Tanaka Tetsu 田中徹

… Alternative Names

TANAKA Tetsu 田中徹

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Researcher Number	40417382
Other IDs	https://orcid.org/0000-0001-7414-315X
Affiliation (Current)	2025: 東北大学, 医工学研究科, 教授
Affiliation (based on the past Project Information) *help	2011 – 2024: 東北大学, 医工学研究科, 教授 2017: 東北大学, 大学院医工学研究科, 教授 2014 – 2015: 東北大学大学院, 医工学研究科, 教授 2011 – 2015: 東北大学, 大学院医工学研究科, 教授 2014: 東北大学, その他の研究科, 教授 … More 2013: 東北大学, 大学院・医工学研究科, 教授 2012: 東北大学, 大学院・医工学研究所, 教授 2008 – 2011: Tohoku University, 大学院・医工学研究科, 教授 2007: Tohoku University, Graduate School of Engineering, Associate Professor 2006: 東北大学, 大学院工学研究科, 助教授 Less
Review Section/Research Field	Principal Investigator Electron device/Electronic equipment / Medium-sized Section 90:Biomedical engineering and related fields / Medium-sized Section 21:Electrical and electronic engineering and related fields / Medium-sized Section 28:Nano/micro science and related fields / Medical systems / Science and Engineering Except Principal Investigator Electron device/Electronic equipment / Basic Section 21060:Electron device and electronic equipment-related / Medium-sized Section 90:Biomedical engineering and related fields / Medium-sized Section 56:Surgery related to the biological and sensory functions and related fields … More / Medium-sized Section 21:Electrical and electronic engineering and related fields / Engineering / Science and Engineering / Ophthalmology / Otorhinolaryngology Less
Keywords	Principal Investigator 三次元集積回路 / 人工網膜 / 医用システム / 生体医工学 / 人工視覚 / 生体適合性 / 半導体物性 / 半導体超微細化 / チップレット / 光無線神経プローブ … More / 光神経プローブ / オプトジェネティクス / アップコンバージョンナノ粒子 / アップコンバージョン / 光遺伝学 / 神経プローブ / 透明電極 / FOWLP / 人間医工学 / 高次視覚処理 / 3次元集積回路 / 半導体神経工学 / 視覚情報処理 / Charge Injection Capacity / Cyclic Voltammetry / EEP / 埋め込み術式 / ラプラシアンフィルタ / 低消費電力 / 医用マイクロ・ナノシステム / 雷子デバイス / 超薄膜 / デバイス設計 / 電子デバイス / 不挿発性メモリ / High-K絶縁膜 / 不揮発性メモリ / ナノ材料 / 電子デバイス・集積回路 / 量子ドット … More Except Principal Investigator 網膜 / 遺伝子治療 / オプトジェネティクス / システムオンチップ / トンネル効果 / メモリ / 半導体 / 光遺伝学 / 人工視覚 / 視覚野 / 網膜色素変性症 / 脊髄腫瘍 / ウェアラブルディスプレイ / 成型加工 / チップレット / 半導体パッケージング / FHE / マイクロLEDディスプレイ / フレキシブルデバイス / ディスプレイ / マイクロLED / めっき / Micro-LED / TSV / ヘルスケアデバイス / フレキシブルエレクトロニクス / 常温接合 / FOWLP / 3D-IC / 三次元実装 / ヘテロインテグレーション / 半導体メモリ / ニューラルネットワーク / SNN / STDP / 不揮発性メモリ / トンネルFET / スパイキングニューラルネットワーク / てんかん / 頭蓋内電極 / 脳波計測 / 電極システム / ハイドロゲル電極 / 生体親和性 / 経皮通電 / 酵素電池 / ハイドロゲル / 医工学 / 理論生体力学 / 実験生体力学 / 計算生体力学 / バイオメカニクス / スマートセンサ情報システム / 半導体物性 / 先端機能デバイス / 電子デバイス・機器 / High Speed Data Transfer / Parallel Processing System / Optical Wave Guide / Optical Interconnection / Wafer Bonding / Three-Dimensional Integration / Multiport Shared Memory / Three-Dimensionally Stacked Processor / ウェーハ張り合わせ / 高速データ転送 / 並列処理システム / 光導波路 / 光インターコネクション / ウェーハ貼り合わせ / 三次元積層化技術 / マルチポート共有メモリ / 三次元積層型プロセッサ / アデノ随伴ウイルス / 遺伝子導入 / 皮質電図 / 視覚再生 / 視細胞変性 / 誘発電位 / チャネルロドプシン / 生理学 / 微細電極 / 周波数地図 / 蝸牛神経インプラント / 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ / ウイルスベクター / 脳分子プロファイル / モデル動物 / 脳画像データベース / ブレインバンク / 技術開発支援 / 研究リソース支援 / 若手研究者育成支援 / 技術開発 / 研究リソース / 研究集会 / 研究支援 / 脳科学 / 光電子集積システム・オン・チップ / シリコン貫通配線 / スーパーチップ / 光電子集積化 / 三次元集積化 / セルフアセンブリー / グラフォアセンブリー / 微細接続 / 流体 / マイクロ・ナノデバイス / 自己組織化 / インターコネクト・パッケージのシステム化・応用 Less

トンネルFET構造による3D-NANDフラッシュメモリの超多値化
- Principal Investigator
  
  木野久志
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
人と同じ広視野・高機能視覚を有する三次元積層チップレット型完全埋植人工網膜の開発Principal Investigator
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
脊髄悪性腫瘍に対する光刺激インプラントデバイスを用いた新規治療法の開発
- Principal Investigator
  
  遠藤俊毅
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 56:Surgery related to the biological and sensory functions and related fields
- Research Institution
  Tohoku University
オプトジェネティクスと工学技術の融合による視覚野刺激型視覚再建デバイスの開発
- Principal Investigator
  
  富田浩史
- Project Period (FY)
  2022 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Iwate University
Development of minimally invasive pixel-dispersive fully implantable retinal prosthesis with human-like viewing angle and information processing functionsPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin Display
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2021 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Development of ultra-low power neural network chips using non-volatile tunnel FET memory
- Principal Investigator
  
  Kino Hisashi
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Tohoku University
Fully implantable and optical wireless neural probe for optogenetics using upconversion nanoparticlePrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2019 – 2020
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 28:Nano/micro science and related fields
- Research Institution
  Tohoku University
Biocompatible devices with soft wet electrodes
- Principal Investigator
  
  Nishizawa Matsuhiko
- Project Period (FY)
  2018 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Development of Fully Implantable and Minimally Invasive Flexible Retina Prosthesis for Reconstruction of Wide Field of VisionPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 90:Biomedical engineering and related fields
- Research Institution
  Tohoku University
Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human visionPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Medical systems
- Research Institution
  Tohoku University
Stereo-Vision Image Sensor LSI Fabricated by 3D Heterogeneous Integration Technology
- Principal Investigator
  
  KOYANAGI MITSUMASA
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Integrated nano-biomechanics
- Principal Investigator
  
  YAMAGUCHI Takami
- Project Period (FY)
  2013 – 2017
- Research Category
  
  Grant-in-Aid for Specially Promoted Research
- Review Section
  
  Science and Engineering
  Engineering
- Research Institution
  Tohoku University
Development of fully-implanted low-power retinal prosthesis system with visual information processing functionsPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Evaluation of restored visual function by using chronically implantable ECoG electrode array.
- Principal Investigator
  
