Koyanagi Mitsumasa 小柳光正

… Alternative Names

小柳光正コヤナギミツマサ

KOYANAGI Mitsumasa 小柳光正

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Researcher Number	60205531
Other IDs
External Links
Affiliation (Current)	2025: 東北大学, 未来科学技術共同研究センター, 名誉教授
Affiliation (based on the past Project Information) *help	2022 – 2023: 東北大学, 未来科学技術共同研究センター, 名誉教授 2016 – 2017: 東北大学, 未来科学技術共同研究センター, 名誉教授 2010 – 2015: 東北大学, 未来科学技術共同研究センター, 教授 2009: Tohoku University, 大学院・工学研究科, 教授 2007: Tohoku University, Tohoku University, Graduate School of Engineering, Professor … More 2006: 東北大学, 大学院工学研究科, 教授 1997 – 2005: Tohoku Univ., Faculty of Eng., Prof., 大学院・工学研究科, 教授 1998: 東北大学, 工学研究科, 教授 1994 – 1997: 東北大学, 工学部, 教授 1992 – 1993: 広島大学, 集積化システム研究センター, 教授 Less
Review Section/Research Field	Principal Investigator 電子デバイス・機器工学 / Electron device/Electronic equipment / Science and Engineering Except Principal Investigator Electron device/Electronic equipment / Applied physics, general / Medium-sized Section 21:Electrical and electronic engineering and related fields / Medical systems / Ophthalmology / 複合化集積システム / 計算機科学 / 電子デバイス・機器工学 / Science and Engineering
Keywords	Principal Investigator 光インターコネクション / 並列処理 / システムオンチップ / ウェーハ張り合わせ / 光導波路 / 並列処理システム / Optical Interconnection / Wafer Level Integration / Parallel Processing / マイクロバンプ … More / ウエーハ張り合わせ技術 / ウエーハレベルインテグレーション / ウェーハ張り合わせ技術 / LSI集積化技術 / 半導体技術 / システムオンチップ / ウェーハレベルインテグレーション / 3次元積層技術 / 極微細結晶粒 / CMOSメモリ / 室温動作 / マルチチャネル / クーロンブロッケード / 単電子メモリ / 単電子素子 / 大規模集積回路 / 極微細半導体素子 / デバイスシミュレーション / バスボトルネック / スマートセンサ情報システム / 半導体物性 / 先端機能デバイス / 電子デバイス・機器 / High Speed Data Transfer / Parallel Processing System / Optical Wave Guide / Wafer Bonding / Three-Dimensional Integration / Multiport Shared Memory / Three-Dimensionally Stacked Processor / 高速データ転送 / ウェーハ貼り合わせ / 三次元積層化技術 / マルチポート共有メモリ / 三次元積層型プロセッサ / Large Scale Integration Technology / Semiconductor Technology / Micro-Bump / Wafer Bonding Technology / System on Chip / Optical Waveguide / LSI / Semiconductor / Memory / System on a Chip / Three Dimensional Integration / メモリー / 3次元集積化技術 / WAFER BONDING / 3D INTEGRATION / PARALLEL PROCESSING / NEURAL NETWORK / ASSOCIATION / LEARNING / REAL-TIME / IMAGE PROCESSING / 三次元積層技術 / 張り合わせ技術 / ニューラルネットワーク / 連想機能 / 学習機能 / リアルタイム / 視覚情報処理 / ULSI / Deca-nano device / Device Simulation / Parallel Monte Carlo Analysis / Bus Bottle Neck / High Speed parallel Computing System / Three Dimensional Integrated Shard Memory / Three Dimensional Integration Technology / 並列モンテカルロ解析 / 超高速並列処理システム / 3次元集積型実共有メモリ / 光電子集積システム・オン・チップ / シリコン貫通配線 / スーパーチップ / 光電子集積化 / 三次元集積化 / セルフアセンブリー / グラフォアセンブリー / 積層型画像処理チップ / 電流モードFFT LSI / 並列型SIMF / SS-CDMA / 三次元システムインパッケージ / 時分割全二重通信 / 0.18um CMOSプロセス / オールディジタルモデム / 超並列パイプライン / 積層化画像処理チップ / 三次元集積化技術 / 融合素子 / SOI / イメージセンサ / 液晶表示素子 / スマートピクセル / 画像処理 / 多層実装 / モンテカルロ解析 / 光ラムバス・メモリ / 光受動素子 / マイクロボンディング / 3次元積層化 / 3次元光結合メモリ / 3次元光結合プロセッサ / 光結合 / 連想メモリ / マルポートメモリ / 3次元LSI … More Except Principal Investigator 人工網膜 / 三次元集積回路 / LSI / FPGA / マイクロマシン / 半導体 / 実装技術 / 集積回路 / 3次元集積化技術 / フレキシブル集積 / 垂直配線 / システムインテグレーション / 実装工学 / 3D-IC / TSV / FHE / フレキシブルインターコネクト / 半導体実装工学 / Cuピラー / アセンブリ / チップレット / マストランスファー / 半導体パッケージング工学 / 表面張力 / 貫通配線 / 微小コンポーネント / 自己組織化実装 / ナノアセンブリ / 人間医工学 / 人工視覚 / 生体医工学 / 医用システム / rabbits / three dimensional stacked technology / retinal degeneration / retinal prosthesis / ウサギ / 三次元積層化技術 / 網膜変性 / Semiconductor / Parallel Processing / Image Processing / Reconfigurable Logic / Packaging / Three Dimensional Integration Technology / Biologically Inspired System / Neuromorphic System / Vision Chip / 半導体技術 / 並列処理 / Reconfiguration / 画像処理 / Volume Rendering / Memory / Brain Models / Neural Networks / Computer Graphics / Instruction-Level Parallel Processing / Computer Architecture / ボリュームレンダリング / 記憶 / 脳モデル / ニューラルネットワーク / コンピュータグラフィックス / 命令レベル並列処理 / コンピュータアーキテクチャ / Three-dimensinal machining / Distributed machine / Flexible machine / Micro motion system / Active catheter / Micromachining / Micromachine / Microactuator / 文体的微細加工 / 能動力カテーテル / 分布型機械 / マイクロマシ-ニング / 立体的微細加工 / 分布垂機械 / 柔構造機械 / マイクロ運動システム / 能動カテーテル / マイクロマシニング / マイクロアクチュエータ / Motion vector / Adaptive storage time / Image data compression / Computational sensor / High dielectric constant C / Vision chip / Image processing system / 3D integration / 3次元配線 / 低消費電力化 / 条件読み出し方式 / 微細素子のエネルギー限界 / シリコンウェーハ積層技術 / 4進木構造画像センサー / 情報圧縮センサー / コンピュテ-ショナルセンサ / 動きベクトル検出 / 適応蓄積時間 / 画像圧縮 / コンピュテーショナルセンサ / 高誘電率薄膜キャパシタ / ビジョンチップ / 画像処理システム / 3次元積層化 / 高次視覚処理 / 3次元集積回路 / 半導体神経工学 / 視覚情報処理 / 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ / Charge Injection Capacity / Cyclic Voltammetry / 生体適合性 / EEP / 埋め込み術式 / ラプラシアンフィルタ / 低消費電力 / 医用マイクロ・ナノシステム / システムオンチップ / 微細接続 / 流体 / マイクロ・ナノデバイス / 自己組織化 / インターコネクト・パッケージのシステム化・応用 / 蓄積電荷量 / フォトン / イオンエネルギー / オンウエハーモニタリング / モニタリング / 薄膜堆積 / 微細加工 / 側壁導電性 / 電子エネルギー分布 / イオンエネルギー分布 / センサー / 光照射損傷 / プラズマプロセス / オンウエハモニタリング / 医工学 / 医療 / 義眼 / 人工眼 / 高選択異方性エッチング / 不純物拡散 / in-situ不純物ドーピング / CVD低温選択成長 / 高精度エッチング / 不純物ドーピング / 選択成長 / CVD / HBT / MOS / SiGeC / SiGe Less

Holistic Integration Engineering with Micro-assembly and Wirelets
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Challenging Research (Pioneering)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Stereo-Vision Image Sensor LSI Fabricated by 3D Heterogeneous Integration TechnologyPrincipal Investigator
- Principal Investigator
  
