KONDO Kazuo 近藤和夫

Researcher Number	50250478
External Links
Affiliation (based on the past Project Information) *help	2018 – 2020: 大阪府立大学, 研究推進機構, 客員研究員 2017: 大阪府立大学, 研究推進機構, 教授 2015 – 2016: 大阪府立大学, 21世紀科学研究機構, 教授 2015: 大阪府立大学, 大学院工学研究科, 教授 2011 – 2014: 大阪府立大学, 工学(系)研究科(研究院), 教授 … More 2012: 大阪府立大学, 工学研究科, 教授 2011: 大阪府立大学, 大学院・工学研究科, 教授 1997 – 2002: 岡山大学, 工学部, 助教授 1994 – 1995: 北海道大学, 工学部, 助手 Less
Review Section/Research Field	Principal Investigator Material processing/treatments / Basic Section 26030:Composite materials and interfaces-related / Material processing/Microstructural control engineering / 化学工学一般 / Material processing/treatments Except Principal Investigator 化学工学一般 / Material processing/Microstructural control engineering / Structural/Functional materials
Keywords	Principal Investigator めっき / Electrodeposition / SPS / 銅めっき / 一価銅 / 添加剤 / バンプ / 電流密度分布 / 高密度接続 / 電子材料 … More / 促進剤 / 細孔底 / 一価銅錯体 / 銅ダマシンめっき / 回転リングーディスク電極 / ＣＶＳ / 回転リング－ディスク電極 / リング電流 / CVS / 中間錯体 / 回転リング-デイスク電極 / モニター / 微小電極 / 二価銅 / 電極反応速度解析 / 塩素 / 穴埋め / ダマシン / 穴埋めっき / TSV / MECHANISM / ACCELERATION EFFECT / INHIBITION EFFECT / ADDITIVES / COPPER ELECTRODEPOSITION / COPPER CONCUCTOR / メカニズム / 促進作用 / 抑制作用 / Cuめっき / Cu配線 / nano level / Crystal growth / Surface treatment / Zinc / ナノレベル / 結晶成長 / 表面処理 / 亜鉛 / electronics / Bumping / Current Distribution / High Density Inter Connection / Packaging Chemical Engineering / 表面実装化学工学 / 実装プロセス工学 / 表面実装化学工学 / Bumpping / Current distribution / High density interconnection / Electronics / Packaging / 実装 / ジアリルアミン / 有機添加物 / ｼﾞｱﾘﾙｱﾐﾝ / 単一 / 有機添加剤 / 銅ダマシン … More Except Principal Investigator 抵抗率 / Aluminium Nitride / Agglomeration / Fluidized Bed / Moving Bed / Coating / CVD / Fine Particle / 表面改質 / 流動層 / 窒化アルミニウム / 造粒 / 移動層 / 表面被覆 / 気相反応法 / 微粒子 / 低ひずみ / TSV / 低歪 / 化合物 / 結晶粒径 / 3次元実装 / 不純物 / Cuめっき / 低抗率 / ３次元実装 / Cu-TSV / 配線評価用TEG / パルスめっき技術 / 配線抵抗率 / 添加剤フリーめつき技術 / 超高純度めっき材料 / ULSI / 微細構造 / 微量不純物 / Cuの高純度化 / TEG / 分子動力学シミュレーション / 革新的高導電性 / 超高純度めっき材 / 添加剤フリー / Cu 配線 / 収差補正STEM / クレヴァス / Ru膜 / 添加剤フリーめっき / 収差補正TEM / 粒界不純物 / 超高純度硫酸銅 / Cu配線 / LSI / 情報材料 / 電子 Less

Cuprous complex and via filling electrodepositionPrincipal Investigator
- Principal Investigator
  
  Kondo Kazuo
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Osaka Prefecture University
Role of Monovalent Copper Ion in Embedding Copper Damascene Wiring PorePrincipal Investigator
- Principal Investigator
  