  TOMITA Hiroshi
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Ophthalmology
- Research Institution
  Iwate University
High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Design of cochlear nerve implant based on the tonotopic organization of the cochlear nerve
- Principal Investigator
  
  KAWASE TETSUAKI
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Otorhinolaryngology
- Research Institution
  Tohoku University
Comprehensive Brain Science Network
- Principal Investigator
  
  Kimura Minoru
- Project Period (FY)
  2010 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research on Innovative Areas (Research in a proposed research area)
- Research Institution
  Center for Novel Science Initatives, National Institutes of Natural Sciences
眼球内埋め込み用低電力三次元積層型人工網膜システムの研究Principal Investigator
- Principal Investigator
  
  田中徹
- Project Period (FY)
  2010 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2009 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Study of tunnel-injected carrier conduction mechanism of Germanium nano-device in the ultrahigh frequency regionPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-Assembly
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2007 – 2009
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University
Nano-integration of Metal Nanodot Nonvolatile MemoryPrincipal Investigator
- Principal Investigator
  
  TANAKA Tetsu
- Project Period (FY)
  2006 – 2009
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Tohoku University
High Performance Parallel Processor System Using Three-Dimensional Processor Chip
- Principal Investigator
  
  KOYANAGI Mitsumasa
- Project Period (FY)
  2003 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

[Book] Optogenetics: Light-Sensing Proteins and Their Applications in Neuroscience and Beyond (Advances in Experimental Medicine and Biology, 1293) 32 Multimodal Functional Analysis Platform: 2. Development of Si Opto-Electro Multifunctional Neural Probe with Multiple Optical Waveguides and Embedded Optical Fiber for Optogenetics2021
- Author(s)
  Tetsu Tanaka, Norihiro Katayama, Kazuhiro Sakamoto, Makoto Osanai, Hajime Mushiake
- Publisher
  Springer
- ISBN
  9789811587627
- Data Source
  KAKENHI-PROJECT-19K22098
[Book] Optogenetics: Light-Sensing Proteins and Their Applications in Neuroscience and Beyond (Advances in Experimental Medicine and Biology, 1293) 33 Multimodal Functional Analysis Platform: 3. Spherical Treadmill System for Small Animals2021
- Author(s)
  Norihiro Katayama, Mitsuyuki Nakao, Tetsu Tanaka, Makoto Osanai, Hajime Mushiake
- Publisher
  Springer
- ISBN
  9789811587627
- Data Source
  KAKENHI-PROJECT-19K22098
[Book] Optogenetics: Light-Sensing Proteins and Their Applications in Neuroscience and Beyond (Advances in Experimental Medicine and Biology, 1293) 34 Multimodal Functional Analysis Platform: 4. Optogenetics-Induced Oscillatory Activation to Explore Neural Circuits2021
- Author(s)
  Hajime Mushiake, Tomokazu Ohshiro, Shin-ichiro Osawa, Ryosuke Hosaka, Norihiro Katayama, Tetsu Tanaka, Hiromu Yawo, Makoto Osanai
- Publisher
  Springer
- ISBN
  9789811587627
- Data Source
  KAKENHI-PROJECT-19K22098
[Book] Optogenetics: Light-Sensing Proteins and Their Applications in Neuroscience and Beyond (Advances in Experimental Medicine and Biology, 1293) 31 Multimodal Functional Analysis Platform: 1. Ultrathin Fluorescence Endoscope Imaging System Enables Flexible Functional Brain Imaging2021
- Author(s)
  Makoto Osanai, Hideki Miwa, Atsushi Tamura, Satomi Kikuta, Yoshio Iguchi, Yuchio Yanagawa, Kazuto Kobayashi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake
- Publisher
  Springer
- ISBN
  9789811587627
- Data Source
  KAKENHI-PROJECT-19K22098
[Book] マウス・ラットモデル作製・解析プロフェッショナル　第3章　生理機能の解析４．多機能整理計測プラットフォーム2021
- Author(s)
  虫明元、田中徹、片山統裕、小山内実
- Publisher
  羊土社
- ISBN
  9784758121125
- Data Source
  KAKENHI-PROJECT-19K22098
[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018
- Author(s)
  木野久志,　田中徹
- Total Pages
  205
- Publisher
  シーエムシー出版
- ISBN
  9784781313160
- Data Source
  KAKENHI-PROJECT-15H01812
[Book] 新材料・新素材シリーズ　熱膨張制御材料の開発と応用2018
- Author(s)
  木野久志,　田中徹
- Total Pages
  205
- Publisher
  シーエムシー出版
- ISBN
  9784781313160
- Data Source
  KAKENHI-PROJECT-15H02246
[Book] 3D Integration in VLSI Circuits: Implementation Technologies and Applications2018
- Author(s)
  M. Koyanagi, T. Fukushima, and T. Tanaka
- Total Pages
  217
- Publisher
  CRC Press
- ISBN
  9781138710399
- Data Source
  KAKENHI-PROJECT-15H02246
[Book] 基礎からよくわかる実践的CFD(数値流体力学)入門脳血管編2017
- Author(s)
  高尾洋之, 山本誠, 鈴木貴士, 増田俊輔, 村山雄一, 田中美千裕, 石橋敏寛, 結城一郎, 根本繁, 渡邊充祥, 滝川知司, 松丸祐司, 藤村宗一郎, 木村尚人, 面高俊介, 杉山慎一郎, 新妻邦泰, 冨永悌二, 見崎孝一, 下權谷祐児, 他
- Pages
  107-112
- Total Pages
  288
- Publisher
  メディカ出版
- Data Source
  KAKENHI-PROJECT-25000008
[Book] Handbook of 3D Integration, Vol.3, 3D Process technology2014
- Author(s)
  Mitsumasa Koyanagi, Tetsu Tanaka, 他
- Total Pages
  280
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] Handbook of 3D Integration Volume 3: 3D Process Technology, 執筆担当部分：Chapter 6.6, “Via Reveal and Backside Processing” (in press)2014
- Author(s)
  Mitsumasa Koyanagi, Tetsu Tanaka
- Total Pages
  280
- Publisher
  Wiley-VCH
- Data Source
  KAKENHI-PROJECT-21226009
[Book] "次世代半導体メモリーの最新技術", 第6章:その他のメモリー最新技術2009
- Author(s)
  田中徹, 裴艶麗
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-18063002
[Book] 次世代半導体メモリーの最新技術2009
- Author(s)
  田中徹
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-18063002
[Book] 次世代半導体メモリの最新技術",第6章第3節:金属ナノドット不揮発性メモリ2009
- Author(s)
  田中徹, 裴艶麗
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-18063002
[Book] M&E(自己組織化によるウェハレベル三次元集積化技術, 36(1))2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansion gate electrodes2022
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 15 Issue: 11 Pages: 111004-111004
- DOI
  10.35848/1882-0786/ac9d24
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics2022
- Author(s)
  Miwa Yuki、Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Journal of Vacuum Science & Technology B
  
  Volume: 40 Issue: 5 Pages: 052202-052202
- DOI
  10.1116/6.0001836
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] SIG-1451, a Novel, Non-Steroidal Anti-Inflammatory Compound, Attenuates Light-Induced Photoreceptor Degeneration by Affecting the Inflammatory Process2022
- Author(s)
  Kikuchi Yuki、Sugano Eriko、Yuki Shiori、Tabata Kitako、Endo Yuka、Takita Yuya、Onoguchi Reina、Ozaki Taku、Fukuda Tomokazu、Takai Yoshihiro、Kurose Takahiro、Tanaka Koichi、Honma Yoichi、Perez Eduardo、Stock Maxwell、Fernandez Jose R.、Tamura Masanori、Voronkov Michael、Stock Jeffry B.、Tomita Hiroshi
- Journal Title
  