  KOYANAGI MITSUMASA
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human vision
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Medical systems
- Research Institution
  Tohoku University
Development of fully-implanted low-power retinal prosthesis system with visual information processing functions
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
眼球内埋め込み用低電力三次元積層型人工網膜システムの研究
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2010 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-AssemblyPrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2009 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-Assembly
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2007 – 2009
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Basic studies of three dimensionally stacked retinal prosthesis toward for clinical trials
- Principal Investigator
  
  TOMITA Hiroshi
- Project Period (FY)
  2005 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Ophthalmology
- Research Institution
  Tohoku University
High Performance Parallel Processor System Using Three-Dimensional Processor ChipPrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2003 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
人に移植可能な1チップ薄膜化人工眼の開発
- Principal Investigator
  
  栗野浩之
- Project Period (FY)
  2002 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  Tohoku University
超高精度プラズマプロセス用オンウエハーモニタリングシステムの構築
- Principal Investigator
  
  SAMUKAWA Seiji
- Project Period (FY)
  2002 – 2003
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Applied physics, general
- Research Institution
  Tohoku University
超機能化ヒューマン・インターフェース画像処理・ワイヤレス情報端末チップ創製Principal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  2001 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Tohoku University
Wafer-Scale Dynamic Neural-Network-System with Optical WaveguidePrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2000 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  Tohoku University
Three Dimensional Integrated Field Programmable Gate Array with Genetic Concept
- Principal Investigator
  
  KURINO Hiroyuki
- Project Period (FY)
  2000 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  複合化集積システム
- Research Institution
  TOHOKU UNIVERSITY
人工IV族半導体極微細構造を用いた超高速光・電子デバイスの開発
- Principal Investigator
  
  室田淳一
- Project Period (FY)
  1999 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Tohoku University
Wafer Level Parallel Processing System Using Cubic Integration TechnologyPrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  1999 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  TOHOKU UNIVERSITY
室温で高速動作可能なCMOS融合型マルチ単電子メモリPrincipal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1998
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas (A)
- Research Institution
  Tohoku University
Advanced Architectures for Brain - Structured Supercomputers
- Principal Investigator
  
  NAKAMURA Tadao
- Project Period (FY)
  1998 – 1999
- Research Category
  
  Grant-in-Aid for Scientific Research (B).
- Research Field
  
  計算機科学
- Research Institution
  TOHOKU UNIVERSITY
室温で高速動作可能なマルチ単電子メモリPrincipal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1997
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Research Institution
  Tohoku University
THREE-DIMENSIONALLY STACKED IMAGE PROCESSING SYSTEM WITH LEARNING FUNCTIONPrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  1997 – 1999
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  TOHOKU UNIVERSITY
HIGH SPEED PARALLEL COMPUTER SYSTEM USING 3-DIMENTIONAL INTEGLATED SHARED MEMORYPrincipal Investigator
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  1996 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  TOHOKU UNIVERSITY
イメージセンサと液晶表示素子を一体化した即時画像処理システムPrincipal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1995 – 1996
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  Tohoku University
Instantaneous 2-D data processing system
- Principal Investigator
  
  ASADA Kunihiro
- Project Period (FY)
  1995 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Research Institution
  University of Tokyo
Flexible micro motion-systems having distributed actuators
- Principal Investigator
  
  ESASHI Masayoshi
- Project Period (FY)
  1995 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Applied physics, general
- Research Institution
  Tohoku University
超高速光バスを有するモンテカルロ解析専用並列処理システムの試作Principal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1994 – 1995
- Research Category
  
  Grant-in-Aid for Developmental Scientific Research (B)
- Research Field
  
  電子デバイス・機器工学
- Research Institution
  Tohoku University
光インターコネクションを有する3次元光電子集積回路と超並列演算システムPrincipal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1993
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Research Institution
  Hiroshima University
光インターモネクションを有する3次元光電子集積回路と超並列演算システムPrincipal Investigator
- Principal Investigator
  
  小柳光正
- Project Period (FY)
  1992
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Research Institution
  Hiroshima University

[Book] 3D Integration in VLSI Circuits: Implementation Technologies and Applications2018
- Author(s)
  M. Koyanagi, T. Fukushima, and T. Tanaka
- Total Pages
  217
- Publisher
  CRC Press
- ISBN
  9781138710399
- Data Source
  KAKENHI-PROJECT-15H02246
[Book] Three Dimensional Integration of Semiconductors Processing Materials and Applications2015
- Author(s)
  Kang-Wook Lee, M. Koyanagi
- Total Pages
  408
- Publisher
  Springer
- Data Source
  KAKENHI-PROJECT-15H02246
[Book] Handbook of 3D Integration, Vol.3, 3D Process technology2014
- Author(s)
  Mitsumasa Koyanagi, Tetsu Tanaka, 他
- Total Pages
  280
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Handbook of 3D Integration Volume 3: 3D Process Technology, 執筆担当部分：Chapter 6.6, “Via Reveal and Backside Processing” (in press)2014
- Author(s)
  Mitsumasa Koyanagi, Tetsu Tanaka
- Total Pages
  280
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Handbook of Wafer Bonding2011
- Author(s)
  M.Koyanagi(分担執筆)
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Handbook of Wafer Bonding2011
- Author(s)
  M.Koyanagi, 他
- Total Pages
  450
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Untra-thin Chip Technology and Application, Chapter III-11, " 3D Technology Using Ultra-Thin Chips"2010
- Author(s)
  M.Koyanagi, 他
- Total Pages
  467
- Publisher
  Springer
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Untra-thin Chip Technology and Application (Editor : J.N.Burghartz), Chapter III-11, "3D-IC Technology Using Ultra-Thin Chips2010
- Author(s)
  M.Koyanagi
- Publisher
  Springer
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Materials and technologies for 3-D Integration2009
- Author(s)
  Mitsumasa Koyanagi(Co-editor/Author)
- Total Pages
  273
- Publisher
  Material Research Society
- Data Source
  KAKENHI-PROJECT-21226009
[Book] M&E(自己組織化によるウェハレベル三次元集積化技術, 36(1))2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Data Source
  KAKENHI-PROJECT-19686022
[Book] 3次元システムインパッケージと材料技術バイオエレクトロニクスへの応用2007
- Author(s)
  小柳光正、田中徹、富田浩史
- Total Pages
  20
- Publisher
  (株)シーエムシー出版
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17390465
[Book] 「最先端半導体パッケージ技術のすべて(分担執筆)」2007
- Author(s)
  小柳光正
- Publisher
  工業調査会
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Book] 「新改版表面科学の基礎と応用(分担執筆)」2004
- Author(s)
  小柳光正
- Publisher
  NTS出版
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration2017
- Author(s)
  Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 7 Pages: 2912-2918
- DOI
  10.1109/ted.2017.2705562
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 12 Pages: 5065-5072
- DOI
  10.1109/ted.2017.2767598
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] 半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に2016
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  表面技術
  
  Volume: 67 Pages: 414-420
- NAID
  130005875872
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016
- Author(s)
  T. Fukushima, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  ECS Transactions
  
  Volume: 75 Issue: 9 Pages: 285-290
- DOI
  10.1149/07509.0285ecst
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] 三次元集積用テンポラリー接着剤の特性とウエハエッジの影響2016
- Author(s)
  福島誉史、マリアッパンムルゲサン、裵志哲、李相勲、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会誌C
  
  Volume: J99-C Pages: 493-500
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC07-04EC07
- DOI
  10.7567/jjap.55.04ec07
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC2016
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC03-04EC03
- DOI
  10.7567/jjap.55.04ec03
- NAID
  210000146283
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: 7 Issue: 10 Pages: 184-184
- DOI
  10.3390/mi7100184
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246, KAKENHI-PROJECT-15K14139
[Journal Article] Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration2015
- Author(s)
  Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Journal of Microelectromechanical Systems
  
  Volume: 25 Issue: 1 Pages: 91-100
- DOI
  10.1109/jmems.2015.2480787
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015
- Author(s)
  Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 37 Issue: 1 Pages: 81-83
- DOI
  10.1109/led.2015.2502584
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Applications of three-dimensional LSI2015
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, and Tetsu Tanaka
- Journal Title
  
