AKAHASHI Yasuo 高橋康夫

… Alternative Names

TAKAHASHI Yasuo 高橋康夫

TAKAHASHI Y. 高橋康雄

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Researcher Number	80144434
Other IDs
External Links
Affiliation (based on the past Project Information) *help	2016: 大阪大学, 接合科学研究所, 特任教授 2011 – 2015: 大阪大学, 接合科学研究所, 教授 2006 – 2010: 大阪大学, 先端科学イノベーションセンター, 教授 2004: 大阪大学, 先端科学・イノベーションセンター, 教授 2004: Osaka University, Center for Advanced Science and Technology, Professor, 先端科学技術イノベーションセンター, 教授 … More 2003: 大阪大学, 先端科学技術共同研究センター, 教授 2002: 大阪大学, 接合科学研究所, 助教授 1996 – 2000: 大阪大学, 接合科学研究所, 助教授 1996: Osaka university, JWRI,A.Prof., 接合工学研究所, 助教授 1995: 大阪大学, 溶接研, 助教授 1991 – 1995: 大阪大学, 溶接工学研究所, 助教授 1987 – 1989: 大阪大学, 工学部, 助手 Less
Review Section/Research Field	Principal Investigator Material processing/treatments / 溶接工学 / Material processing/treatments Except Principal Investigator Material processing/treatments / Material processing/treatments / 溶接工学 / Composite materials/Surface and interface engineering
Keywords	Principal Investigator Bonding mechanism / 接合機構 / Microjoining / マイクロ接合 / 電子実装 / Assembly Process / Integrated circuit / Electric pad / 集積回路 / 電極 … More / 金細線 / 残留応力 / ワイヤーボンディング / 接合界面 / 固相接合 / 数値計算 / インターコネクション / void shrinkage / bond interface / Optimum condition / Computer Simulation / Algorithm / Diffusion bonding / Solid state bonding / 接合過程の予測 / 接合のモデル化 / ボイド収縮過程 / 空隙収縮 / 最適条件 / コンピュ-タシミュレ-ション / アルゴリズム / 拡散接合 / Process control / Interface formation / Fine wire / 超音波振動 / エレクトロニクス実装 / 摩擦 / 凝着 / 塑性変形 / 超音波接合 / 微細接合 / Numerical analysis / Interfacial deformation / Fine gold wire / 接合強度 / 空孔拡散 / 常温接合 / インナーリードボンディング / 数値解析 / 界面変形 / 実装工程 / Modeling / Numerical Analysis / Finite Element Method / Gold Wire / Pad / Lead / Wire Bonding / Thermocompression Bonding / 接合率 / 変形過程 / リ-ドボンディング / 電子材料 / マイクロ接合モデル化 / マイクロ接合,モデル化 / 有限要素法 / 金ワイヤ / パッド / リ-ド / ワイヤボンディング / 熱圧着 / 反応拡散 / 配線接合 / 窒化ガリウム / 炭化珪素 / 化合物半導体 / インターコネクション超音波接合 / 接合 / 界面 / ナノ / パワーデバイス / 環境調和 / 拡散 / プローブ計測 / 発熱 / ステンレス鋼 / 発光分光 / イオン / 窒化 / プラズマ … More Except Principal Investigator コンタクト通電特性 / 窒化ガリウム / ショットキー障壁 / 界面反応制御 / surface analysis / electronic spectroscopy / interface / chemical bond / molecular dynamics / ultra high vacuum / atomic force microscope / adhesion / 拡散 / 接合 / 無加圧 / 表面分析 / 電子分光 / 界面 / 結合状態 / 分子動力学 / 超高真空 / 原子間力顕微鏡 / 凝着 / Neural Networks / Weld Joint Image / Dominant Point Detection / Top Down Approach / Genetic Algorithm / Active Contour Extraction / Image Processing / Parallel Processing / Hough変換 / 接合部自動検査 / 並列画像処理 / ニューラルネット / ノイズ除去 / 光スライス法 / 接合部開先形状 / 拡張ラグランジェ関数 / トップダウン的アプローチ / 特徴点抽出法 / 高機能画像処理システム / ニューラル・ネットワーク / 溶接・接合部分画像 / 特徴点検出 / トップダウンアプローチ / 遺伝的アルゴリズム / 動的輪郭抽出法 / 画像処理 / 並列処理 / Thermal deterioration / Surface deposition with evaporation / Solid phase bonding / Waterjet cutting / Composite materials / 材質の熱変質回避 / ウォ-タジェット加工 / 複合材料構造体 / 熱変質 / 表面蒸着 / 低温固相接合 / ウォータジェット加工 / 複合材料 / ｐ型窒化ガリウム / 過渡現象 / 脆弱層形成の抑制 / n型炭化ケイ素 / ニッケル電極 / パラジウム電極 / 水素透過能 / 有効正孔濃度 / p型窒化ガリウム / 通電熱処理 / 電極材料 / パワーエレクトロニクス / 炭化ケイ素 / 反応制御 / 界面構造制御 / 成膜残留歪 / 歪 / オーミック電極 / 界面電気伝導特性 / 電極／基板界面 / ひずみ / 多段ステップ昇温熱処理 / 単結晶炭化珪素 / オーム性電極 / 単結晶窒化ガリウム / ガラス遷移温度 / 等速昇温変態曲線 / 結晶化メカニズム / 熱的安定性評価 / 超音波接合 / 金属ガラス / 炭化珪素 / 広禁制帯幅化合物半導体 / 異材界面構造 / 界面機能 / 数学的モデリング / 数値シュミュレーション / 加工現象 / 高分子材料 / エキシマレーザ Less