  International Journal of Molecular Sciences
  
  Volume: 23 Issue: 15 Pages: 8802-8802
- DOI
  10.3390/ijms23158802
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K09713, KAKENHI-PROJECT-22K09760, KAKENHI-PROJECT-21K18278, KAKENHI-PROJECT-22H04922, KAKENHI-PROJECT-22H00579, KAKENHI-PROJECT-20H03845, KAKENHI-PROJECT-22KJ0150
[Journal Article] High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path2021
- Author(s)
  Kino Hisashi、Fukushima Takafumi、Tanaka Tetsu
- Journal Title
  
  Applied Physics Express
  
  Volume: 14 Issue: 9 Pages: 091003-091003
- DOI
  10.35848/1882-0786/ac18b0
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20H02193
[Journal Article] Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics2020
- Author(s)
  Takafumi Fukushima , Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, and Tetsu Tanaka,
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 10 Issue: 8 Pages: 1419-1422
- DOI
  10.1109/tcpmt.2020.3009640
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19KK0101, KAKENHI-PROJECT-18H04159
[Journal Article] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 59 Issue: SB Pages: SBBA04-SBBA04
- DOI
  10.7567/1347-4065/ab4f3c
- NAID
  210000157397
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] High-Thermoresistant Temporary Bonding　Technology for Multichip-to-Wafer　3-D Integration With Via-Last TSVs2019
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: 9 Issue: 1 Pages: 181-188
- DOI
  10.1109/tcpmt.2018.2871764
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter2019
- Author(s)
  Miao Xiong, Zhiming Chen, Yingtao Ding , Hisashi Kino , Takafumi Fukushima , and Tetsu Tanaka
- Journal Title
  
  IEEE TRANSACTIONS DEVICE LETTERS
  
  Volume: 40 Issue: 1 Pages: 95-98
- DOI
  10.1109/led.2018.2884452
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Journal Title
  
  IEEE Journal of the Electron Devices Society
  
  Volume: 7 Pages: 1225-1231
- DOI
  10.1109/jeds.2019.2936180
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18H04159
[Journal Article] Study of Al-doped ZnO Transparent Stimulus Electrodefor Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip2018
- Author(s)
  Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Journal Title
  
  Sensors and Materials
  
  Volume: 30 Pages: 225-234
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018
- Author(s)
  菅原陽平, 木野久志, 福島誉史, 田中徹
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J101-C Pages: 58-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018
- Author(s)
  菅原陽平, 木野久志, 福島誉史, 田中徹
- Journal Title
  
  電子情報通信学会論文誌 C
  
  Volume: J101-C Pages: 58-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration2017
- Author(s)
  Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 7 Pages: 2912-2918
- DOI
  10.1109/ted.2017.2705562
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017
- Author(s)
  Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 64 Issue: 12 Pages: 5065-5072
- DOI
  10.1109/ted.2017.2767598
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] 半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に2016
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  表面技術
  
  Volume: 67 Pages: 414-420
- NAID
  130005875872
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016
- Author(s)
  T. Fukushima, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  ECS Transactions
  
  Volume: 75 Issue: 9 Pages: 285-290
- DOI
  10.1149/07509.0285ecst
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Deformation of a micro torque swimmer2016
- Author(s)
  T. Ishikawa, T. Tanaka, Y. Imai, T. Omori and D. Matsunaga
- Journal Title
  
  Proceedings of the Royal Society A
  
  Volume: 472 Issue: 2185 Pages: 2185-2185
- DOI
  10.1098/rspa.2015.0604
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-26242039, KAKENHI-PROJECT-14J04025, KAKENHI-PROJECT-25000008
[Journal Article] 三次元集積用テンポラリー接着剤の特性とウエハエッジの影響2016
- Author(s)
  福島誉史、マリアッパンムルゲサン、裵志哲、李相勲、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会誌C
  
  Volume: J99-C Pages: 493-500
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Phosphorylation of TAR DNA-binding Protein of 43 kDa (TDP-43) by Truncated Casein Kinase 1δ Triggers Mislocalization and Accumulation of TDP-43.2016
- Author(s)
  Nonaka T, Suzuki G, Tanaka Y, Kametani F, Hirai S, Okado H, Miyashita T, Saitoe M, Akiyama H, Masai H, Hasegawa M.
- Journal Title
  
  The journal of Biological Chemistry
  
  Volume: 291 Issue: 11 Pages: 5473-83
- DOI
  10.1074/jbc.m115.695379
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15K18370, KAKENHI-PROJECT-221S0003, KAKENHI-ORGANIZER-25115001, KAKENHI-PLANNED-25115006, KAKENHI-PROJECT-23228004, KAKENHI-PROJECT-25250010, KAKENHI-PROJECT-14J03307, KAKENHI-PROJECT-24500429, KAKENHI-PROJECT-25650014, KAKENHI-PROJECT-26251004, KAKENHI-PROJECT-26290016, KAKENHI-PROJECT-16K14569, KAKENHI-PROJECT-16K14675
[Journal Article] Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC07-04EC07
- DOI
  10.7567/jjap.55.04ec07
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC2016
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 4S Pages: 04EC03-04EC03
- DOI
  10.7567/jjap.55.04ec03
- NAID
  210000146283
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] Gain-of-function profilin 1 mutations linked to familial amyotrophic lateral sclerosis cause seed-dependent intracellular TDP-43 aggregation.2016
- Author(s)
  Tanaka Y, Nonaka T, Suzuki G, Kametani F, Hasegawa M.
- Journal Title
  
  Human Molecular Genetics
  
  Volume: 25 Issue: 7 Pages: 1420-33
- DOI
  10.1093/hmg/ddw024
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K18370, KAKENHI-PROJECT-221S0003, KAKENHI-PUBLICLY-26111730, KAKENHI-PROJECT-23228004, KAKENHI-PROJECT-15H02356, KAKENHI-PROJECT-14J03307, KAKENHI-PROJECT-16K21650
[Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: 7 Issue: 10 Pages: 184-184
- DOI
  10.3390/mi7100184
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246, KAKENHI-PROJECT-15K14139
[Journal Article] FUS regulates AMPA receptor function and FTLD/ALS-associated behaviour via GluA1 mRNA stabilization.2015
- Author(s)
  Udagawa, T., Fujioka, Y., Tanaka, M., Honda, D., Yokoi, S., Riku, Y., Ibi, D., Nagai, T., Yamada, K., Watanabe, H., Katsuno, M., Inada, T., Ohno, K., Sokabe, M., Okado, H., Ishigaki S*., and Sobue, G.
- Journal Title
  
  Nat Commun
  
  Volume: 6 Issue: 1 Pages: 7098-7098
- DOI
  10.1038/ncomms8098
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-15K09310, KAKENHI-PUBLICLY-25118508, KAKENHI-PROJECT-221S0003, KAKENHI-PLANNED-26116003, KAKENHI-PLANNED-26117004, KAKENHI-PROJECT-24247028, KAKENHI-PROJECT-15H06719, KAKENHI-PROJECT-25460093, KAKENHI-PROJECT-15K15337, KAKENHI-PROJECT-26670439, KAKENHI-PROJECT-25860708, KAKENHI-PROJECT-26293206, KAKENHI-PLANNED-26117002, KAKENHI-ORGANIZER-26117001
[Journal Article] Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration2015
- Author(s)
  Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Journal of Microelectromechanical Systems
  