  MRS BULLETIN
  
  Volume: 40 Issue: 3 Pages: 242-247
- DOI
  10.1557/mrs.2015.33
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Recent progress in 3D integration technology2015
- Author(s)
  Mitsumasa Koyanagi
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 12 Issue: 7 Pages: 20152001-20152001
- DOI
  10.1587/elex.12.20152001
- NAID
  130005063774
- ISSN
  1349-2543
- Language
  English
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology2014
- Author(s)
  K.-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, C. Nagai, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: - Pages: 669-672
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] Reconfigured-Wafer-to-Wafer 3D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film2014
- Author(s)
  Takafumi Fukushima, Ji Cheol Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.61, No.2 Issue: 2 Pages: 533-539
- DOI
  10.1109/ted.2013.2294831
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014
- Author(s)
  Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 61 Issue: 2 Pages: 540-546
- DOI
  10.1109/ted.2013.2295463
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060, KAKENHI-PROJECT-25820133
[Journal Article] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration2013
- Author(s)
  Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee,Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T.Fukusima, H.Hashiguchi, J.Bea, M.Mururesan, K-W.Lee, T.Tanaka, and M.Koyanagi
- Journal Title
  
  Proc.of IEEE 63rd ECTC
  
  Volume: VOL.63 Pages: 58-63
- DOI
  10.1109/ectc.2013.6575550
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Proc. of IEEE 63rd ECTC
  
  Volume: 63 Pages: 891-896
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (JJAP)
  
  Volume: 52 Issue: 4S Pages: 04CB09-04CB09
- DOI
  10.7567/jjap.52.04cb09
- NAID
  210000141985
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI2012
- Author(s)
  Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE ELECTRON DEVICES LETTERS
  
  Volume: Vol.33 Issue: 2 Pages: 221-223
- DOI
  10.1109/led.2011.2174608
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] New Chip -to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 789-792
- DOI
  10.1109/iedm.2012.6479157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs2012
- Author(s)
  M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 657-660
- DOI
  10.1109/iedm.2012.6479124
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate-an alternative method to wire bonding2012
- Author(s)
  M Murugesan, T Fukushima, K Kiyoyama, J C Bea, T Tanaka and M Koyanagi
- Journal Title
  
  JOURNAL of Micromechanics and Microengineering
  
  Volume: Vol.22(8) Issue: 8 Pages: 085033-085033
- DOI
  10.1088/0960-1317/22/8/085033
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Low-Resistance Cu-Sn Electroplated　Evaporated Microbumps for 3D Chip Stacking2012
- Author(s)
  M. MURUGESAN, Y. OHARA, T. FUKUSHIMA, T. TANAKA, and M. KOYANAGI
- Journal Title
  
  Journal of ELECTRONIC MATERIALS
  
  Volume: Vol.41(4) Issue: 4 Pages: 720-729
- DOI
  10.1007/s11664-012-1949-1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration2012
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Proc. of IEEE 62nd Electronic Components and Technology Conference
  
  Volume: - Pages: 393-398
- DOI
  10.1109/ectc.2012.6248860
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 58 Issue: 3 Pages: 748-757
- DOI
  10.1109/ted.2010.2099870
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術2011
- Author(s)
  大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 394-401
- NAID
  110008761542
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] 微細Si貫通ビアによる三次元インタコネクト技術2011
- Author(s)
  小柳光正, 田中徹
- Journal Title
  
  電子情報通信学会誌(インタコネクション技術小特集)
  
  Volume: Vol.94(招待論文) Pages: 1027-1032
- NAID
  110008799241
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.58 Pages: 748-757
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価2011
- Author(s)
  木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 411-418
- NAID
  110008761544
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Evaluation of Cu Diffusion from Cu Through-Silicon Via (TSV) in 3-D LSI by Transient Capacitance Measurement2011
- Author(s)
  J-C.Bea, K.W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: Volume 32 Issue: 7 Pages: 940-942
- DOI
  10.1109/led.2011.2141109
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] 三次元集積化技術とヘテロインテグレーション2011
- Author(s)
  小柳光正, 福島誉史, 李康旭, 田中徹
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C(招待論文) Pages: 355-364
- NAID
  110008761537
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010
- Author(s)
  岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: Vol.J93-C Pages: 493-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsuma Koyanagi
- Journal Title
  
  ECS (Electrochemical Society) Transactions
  
  Volume: Vol.33 Pages: 71-90
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface-tensiondriven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: VOL.96 Issue: 15
- DOI
  10.1063/1.3328098
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, K. -W. Lee, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letters Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module2010
- Author(s)
  Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
  
  Volume: Vol.19 Pages: 1284-1291
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 極限集積化を目指すスーパーチップ2010
- Author(s)
  小柳光正、福島誉史、李康旭、田中徹
- Journal Title
  
  電子情報通信学会誌
  
  Volume: Vol.93(招待論文) Pages: 918-922
- NAID
  110007880868
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2010
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: Vol.2 Pages: 49-68
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  電子材料
  
  Volume: Vol.49 Pages: 17-24
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters 96(accepted)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F.Inoue, M.Koyanagi, T.Fukushima, K.Yamamoto, S.Tanaka, Z.wang, S.Shingubara
- Journal Title
  
  ECS Transactions 16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE IEDM Technical Digest
  
  Pages: 349-352
- NAID
  110008001112
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 104-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Journal Title
  
  Proceedings of the IEEE Vol.97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] HighDensity Through Silicon Vias for 3-D LSIs2009
- Author(s)
  Mitsumasa Koyanagi
- Journal Title
  
  Proceedings of the IEEE 97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 Vol.12
  
  Pages: 105-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F. Inoue, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. wang, S. Shingubara
- Journal Title
  
  ECS Transactions Vol.16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System2009
- Author(s)
  Kenji Makita, Kouji Kiyoyama, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066588
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article]2009
- Author(s)
  Mitsumasa Koyanagi, Co-editor/Author
- Journal Title
  
  Materials and Technologies for 3-D Integration(共著)(Material Research Society)
  
  Pages: 121-130
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: VOL.48 Issue: 4S Pages: 04C113-04C113
- DOI
  10.1143/jjap.48.04c113
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  MITSUMASA KOYANAGI, TAKAFUMI FUKUSHIMA, TETSU TANAKA
- Journal Title
  
  Proceedings of THE IEEE 97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate2008
- Author(s)
  Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya. Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2936-2940
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 499-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  応用物理学会分科会シリコンテクノロジー「多層配線」特集号 No.99
  
  Pages: 34-37
- NAID
  110006935847
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs2008
- Author(s)
  H. Kikuchi, Y. Yamada, A.M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2801-2806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 985-988
- NAID
  120002070107
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections2006
- Author(s)
  Mitsumasa, Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES Vol.53
  
  Pages: 2799-2808
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections2006
- Author(s)
  Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES Vol. 53
  
  Pages: 2799-2808
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Self-Assembly Technique2005
- Author(s)
  T.Fukushima, Y.Yamada, H.Kikuchi, M.Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 359-362
- NAID
  120002070106
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Multi-Chip Shared-Memory Module with Optical Interconnection for Parallel Processor System2005
- Author(s)
  Hirofumi Kuribara, Hiroyuki Hashimoto, Mitsumasa Koyanagi, et al.
- Journal Title
  
  The 2005 International Conference on Solid State Devices and Materials
  
  Pages: 334-335
- NAID
  10022541847
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Design of a Novel Real-Shared Cache Module for High Performance Parallel Processor System on chip2005
- Author(s)
  Zhe LIU, Mitsumasa KOYANAGI, Hiroyuki KURINO
- Journal Title
  
  GESTS International Transaction on Computer Science and Engineering 7(1)
  
  Pages: 13-26
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration2005
- Author(s)
  Hirokazu Kikuchi, Yusuke Yamada, Mitsumasa Koyanagi, et al.
- Journal Title
  