Control of interfacial nanostructure between wide-gap semiconductors and their electrodes
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Nihon University
Control of Interfacial Strain between Wide-Bandgap Semiconductor and Electrode to Improve Interfacial Electrical Conductance
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2012 – 2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Improvement of Interfacial Functions in Eco-devices Based on Control of Interfacial Nanostructure
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2009 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Analysis of interface-bond formation mechanism of environmentally friendly electronic device wiring and optimization of the bonding processPrincipal Investigator
- Principal Investigator
  
  AKAHASHI Yasuo
- Project Period (FY)
  2006 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Micro-interface formation control of electronic devises based on analysis of solid state bonding mechanismPrincipal Investigator
- Principal Investigator
  
  TAKAHASHI Yasuo
- Project Period (FY)
  2002 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.Principal Investigator
- Principal Investigator
  
  TAKAHASHI Yasuo
- Project Period (FY)
  1998 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (B).
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Widening of the joined interface by the procedure without heating and pressing
- Principal Investigator
  
  ONZAWA Tadao
- Project Period (FY)
  1995 – 1996
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Tokyo Institute of Technology
Micro-thermocompression Bonding Mechanism and Modeling for Electronics Devise InterconnectionPrincipal Investigator
- Principal Investigator
  
  TAKAHASHI Yasuo
- Project Period (FY)
  1995 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Detecting System of Weld Joint by Image Measurement
- Principal Investigator
  
  INOUE Katsunori
- Project Period (FY)
  1993 – 1994
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
エキシマレーザによる高分子材料の加工
- Principal Investigator
  
  INOUE Katsunori
- Project Period (FY)
  1992
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Institution
  Osaka University
プラズマ窒化プロセスに及ぼすイオン化と発熱効果に関する研究Principal Investigator
- Principal Investigator
  
  高橋康夫
- Project Period (FY)
  1992
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Institution
  Osaka University
Low damage cutting and bonding process of high performance composite materials and its systematizing
- Principal Investigator
  
  MATSUYAMA Kinichi, NISHIGUCHI K.
- Project Period (FY)
  1991 – 1993
- Research Category
  
