TASHIRO Suguru 田代優

… Alternative Names

田代優タシロスグル

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Researcher Number	90272111
Other IDs
Affiliation (Current)	2025: 茨城大学, 応用理工学野, 准教授
Affiliation (based on the past Project Information) *help	2021 – 2023: 茨城大学, 理工学研究科(工学野), 准教授 2012 – 2015: 茨城大学, 工学部, 講師 2008 – 2010: 茨城大学, 工学部, 講師
Review Section/Research Field	Principal Investigator Medium-sized Section 26:Materials engineering and related fields / Material processing/treatments Except Principal Investigator Structural/Functional materials
Keywords	Principal Investigator 接合強度 / Cu-Al / 異種金属間接合 / 回復・再結晶 / 合金相 / 金属間化合物相 / 粒子法 / 摩擦撹拌接 / Cu-Al異種金属間接合 / ヒートサイクル試験 … More / Al-Cu合金 / ワイヤボンデイング / 硬さ / 組織観察 / 接合 / 時効処理 / 析出 / θ相 / アルミ銅合金ワイヤ … More Except Principal Investigator 配線評価用TEG / パルスめっき技術 / 配線抵抗率 / 添加剤フリーめつき技術 / 超高純度めっき材料 / ULSI / 微細構造 / 微量不純物 / Cuの高純度化 / TEG / 分子動力学シミュレーション / 革新的高導電性 / 超高純度めっき材 / 添加剤フリー / Cu 配線 / 収差補正STEM / クレヴァス / Ru膜 / 添加剤フリーめっき / 収差補正TEM / 粒界不純物 / 抵抗率 / 超高純度硫酸銅 / Cu配線 / LSI / 情報材料 / 電子 Less

Development of bonding technology for thin metal sheets using friction stir weldingPrincipal Investigator
- Principal Investigator
  
  田代優
- Project Period (FY)
  2021 – 2024
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 26:Materials engineering and related fields
- Research Institution
  Ibaraki University
Development of high-temperature operation power semiconductor for the aluminum copper alloy wire bondingPrincipal Investigator
- Principal Investigator
  
  TASHIRO SUGURU
- Project Period (FY)
  2012 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Ibaraki University
Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.
- Principal Investigator
  
  ONUKI Jin (OONUKI Jin)
- Project Period (FY)
  2008 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Ibaraki University

All 2011 2010 2009 2008 Other

All Journal Article Patent

[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011
- Author(s)
  田代優, 門田裕行, 伊藤雅彦, 打越雅仁, 三村耕司, 一色実, 大貫仁
- Journal Title
  
  日本金属学会誌
  
  Volume: 75(掲載決定)
- NAID
  10029368773
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011
- Author(s)
  田代優, 打越雅仁, 三村耕司, 一色実, 大貫仁
- Journal Title
  
  本金属学会誌 75掲載決定
- NAID
  10029368773
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 超微細Cu配線の微細構造と抵抗率に及ぼす硫酸銅純度の影響2011
- Author(s)
  田代優、K, P.Khoo、大貫仁
- Journal Title
  
  日本金属学会誌
  
  Volume: 75 Pages: 223-228
- NAID
  10028175938
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 微細Cu配線の微細構造と抵抗率に及ぼす硫酸銅純度の影響2011
- Author(s)
  田代優, 大貫仁
- Journal Title
  
  日本金属学会誌 5
  
  Pages: 223-228
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K. P. Khoo, N. Ishikawa, Y.Chonan, T.Kimura, H. Akahoshi
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 157巻
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K.P.Khoo, N.Ishikawa, Y.Chonan, T.Kimura, H.Akahoshi
- Journal Title
  
  J.Electrochem.Soc 157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010
- Author(s)
  J.Onuki, S.Tashiro, K.P.Khoo, N.Ishikawa, Y.Chonan, T.Kimura, H.Akahoshi
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Influence on the Electro-migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
- Author(s)
  K.P.Khoo, Suguru Tashiro, 大貫仁
- Journal Title
  
  Material Transactions (印刷中)
- NAID
  10027018498
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Patent] 特許出願(発明の名称)半導体集積回路装置及びその製造方法2009
- Inventor(s)
  篠嶋妥、大貫仁、田代優、KyooKhyou Pin
- Industrial Property Rights Holder
  茨城大学
- Filing Date
  2009-12-03
- Overseas
- Data Source
  KAKENHI-PROJECT-20226014
[Patent] 半導体集積回路およびその製造方法2008
- Inventor(s)
  篠嶋、大貫、田代、K. P. Khoo
- Industrial Property Rights Holder
  茨城大
- Industrial Property Number
  2008-309890
- Filing Date
  2008-12-04
- Data Source
  KAKENHI-PROJECT-20226014

1. ONUKI Jin (70315612)

# of Collaborated Projects: 2 results

# of Collaborated Products: 8 results
2. NAGANO Takatoshi (70343621)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. MIMURA Koji (00091752)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
4. ISHIKAWA Nobuhiro (00370312)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
5. KONDO Kazuo (50250478)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. INAMI Takashi (20091853)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. CHONAN Yasunori (30363740)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
8. ITO Shinji (50370317)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
9. UCHIKOSHI Masahito (60447191)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
10. OHTA Hiromichi (70168946)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. KIMURA Takashi (70370319)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
12. SASAJIMA Yasushi (80187137)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. AOYAMA Takashi (80363737)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. 一色実 (20111247)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results

TASHIRO Suguru 田代 優

田代 優 タシロ スグル

Research Projects

Research Products

Co-Researchers

Development of bonding technology for thin metal sheets using friction stir weldingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of high-temperature operation power semiconductor for the aluminum copper alloy wire bondingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011

Author(s)

Journal Title

NAID

Data Source

[Journal Article] 高純度めっき材料を用いた 低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011

Author(s)

Journal Title

NAID

Data Source

[Journal Article] 超微細Cu配線の微細構造と抵抗率に及ぼす硫酸銅純度の影響2011

Author(s)

Journal Title

NAID

Data Source

[Journal Article] 微細Cu配線の微細構造と抵抗率に及ぼす硫酸銅純度の影響2011

Author(s)

Journal Title

Data Source

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resitivity of Cu Wires for Future LSIs2010

Author(s)

Journal Title

Data Source

[Journal Article] Influence on the Electro-migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires

Author(s)

Journal Title

NAID

Data Source

[Patent] 特許出願(発明の名称)半導体集積回路装置及びその製造方法2009

Inventor(s)

Industrial Property Rights Holder

Filing Date

Data Source

[Patent] 半導体集積回路およびその製造方法2008

Inventor(s)

Industrial Property Rights Holder

Industrial Property Number

Filing Date

Data Source

TASHIRO Suguru 田代優

田代優タシロスグル

[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011