  The 2005 International Conference on Solid State Devices and Materials
  
  Pages: 562-563
- NAID
  10022542549
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration2005
- Author(s)
  Takafumi Fukushima, Yusuke Yamada, Mitsumasa Koyanagi, et al.
- Journal Title
  
  The 2005 International Conference on Solid State Devices and Materials
  
  Pages: 64-65
- NAID
  10022540983
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI2005
- Author(s)
  Jun Deguchi, Yoshihiro Nakatani, Mitsumasa Koyanagi, et al.
- Journal Title
  
  The 2005 International Conference on Solid State Devices and Materials
  
  Pages: 660-661
- NAID
  10022542853
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Optimization of Vertical Interconnection in 3D LSI Using Wire-Length Distribution2004
- Author(s)
  T.Nakamura, Y.Yamada, T.Ono, H.Kurino, M.Koyanagi, et al.
- Journal Title
  
  Conference Proceedings AMC XIX
  
  Pages: 35-43
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Bump Formation Technique for Multi-Chip Module with Optical Interconnection2004
- Author(s)
  H.Kurino, R.Nitobe, J.Shim, M.Koyanagi, et al.
- Journal Title
  
  The Electrochemical Society International Semiconductor Technology Conference
  
  Pages: 94-94
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Retinal Prosthesis System with Telemetry Circuit Controlled by Human Eyelid Movement2004
- Author(s)
  Jun Deguchi, Hiroyuki Kurino, Makoto Tamai, Mitsumasa Koyanagi, et al.
- Journal Title
  
  Extended Abstracts of the 2004 International Conference on Solid State Devices and Materials
  
  Pages: 350-351
- NAID
  10022538727
- Data Source
  KAKENHI-PROJECT-14205051
[Journal Article] Design of a Novel Real-Shared Memory Module for High Performance Parallel Processor System with Shared Memory2004
- Author(s)
  Z.Liu, J.Shim, H.Kurino, Mitsumasa Koyanagi
- Journal Title
  
  International Conference on Advanced Information Networking and Applications
  
  Pages: 241-244
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Design and Evaluation of a High Speed Routing Lookup Architecture2004
- Author(s)
  Jun Zhang, JeoungChill Shim, Hiroyuki Kurino, Mitsumasa Koyanagi
- Journal Title
  
  IEICE Transactions on Communications E87-B
  
  Pages: 406-412
- NAID
  110003222242
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Wafer Level Three Dimensional LSI Technology2004
- Author(s)
  Hiroyuki Kurino, Mitsumasa Koyanagi
- Journal Title
  
  Proceedings Twenty First International VLSI Multilevel Interconnection Conference
  
  Pages: 98-104
- Data Source
  KAKENHI-PROJECT-14205051
[Journal Article] Novel Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistors with Buried Back Gate2004
- Author(s)
  Hyuckjae Oh, Hoon Choi, Hiroyuki Kurino, Mitsumasa Koyanagi, et al.
- Journal Title
  
  Japanese Journal of Applied Physics 43
  
  Pages: 2140-2144
- NAID
  10012949608
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Three-Dimensionally Stacked Analog Retinal Prosthesis Chips2004
- Author(s)
  Jun Deguchi, Taiichiro Watanabe, Hiroyuki Kurino, Mitsumasa koyanagi, et al.
- Journal Title
  
  Japan Journal of Applied Physics(JJAP) 43・4B
  
  Pages: 1685-1689
- NAID
  10012948279
- Data Source
  KAKENHI-PROJECT-14205051
[Journal Article] Technology for Three Dimensional Integrated System-on-a-Chip2004
- Author(s)
  Hiroyuki Kurino, Mitsumasa Koyanagi
- Journal Title
  
  Proceedings of 7^<th> International Conference on Solid-State and Integrated Circuits Technology
  
  Pages: 599-602
- Data Source
  KAKENHI-PROJECT-15106006
[Journal Article] Vision Chip with Electrical Fovea Motion2004
- Author(s)
  Yoshihiro Nakagawa, Jun Deguchi, Hiroyuki Kurino, Mitsumasa Koyanagi, et al.
- Journal Title
  
  Japan Journal of Applied Physics(JJAP) 43・4B
  
  Pages: 1680-1684
- NAID
  10012948257
- Data Source
  KAKENHI-PROJECT-14205051
[Journal Article] Technology for Three Dimensional Integrated System-on-a-Chip2004
- Author(s)
  Hiroyuki Kurino, Mitsumasa Koyanagi
- Journal Title
  
  Proceedings of 7^<th> International Conference on Solid-State and Integrated Circuits Technology
  
  Pages: 599-602
- Data Source
  KAKENHI-PROJECT-14205051
[Journal Article] Ultimate Function Multi-Electrode System(UFMES) Based on Multi-Chip Bonding Technique2004
- Author(s)
  Taiichiro Watanabe, Hiroyuki Kurino, Mitsumasa Koyanagi, et al.
- Journal Title
  
  Extended Abstracts of the 2004 International Conference on Solid State Devices and Materials
  