  Grant-in-Aid for General Scientific Research (A)
- Research Field
  
  溶接工学
- Research Institution
  Osaka University
Analysis of the formation process of the bonded area in the solid state bonding and its predictionPrincipal Investigator
- Principal Investigator
  
  TAKAHASHI Yasuo
- Project Period (FY)
  1987 – 1989
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  溶接工学
- Research Institution
  Osaka University

All 2016 2015 2014 2013 2012 2011 2010 2009 2008 2007 2006 2005 Other

All Journal Article Presentation Book Patent

[Book] "Microjoining and Nanojoining,"edited by Y. Zhou,Chapter 5,"Modeling of Solid State Bonding"2008
- Author(s)
  Y.Takahashi
- Publisher
  Woodhead publishing, Cambridge, CB21, 6AH,UK,
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] p型GaN中の水素除去促進のための通電熱処理と電気特性改善効果2016
- Author(s)
  土田啓介，アイマン・ビン・モハマド・ハリル，高橋康夫，前田将克
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 193-198
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 超塑性材料の固相接合における微小空洞消失機構解析2016
- Author(s)
  梨木悠介，衡中皓，前田将克，高橋康夫
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 177-182
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 超音波Alリボンボンディングにおける凝着界面形成および接合部信頼性2016
- Author(s)
  三澤浩太，高岡勇介，前田将克，高橋康夫
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 73-78
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 4.p型GaN中の水素除去促進のための通電熱処理と電気特性改善効果2016
- Author(s)
  土田啓介，アイマンビンモハマドハリル，高橋康夫，前田将克
- Journal Title
  
  Mateシンポジウム論文集
  
  Volume: 22 Pages: 193-198
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 5.Microstructures Observation of N-type GaN Contacts and the Electrical Properties2015
- Author(s)
  Halil Aiman bin Mohd, Kimura Kota, Maeda Masakatsu, Takahashi Yasuo
- Journal Title
  
  Trans. JWRI
  
  Volume: 44 Pages: 19-22
- Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 6.Improvement of Electrical Properties of p-type GaN and Au Contact Interface2015
- Author(s)
  Aiman bin Mohd Halil, Keisuke Tsuchida, Masakatsu Maeda, Yasuo Takahashi
- Journal Title
  
  Quart. J. Jpn. Weld. Soc.
  
  Volume: 33
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Ni nano level thin film formation on p-GaN and improvement of electrical properties by hydrogen release enhancement2015
- Author(s)
  Aiman b. M. H., K. Tsuchida, M. Maeda and Y. Takahashi
- Journal Title
  
  J. Smart Process. Soc.
  
  Volume: 4 Pages: 109-114
- NAID
  130005119121
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Nickel-titanium-based contact for n-type silicon carbide to combine high ohmic conductivity and mechanical properties2014
- Author(s)
  M. Maeda, M. Sano and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012031-012031
- DOI
  10.1088/1757-899x/61/1/012031
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of Ti3SiC2 formation on p-type GaN by vacuum annealing on the contact properties2014
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012034-012034
- DOI
  10.1088/1757-899x/61/1/012034
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of crystal orientation on ohmic contact formation for n-type gallium nitride2014
- Author(s)
  K. Kimura, Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012033-012033
- DOI
  10.1088/1757-899x/61/1/012033
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Nucleation and growth of Ti3SiC2 on SiC by interfacial reaction2014
- Author(s)
  K. Ideguchi, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012032-012032
- DOI
  10.1088/1757-899x/61/1/012032
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of Argon Ion Irradiation on Ohmic Contact Formation on n-type Gallium Nitride2013
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 54 Issue: 6 Pages: 895-898
- DOI
  10.2320/matertrans.MD201217
- NAID
  10031176404
- ISSN
  1345-9678, 1347-5320
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Interfacial nanostructure and electrical properties of Ti3SiC2 contact on p-type gallium nitride2013
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  Mater. Trans
  
  Volume: Vol. 54 Pages: 890-894
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of interfacial properties in power electronic devices2013
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  International Journal of Nanotechnology
  