  Volume: 25 Issue: 1 Pages: 91-100
- DOI
  10.1109/jmems.2015.2480787
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Increased production of intestinal immunoglobulins in Syntenin-1-deficient mice.2015
- Author(s)
  Tamura K., Ikutani M., Yoshida T., Tanaka-Hayashi A., Yanagibashi T., Inoue R., Nagai Y., Adachi Y., Miyawaki T., Takatsu K., Mori H.
- Journal Title
  
  Immunobiology
  
  Volume: 220 Issue: 5 Pages: 597-604
- DOI
  10.1016/j.imbio.2014.12.003
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24390119, KAKENHI-PROJECT-24590577, KAKENHI-PUBLICLY-25126707, KAKENHI-PROJECT-221S0003
[Journal Article] Is D-aspartate produced by glutamic-oxaloacetic transaminase -1 like 1(Got1l1), a putative aspartate racemase?2015
- Author(s)
  Tanaka-Hayashi A, Hayashi S, Inoue R, Ito T, Konno K, Yoshida T, Watanabe M, Yoshimura T, Mori H
- Journal Title
  
  Amino Acids
  
  Volume: 47 Issue: 1 Pages: 79-86
- DOI
  10.1007/s00726-014-1847-3
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-24780098, KAKENHI-PUBLICLY-25110708, KAKENHI-PROJECT-25292059, KAKENHI-PROJECT-25293057, KAKENHI-PROJECT-26640038, KAKENHI-PROJECT-24220007, KAKENHI-PROJECT-25293059
[Journal Article] A CDC42EP4/septin-based perisynaptic glial scaffold facilitates glutamate clearance.2015
- Author(s)
  Ageta-Ishihara N, Yamazaki M, Konno K, Nakayama H, Abe M, Hashimoto K, Nishioka T, Kaibuchi K, Hattori S, Miyakawa T, Tanaka K, Huda F, Hirai H, Hashimoto K, Watanabe M, Sakimura K, Kinoshita M.
- Journal Title
  
  Nat Commun.
  
  Volume: 6 Issue: 1 Pages: 10090-10090
- DOI
  10.1038/ncomms10090
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26350979, KAKENHI-PROJECT-15K18342, KAKENHI-PUBLICLY-15H01297, KAKENHI-PROJECT-221S0003, KAKENHI-PLANNED-25117006, KAKENHI-PROJECT-24240048, KAKENHI-PROJECT-15H04274, KAKENHI-PROJECT-26640007, KAKENHI-PROJECT-26290021, KAKENHI-PROJECT-26440095, KAKENHI-PROJECT-25242078, KAKENHI-PUBLICLY-15H01429
[Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015
- Author(s)
  Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 37 Issue: 1 Pages: 81-83
- DOI
  10.1109/led.2015.2502584
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812, KAKENHI-PROJECT-15H02246
[Journal Article] Disrupted-in-schizophrenia 1 regulates transport of ITPR1 mRNA for synaptic plasticity.2015
- Author(s)
  Tsuboi D, Kuroda K, Tanaka M, Namba T, Iizuka Y, Taya S, Shinoda T, Hikita T, Muraoka S, Iizuka M, Nimura A, Mizoguchi A, Shiina N, Sokabe M, Okano H, Mikoshiba K, Kaibuchi K
- Journal Title
  
  Nature Neuroscience
  
  Volume: in press Issue: 5 Pages: 698-707
- DOI
  10.1038/nn.3984
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24700377, KAKENHI-PROJECT-25251021, KAKENHI-PROJECT-25830051, KAKENHI-PROJECT-15K06772, KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-25221002, KAKENHI-PROJECT-24247028, KAKENHI-PROJECT-25440099
[Journal Article] Normal development of human brain white matter from infancy to early adulthood: a diffusion tensor imaging study.2015
- Author(s)
  Uda S, Matsui M, Tanaka C, Uematsu A, Miura K, Kawana I, Noguchi K.
- Journal Title
  
  Dev Neurosci.
  
  Volume: 37(2) Issue: 2 Pages: 182-194
- DOI
  10.1159/000373885
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PUBLICLY-26118707, KAKENHI-PROJECT-26590143
[Journal Article] Applications of three-dimensional LSI2015
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, and Tetsu Tanaka
- Journal Title
  
  MRS BULLETIN
  
  Volume: 40 Issue: 3 Pages: 242-247
- DOI
  10.1557/mrs.2015.33
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15H01812
[Journal Article] L-carnitine enhances axonal plasticity and improves white-matter lesions after chronic hypoperfusion in rat brain.2015
- Author(s)
  Ueno Y, Koike M, Shimada Y, Shimura H, Hira K, Tanaka R, Uchiyama Y, Hattori N, Urabe T.
- Journal Title
  
  J Cereb Blood Flow Metab
  
  Volume: 35 Issue: 3 Pages: 382-91
- DOI
  10.1038/jcbfm.2014.210
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25460276, KAKENHI-PUBLICLY-26111519, KAKENHI-PROJECT-221S0003
[Journal Article] Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology2014
- Author(s)
  K.-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, C. Nagai, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: - Pages: 669-672
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] Mechanisms for interferon-α-induced depression and neural stem cell dysfunction.2014
- Author(s)
  Zheng LS, Hitoshi S, Kaneko N, Takao K, Miyakawa T, Tanaka Y, Xia H, Kalinke U, Kudo K, Kanba S, Ikenaka K, Sawamoto K.
- Journal Title
  
  Stem Cell Reports
  
  Volume: 3(1) Issue: 1 Pages: 73-84
- DOI
  10.1016/j.stemcr.2014.05.015
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-23680041, KAKENHI-PROJECT-24300136, KAKENHI-PUBLICLY-25111727, KAKENHI-PUBLICLY-25116526, KAKENHI-PUBLICLY-25123706, KAKENHI-PROJECT-25350989, KAKENHI-PROJECT-25650005, KAKENHI-PUBLICLY-26110710, KAKENHI-PUBLICLY-26115529, KAKENHI-PROJECT-25242078
[Journal Article] Reconfigured-Wafer-to-Wafer 3D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film2014
- Author(s)
  Takafumi Fukushima, Ji Cheol Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.61, No.2 Issue: 2 Pages: 533-539
- DOI
  10.1109/ted.2013.2294831
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014
- Author(s)
  Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 61 Issue: 2 Pages: 540-546
- DOI
  10.1109/ted.2013.2295463
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060, KAKENHI-PROJECT-25820133
[Journal Article] RacGAP α2-chimaerin function in development adjusts cognitive ability in adulthood2014
- Author(s)
  Iwata R, Ohi K, Kobayashi Y, Masuda A, Masuda A, Iwama M, Yasuda Y, Yamamori H, Tanaka M, Hashimoto R, Itohara S, Iwasato T
- Journal Title
  
  Cell Report
  
  Volume: 8(5) Issue: 5 Pages: 1257-64
- DOI
  10.1016/j.celrep.2014.07.047
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PUBLICLY-25129704, KAKENHI-PROJECT-25293250, KAKENHI-PROJECT-26670541, KAKENHI-PLANNED-22115009
[Journal Article] Evaluation of SLC20A2 mutations that cause idiopathic basal ganglia calcification in Japan.2014
- Author(s)
  Yamada, M., M. Tanaka, M. Takagi, S. Kobayashi, Y. Taguchi, S. Takashima, K. Tanaka, T. Touge, H. Hatsuta, S. Murayama, Y. Hayashi, M. Kaneko, H. Ishiura, J. Mitsui, N. Atsuta, G. Sobue, N. Shimozawa, T. Inuzuka, S. Tsuji and I. Hozumi
- Journal Title
  