  Pages: 380-381
- NAID
  10022538809
- Data Source
  KAKENHI-PROJECT-14205051
[Patent] 半導体装置2014
- Inventor(s)
  鈴木拓、北村康宏、浅見一志、小柳光正、福島誉史、李康旭
- Industrial Property Rights Holder
  東北大学、(株)デンソー
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-053473
- Filing Date
  2014-03-17
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] 半導体装置2014
- Inventor(s)
  鈴木拓、北村康宏、浅見一志、小柳光正、福島誉史、李康旭
- Industrial Property Rights Holder
  東北大学、㈱デンソー
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-053473
- Filing Date
  2014-03-17
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] 自己組織化機能を用いた三次元集積回路の製造方法及び製造装置2009
- Inventor(s)
  小柳光正, 福島誉史, 杉山雅彦
- Industrial Property Rights Holder
  東北大学, 東京エレクトロン
- Industrial Property Number
  2009-095241
- Filing Date
  2009-04-06
- Data Source
  KAKENHI-PROJECT-19686022
[Patent] 一括保持トレイ及び三次元集積回路製造装2009
- Inventor(s)
  小柳光正、福島誉史、杉山雅彦
- Industrial Property Rights Holder
  東京エレクトロン株式会社
- Industrial Property Number
  2009-095241
- Filing Date
  2009-04-06
- Data Source
  KAKENHI-PROJECT-19686022
[Patent] 自己組織化機能を用いた三次元集積回路の製造方法2009
- Inventor(s)
  小柳光正, 福島誉史, 杉山雅彦
- Industrial Property Rights Holder
  東北大学, 東京エレクトロン
- Industrial Property Number
  2009-070769
- Filing Date
  2009-03-23
- Data Source
  KAKENHI-PROJECT-19686022
[Patent] 三次元積層構造を持つ集積回路装置の製造方法2005
- Inventor(s)
  小柳光正
- Industrial Property Rights Holder
  株式会社ザイキューブ
- Industrial Property Number
  2005-259824
- Filing Date
  2005-09-07
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Patent] 三次元積層構造を持つ半導体装置の製造方法2004
- Inventor(s)
  小柳光正
- Industrial Property Rights Holder
  株式会社ザイキューブ
- Industrial Property Number
  2004-240944
- Filing Date
  2004-08-20
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Patent] 三次元積層構造を持つ半導体装置及びその製造方法2004
- Inventor(s)
  小柳光正
- Industrial Property Rights Holder
  株式会社ザイキューブ
- Industrial Property Number
  2004-166821
- Filing Date
  2004-06-04
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Temporary Bonding and De-bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si2017
- Author(s)
  M. Murugesan, T. Fukushima and M. Koyanagi
- Organizer
  2017 IEEE 67th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel 3D/2.5D Heterogeneous Integration Technologies for IoT and AI2017
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  International Conference on Advanced Materials (IUMRS-ICA2017)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] New 2.5/3D Assembly Based on Micro-scale Assembly2017
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  3D Architectures for High Density Integration and Packaging (3D-ASIP2017)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Heterogeneous 3D/2.5D Integration toward IoT and AI era, Mitsumasa Koyanagi, Tohoku University2017
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  Symposium on VLSI Technology (Short Course)
- Invited
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Temporary Bonding and De-bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si2017
- Author(s)
  M. Murugesan, T. Fukushima and M. Koyanagi
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Directed Self-Assembly Patterning for 3D LSI2017
- Author(s)
  T. Fukushimaand M. Koyanagi
- Organizer
  INC 2017 Workshop
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Challenges and Benefits of 3D Stacked IC Packages2017
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  Cooling Technology Workshop (CTW2017)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] New Multichip-to-Wafer 3D Integration Technology Using Self-Assembly and Cu Nano-Pillar Hybrid Bonding2016
- Author(s)
  M. Koyanagi, K.W. Lee, T. Fukushima, and T. Tanaka
- Organizer
  IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2016)
- Place of Presentation
  Hangzhou, China
- Year and Date
  2016-10-25
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration2016
- Author(s)
  Kangwook Lee, Chisato Nagai, Jichel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Suresh Ramalingam and Xin Wu
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications2016
- Author(s)
  Kangwook. Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra- fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration2016
- Author(s)
  K.W. Lee, C.Nagai, J.C. Bea, T. Fukushima, R. Suresh, and X. Wu, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Influence of Cu-TSVs, CuSn-and PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, and Tetsu Tanaka
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価2016
- Author(s)
  菅原陽平、木野久志、福島誉史、李康旭、小柳光正、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  T. Fukushima, H. Hashiguchi, H. Kino, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique2016
- Author(s)
  Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  2016 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan
- Year and Date
  2016-09-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2016 IEEE International Reliability Physics Symposium(IRPS 2016)
- Place of Presentation
  Pasadena Convention Center, Pasadena, USA
- Year and Date
  2016-04-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価2015
- Author(s)
  菅原　陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Consideration of Microbump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Activated Chip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Transfer and Non-transfer Stacking Technologies Based on Chip-to-wafer Self-assembly for High-throughput and High-precision Alignment and Microbump Bonding2015
- Author(s)
  Takafumi FUKUSHIMA, Taku SUZUKI, Hideto HASHIGUCHI, Chisato NAGAI, Jichoel BEA, Hiroyuki HASHIMOTO, Mariappan MURUGESAN, Kang-Wook LEE, Tetsu TANAKA, Kazushi ASAMI, Yasuhiro KITAMURA, and Mitsumasa KOYANAGI
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Mitigating Thermo Mechanical Stress in High-density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via micro-RS and micro-XRD Study2015
- Author(s)
  M. Murugesan, J.C. Bea, H. Hashimoto, K.W. Lee, and M. Koyanagi, T. Fukushima, and T. Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D LSI and Nanotehnology for IOT2015
- Author(s)
  M. Koyanagi
- Organizer
  International Nanotechnology Conference on Communication and Cooperation (INC11)
- Place of Presentation
  ヒルトン福岡 (福岡県・福岡市)
- Year and Date
  2015-05-11
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration2015
- Author(s)
  K-W. Lee, J-C Bea, T. Fukushima, S. Ramalingam, X. Wu, T. Tanaka, M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington D.C., USA
- Year and Date
  2015-12-07
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array2015
- Author(s)
  Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors2015
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究2015
- Author(s)
  木野久志, 橋口日出登, 谷川星野, 菅原陽平, 池ヶ谷俊介, 福島誉史, 小柳光正, 田中徹
- Organizer
  第25回マイクロエレクトロニクスシンポジウム MES2015
- Place of Presentation
  大阪大学吹田キャンパス、大阪府、吹田市
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価2015
- Author(s)
  谷川星野、木野久志、福島誉史、小柳光正、田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D Hetero-integration Technology for Innovative Convergence Systems2015
- Author(s)
  Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  IEEE EDAPS (Electrical Design of Advanced Packaging & Systems) Symposium 2015
- Place of Presentation
  Seoul, Korea
- Year and Date
  2015-12-14
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Reconfigured Multichip-on-wafer (mCoW) Cu/oxide Hybrid Bonding Technology for Ultra-high Density 3D Integration Using Recessed Oxide, Thin Glue Adhesive, and Thin Metal Capping Layers2015
- Author(s)
  Kangwook Lee, Chisato Nagai, Ai Nakamura, H. Aizawa, H. Hashiguchi, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向2015
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第32回「センサ・マイクロマシンと応用システム」シンポジウム
- Place of Presentation
  朱鷺メッセ　新潟コンベンションセンター、新潟県、新潟市
- Year and Date
  2015-10-28
- Invited
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D-LSI System Module for Future Automatic Driving Vehicle Fabricated by Heterogeneous 3D Integration Technology2015
- Author(s)
  M. Koyanagi
- Organizer
  CMOS Emerging Technology Symp. (CMOSETR 2015)
- Place of Presentation
  Vancouver, Canada
- Year and Date
  2015-05-21
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV2015
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications2015
- Author(s)
  Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, and Kang-Wook Lee
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Development of Highly-Reliable　Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges2015
- Author(s)
  Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3次元リコンフィギャラブルLSIによる並列情報処理技術2015
- Author(s)
  小柳光正
- Organizer
  電子情報通信学会ソサイエティ大会
- Place of Presentation
  東北大学(宮城県・仙台市)
- Year and Date
  2015-09-10
- Invited
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 三次元集積化におけるTSV作製プロセスがトランジスタ特性に及ぼす影響評価2014
- Author(s)
  菅原陽平, 谷川星野, 橋口日出登, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  平成26年電気学会全国大会
- Place of Presentation
  愛媛大学（松山）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System2013
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2013
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元集積化による超低消費電力化2013
- Author(s)
  小柳光正
- Organizer
  第29回京都賞記念ワークショップ先端術部門
- Place of Presentation
  京都
- Year and Date
  2013-11-12
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元LSI とヘテロインテグレーション2013
- Author(s)
  李康旭, 福島誉史, 田中徹, 小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京工業大学, Japan
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013
- Author(s)
  木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス（京田辺）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding2013
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center（大阪）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  63rd Electronic Components and Technology Conference 2013
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSIとヘテロインテグレーション2013
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor2013
- Author(s)
  K.Kiyoyama, Y.Sato, H.Hashimoto, K-W Lee, T.Fukushima, T.Tanaka, and M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2013
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T. Fukushima, K-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE Electrical Components Technology Conference (ECTC)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Heterogeneous 3D Integration-Technology Enabler toward Future Super-Chip (Plenary Talk)2013
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE International Electron Devices Meeting 2013 (IEDM)
- Place of Presentation
  アメリカ、ワシントンD.C.
- Year and Date
  2013-12-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013