  Volume: 10 Pages: 89-99
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of argon ion irradiation on ohmic contact formation on n-type gallium nitride2013
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  Mater. Trans
  
  Volume: Vol. 54 Pages: 895-898
- NAID
  10031176404
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Interfacial Nanostructure and Electrical Properties of Ti<sub>3</sub>SiC<sub>2</sub> Contact on p-Type Gallium Nitride2013
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 54 Issue: 6 Pages: 890-894
- DOI
  10.2320/matertrans.MD201206
- NAID
  10031176403
- ISSN
  1345-9678, 1347-5320
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of interfacial properties in power electronic devices2013
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Int. J. Nanotechnol
  
  Volume: Vol. 10 Pages: 89-99
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] 金属ガラスの接合2011
- Author(s)
  前田将克, 高橋康夫
- Journal Title
  
  まてりあ
  
  Volume: Vol.50 Pages: 439-445
- NAID
  10029693285
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Effect of interfacial reaction on electrical conduction across the interface between n-type gallium nitride and contact materials2011
- Author(s)
  M.Maeda, T.Yamasaki, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 1 Pages: 111-112
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] 金属ガラスの接合2011
- Author(s)
  前田将克,高橋康夫
- Journal Title
  
  まてりあ
  
  Volume: 50 Pages: 439-445
- NAID
  10029693285
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] n型窒化ガリウムとチタンの界面反応制御によるオーミックコンタクト層形成2011
- Author(s)
  前田将克, 松本倫幸, 高橋康夫
- Journal Title
  
  エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム講演論文集(Mate 2011)
  
  Volume: Vol.17 Pages: 201-204
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Change in electrical properties by the evolution of interfacial structure between p-type 4H-SiC and Ti/Al bilayer2011
- Author(s)
  M.Higuchi, K.Nonomura, M.Maeda, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 2 Pages: 149-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Change in electrical properties by the evolution of interfacial structure between p-type 4H-SiC and Ti/ Al bilayer2011
- Author(s)
  M. Higuchi, K. Nonomura, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. Int. Symp. Materials Science and Innovation for Sustainable Society(ECO-MATES 2011)
  
  Volume: Vol.2 Pages: 149-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties and structure of contact interface between Ti3SiC2 and p-type GaN2011
- Author(s)
  Aiman b.M.H., M.Maeda, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 1 Pages: 113-114
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Formation of Ohmic Contact Layer on n-type Gallium Nitride by Controlling Interfacial Reaction with Titanium2010
- Author(s)
  M.Maeda, N.Matsumoto, Y.Takahashi
- Journal Title
  
  Proc.Mater.Sci.Technol.(MS & T)2010
  
  Pages: 2732-2742
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Thermal stability of Zr_<55>Cu_<30>Ni_<5>Al_<10> metallic glass in contact with aluminum2010
- Author(s)
  M.Maeda, Y.Takahashi, A.Inoue
- Journal Title
  
  Ceramic Transactions
  
  Volume: 219 Pages: 67-72
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Thermal stability of Zr_<55> Cu_<30> Ni_5Al_<10> metallic glass in contact with aluminum2010
- Author(s)
  M. Maeda, Y. Takahashi and A. Inoue
- Journal Title
  
  Ceram. Trans.
  
  Volume: Vol.219 Pages: 67-72
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Formation of ohmic contact layer on n-type gallium nitride by controlling interfacial reaction with titanium2010
- Author(s)
  M. Maeda, N. Matsumoto and Y. Takahashi
- Journal Title
  
  Proc. Materials Science and Technology
  
  Pages: 2732-2742
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] 銅と電解錫めっき銅基板の無加熱超音波接合2009
- Author(s)
  井上直人,佐藤貴昭,前田将克,高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol. 15
  
  Pages: 367-370
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial microstructure and thermal stability of Zr_<55> Cu_<30> Ni_5Al_<10> metallic glass joints formed by ultrasonic bonding2009
- Author(s)
  M. Maeda, T. Yamasaki, Y. Takahashi and A. Inoue
- Journal Title
  
  Mater. Trans.
  