  Kondo Kazuo
- Project Period (FY)
  2015 – 2018
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/Microstructural control engineering
- Research Institution
  Osaka Prefecture University
Low strain and high aspect ratio Cu-TSVs
- Principal Investigator
  
  Onuki Jin
- Project Period (FY)
  2013 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/Microstructural control engineering
- Research Institution
  Ibaraki University
Molecular design of copper Damascene additive which fills via by only one organic additivePrincipal Investigator
- Principal Investigator
  
  KONDO Kazuo
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka Prefecture University
Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.
- Principal Investigator
  
  ONUKI Jin (OONUKI Jin)
- Project Period (FY)
  2008 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Ibaraki University
Acceleration and inhibition effects on via filling electrodeposition were discussedPrincipal Investigator
- Principal Investigator
  
  KONDO Kazuo
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  OKAYAMA UNIVERSITY
Crystal growth and contral of nano-level zinc alloy electrodepositsPrincipal Investigator
- Principal Investigator
  
  KONDO Kazuo
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  OKAYAMA UNIVERSITY
High Density Interconnection and Packaging Chemical Engineering in 21st CenturyPrincipal Investigator
- Principal Investigator
  
  KONDO Kazuo
- Project Period (FY)
  1998 – 1999
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  化学工学一般
- Research Institution
  OKAYAMA UNIVERSITY
Processins Technology of High Density Interconnection BumpsPrincipal Investigator
- Principal Investigator
  
  KONDO Kazuo
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Okayama University
Surface Coating of Submicron Particles by Fluidized/Moving Bed-CVD
- Principal Investigator
  
  SHINOHARA Kunio
- Project Period (FY)
  1994 – 1995
- Research Category
  
  Grant-in-Aid for Developmental Scientific Research (B)
- Research Field
  
  化学工学一般
- Research Institution
  HOKKAIDO UNIVERSITY

All 2021 2020 2019 2018 2017 2016 2015 2014 2013 2012 2011 Other

All Journal Article Presentation Book Patent

[Book] Cuprous is key to acceleration in Copper bottom up filling2017
- Author(s)
  Kazuo Kondo
- Total Pages
  50
- Publisher
  Lambert
- Data Source
  KAKENHI-PROJECT-15K06511
[Journal Article] A Rotating Ring-Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolyte2021
- Author(s)
  Anh Van Nhat TRAN, Tetsuji HIRATO, Kazuo KONDO
- Journal Title
  
  Journal of The Electrochemical Society
  
  Volume: Ｕｎｄｅｒ　Ｒｅｖｉｅｗ
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] Electrochemical Behavior of 2M5S and Its Influence on Reduction of Cu Pumping and Keep-Out Zone2020
- Author(s)
  V.Q.Dinh, K.Kondo, T.Hirato
- Journal Title
  
  J. Electrochem. Soc.
  
  Volume: 167 Issue: 6 Pages: 062504-062504
- DOI
  10.1149/1945-7111/ab7d45
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding2020
- Author(s)
  Anh Van Nhat TRAN, Tetsuji HIRATO, Kazuo KONDO
- Journal Title
  
  ECS Journal of Solid State Science and Technology
  
  Volume: 第9巻　第12号 Issue: 12 Pages: 124003-124010
- DOI
  10.1149/2162-8777/abd14a
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] Bottom-Up TSV Filling Using Sulfonated Diallyl Dimethyl Ammonium Bromide Copolymer as a Leveler2019
- Author(s)
  V.Q.Dinh, V.H.Hang, K.Kondo, T.Hirato
- Journal Title
  
  J. Electrochem. Soc.
  
  Volume: 166 Issue: 12 Pages: D505-D507
- DOI
  10.1149/2.1021912jes
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] Monitoring of SPS Concentraton by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution2019
- Author(s)
  Anh Van Nhat Tran, Ha Van Hoang, Tetsuji Hirato, Kazuo Kondo
- Journal Title
  
  Journal of The Electrochemical Society
  
  Volume: 166 Issue: 14 Pages: D742-D746
- DOI
  10.1149/2.0841914jes
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] Thermal Stress of Through Silicon Via with Annealing2018
- Author(s)
  Dinh Van Quy, K.Kondo, Ha Van Hoang, T.Hirato
- Journal Title
  
  ECS J. Solid State Sci. Technol.
  