- Author(s)
  H. Kino, T. Fukushima, K. -W. Lee, M. Koyanagi, T. Tanaka
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk（福岡）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A. Noriki, K. W. Lee, J. Bea, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Year and Date
  2012-09-26
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国
- Year and Date
  2012-04-12
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High Density Cu-TSVs and Reliability Issues2012
- Author(s)
  M.Murugesan, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
- Organizer
  the Electro Chemical Society (ESC) Meeting
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A.Noriki, K.W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High-Bandwidth Data Transmission of New Transceiver Module Through Optical Interconnection2012
- Author(s)
  Y.Ito, S.Terada, S.Arai, K.Choki, T.Fukushima, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C Bea, T. Tanaka, and M. Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] W/Cu TSVs for 3D-LSI with Minimum Thermo-Mechanical Stress2012
- Author(s)
  M.Murugesan, H.Hashiguchi, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Novel Detachable Bonding Process with Wettability Control of Bonding Surface for Versatile Chip-Level 3D Integration2012
- Author(s)
  Y.Ohara, K.-W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  東京
- Year and Date
  2012-10-23
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] A Very Low Area ADC for 3-D Stacked CMOS Image Processing System2012
- Author(s)
  K.Kiyoyama, K.W.Lee, T.Fukushima, H.Naganuma, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  第25回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  横浜国立大学
- Year and Date
  2011-03-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011
- Author(s)
  T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  第61回Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Florida, USA
- Year and Date
  2011-06-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of 5 μm Diameter Backside Cu TSV Technology for 3D LSI2011
- Author(s)
  Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Conference on Electronics Packaging 2011 (ICEP2011)
- Place of Presentation
  Nara, Japan
- Year and Date
  2011-04-14
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] シリコン貫通光配線を用いた三次元光電子集積化技術2011
- Author(s)
  乗木暁博, 李康旭, 裴志哲, 福島誉史, 田中徹, 小柳光正
- Organizer
  J PCA Show 2011/ラージエレクトロニクスショー2011/2011マイクロエレクトロニクスショー/JISSO PROTEC2011
- Place of Presentation
  東京
- Year and Date
  2011-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  電子通信学会エレクトロニクスソサイエティ大会
- Place of Presentation
  札幌(特別講演)
- Year and Date
  2011-09-14
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D LSI Technology and Reliability Issues2011
- Author(s)
  T.Tanaka, J.Bea, M.Murugesan, K.Lee, T.Fukushima, M.Koyanagi
- Organizer
  2011 Symposium on VLSI Technology
- Place of Presentation
  Kyoto, Japan(招待)
- Year and Date
  2011-06-16
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer2011
- Author(s)
  M.Murugesan, H.Nohira, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid state Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Performance of Low-Loss and Low-Cost Optoelectronic Module with Polynorbornene Waveguide for 10-Gbps Data Transmission2011
- Author(s)
  Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials
- Place of Presentation
  Nagoya
- Year and Date
  2011-09-28
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis2011
- Author(s)
  Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  台湾
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA) 12^<th> International Conference in Asia
- Place of Presentation
  Taipei, Taiwan(招待講演)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術2011
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 高集積微細デバイスにおける今後の信号伝達/配線技術:シリコン貫通光インターコネクション(TSPV)を用いた光電子三次元2011
- Author(s)
  福島誉史, 乗木暁博, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI2011
- Author(s)
  H.Kino, M.Murugesan, K.-W.Lee, J.-C.Bea, C.Miyazaki, H.Kobayashi, H.Shimamoto, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Efficient Unidirectional Optical Coupler for Through Silicon Photonic Via in Optoelectronic 3D-LSI2011
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials
- Place of Presentation
  Nagoya
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIに用いるシリコン貫通光配線のFDTD解析2011
- Author(s)
  乗木暁博, 李康旭, Jichoel Bea, 福島誉史, 田中徹, 小柳光正
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学
- Year and Date
  2011-09-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光・電気刺激に対する網膜応答記録用フレキシブルケーブル電極の作製2011
- Author(s)
  木暮爾, 渡辺慶朋, 笹木悠一郎, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs2011
- Author(s)
  H.Hashiguchi, M.Murugesan, J.C.Bea, K.W.Lee, T.Fukushima, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 電極間クロストークを抑制した人工網膜用ピラー型刺激電極アレイの開発2011
- Author(s)
  渡辺慶朋, 木暮爾, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Density 3D LSI Technology using W/Cu Hybrid TSVs2011
- Author(s)
  M.Murugesan, H.Kino, A.Hashiguchi, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM2011)
- Place of Presentation
  WashingtonD.C, USA
- Year and Date
  2011-12-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  センサ・マイクロマシンと応用システムシンポジウム
- Place of Presentation
  東京(招待講演)
- Year and Date
  2011-09-26
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元積層時の局所応力がMOSFETの特性に与える影響2011
- Author(s)
  木野久志, Murugesan Mariappan, Jichel Bea, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-09-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011
- Author(s)
  Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop ICRA (IEEE Int.Conf.on Robotics and Automation) 2011 MEMS assembly and packaging : trends and challenges for robotics in the microscale
- Place of Presentation
  Shanghai, China(招待講演)
- Year and Date
  2011-05-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  Taipei (Taiwan)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM)第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] バッチ式Die-to-Wafer三次元集積化技術2010
- Author(s)
  福島誉史、李康旭、小柳光正
- Organizer
  関西ワークショップ2010
- Place of Presentation
  京都(招待講演)
- Year and Date
  2010-07-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  K.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  218th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Las Vegas, USA(招待講演)
- Year and Date
  2010-10-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society(EDS)Japan Chapter 総会・2009 International Electron Devices Meeting(IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration2010
- Author(s)
  Eiji Iwata, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A. Noriki, K.-W. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010(3DIC)
- Place of Presentation
  ドイツ, ミュンヘン
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010
- Author(s)
  T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D-LSI/TSVの技術動向と新領域への展開2010
- Author(s)
  田中徹, 福島誉史, 李康旭, 小柳光正
- Organizer
  Semi Forum Japan 2010 TSV/3次元実装セミナー
- Place of Presentation
  グランキューブ大阪(招待講演)
- Year and Date
  2010-06-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technology and 3D System-on-a Chip2010
- Author(s)
  M.Koyanagi
- Organizer
  International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  Tokyo(招待講演)
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] ファインピッチ金属マイクロバンプを有するチップの自己組織化積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  第71回応用物理学会学術講演会
- Place of Presentation
  長崎大学(長崎)
- Year and Date
  2010-09-15
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3-D Integration Technology and 3-D LSIs2010
- Author(s)
  M.Koyanagi
- Organizer
  IEEE International Conf.on IC Design and Technology (ICICDT)
- Place of Presentation
  Grenoble, France(招待講演)
- Year and Date
  2010-06-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society (EDS) Japan Chapter総会・2009 International Electron Devices Meeting (IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A.Noriki, K.-W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration2010
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2010-01-20
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM) 第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI2010
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding2010
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  IEEE Custom Integrated Circuits Conference (CICC)
- Place of Presentation
  San Jose, USA(招待講演)
- Year and Date
  2010-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 東北大学における三次元積層技術とヘテロインテグレーション2010
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  JPCA Show 2010 (pp.99-104)
- Place of Presentation
  アカデミックプラザ,東京ビッグサイト(招待講演)
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration2010
- Author(s)
  T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 金属マイクロバンプ接合を介した自己組織化チップ積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第57回応用物理学関係連合講演会
- Place of Presentation
  平塚
- Year and Date
  2010-03-19
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Super Chip Technology Achieving Hetero-Integration2010
- Author(s)
  小柳光正
- Organizer
  SEMICON Japan 2010
- Place of Presentation
  幕張メッセ(招待講演)
- Year and Date
  2010-12-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2009 (3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Thin-Film Devices and Three-Dimensional Systems(Invited)2009
- Author(s)
  小柳光正
- Organizer
  Active Matrix-Flat Panel Display(AM-FPD)
- Place of Presentation
  奈良
- Year and Date
  2009-07-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M. Murugesan, J.C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W.C. Jeong, H. Kino, A. Noriki, K.W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference (ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Super-Hetero Integration Technology Using Self-Assembly(Invited)2009
- Author(s)
  小柳光正
- Organizer
  International Conference on Planarization/CMP Technology 2009(ICPT2009)
- Place of Presentation
  福岡
- Year and Date
  2009-11-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technology and 3D Integrated Systems(Invited)2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Optoelectronic Multichip Module with Optical Interconnection(Invited)2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  12th IEEE International Symposium on Microwave and Optical Technology(ISMOT-2009)
- Place of Presentation
  Indiaニューデリー
- Year and Date
  2009-12-18
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 異種デバイスの融合を目指すスーパー・ヘテロインテグレーション技術2009
- Author(s)
  小柳光正
- Organizer
  浜松ホトニクス第21回半導体ワークショップ
- Place of Presentation
  浜松
- Year and Date
  2009-06-04