  Volume: Vol.50 Pages: 1263-1268
- NAID
  10024815498
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Early stage of Solid State Interfacial Reaction between Copper and Tin2009
- Author(s)
  M. Maeda, N. Inoue, T. Sato, and Y. Takahashi
- Journal Title
  
  Defect and Diffusion Forum Vols. 283-286
  
  Pages: 323-328
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructure and Thermal Stability of Zr_<55>Cu_<30>Ni_5Al_<10> Metallic Glass Joints Formed by Ultrasonic Bonding2009
- Author(s)
  M.Maeda, T.Yamasaki, Y.Takahashi, A.Inoue
- Journal Title
  
  Materials Transactions 50
  
  Pages: 1263-1268
- NAID
  10024815498
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Heatless Ultrasonic Bonding of Copper-foil with Tin Electroplated Copper Substrate2009
- Author(s)
  N. Inoue, T. Sato, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) 15
  
  Pages: 367-370
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Copper Foils Using Deposition Films of Tin2009
- Author(s)
  T. Sato, N. Inoue, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) 15
  
  Pages: 375-378
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 錫蒸着膜を介した銅の常温超音波接合2009
- Author(s)
  佐藤貴昭,井上直人,前田将克, 高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol. 15
  
  Pages: 375-378
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Early Stage of Solid State Interfacial Reaction between Copper and Tin2009
- Author(s)
  M. Maeda, N. Inoue, T. Sato, Y. Takahashi
- Journal Title
  
  Defect and Diffusion Forum 283-286
  
  Pages: 323-328
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Deformation Behavior of Wiring Metals during Ultrasonic Bonding2008
- Author(s)
  Y. Yoneshima, H. Kitamura, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 347-350
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Formation of Ti3SiC2 Contact Layer Preventing Interfacial Reaction with SiC Substrate2008
- Author(s)
  K. Takahashi, M. Maeda, N. Matsumoto, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 339-342
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Zr55Cu30Ni 5Al10 Metallic Glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M Fukuhara, X. Wang, and A. Inoue
- Journal Title
  
  Materials Sc. Eng. B Vol. 141-14
  
  Pages: 0-0
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Copper and Tin2008
- Author(s)
  N. Inoue, T. Sato, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 339-342
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic bonding of Zr_<55>Cu_<30>Ni_5Al_<10> metallic glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M. Fukuhara, X. Wang, A. Inoue
- Journal Title
  
  Materials Science and Engineering B 148
  
  Pages: 141-144
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 固相凝着接合現象2008
- Author(s)
  高橋康夫
- Journal Title
  
  BRAZE 42
  
  Pages: 36-43
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 窒化ガリウムと金属蒸着膜との界面組織2008
- Author(s)
  前田将克, 高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol.14
  
  Pages: 351-354
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructures of Zr_<55>Cu_<30>Ni_5Al_<10> Metallic Glass Joints Formed by Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Akagi, Y. Takahashi
- Journal Title
  
  Smart Processing Technology 2
  
  Pages: 239-242
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 超音波接合における配線材変形挙動2008
- Author(s)
  米島康弘,北村英樹,前田将克,高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol.14
  
  Pages: 347-349
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructure between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 351-354
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic bonding of Zr55Cu30Ni5Al10 metallic glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M. Fukuhara, X. Wang, A. Inoue
- Journal Title
  
  Materials Science and Engineering B Vol 141
  
  Pages: 141-144
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Reaction during Solid State Diffusion Bonding of Copper and Tin2008
- Author(s)
  N. Inoue, T. Sato, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of-14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 335-338
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Room Temperatuer Micro-bonding of Fine Wires to Foils2007
- Author(s)
  Y Takahashi, M Maeda, T Doki, S Matsusaka
- Journal Title
  