  Neurology
  
  Volume: 82 Issue: 8 Pages: 705-712
- DOI
  10.1212/wnl.0000000000000143
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-24700371, KAKENHI-PROJECT-25461277, KAKENHI-PROJECT-25860700, KAKENHI-PROJECT-25860705
[Journal Article] Deletion of SHATI/NAT8L increases dopamine D1 receptor on the cell surface in the nucleus accumbens, accelerating methamphetamine dependence2014
- Author(s)
  Toriumi K, Kondo M, Nagai T, Hashimoto R, Ohi K, Song Z, Tanaka J, Mouri A, Koseki T, Yamamori H, Furukawa-Hibi Y, Mamiya T, Fukushima T, Takeda M, Nitta A, Yamada K, Nabeshima T
- Journal Title
  
  Int J Neuropsychopharmacol
  
  Volume: 17 Issue: 03 Pages: 443-453
- DOI
  10.1017/s1461145713001302
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-23590299, KAKENHI-PROJECT-24590304, KAKENHI-PROJECT-25293250, KAKENHI-PROJECT-25461730, KAKENHI-PROJECT-26460095
[Journal Article] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration2013
- Author(s)
  Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee,Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T.Fukusima, H.Hashiguchi, J.Bea, M.Mururesan, K-W.Lee, T.Tanaka, and M.Koyanagi
- Journal Title
  
  Proc.of IEEE 63rd ECTC
  
  Volume: VOL.63 Pages: 58-63
- DOI
  10.1109/ectc.2013.6575550
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Proc. of IEEE 63rd ECTC
  
  Volume: 63 Pages: 891-896
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (JJAP)
  
  Volume: 52 Issue: 4S Pages: 04CB09-04CB09
- DOI
  10.7567/jjap.52.04cb09
- NAID
  210000141985
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Development and In Vivo Evaluation of Conductive Polymer (PEDOT) Stimulus Electrodes for Fully Implantable Retinal Prosthesis2013
- Author(s)
  Chikashi kigure, Hideki Naganuma, Yuichiro Sasaki, Hiroshi Kino, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52 Issue: 4S Pages: 04CL03-04CL03
- DOI
  10.7567/jjap.52.04cl03
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24246060
[Journal Article] In vivo optogenetic tracing of functional corticocorticai connections between motor forelimb areas2013
- Author(s)
  Hira R, Ohkubo F, Tanaka YR, Masamizu Y, Augustine GJ, Kasai H, Matsuzaki M
- Journal Title
  
  Frontiers in Neural Circuits
  
  Volume: 7 Pages: 55-55
- DOI
  10.3389/fncir.2013.00055
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-10J00136, KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-23300148, KAKENHI-PROJECT-23800071, KAKENHI-PLANNED-22115005
[Journal Article] Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain2013
- Author(s)
  Sanghoon Lee, Soichiro Kanno, Hisashi Kino, Tetsu Tanaka
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52 Issue: 4S Pages: 04CL04-04CL04
- DOI
  10.7567/jjap.52.04cl04
- NAID
  210000142106
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-221S0003
[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI2012
- Author(s)
  Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE ELECTRON DEVICES LETTERS
  
  Volume: Vol.33 Issue: 2 Pages: 221-223
- DOI
  10.1109/led.2011.2174608
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] New Chip -to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 789-792
- DOI
  10.1109/iedm.2012.6479157
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs2012
- Author(s)
  M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
  
  Volume: - Pages: 657-660
- DOI
  10.1109/iedm.2012.6479124
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Impaired synaptic clustering of postsynaptic density proteins and altered signal transmission in hippocampal neurons, and disrupted learning behavior in PDZ1 and PDZ2 ligand binding-deficient PSD-95 knockin mice.2012
- Author(s)
  Nagura H, Ishikawa Y, Kobayashi K, Takao K, Tanaka T, Nishikawa K, Tamura H, Shiosaka S, Suzuki H, Miyakawa T, Fujiyoshi Y, Doi T.
- Journal Title
  
  Mol Brain
  
  Volume: 5 Issue: 1 Pages: 43-43
- DOI
  10.1186/1756-6606-5-43
- NAID
  120005323021
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-221S0003, KAKENHI-PROJECT-22500342, KAKENHI-PROJECT-23700449, KAKENHI-PUBLICLY-24111546, KAKENHI-PROJECT-24500439, KAKENHI-PUBLICLY-23110519
[Journal Article] High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate-an alternative method to wire bonding2012
- Author(s)
  M Murugesan, T Fukushima, K Kiyoyama, J C Bea, T Tanaka and M Koyanagi
- Journal Title
  
  JOURNAL of Micromechanics and Microengineering
  
  Volume: Vol.22(8) Issue: 8 Pages: 085033-085033
- DOI
  10.1088/0960-1317/22/8/085033
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Low-Resistance Cu-Sn Electroplated　Evaporated Microbumps for 3D Chip Stacking2012
- Author(s)
  M. MURUGESAN, Y. OHARA, T. FUKUSHIMA, T. TANAKA, and M. KOYANAGI
- Journal Title
  
  Journal of ELECTRONIC MATERIALS
  
  Volume: Vol.41(4) Issue: 4 Pages: 720-729
- DOI
  10.1007/s11664-012-1949-1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-24246060
[Journal Article] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration2012
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Proc. of IEEE 62nd Electronic Components and Technology Conference
  
  Volume: - Pages: 393-398
- DOI
  10.1109/ectc.2012.6248860
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: 58 Issue: 3 Pages: 748-757
- DOI
  10.1109/ted.2010.2099870
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術2011
- Author(s)
  大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 394-401
- NAID
  110008761542
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] 微細Si貫通ビアによる三次元インタコネクト技術2011
- Author(s)
  小柳光正, 田中徹
- Journal Title
  
  電子情報通信学会誌(インタコネクション技術小特集)
  
  Volume: Vol.94(招待論文) Pages: 1027-1032
- NAID
  110008799241
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems2011
- Author(s)
  Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: Vol.58 Pages: 748-757
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価2011
- Author(s)
  木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C Pages: 411-418
- NAID
  110008761544
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] Evaluation of Cu Diffusion from Cu Through-Silicon Via (TSV) in 3-D LSI by Transient Capacitance Measurement2011
- Author(s)
  J-C.Bea, K.W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: Volume 32 Issue: 7 Pages: 940-942
- DOI
  10.1109/led.2011.2141109
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22246045
[Journal Article] 三次元集積化技術とヘテロインテグレーション2011
- Author(s)
  小柳光正, 福島誉史, 李康旭, 田中徹
- Journal Title
  
  電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
  
  Volume: Vol.J94-C(招待論文) Pages: 355-364
- NAID
  110008761537
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010
- Author(s)
  岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
- Journal Title
  
  電子情報通信学会論文誌C
  
  Volume: Vol.J93-C Pages: 493-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2010
- Author(s)
  Y. Pei, C. Yin, T. Kojima, J. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  IEEE Transactions on Nanotechnology (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsuma Koyanagi
- Journal Title
  