  Volume: 7(11) Issue: 11 Pages: 689-692
- DOI
  10.1149/2.0301811jss
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] A Rotating Ring Disk Study of Accelerators with Cl<sup>－</sup> and Br<sup>－</sup> for Copper Damascene Electrodeposition2018
- Author(s)
  Anh Van Nhat Tran, Ha Van Hoang,Tetsuji Hirato and Kazuo Kondo
- Journal Title
  
  Journal of The Surface Finishing Society of Japan
  
  Volume: 69 Issue: 8 Pages: 352-355
- DOI
  10.4139/sfj.69.352
- NAID
  130007587321
- ISSN
  0915-1869, 1884-3409
- Year and Date
  2018-08-01
- Language
  English
- Data Source
  KAKENHI-PROJECT-18K04731
[Journal Article] Accelerating kinetic on copper damascene and cuprous concentration computation2017
- Author(s)
  Van Ha and Kazuo Kondo
- Journal Title
  
  Journal of the Electrochemical Society
  
  Volume: 印刷中
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15K06511
[Journal Article] Role of Cuprous ion on Copper Electrodeposition Acceleration2015
- Author(s)
  T.Hayashi, S.Matsuura, K.Kataoka, K.Nishimura, M.Kada, K.Kondo, T.Saito, N.Okamoto
- Journal Title
  
  Journal of the Electrochemical Society
  
  Volume: 162(6)
- Data Source
  KAKENHI-PROJECT-15K06511
[Journal Article] Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition2014
- Author(s)
  M. Takeuchi, Y. Anami, Y. Yamada, M. Bunnya, S. Okada, N. Okamoto, T. Saito, M. Yokoi,K. Kondo
- Journal Title
  
  Electrochemistry
  
  Volume: in print
- NAID
  130004562475
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition2014
- Author(s)
  Y. Yamada, K. Kondoa, M. Takeuchia, N. Okamotoa, T. Saitoa, M. Bunyab and Y. Yokoi
- Journal Title
  
  ECS Trans.
  
  Volume: 58 Issue: 17 Pages: 97-107
- DOI
  10.1149/05817.0097ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Five-Minute TSV Copper Electrodeposition2014
- Author(s)
  Kazuo Kondo, Chikara Funahashi,Yuko Miyake
- Journal Title
  
  Journal of The Electrochemical Society
  
  Volume: 161 Issue: 14 Pages: D791-D793
- DOI
  10.1149/2.0751414jes
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-25289258
[Journal Article] 銅穴埋めめっきにおけるジアリルアミン系レベラーの側鎖の影響2013
- Author(s)
  山田康貴,竹内　実,岡本尚樹,齊藤丈靖,文屋　勝,横井昌幸,近藤和夫
- Journal Title
  
  マイクロエレクトロニクスシンポジュム
  
  Volume: なし Pages: 211-214
- NAID
  130007887239
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition2013
- Author(s)
  M. Takeuchi, Y.Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo
- Journal Title
  
  J. Electrochem. Soc.
  
  Volume: 160 (12) Pages: 3110-3115
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper2013
- Author(s)
  M. Takeuchi, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo
- Journal Title
  
  ECS
  
  Volume: 160 Issue: 12 Pages: D3110-D3115
- DOI
  10.1149/2.021312jes
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Cu-filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film2012
- Author(s)
  N. Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto and M. Hirota
- Journal Title
  
  ELECTROCHIMICA ACTA
  
  Volume: 82 Pages: 363-366
- DOI
  10.1016/j.electacta.2012.04.151
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition2012
- Author(s)
  M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, and T. Saito
- Journal Title
  