  Solid State Phenomena Vol.127
  
  Pages: 277-282
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Reaction between SiC Single crystal and Ti/Al Multilayered Contact Films2007
- Author(s)
  M. Maeda, K. Nonomura, Y. Takahashi and K. Tenyama
- Journal Title
  
  Proc. 8th International Conference On Brazing High Temperature Brazing and Diffusion welding
  
  Pages: 84-87
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Solid State Adhersion of Fine Metal Wires2006
- Author(s)
  Y Takahashi, M Maeda, T Tomimura, T Doki, S Matsusaka
- Journal Title
  
  2006 Korea-Japan Joint Symposium on Microjoining Technology, Korean Welding Society
  
  Pages: 1-6
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 超音波微細接合における初期凝着形成機構2005
- Author(s)
  前田将克, 北森智子, 山根恵太, 高橋康夫
- Journal Title
  
  エレクトロニクス分野におけるマイクロ接合・実装技術シンポジウム論文集(溶接学会) 11巻
  
  Pages: 405-408
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-14350384
[Journal Article] Initial Stage of Bond Formation during Ultrasonic Microjoining2005
- Author(s)
  M.Maeda, S.Kitamori, K.Yamane, Y.Takahashi
- Journal Title
  
  Proceeding of 11th Symposium on Microjoining and Assembly Technology in Electronics (Mate2005), Feb.3rd-4th, Yokohama, Japan, JWS Vol.11
  
  Pages: 405-408
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-14350384
[Journal Article] Nickeltitaniu based contact for n-type silicon carbide to combine high ohmic conductivity and mechanical properties
- Author(s)
  M. Maeda, M. Sano and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of Interfacial Properties in Power Electronic Devices
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Int. J. Nanotechnol.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties and structure of contact interface between Ti_3SiC_2 and p-type GaN
- Author(s)
  Aiman b. M. H., M. Maeda, Y. Takahashi
- Journal Title
  
  J. Phys.: Conf. Ser.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties of the interface between p-GaN and contact materials
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of interfacial reaction on electrical conduction across the interface between n-type gallium nitride and contact materials
- Author(s)
  M. Maeda, T. Yamasaki and Y. Takahashi
- Journal Title
  