  ECS (Electrochemical Society) Transactions
  
  Volume: Vol.33 Pages: 71-90
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application2010
- Author(s)
  Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (未定, 印刷中)
- NAID
  40017176042
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Surface-tensiondriven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: VOL.96 Issue: 15
- DOI
  10.1063/1.3328098
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T. Fukushima, E. Iwata, T. Konno, K. -W. Lee, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letters Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module2010
- Author(s)
  Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
  
  Volume: Vol.19 Pages: 1284-1291
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 極限集積化を目指すスーパーチップ2010
- Author(s)
  小柳光正、福島誉史、李康旭、田中徹
- Journal Title
  
  電子情報通信学会誌
  
  Volume: Vol.93(招待論文) Pages: 918-922
- NAID
  110007880868
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Investigation of Effects of Post-Deposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application2010
- Author(s)
  Y. Pei, T. Kojima, T. Hiraki, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics (in print)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters
  
  Volume: Vol.96
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2010
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Micromachines
  
  Volume: Vol.2 Pages: 49-68
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010
- Author(s)
  福島誉史、李康旭、田中徹、小柳光正
- Journal Title
  
  電子材料
  
  Volume: Vol.49 Pages: 17-24
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010
- Author(s)
  T.Fukushima, E.Iwata, T.Konno, K.-W.Lee, T.Tanaka, M.Koyanagi
- Journal Title
  
  Applied Physics Letters 96(accepted)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F.Inoue, M.Koyanagi, T.Fukushima, K.Yamamoto, S.Tanaka, Z.wang, S.Shingubara
- Journal Title
  
  ECS Transactions 16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Applied Physics Letters 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory Characteristics of Metal-Oxide-Semiconductor Capacitor with High Density Cobalt Nanodots Floating Gate and HfO2 Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Applied Physics Letters 95
  
  Pages: 33118-33118
- NAID
  120003728303
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density2009
- Author(s)
  Yun Heub Song, Ji Chel Bea, Kang Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
  
  Pages: 106505-106505
- NAID
  40016796078
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Electrical Characterization of MOS Memory Devices with Self-Assembled Tungsten Nano-Dots Dispersed in Silicon Nitride2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  ECS Trans. 18
  
  Pages: 33-37
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  IEEE IEDM Technical Digest
  
  Pages: 349-352
- NAID
  110008001112
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Characteristics of copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W. -C. Jeong, K. Kiyoyama, K. -W. Lee, A. Noriki, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.48,No.4
- NAID
  210000066668
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 12
  
  Pages: 104-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Journal Title
  
  Proceedings of the IEEE Vol.97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density2009
- Author(s)
  Y. Song, J. Bea, K. Lee, G. Lee, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
  
  Pages: 106505-106505
- NAID
  40016796078
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Cell characteristics of a multiple alloy nano-dots memory structure2009
- Author(s)
  Ji Chel Bea, Yun Heub Song, Kang-Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Semiconductor Science and Technology 24
  
  Pages: 85013-85013
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  エレクトロニクス実装学会誌 Vol.12
  
  Pages: 105-109
- NAID
  110007122665
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors2009
- Author(s)
  F. Inoue, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. wang, S. Shingubara
- Journal Title
  
  ECS Transactions Vol.16
  
  Pages: 27-32
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Characteristics of copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W.-C.Jeong, K.Kiyoyama, K.-W.Lee, A.Noriki, M.Murugesan, T.Fukushima, T.Tanaka, M.Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066668
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Characteristicsof copper spiral inductors utilizing FePtnano-dots film2009
- Author(s)
  W.-C. Jeong, K. Kiyoyama, K.-W. Lee, A. Noriki, M. Murugesan, T. Fukushima, T. Tanaka, and M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics C157-1C157-4
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19360153
[Journal Article] Cell characteristics of a multiple alloy nano-dots memory structure2009
- Author(s)
  J. Bea, Y. Song, K. Lee, G. Lee, T. Tanaka, M. Koyanagi
- Journal Title
  
  Semiconductor Science and Technology 24
  
  Pages: 85013-85013
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Appl. Phys. Lett. 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System2009
- Author(s)
  Kenji Makita, Kouji Kiyoyama, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 48
- NAID
  210000066588
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] MOSFET Nonvolatile Memory with High Density Tungsten Nanodots Floating Gate Formed by Self-Assembled Nanodot Deposition2009
- Author(s)
  Y Pei, C Yin, J C Bea, H Kino, T Fukushima, T Tanaka, M Koyanagi
- Journal Title
  
  Semiconductor Science and Technology 24
  
  Pages: 45022-45022
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory Characteristics of Metal-Oxide-Semiconductor Capacitor with High Density Cobalt Nanodots Floating Gate and HfO2 Blocking Dielectric2009
- Author(s)
  Y. Pei, C. Yin, T. Kojima, M. Nishijima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 95
  
  Pages: 33118-33118
- NAID
  120003728303
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection2009
- Author(s)
  Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: VOL.48 Issue: 4S Pages: 04C113-04C113
- DOI
  10.1143/jjap.48.04c113
- NAID
  210000066624
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 94
  
  Pages: 63108-63108
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] High-Density Through Silicon Vias for 3-D LSIs2009
- Author(s)
  MITSUMASA KOYANAGI, TAKAFUMI FUKUSHIMA, TETSU TANAKA
- Journal Title
  
  Proceedings of THE IEEE 97
  
  Pages: 49-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009
[Journal Article] Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride2008
- Author(s)
  Y. Pei, M. Nishijima, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Applied Physics Letter 93
  
  Pages: 113115-113117
- NAID
  120002338347
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate2008
- Author(s)
  Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya. Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2936-2940
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy2008
- Author(s)
  M. Murugesan, J.C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Journal Title
  
  Journal of Applied Physics 104
  
  Pages: 74316-74316
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] "Electrical Characterization of Metal-Oxide-Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots2008
- Author(s)
  Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 47
  
  Pages: 2680-2683
- NAID
  210000064565
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Appl. Phys. Lett. 93
  
  Pages: 113115-113117
- NAID
  120002338347
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 499-502
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy2008
- Author(s)
  M. Murugesan, J.C. Bea, C.-K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, and M. Koyanagi
- Journal Title
  
  JOURNAL OF APPLIED PHYSICS 104
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19360153
[Journal Article] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Journal Title
  
  応用物理学会分科会シリコンテクノロジー「多層配線」特集号 No.99
  
  Pages: 34-37
- NAID
  110006935847
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] Electrical Characterization of Metal-Oxide-Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots2008
- Author(s)
  Yanli Pei, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Jpn. J. Appl. Phys. 47
  
  Pages: 2680-2683
- NAID
  210000064565
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Journal Article] Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs2008
- Author(s)
  H. Kikuchi, Y. Yamada, A.M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics Vol.47
  
  Pages: 2801-2806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Journal Title
  
  International Electron Devices Meeting (IEDM) Technical Digest
  
  Pages: 985-988
- NAID
  120002070107
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19686022
[Journal Article] New Magnetic Nanodot Memory with FePt Nanodots2007
- Author(s)
  C. Yin, M. Murugesan, J. Bea, M. Oogane, T. Fukushima, T. Tanaka, M. Miyao, S. Samukawa, M. Koyanagi
- Journal Title
  