  J. Electrochem. Soc.
  
  Volume: 159 (4) Pages: 230-234
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device2012
- Author(s)
  T. Saito, Y. Miyamoto, S. Hattori, N. Okamoto, K. Kondo
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 51(5) Issue: 5S Pages: 05EA03-05EA03
- DOI
  10.1143/jjap.51.05ea03
- NAID
  210000140634
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872, KAKENHI-PROJECT-23560922
[Journal Article] Diallyamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition2012
- Author(s)
  M.Takeuchi, K.Kondo, H.Kuri, M.Bunya, M.Okamoto, T.Saito
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 159
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] High-Speed Through Silicon Via (TSV) Filling Using Diallylamine Additive2011
- Author(s)
  T. Hayashi, K. Kondo, T. Saito, M. Takeuchi, and N. Okamoto
- Journal Title
  
  J. Electrochem. Soc.
  
  Volume: 158 (12) Pages: 715-718
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] ジアリルアミン添加剤を用いた銅穴埋めめっき2011
- Author(s)
  阿南善裕、竹内実、岡本尚樹、齊藤丈靖、文屋勝、近藤和夫
- Journal Title
  
  表面技術
  
  Volume: 62 Pages: 728-733
- NAID
  10030476193
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] ジアリルアミン添加剤を用いた銅穴埋めめっき2011
- Author(s)
  阿南善裕, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 近藤和夫
- Journal Title
  
  表面技術協会誌
  
  Volume: Vol.62, No.12
- NAID
  10030476193
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Journal Article] High-speed through silicon via filling using diallylamine additive2011
- Author(s)
  T.Hayashi, K.Kondo, M.Takeuchi, T.Saitou, N.Okamoto
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 158
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of Counter ions in a Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition
- Author(s)
  M. Takeuchi, Y.Anami, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, M. Yokoi, and K. Kondo
- Journal Title
  