  J. Phys.: Conf. Ser.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Nucleation and growth of Ti3SiC2 on SiC by interfacial reaction
- Author(s)
  K. Ideguchi, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of crystal orientation on ohmic contact formation for n-type gallium nitride
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Patent] オーミック電極およびその製造方法2009
- Inventor(s)
  関章憲,杉本雅裕,川橋憲,高橋康夫,前田将克
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車
- Industrial Property Number
  2009-182541
- Filing Date
  2009-08-05
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] 半導体装置、及び、半導体装置の製造方法2009
- Inventor(s)
  高橋康夫, 他4名
- Industrial Property Rights Holder
  大阪大学, 他1名
- Industrial Property Number
  2009-229381
- Filing Date
  2009-10-01
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] オーミック電極およびその製造方法2009
- Inventor(s)
  高橋康夫, 他4名
- Industrial Property Rights Holder
  大阪大学, 他1名
- Industrial Property Number
  2009-182541
- Filing Date
  2009-08-05
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] オートミック電極およびその形成方法2009
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Industrial Property Number
  2009-020850
- Filing Date
  2009-01-30
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 半導体装置、及び、半導体装置の製造方法2009
- Inventor(s)
  杉本雅裕,関章憲,川橋憲,高橋康夫,前田将克
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車
- Industrial Property Number
  2009-229381
- Filing Date
  2009-10-01
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] オーミック電極およびその形成方法2009
- Inventor(s)
  高橋康夫, 他4名
- Industrial Property Rights Holder
  高橋康夫, 他4名
- Industrial Property Number
  2009-020850
- Filing Date
  2009-01-30
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 超音波接合方法及び超音波接合体2008
- Inventor(s)
  高橋康夫, 他5名
- Industrial Property Rights Holder
  高橋康夫, 他5名
- Industrial Property Number
  2008-200955
- Filing Date
  2008-08-04
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] p型4H-SiC基板上のオートミック電極の形成方法2008
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Filing Date
  2008-03-13
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 超音波接合方法及び超音波接合体2008
- Inventor(s)
  高橋康夫,前田将克他4名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Industrial Property Number
  2008-200955
- Filing Date
  2008-08-04
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] P型4H-SiC基板上のオーミック電極の形成方法2008
- Inventor(s)
  高橋康夫, 他4名
- Industrial Property Rights Holder
  高橋康夫, 他4名
- Filing Date
  2008-03-13
- Overseas
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] Semiconductor Devices and Manufacturing Method Thereof2007
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Filing Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] Semiconductor Devices and Manufacturing Method Thereof2007
- Inventor(s)
  高橋康夫, 他4名
- Industrial Property Rights Holder
  大阪大学
- Filing Date
  2007-09-21
- Overseas
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 半導体装置とその製造方法2006
- Inventor(s)
  高橋康夫他4名
- Industrial Property Rights Holder
  大阪大学
- Industrial Property Number
  2006-256705
- Filing Date
  2006-09-22
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 超音波接合方法及び装置2006
- Inventor(s)
  高橋康夫他4名
- Industrial Property Rights Holder
  大阪大学
- Filing Date
  2006-08-11
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] n型窒化ガリウムへのオーミックコンタクト形成とそのメカニズム2012
- Author(s)
  前田将克, 高橋康夫
- Organizer
  溶接学会界面接合研究委員会
- Place of Presentation
  東京工業大学
- Year and Date
  2012-05-18
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] Control of Interfacial Properties in Power Electronic Devices2011
- Author(s)
  M.Maeda, Y.Takahashi
- Organizer
  The 4th International Symposium on Functional Materials
- Place of Presentation
  Sendai, Japan(招待講演)
- Year and Date
  2011-08-03
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] 炭化ケイ素半導体のオーミックコンタクト形成機構と特性評価2010
- Author(s)
  樋口真之, 前田将克, 高橋康夫, 森本純司
- Organizer
  溶接学会
- Place of Presentation
  日本大学
- Year and Date
  2010-09-08
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] ジルコニウム基金属ガラスとアルミニウムの異材界面の構造と安定性2010
- Author(s)
  児玉拓己, 前田将克, 高橋康夫
- Organizer
  溶接学会
- Place of Presentation
  日本大学
- Year and Date
  2010-09-08
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] p型4H-SiC半導体へのオーミックコンタクト形成と特性評価2009
- Author(s)
  木村義孝, 前田将克, 高橋康夫
- Organizer
  溶接学会
- Place of Presentation
  徳島大学
- Year and Date
  2009-09-11
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] Low Temperature Solid State Bonding of Cu and Sn for Electronic Packaging2008
- Author(s)
  T. Sato, N. Inoue, M. Maeda, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] In-situ Observation of Ultrasonic Aluminum Wire Bonding2008
- Author(s)
  Kitamura, Y, Yoneshima, M. Maeda, and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Yamane, S. Matsusaka, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Low Temperature Solid State Bonding of Cu and Sn for Electronic Packaging2008
- Author(s)
  T. Sato, N. Inoue, M. Maeda and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Interfacial Structure between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda, H. Hatakawa, Y. Takahashi
- Organizer
  6th International Materials Technology Conference & Exhibition
- Place of Presentation
  Kuala Lumpur, Malaysia
- Year and Date
  2008-08-27
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Relation between Vibration of Wedgetool and Adhsion of Wire to Substrate during Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Yamane, S. Matsusaka and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 窒化ガリウム単結晶と金属薄膜の界面組織2008
- Author(s)
  前田将克,畑川裕生,高橋康夫
- Organizer
  化ガリウム単結晶と金20年度溶接学会秋季全国大会
- Place of Presentation
  小倉
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Interfacial Structur between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda, H. Hatakawa and Y. Takahashi
- Organizer
  Proceeding of 6th International Materials Technology Conference and Exhibition (IMTCE 2008)
- Place of Presentation
  Kuala Lumpur (Malaysia)
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] In-situ Observation of Ultrasonic Aluminum Wire Bonding2008
- Author(s)
  H. Kitamura, Y. Yoneshima, M. Maeda, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Formation of Ti_3SiC_2 on SiC by Control of Interfacial Reaction between SiC and Ti / Al Multilayer2008
- Author(s)
  M. Maeda, Y. Takahashi
- Organizer
  4th JWS-KWJS Young Researcher Symposium
- Place of Presentation
  大阪市
- Year and Date
  2008-04-09
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] "Reaction between Gan and Metallic Deposition Film2008
- Author(s)
  N. Matsumoto, H. Hatagawa, M. Maeda, and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 窒化ガリウム単結晶と金属膜の界面組織2008
- Author(s)
  前田将克, 高橋康夫, 畑川裕生
- Organizer
  溶接学会秋季全国大会講演会
- Place of Presentation
  北九州国際会議場
- Year and Date
  2008-09-12
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 太径ワイヤによる超音波配線接合プロセスのその場観察2007
- Author(s)
  米島康弘, 前田将克, 高橋康夫
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] CuとSnの固相接合における界面反応プロセス2007
- Author(s)
  井上直人, 佐藤貴昭, 前田将克, 高橋康夫
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-20
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 炭化珪素単結晶とTi/Al多層コンタクト膜の界面反応制御2007
- Author(s)
  前田将克, 高橋康夫, 野々村和政
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-20
- Data Source
  KAKENHI-PROJECT-18206076