  Japanese Journal of Applied Physics 46
  
  Pages: 2167-2171
- NAID
  10022547399
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18063002
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Patent] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法2013
- Inventor(s)
  小柳光正、福島誉史、田中徹
- Industrial Property Rights Holder
  東北大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-13
- Overseas
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Negative-Thermal-Expansion Gate Electrode to Introduce Tensile Strain into the Channel of MOSFETs for Mobility Enhancement2023
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] FOWLP-based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display2023
- Author(s)
  Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  IEEE Components, Packaging and Manufacturing Technology (CPMT) Symposium Japan (ICSJ)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] ハイドロゲルFHEデバイスのためのRDL-first Multichip-to-Wafer集積技術2023
- Author(s)
  星匡朗, 西口大智, 木野久志, 田中徹, 福島誉史
- Organizer
  第84回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] A Finite Element Study of Stretchable Corrugated Interconnections on Chiplet-Embedded Flexible Hybrid Electronics2022
- Author(s)
  Chang Liu, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Flex2022
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet- Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging2022
- Author(s)
  Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration2022
- Author(s)
  Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs2022
- Author(s)
  Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display2022
- Author(s)
  Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, and Tak Fukushima
- Organizer
  Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices2022
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2022 IEEE International Interconnect Technology Conference (IITC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02193
[Presentation] Effect of Light Emission on Recording Electrodes of Opto-Neural Probe with Upconversion Nanoparticles2021
- Author(s)
  楊芬、浦山翔太、長崎春樹、木野久志、福島誉史、田中徹
- Organizer
  第68回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021
- Author(s)
  Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  第68回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 多段階励起による発光現象を用いた光遺伝学用神経メッシュプローブの提案と作製2021
- Author(s)
  長﨑春樹、浦山翔太、楊芬、木野久志、福島誉史、田中徹
- Organizer
  第68回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] スマートスキンディスプレイの提案とマイクロLEDの常温Cu直接接合技術2021
- Author(s)
  煤孫祐樹, 王喆, 小田島輩, 荒山俊亮, 星匡朗, 木野久志, 田中徹, 福島誉史
- Organizer
  第82回応用物理学会秋季学術講演会講演予稿集
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display2021
- Author(s)
  Yuki Susumago, Tomo Odashima, Masatsugu Ichikawa, Hiroki Hanaoka, Hisashi Kino, Tetsu Tanaka, and Takafumi Fukushima
- Organizer
  Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21H04545
[Presentation] Die-Level Cu-CMP　Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration2020
- Author(s)
  Shuai Liu, Kousei Kumahara, Yuki Miwa , Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020
- Author(s)
  Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukishima
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Fabrication and Evaluation of Neural Recording Microelectrode on Opto-Neural Probe with Upconversion Nanoparticles Light Emitter2020
- Author(s)
  Fen Yang,Shota Urayama,Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices2020
- Author(s)
  Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of Optical Waveguiding Neural Probe with Upconversion-Nanoparticle Light Emitter for Optogenetics2020
- Author(s)
  Shota Urayama, Fen Yang, Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion2020
- Author(s)
  Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] インモールドエレクトロニクス用フレキシブル三次元波状配線の作製2020
- Author(s)
  永田柊太, 木野久志, 田中徹, 福島誉史
- Organizer
  第81回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration2020
- Author(s)
  Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  The 2019 IEEE 69th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of 3D-IC Embedded Flexible Hybrid System2019
- Author(s)
  S. Lee, Y. Susumago, Z. Qian, N. Takahashi, H. Kino, T. Tanaka, and T. Fukushima
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Study of Transparent Electrodes for 3D-Stacked Retinal Prosthesis2019
- Author(s)
  Michael Proffitt, Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino, Hiroshi Tomita
- Organizer
  2019 MRS Spring Meeting
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Integrated Biomedical Micro/Nano Devices with 3D-IC: Fully Implantable Retinal Prosthesis2019
- Author(s)
  Tetsu Tanaka
- Organizer
  Future Chips forum 2019
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 多段階励起による発光現象を用いた光遺伝学用神経プローブの作製2019
- Author(s)
  浦山翔太、島智大、張博文、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Technology Platform Development of Multichip-to-Wafer 3D Integration (2)- SiO2 Liner Technology for Low Temperature TSV Process -2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] マイクロLED埋め込み型フレキシブルオプト神経プローブの開発2019
- Author(s)
  島智大, 煤孫裕樹, 張博文, 浦山翔太, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer三次元集積化基盤技術の開発 (1)－テンポラリ接着剤を用いた一括チップ薄化技術－2019
- Author(s)
  李晟豪、梁ザイ、三輪侑紀、木野久志、福島誉史、田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Annealing Effect on Room-Temperature-Deposited SiO2 Liner for Multichip-to-Wafer 3D Integration Process2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Hisashi Kino,Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] RDL-first FOWLPによるハイドロゲル用いたFHEのためのチップ内蔵技術2019
- Author(s)
  髙橋則之, 煤孫祐樹, 木野久志, 田中徹, 福島誉史
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 光遺伝学用UCNPオプト神経プローブの発光強度特性評価2019
- Author(s)
  浦山翔太、木野久志、福島誉史、田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] Room Temperature SiO2 Liner Technology for Multichip-to-Wafer 3D Integration with Via-last TSV2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC 2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs2019
- Author(s)
  Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Mechanical Characterization of FOWLP Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019
- Author(s)
  Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
- Organizer
  2019 International Conference on Electronics Packaging ICEP 2019
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip-to-Wafer三次元集積に向けたマイクロバンプ接合技術2019
- Author(s)
  熊原宏征、三輪侑紀、李晟豪、梁ザイ、木野久志、福島誉史、田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 高密度電極接続を用いた三次元集積のための低背マイクロバンプ接合評価2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 熊原宏征, 木野久志, 福島誉史, 田中徹
- Organizer
  第80回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Investigation of the Underfill with Negative-Thermal- Expansion Material to Suppress Mechanical Stress in 3D Integration System2019
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation2019
- Author(s)
  Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara,Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 International 3D Systems Integration Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Development of Wireless Opto-Neural Probe with Upconversion Nanoparticles (UCNP) for Optogenetics2019
- Author(s)
  Shota Urayama, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  2019 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K22098
[Presentation] Multichip-to-Wafer 三次元集積化基盤技術の開発 (3) ―異種機能集積化に向けたマイクロバンプ接合技術―2019
- Author(s)
  三輪侑紀, 李晟豪, 梁ザイ, 木野久志, 福島誉史, 田中徹
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019
- Author(s)
  Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
- Organizer
  2019 6th International Workshop on Low Temperature Bonding for 3D Integration
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] 医療・ヘルスケア用ウェアラブル/インプランタブルLSIの開発2018
- Author(s)
  田中　徹
- Organizer
  SEMICON Japan 2018
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018
- Author(s)
  李晟豪, 菅原陽平, 伊藤誠人, 木野久志, 福島誉史, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs2018
- Author(s)
  H. Kino, S. Lee, Y. Sugawara, T. Fukushima, T. Tanaka
- Organizer
  21st IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018
- Author(s)
  S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
- Organizer
  2018 Japan-Taiwan Workshop on Electronic Interconnection Ⅱ
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18H04159
[Presentation] DRAMセルアレイを用いた3D-IC内部Cu汚染の高精度評価2018
- Author(s)
  谷川星野, 福島誉史, 木野久志, 田中徹
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018