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  T. Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society (ECS) Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Super Chip Integration Technology for Three-Dimensionally Stacked Retinal Prosthesis Chips2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Smart System Integration Conference 2009
- Place of Presentation
  ブリュッセル(ベルギー)
- Year and Date
  2009-03-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  M. Koyanagi, T. Fukushima, T. Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3次元LSI技術を使ったイメージセンサ技術の課題、動向(招待講演)2009
- Author(s)
  小柳光正, 元吉真
- Organizer
  SEMIテクノロジーシンポジウム(STS)
- Place of Presentation
  幕張
- Year and Date
  2009-12-04
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Integration Technology to Achieve Super Chip2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  SEMICON Korea
- Place of Presentation
  ソウル(韓国)
- Year and Date
  2009-01-21
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリー伝を用いた新しいヘテロインテグレーション技術(VLSI特集)(招待講演)2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会
- Place of Presentation
  東京
- Year and Date
  2009-07-21
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Integration Technology Using Self-Assembly Technique(Invited)2009
- Author(s)
  小柳光正
- Organizer
  International Symposium on Dry Process(DPS)
- Place of Presentation
  Korea釜山
- Year and Date
  2009-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE International 3D System Integration Conference 2009(3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Development of a New Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Tanafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Proc.of IEEE International 3D System Integration Conference(3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M.Murugesan, J.C.Bea, T.Fukushima, T.Konno, K.Kiyoyama, W.C.Jeong, H.Kino, A.Noriki, K.W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference(ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2009 IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  ボルチモア(USA)
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon(SOS)2009
- Author(s)
  K-W Lee, A.Noriki, K.Kiyoyama, S.Kanno, R.Kobayashi, W-C Jeong, J-C Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology(Invited)2009
- Author(s)
  Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  Vienna, Austria
- Year and Date
  2009-10-06
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 自己組織化による三次元LSIチップの高精度位置合わせ技術2009
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第70回応用物理学会学術講演会
- Place of Presentation
  富山
- Year and Date
  2009-09-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New 3D Integration Technology and 3D System LSIs(Invited)2009
- Author(s)
  小柳光正
- Organizer
  Symposium on VLSI Technology
- Place of Presentation
  京都
- Year and Date
  2009-06-15
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module2009
- Author(s)
  A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K. -W. Lee, J. -C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  2009 International Conference on Solid State Devices and Materials
- Place of Presentation
  仙台
- Year and Date
  2009-10-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会多層配線システム研究委員会(共催:電子情報通信学会、シリコン材料・デバイス研究会(SDM)
- Place of Presentation
  東京
- Year and Date
  2008-02-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly for Heterogeneous Integration with Lateral Interconnections Extending over MEMS and LSI Chips2008
- Author(s)
  Takayuki Konno, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリーを用いた3次元集積化技術2008
- Author(s)
  福島誉史, 小柳光正
- Organizer
  九州学術研究都市第8回産学連携フェア
- Place of Presentation
  小倉
- Year and Date
  2008-10-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] MEMS-半導体横方向配線技術I:フレキシブル基板へのLSIチップのセルフアセンブリ2008
- Author(s)
  福島誉史, 今野隆行, 田中徹, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会
- Place of Presentation
  船橋
- Year and Date
  2008-03-28
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D System Integration Technology and 3D Systems2008
- Author(s)
  T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  Materials for Advanced Metallization Conference 2008 (MAM 2008)
- Place of Presentation
  Dresden(Germany)
- Year and Date
  2008-03-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Chip Self-Assembly Technique for 3D LSI Fabrication2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  3D System Integration Technology Conference (3D-SIC) 2008
- Place of Presentation
  東京
- Year and Date
  2008-05-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  サンフランシスコ(米国)
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] A New Nano-System with Three-Dimensional Structure for Real Time Parallel Image Processing2008
- Author(s)
  T. Fukushima, M. Koyanagi
- Organizer
  the 5th International Conference on Mechanical Science based on Nanotechnology
- Place of Presentation
  Sendai
- Year and Date
  2008-03-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Multichip Self-Assembly Technique on Flexible Polymeric Substrate2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  The 59th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  フロリダ(米国)
- Year and Date
  2008-05-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Tapered Through-Si Via Formation for Optical Interposer with 3D ICs and Buried Vertical-Cavity Surface-Emitting Laser / Photo Diode Chips2008
- Author(s)
  Makoto Fujiwara, Akihiro Noriki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 Materials Research Society (MRS) Fall Meeting
- Place of Presentation
  ボストン(米国)
- Year and Date
  2008-12-01
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] キャビティ構造を有するMEMSチップのセルフアセンブリ2008
- Author(s)
  今野隆行, 小林吏悟, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 三次元LSIを搭載した光インターポーザのためのテーパTSVの形成2008
- Author(s)
  乗木暁博, 藤原誠, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D system integration technology and 3D systems2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Advanced Metallization Conference (AMC) 2008
- Place of Presentation
  サンディエゴ(米国)
- Year and Date
  2008-09-23
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Three-Dimensional Integration Technologies Based on Wafer-to-Wafer and Chip-to-Wafer Bonding Methods2007
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  IEEE International Solid State Circuits Conference (ISSCC) Forum
- Place of Presentation
  San Francisco, USA,
- Year and Date
  2007-02-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Three-Dimensional Super-Chip Integration Technology Using a New Self Assembly Technique2007
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  IEEE 3D System Integration Workshop
- Place of Presentation
  Munich, Germany
- Year and Date
  2007-10-01
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] 3次元実装技術2007
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  エレクトロニクス実装学会/材料技術委員会公開研究会「次世代インテリジェント実装材料」
- Place of Presentation
  東京
- Year and Date
  2007-11-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo
- Year and Date
  2007-11-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Super-Chip Integration Technology Using a New Self Assembly Technique2007
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE "3D System Integration" Workshop
- Place of Presentation
  Munich, Germany
- Year and Date
  2007-10-01
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany (USA)
- Year and Date
  2007-10-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Three-Dimensional Integration Technologies Based on Wafer-to-Wafer and Chip-to-Wafer Bonding Methods2007
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  IEEE International Solid State Circuits Conference (ISSCC) Forum
- Place of Presentation
  San Francisco, USA
- Year and Date
  2007-02-11
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
- Organizer
  57th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Reno (USA)
- Year and Date
  2007-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi. Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington DC(USA)
- Year and Date
  2007-12-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New three-dimensional integration technology to achieve a super chip2006
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  International Conference on Solid-State and Integrated-Circuit Technology ICSIT-2006
- Place of Presentation
  Shanghai, China
- Year and Date
  2006-10-24
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New three-dimensional integration technology to achieve a super chip2006
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  International Conference on Solid-State and Integrated-Circuit Technology ICSIST-2006
- Place of Presentation
  Shanghai, China
- Year and Date
  2006-10-24
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] A New Super Smart Stack Technology for 3D LSIs2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  3D Architectures for Semiconductor Integration and Packaging
- Place of Presentation
  Arizona, USA
- Year and Date
  2005-09-15
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] A New Smart-Stack Technology for Three-Dimensional LSI2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  Advanced Metallization Conference 2005
- Place of Presentation
  Tokyo, University of Tokyo
- Year and Date
  2005-10-13
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] A New Smart Stacking Technology for 3D-LSIs2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  the International Symposium on Microelectronics and Packaging <ISMP 2005>
- Place of Presentation
  Seoul, Korea
- Year and Date
  2005-09-28
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] A New Smart-Stack Technology for Three-Dimensional LSI2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  Advanced Metallization Conference 2005
- Place of Presentation
  Tokyo, Univ. of Tokyo
- Year and Date
  2005-10-13
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Different Approaches to 3D Chips2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  Stanford University Seminar
- Place of Presentation
  San Francisco, USA
- Year and Date
  2005-05-09
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] A New Smart Stacking Technology for 3D-LSIs2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  The International Symposium on Microelectronics and Packaging (ISMP 2005)
- Place of Presentation
  Seoul, Korea
- Year and Date
  2005-09-28
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Three Dimensional Integration2005
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  Stanford University CIS AdCom Meeting
- Place of Presentation
  San Francisco, USA
- Year and Date