1. MAEDA Masakatsu (00263327)

# of Collaborated Projects: 4 results

# of Collaborated Products: 75 results
2. INOUE Katsunori (90029067)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. OHKUBO Masashi (10233074)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
4. MATSUYAMA Kinichi (80029305)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
5. NISHIGUCHI K. (50028940)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
6. NOGI Kiyoshi (40029335)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. MATSUSAKA Souta (30334171)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
8. ONZAWA Tadao (10016438)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. SUGA Tadatomo (40175401)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. SHIMIZU Ryuichi (40029046)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. TAKAHASHI Kunio (70226827)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. TSUMURA Takuya (00283812)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. SEKINE Testu

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. 清宮紘一

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

AKAHASHI Yasuo 高橋 康夫

TAKAHASHI Yasuo 高橋 康夫

TAKAHASHI Y. 高橋 康雄

Research Projects

Research Products

Co-Researchers

Control of interfacial nanostructure between wide-gap semiconductors and their electrodes

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Control of Interfacial Strain between Wide-Bandgap Semiconductor and Electrode to Improve Interfacial Electrical Conductance

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Improvement of Interfacial Functions in Eco-devices Based on Control of Interfacial Nanostructure

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Analysis of interface-bond formation mechanism of environmentally friendly electronic device wiring and optimization of the bonding processPrincipal Investigator

Principal Investigator

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Micro-interface formation control of electronic devises based on analysis of solid state bonding mechanismPrincipal Investigator

Principal Investigator

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Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.Principal Investigator

Principal Investigator

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Widening of the joined interface by the procedure without heating and pressing

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Micro-thermocompression Bonding Mechanism and Modeling for Electronics Devise InterconnectionPrincipal Investigator

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Detecting System of Weld Joint by Image Measurement

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エキシマレーザによる高分子材料の加工

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プラズマ窒化プロセスに及ぼすイオン化と発熱効果に関する研究Principal Investigator

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Low damage cutting and bonding process of high performance composite materials and its systematizing

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Analysis of the formation process of the bonded area in the solid state bonding and its predictionPrincipal Investigator

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AKAHASHI Yasuo 高橋康夫

TAKAHASHI Yasuo 高橋康夫

TAKAHASHI Y. 高橋康雄