  J. Electrochemistry
  
  Volume: (校正完了し掲載待ち)
- NAID
  130004562475
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23560872
[Patent] 銅メッキ液分析装置、銅メッキ液分析システムおよび銅メッキ液分析方法2018
- Inventor(s)
  近藤和夫・中山直
- Industrial Property Rights Holder
  近藤和夫・中山直
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2018-034883
- Filing Date
  2018
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] High TEC copper to connect copper bond pads for low temperature wafer bonding2020
- Author(s)
  A. V. N. Tran, K. Kondo and T. Hirato
- Organizer
  PRiME 2020
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Reduction of Copper TSV Pumping2019
- Author(s)
  Dinh Van Quy, Kazuo Kondo, Tetsuji Hirato
- Organizer
  IEEE 2019 International 3D Systems Integration Conference, Sendai Japan
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Sulfonated diallyl dimethyl ammonium bromide copolymer as a leveler for high-speed copper TSV filling2019
- Author(s)
  Van Quy Dinh, Kazuo Kondo, Tetsuji Hirato
- Organizer
  The Surface Finishing Society of Japan 21th Kansai Branch Forum
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Monitoring of SPS concentration by RRDE to refresh a void free solution2019
- Author(s)
  Anh Van Nhat Tran, Kazuo Kondo, Tetsuji Hirato
- Organizer
  The Surface Finishing Society of Japan 21th Kansai Branch Forum
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] 低線膨張銅めっき2018
- Author(s)
  近藤和夫
- Organizer
  サポインEXPO
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Monitoring of SPS concentration during electrodeposition process by rotating ring-disk electrode-22018
- Author(s)
  Tran Van Nhat Anh,　近藤和夫、平藤哲司
- Organizer
  関西表面技術フォーラム
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Reduction of stress due to annealing of TSV Copper by the low TCE Copper2018
- Author(s)
  Dinh Van Quy,近藤和夫、平藤哲司
- Organizer
  表面技術協会
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] ‘What’s happen to low TCE Copper when annealing’2018
- Author(s)
  Kazuo Kondo
- Organizer
  IMPACT Taipei
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Reduction of TSV thermal stress by low TCE electrolyte2018
- Author(s)
  Dinh Van Quy、近藤和夫、平藤哲司
- Organizer
  関西表面技術フォーラム
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Reduction of Stress in Copper TSV Due to Annealing By the Low TEC Copper,2018
- Author(s)
  Q. Dinh, K. Kondo, and T.Hirato
- Organizer
  ECS Meeting in Cancun
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Monitoring of SPS concentration in copper electroplating bath by cyclic voltammetry stripping using a rotating ringdisk electrode2018
- Author(s)
  Anh Van Nhat Tran・近藤和夫・平藤哲司
- Organizer
  表面技術協会
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Reduction of stress due to annealing of copper TSV by the low TCE Copper2018
- Author(s)
  Van Quy Dinh・近藤和夫・平藤哲司
- Organizer
  表面技術協会
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] 低線膨張銅めっきが解消する熱応力2018
- Author(s)
  近藤和夫
- Organizer
  日本溶接学会はんだシンポ
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] 低線膨張銅めっき2018
- Author(s)
  近藤和夫
- Organizer
  化学工学会エレクトロニクス部会シンポ
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] What’s happen to low TCE Copper when annealing2018
- Author(s)
  Kazuo Kondo
- Organizer
  ECS Meeting in Cancun
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Monitoring of SPS concentration in copper electroplating bath by cyclic voltammetry stripping using a rotating ring-disk electrode2018
- Author(s)
  Anh Van Nhat Tran, 近藤和夫、平藤哲司
- Organizer
  表面技術協会
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] 低線膨張銅めっきが解消する熱応力2018
- Author(s)
  .近藤和夫
- Organizer
  日本溶接学会電子デバイス実装研究会
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] 低線膨張銅めっき2018
- Author(s)
  近藤和夫
- Organizer
  セミコンジャパン
- Data Source
  KAKENHI-PROJECT-18K04731
[Presentation] Cl and SPS acceｌeｒation2016
- Author(s)
  Van Ha and K.Kondo,
- Organizer
  化学工学会
- Place of Presentation
  徳島大学
- Year and Date
  2016-09-05
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Cl and SPS acceｌeｒation2016
- Author(s)
  Van Ha and K.Kondo
- Organizer
  Electrochemical Society
- Place of Presentation
  Hilton San Diego
- Year and Date
  2016-10-03
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Microdectrode on TVS side wall2016
- Author(s)
  Van Ha and K.Kondo
- Organizer
  Electrochemical Society
- Place of Presentation
  Hilton San Diego
- Year and Date
  2016-10-03
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Microdectrode on TVS side wall2016
- Author(s)
  Van Ha and K.Kondo
- Organizer
  化学工学会
- Place of Presentation
  徳島大学
- Year and Date
  2016-09-05
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Ultra high speed TSV filling2015
- Author(s)
  近藤和夫
- Organizer
  International Society of Electrochemistry
- Place of Presentation
  TPCA (台湾　台北）
- Year and Date
  2015-10-20
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] 低線膨張銅めっき2015
- Author(s)
  近藤和夫
- Organizer
  化学工学会
- Place of Presentation
