
  ECTC: IEEE Electronic Components and Technology Conference
- Place of Presentation
  USA（Las Vegas）
- Year and Date
  2016-06-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  T. Fukushima, H. Hashiguchi, H. Kino, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 気相堆積重合によるポリイミド薄膜の形成とシリコン貫通配線への応用2015
- Author(s)
  福島誉史, マリアッパンムルゲサン, 裵志哲, 李康旭, 小柳光正
- Organizer
  第64回高分子討論会
- Place of Presentation
  宮城県　仙台市　東北大学　川内キャンパス
- Year and Date
  2015-09-10
- Data Source
  KAKENHI-PROJECT-15K14139
[Presentation] Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration2015
- Author(s)
  K-W. Lee, J-C Bea, T. Fukushima, S. Ramalingam, X. Wu, T. Tanaka, M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington D.C., USA
- Year and Date
  2015-12-07
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Revisiting the Silicon-Lattice in the High-Density 3D-LSIs in the Perspective of Device Reliability2013
- Author(s)
  85. M. Murugesan, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
- Place of Presentation
  米国、Washington DC
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization2013
- Author(s)
  165. T. Fukushima, M. Murugesan, J. Bea, K.W. Lee, M. Koyanagi
- Organizer
  Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  福岡
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C Bea, T. Tanaka, and M. Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
- Organizer
  the Electro Chemical Society (ESC) Meeting
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  the 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Orlando, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation
- Author(s)
  Takafumi Fukushima, Murugesan Mariappan, Jichoel Bea, Kang-Wook Lee, and Mitsumasa Koyanagi
- Organizer
  International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば国際会議場（つくば市竹園2-20-3）
- Year and Date
  2014-09-09 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] 高分子材料を用いた三次元集積技術III：気相堆積ポリイミドTSVライナーの形成と特性評価
- Author(s)
  福島誉史，Murugesan Mariappan，裵　志哲，橋本宏之，佐藤　優，李　康旭，小柳光正
- Organizer
  エレクトロニクス実装学会　第29回春季講演大会
- Place of Presentation
  東京大学（東京都文京区本郷7-3-1）
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-25630118

1. FUKUSHIMA Takafumi (10374969)

# of Collaborated Projects: 7 results

# of Collaborated Products: 22 results
2. MURUGESAN Mariappan (10509699)

# of Collaborated Projects: 3 results

# of Collaborated Products: 11 results
3. TANAKA Tetsu (40417382)

# of Collaborated Projects: 3 results

# of Collaborated Products: 20 results
4. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 3 results

# of Collaborated Products: 20 results
5. 橋本宏之 (80589432)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
6. 木野久志 (10633406)

# of Collaborated Projects: 2 results

# of Collaborated Products: 4 results
7. 清山浩司 (60412722)

# of Collaborated Projects: 2 results

# of Collaborated Products: 2 results
8. LEE KANGWOOK (90534503)

# of Collaborated Projects: 1 results

# of Collaborated Products: 8 results
9. Onishi Masaki (20618615)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. 裴艶麗 (70451622)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 大山俊幸 (30313472)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. 長井千里 (70718353)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Bea Jichel ベ ジチョル

ベ ジチョル ベ ジチョル

BEA Jichel 裵 志哲

〓 志哲 ベ ジチョル

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[Journal Article] 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration2017

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DOI

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[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017

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[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016

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[Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015

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[Journal Article] Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration2014

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[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013

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[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012

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Bea Jichel ベジチョル

ベジチョルベジチョル

BEA Jichel 裵志哲

〓志哲ベジチョル

[Presentation] Transfer and Non-Transfer 3D Stacking Technologies　Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016