  2005-05-10
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New devices for communication system in Si chips2004
- Author(s)
  Mitsumas, Koyanagi
- Organizer
  International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium
- Place of Presentation
  Hawaii, USA
- Year and Date
  2004-11-23
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Technology for Three Dimensional Integrated System-on-a Chip2004
- Author(s)
  Hiroyuki, Kurino and Mitsumasa Koyanagi
- Organizer
  Proceedings of International Conference on Solid-State and Integrated Circuits Technology (ICSECT)
- Place of Presentation
  Beijing, China
- Year and Date
  2004-10-21
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Wafer Level Three Dimensional LSI Technology2004
- Author(s)
  Hiroyuki, Kurino and Mitsumasa Koyanagi
- Organizer
  Proceedings International VLSI Multilevel Interconnection Conference (VMIC)
- Place of Presentation
  Hawaii, USA
- Year and Date
  2004-09-30
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] New devices for communication system in Si chips2004
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium)
- Place of Presentation
  Hawaii, USA
- Year and Date
  2004-11-23
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Technology for Three Dimensional Integrated System-on-a Chip2004
- Author(s)
  Hiroyuki, Kurino and Mitsumasa Koyanagi
- Organizer
  Proceedings of International Conference on Solid-State and Integrated Circuits Technology (ICSICT)
- Place of Presentation
  Beijing, China
- Year and Date
  2004-10-21
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Three-Dimensional Integration Technology by Wafer-to-Wafer and Chip-to-Wafer Stacking Chip2003
- Author(s)
  Mitsumasa, Koyanagi
- Organizer
  3D System Integration Workshop
- Place of Presentation
  Munich, Germany
- Year and Date
  2003-12-15
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] 三次元ヘテロ集積化技術とスーパーチップ
- Author(s)
  小柳光正,福島誉史,李康旭,田中徹
- Organizer
  スマートプロセス学会電子デバイス実装研究委員会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology, The IEEE International Conference on 3D System Integration (3D IC)
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, H.-Y. Son, M.-S. Suh, K.-Y.Byun, N.-S. Kim, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International Conference on 3D System Integration (3D IC)
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Tiny VCSEL Chip Self-Assembly for Advanced　Chip-to-Wafer 3D and Hetero Integration
- Author(s)
  Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 光電子集積三次元LSIのための高効率光カップラの検討
- Author(s)
  乗木暁博，李康旭，裵志哲, 福島誉史，田中徹，小柳光正
- Organizer
  2012年第73回応用物理学会秋季学術講演会
- Place of Presentation
  愛媛大学・松山大学（愛媛）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Heterogeneous 3D Integration - Technology Enabler toward Future Super-Chip (Plenary Talk)
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2013
- Place of Presentation
  Washington D.C., USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Characterization and Reliability of 3-D LSI and SiP
- Author(s)
  K-W Lee, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2013
- Place of Presentation
  Washington D.C., USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価
- Author(s)
  菅原陽平，橋口日出登，谷川星野，木野久志，福島誉史，李康旭，小柳光正，田中徹
- Organizer
  第75回応用物理学会秋季学術講演会
- Place of Presentation
  北海道大学札幌キャンパス、北海道、札幌市
- Year and Date
  2014-09-17 – 2014-09-20
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 自己組織化による三次元集積化技術
- Author(s)
  小柳光正
- Organizer
  自然から学ぶナノテクノロジーセミナー (物質・材料研究機構)
- Place of Presentation
  筑波
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  San Francisco, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
- Author(s)
  Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
- Author(s)
  Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Heterogeneous System Integration and New 3D LSIs
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE Symposium on VLSI Circuits Workshop
- Place of Presentation
  Kyoto
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration and Reliability Challenges
- Author(s)
  Mitsumasa Koyanagi, Mariappan Murugesan, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  224th Electrochemical Society (ECS) Meeting
- Place of Presentation
  San Francisco, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration
- Author(s)
  H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
- Place of Presentation
  The University of Tokyo, Hongo, Tokyo, Japan
- Year and Date
  2014-07-15 – 2014-07-16
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIのための高効率光カップラの作製(Fabrication of Unidirectional Optical Coupler for Opto-Electronic 3-D LSI)
- Author(s)
  乗木暁博，李康旭，裵志哲，福島誉史，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly
- Author(s)
  H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K..-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  International Conference on Solid State Devices and Materials (SSDM2014)
- Place of Presentation
  Tsukuba International Congress Center EPOCHAL TSUKUBA, Tsukuba, Ibaraki, Japan
- Year and Date
  2014-09-08 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層
- Author(s)
  橋口日出登，福島誉史，裵　志哲，Murugesan Mariappan，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 自己組織化静電仮接合を用いたC2W三次元集積化技術(Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding)
- Author(s)
  橋口日出登，福島誉史，裵志哲，Mariappan Murugesan，木野久志，李康旭，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Jicheol Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 62nd Electronic Components and Technology Conference
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D System Module with Stacked Image Sensors, Stacked Memories and Stacked Processors on a Si Interposer
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE Solid-State Circuits Conference (ISSCC) 2014, 3D-Forum
- Place of Presentation
  San Francisco, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Heterogeneous 3D Integration Technology and New 3D LSIs
- Author(s)
  M. Koyanagi, K-W Lee, T. Fukushima and T. Tanaka
- Organizer
  IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2012)
- Place of Presentation
  Xi’an, China
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] C2W三次元集積のための自己組織化静電仮接合の評価
- Author(s)
  橋口日出登, 福島誉史, 裵志哲, 木野久志, 李康旭, 田中徹, 小柳光正
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  Seoul, Korea
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques
- Author(s)
  Takafumi Fukushima, Kang Wook Lee, Jicheol Bea, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Honolulu, Hawaii, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K.-W. Lee, T.Tanaka, and M. Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Effects of Electro-less Ni Layer as Barrier/Seed　Layers for High Reliable and Low Cost Cu TSV1
- Author(s)
  K.W. Lee, C. Nagai, A. Nakamura, J.C. Bea, M. Murugesan, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Hetero-Integration Technology for Innovative Convergence Systems
- Author(s)
  K-W. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  Electronics Packaging Symposium
- Place of Presentation
  Binghamton, NY, USA
- Year and Date
  2014-10-08 – 2014-10-09
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Challenges in 3D Integration
- Author(s)
  Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  223th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Toronto, Canada,
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSIとヘテロインテグレーション
- Author(s)
  李康旭,福島誉史,田中徹,小柳光正
- Organizer
  半導体・集積路技術シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
- Organizer
  IEEE International Conference on 3D System Integration (3D IC)
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly-Based 3D Integration Technologies
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京大学（東京）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響
- Author(s)
  木野久志、池ヶ谷俊介、小柳光正、田中徹
- Organizer
  第62回応用物理学会春季学術講演会 S-16シンポジウム
- Place of Presentation
  東海大学湘南キャンパス、神奈川県、平塚市
- Year and Date
  2015-03-11 – 2015-03-14
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ
- Author(s)
  伊藤有香，福島誉史，Murugesan Mariappan，裵　志哲，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3DIC Activity at Tohoku University
- Author(s)
  Mitsumasa Koyanagi
- Organizer
  IEEE International Conference on 3D System Integration (3D IC)
- Place of Presentation
  San Francisco, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
- Author(s)
  H. Hashiguchi, T. Fukushima, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 International Conference on Electronics Packaging (ICEP2014)
- Place of Presentation
  Toyama International Convention Center, Toyama, Toyama, Japan
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元集積化による超低消費電力化
- Author(s)
  小柳光正
- Organizer
  第29回京都賞記念ワークショップ先端技術部門
- Place of Presentation
  京都国際会館
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of 3D Integration Technologies and Recent Challenges
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012: 22nd Asian　Session
- Place of Presentation
  東京大学（東京）
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
- Author(s)
  H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060

1. KURINO Hiroyuki (70282093)

# of Collaborated Projects: 9 results

# of Collaborated Products: 16 results
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44. 熊谷慎也 (70333888)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
45. 佐藤まなみ (80375211)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
46. 杉山直治

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
47. 小野昭一

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
48. FLYNN Michae

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
49. 洪連基

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
50. HONG Young-gi

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Koyanagi Mitsumasa 小柳 光正

小柳 光正 コヤナギ ミツマサ

KOYANAGI Mitsumasa 小柳 光正

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Stereo-Vision Image Sensor LSI Fabricated by 3D Heterogeneous Integration TechnologyPrincipal Investigator

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Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-AssemblyPrincipal Investigator

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High Performance Parallel Processor System Using Three-Dimensional Processor ChipPrincipal Investigator

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超機能化ヒューマン・インターフェース画像処理・ワイヤレス情報端末チップ創製Principal Investigator

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Wafer-Scale Dynamic Neural-Network-System with Optical WaveguidePrincipal Investigator

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Koyanagi Mitsumasa 小柳光正

小柳光正コヤナギミツマサ

KOYANAGI Mitsumasa 小柳光正