  北海道大学（北海道　札幌市）
- Year and Date
  2015-09-09
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] High speed TSV filling2015
- Author(s)
  近藤和夫
- Organizer
  International Microsystem Packaging Assembly and Circrity Technology Conference
- Place of Presentation
  TPCA (台湾　台北）
- Year and Date
  2015-10-21
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] 高速TSV充填2015
- Author(s)
  Van Ha, 近藤和夫
- Organizer
  化学工学会
- Place of Presentation
  北海道大学（北海道　札幌市）
- Year and Date
  2015-09-10
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] 高速TSV充填2015
- Author(s)
  Van Ha, 近藤和夫
- Organizer
  マイクロエレクトロニクスシンポジウム（MES2015）
- Place of Presentation
  大阪大学（大阪府　吹田市）
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] Role of cuprous for copper electrodeposition2015
- Author(s)
  近藤和夫
- Organizer
  International Microsystem Packaging Assembly and Circrity Technology Confernce
- Place of Presentation
  TPCA (台湾　台北）
- Year and Date
  2015-10-22
- Data Source
  KAKENHI-PROJECT-15K06511
[Presentation] 穴埋め電解銅めっき用の新規添加剤の開発2013
- Author(s)
  竹内実, 近藤和夫, 山田康貴, 岡本尚樹, 齋藤丈靖, 文屋勝, 岡田笑子
- Organizer
  2013アカデミックプラザ
- Place of Presentation
  東京ビッグサイト
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの影響2013
- Author(s)
  山田康貴、竹内実、岡本尚樹、齊藤丈靖、文屋勝、横井昌幸、近藤和夫
- Organizer
  化学工学会第45回秋季大会
- Place of Presentation
  岡山大学津島東キャンパス
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの影響2013
- Author(s)
  山田康貴, 竹内実, 岡本尚樹, 齋藤丈靖, 文屋勝, 横井昌幸, 近藤和夫
- Organizer
  化学工学会第45回秋季大会
- Place of Presentation
  岡山大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの側鎖の影響2013
- Author(s)
  山田康貴, 竹内実, 岡本尚樹, 齋藤丈靖, 文屋勝, 横井昌幸, 近藤和夫
- Organizer
  MES 2013
- Place of Presentation
  大阪大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Diallylamine levelers side chains effect on copper via filling2013
- Author(s)
  Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
- Organizer
  224th ECS 2013 Meeting
- Place of Presentation
  San Francisco
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの作用2013
- Author(s)
  阿南善裕，竹内実，岡本尚樹，齊藤丈靖，文屋勝，横井昌幸，近藤和夫
- Organizer
  エレクトロニクス実装学会第27回春季講演大会
- Place of Presentation
  東北大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Reduction of thermal expansion coefficient of electrodeposited copper for TSV2013
- Author(s)
  S. Mukahara, K. Kondo, T. Hayashi, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
- Organizer
  224th ECS 2013 Meeting
- Place of Presentation
  San Francisco
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] スパッタイオンプレーティング法によるCuシード膜の作製2013
- Author(s)
  丸中正雄、土屋貴之、林太郎、岡本尚樹、齊藤丈靖、横井昌幸、近藤和夫
- Organizer
  化学工学会第78年会
- Place of Presentation
  大阪大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Diallylamine levelers side chains effect on copper via filling2013
- Author(s)
  Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
- Organizer
  224th Meeting ECS
- Place of Presentation
  The Hilton San Francisco Hotel
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 電解銅めっきにおけるPRパルス電流制御による直径4μmビア完全充填2012
- Author(s)
  林太郎, 竹内実, 岡本尚樹, 齋藤丈靖, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝
- Organizer
  MES2012
- Place of Presentation
  大阪府立大
- Year and Date
  2012-09-12
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] ジアリルアミン系低分子添加剤を用いたCu配線形成とナノ構造の評価2012
- Author(s)
  荒山卓也, 横山貴大, 玉橋邦裕, 滑川孝, 大貫仁, 近藤和夫, 竹内実
- Organizer
  日本金属学会,秋季大会
- Place of Presentation
  愛媛大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] The Wire Grid Polarizer made by Electro- and electroless- Deposition Processes2012
- Author(s)
  N.Okamoto,Y.Ikeda,Y.Koyama,Y.Kawazu,T.Saito and K.Kondo
- Organizer
  ECS 222nd Meeting
- Place of Presentation
  Honolulu
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] PRパルス電流制御による微細ビア充填とCu(I)生成評価2012
- Author(s)
  林太郎, 竹内実, 岡本尚樹, 齋藤丈靖, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝
- Organizer
  化学工学会第44回秋季大会
- Place of Presentation
  東北大学
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Via Filling Electrodeposition of 4μm Diameter via by Periodical reverse Current2012
- Author(s)
  T. Hayashi, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya, and M. Yokoi
- Organizer
  ECS2012 Fall Meeting
- Place of Presentation
  Honolulu,Hawai
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] 穴埋め電解銅めっき用新規添加剤の開発2011
- Author(s)
  竹内実, 近藤和夫, 久利英之, 岡本尚樹, 齋藤丈靖, 文屋勝
- Organizer
  2011アカデミックプラザ
- Place of Presentation
  東京ビッグサイト
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Single Diallyamine Type Copolymer Additive Which Perfectly Bottom-up Fills Cu Electrodeposition2011
- Author(s)
  M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. saito
- Organizer
  ICEP2011国際会議
- Place of Presentation
  奈良
- Year and Date
  2011-04-15
- Data Source
  KAKENHI-PROJECT-23560872
[Presentation] Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm2011
- Author(s)
  K.Kondo, M.Takauchi, H.Kuri, M.Bunya, N.Okamoto and T.Saito
- Organizer
  ECS
- Place of Presentation
  Boston
- Data Source
  KAKENHI-PROJECT-23560872

1. ONUKI Jin (70315612)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
2. INAMI Takashi (20091853)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. NAGANO Takatoshi (70343621)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
4. SASAJIMA Yasushi (80187137)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
5. FUKUI Keisuke (50047635)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
6. 金子豊 (00169583)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
7. 齊藤丈靖 (70274503)

# of Collaborated Projects: 2 results

# of Collaborated Products: 1 results
8. 横井昌幸 (80359348)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
9. MIMURA Koji (00091752)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. ISHIKAWA Nobuhiro (00370312)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. CHONAN Yasunori (30363740)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. ITO Shinji (50370317)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
13. UCHIKOSHI Masahito (60447191)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. OHTA Hiromichi (70168946)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. KIMURA Takashi (70370319)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. AOYAMA Takashi (80363737)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
17. TASHIRO Suguru (90272111)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
18. SHINOHARA Kunio (60001294)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
19. 一色実 (20111247)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
20. TUTUMI Katsuo

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
21. TAKEUCHI Hiroshi

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
22. CHIBA Sigeo

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
23. Hayashi Taro

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
24. 大山恭史

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
25. 堤香津雄

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
26. 齋藤丈靖

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

KONDO Kazuo 近藤 和夫

Research Projects

Research Products

Co-Researchers

Cuprous complex and via filling electrodepositionPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Role of Monovalent Copper Ion in Embedding Copper Damascene Wiring PorePrincipal Investigator

Principal Investigator

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Research Institution

Low strain and high aspect ratio Cu-TSVs

Principal Investigator

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Molecular design of copper Damascene additive which fills via by only one organic additivePrincipal Investigator

Principal Investigator

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Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.

Principal Investigator

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Acceleration and inhibition effects on via filling electrodeposition were discussedPrincipal Investigator

Principal Investigator

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Crystal growth and contral of nano-level zinc alloy electrodepositsPrincipal Investigator

Principal Investigator

Project Period (FY)

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High Density Interconnection and Packaging Chemical Engineering in 21st CenturyPrincipal Investigator

Principal Investigator

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Processins Technology of High Density Interconnection BumpsPrincipal Investigator

Principal Investigator

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Surface Coating of Submicron Particles by Fluidized/Moving Bed-CVD

Principal Investigator

Project Period (FY)

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Research Institution

[Book] Cuprous is key to acceleration in Copper bottom up filling2017

Author(s)

Total Pages

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Data Source

[Journal Article] A Rotating Ring-Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolyte2021

Author(s)

Journal Title

Data Source

[Journal Article] Electrochemical Behavior of 2M5S and Its Influence on Reduction of Cu Pumping and Keep-Out Zone2020

Author(s)

Journal Title

DOI

Data Source

[Journal Article] High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding2020

Author(s)

KONDO Kazuo 近藤和夫