- Author(s)
  李晟豪, 菅原陽平, 伊藤誠人, 木野久志, 福島誉史, 田中徹
- Organizer
  エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Ultrawide range square wave impedance analysis circuit with ultra-slow Ring-Oscillator using gate-induced drain-leakage current2017
- Author(s)
  Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 3D-IC Technology and Reliability Challenges2017
- Author(s)
  Tetsu Tanaka
- Organizer
  International Workshop on Junction Technology(IWJT2017)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 3D-IC Technology: Reliability Challenges and Biomedical Application2017
- Author(s)
  Tetsu Tanaka
- Organizer
  2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D-IC Technology and Its Application to Fully Implantable Retinal Prosthesis2017
- Author(s)
  Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino
- Organizer
  14th International Conference on Flow Dynamics
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017
- Author(s)
  Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017
- Author(s)
  Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 IEEE 67th Electronic Components and Technology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017
- Author(s)
  Miao Xiong,Yangyang Yan, Yingtao Ding，Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017
- Author(s)
  Miao Xiong,Yangyang Yan, Yingtao Ding，Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  International Conference on Solid State Devices and Materials (SSDM2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 矩形波インピーダンス計測のためのGIDL電流を用いた低周波リングオシレータの設計と評価2017
- Author(s)
  竹澤好樹, 下川賢士, 銭正よう, 福島奨, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Experimental Evaluation of Stimulus Current Generator with Laplacian Edge-enhancement for 3-D Stacked Retinal Prosthesis Chip2017
- Author(s)
  Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
- Organizer
  The 13th IEEE Biomedical Circuit and Systems Conference 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator2017
- Author(s)
  Yoshiki Takezawa, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
- Organizer
  2017 International Conference on Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D-IC Technology and Reliability Challenges2017
- Author(s)
  Tetsu Tanaka
- Organizer
  17th International Workshop on Junction Technology
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 三次元積層人工網膜チップのためのラプラシアンエッジ強調機能を有する刺激電流生成回路の評価2017
- Author(s)
  下川賢士, 銭正よう, 竹澤好樹, 木野久志, 福島誉史, 清山浩司, 田中徹
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017
- Author(s)
  Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC 2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] New Multichip-to-Wafer 3D Integration Technology Using Self-Assembly and Cu Nano-Pillar Hybrid Bonding2016
- Author(s)
  M. Koyanagi, K.W. Lee, T. Fukushima, and T. Tanaka
- Organizer
  IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2016)
- Place of Presentation
  Hangzhou, China
- Year and Date
  2016-10-25
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration2016
- Author(s)
  Kangwook Lee, Chisato Nagai, Jichel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Suresh Ramalingam and Xin Wu
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications2016
- Author(s)
  Kangwook. Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2016-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 画素間ばらつき補正機能を有する３次元積層人工網膜チップの提案2016
- Author(s)
  伊藤圭汰、宇野正真、後藤竜也、竹澤好樹、西野悟、木野久志、清山浩司、田中徹
- Organizer
  LSIとシステムのワークショップ2016
- Place of Presentation
  東京大学、東京都
- Year and Date
  2016-05-16
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価2016
- Author(s)
  谷川星野, 木野久志, 福島誉史, 田中徹
- Organizer
  2016年第63回応用物理学会春季学術講演会
- Place of Presentation
  東京工業大学　大岡山キャンパス、東京都
- Year and Date
  2016-03-19
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] シリコンマイクロチップの生体貼付・埋め込み医療分野への応用2016
- Author(s)
  田中徹
- Organizer
  次世代医療システム産業化フォーラム
- Place of Presentation
  大阪商工会議所、大阪府、大阪市
- Year and Date
  2016-07-26
- Invited
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Wide-range and precise tissue impedance anaysis circuit with ultralow current source using gate-induced drain-leakage current2016
- Author(s)
  Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, and Tetsu Tanaka
- Organizer
  2016 IEEE Biomedical Circuits and Systems Conference(BioCAS 2016)
- Place of Presentation
  Hotel Pullman Shanghai Skyway, Shanghai, China
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra- fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration2016
- Author(s)
  K.W. Lee, C.Nagai, J.C. Bea, T. Fukushima, R. Suresh, and X. Wu, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Influence of Cu-TSVs, CuSn-and PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips2016
- Author(s)
  Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, and Tetsu Tanaka
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価2016
- Author(s)
  菅原陽平、木野久志、福島誉史、李康旭、小柳光正、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  T. Fukushima, H. Hashiguchi, H. Kino, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique2016
- Author(s)
  Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  2016 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan
- Year and Date
  2016-09-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価2016
- Author(s)
  下川賢士、後藤大輝、木野久志、福島誉史、田中徹
- Organizer
  2016年第77回応用物理学会秋季学術講演会
- Place of Presentation
  朱鷺メッセ、新潟県、新潟市
- Year and Date
  2016-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016
- Author(s)
  Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
- Organizer
  The 66th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  The Cosmopolitan of Las Vegas, Las Vegas, USA
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip2016
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2016 IEEE International Reliability Physics Symposium(IRPS 2016)
- Place of Presentation
  Pasadena Convention Center, Pasadena, USA
- Year and Date
  2016-04-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価2015
- Author(s)
  菅原　陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Consideration of Microbump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Activated Chip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 生体埋め込み型バイオメディカル集積デバイスの開発～人の感覚を代行するセンサ応用システム～2015
- Author(s)
  田中徹
- Organizer
  第16回半導体パッケージング技術展専門技術セミナー【ICP-6】
- Place of Presentation
  東京ビッグサイト、東京
- Year and Date
  2015-01-15
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Transfer and Non-transfer Stacking Technologies Based on Chip-to-wafer Self-assembly for High-throughput and High-precision Alignment and Microbump Bonding2015
- Author(s)
  Takafumi FUKUSHIMA, Taku SUZUKI, Hideto HASHIGUCHI, Chisato NAGAI, Jichoel BEA, Hiroyuki HASHIMOTO, Mariappan MURUGESAN, Kang-Wook LEE, Tetsu TANAKA, Kazushi ASAMI, Yasuhiro KITAMURA, and Mitsumasa KOYANAGI
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Mitigating Thermo Mechanical Stress in High-density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via micro-RS and micro-XRD Study2015
- Author(s)
  M. Murugesan, J.C. Bea, H. Hashimoto, K.W. Lee, and M. Koyanagi, T. Fukushima, and T. Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration2015
- Author(s)
  K-W. Lee, J-C Bea, T. Fukushima, S. Ramalingam, X. Wu, T. Tanaka, M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington D.C., USA
- Year and Date
  2015-12-07
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] 3D-IC/TSVの信頼性評価技術と将来展望2015
- Author(s)
  田中徹
- Organizer
  SEMICON Japan2015
- Place of Presentation
  Tokyo Big Sight, Tokyo, Japan
- Year and Date
  2015-12-16
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array2015
- Author(s)
  Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors2015
- Author(s)
  Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究2015
- Author(s)
  木野久志, 橋口日出登, 谷川星野, 菅原陽平, 池ヶ谷俊介, 福島誉史, 小柳光正, 田中徹
- Organizer
  第25回マイクロエレクトロニクスシンポジウム MES2015
- Place of Presentation
  大阪大学吹田キャンパス、大阪府、吹田市
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価2015
- Author(s)
  谷川星野、木野久志、福島誉史、小柳光正、田中徹
- Organizer
  2015年第76回応用物理学会秋季学術講演会
- Place of Presentation
  名古屋国際会議場、愛知県、名古屋市
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 3D Hetero-integration Technology for Innovative Convergence Systems2015
- Author(s)
  Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  IEEE EDAPS (Electrical Design of Advanced Packaging & Systems) Symposium 2015
- Place of Presentation
  Seoul, Korea
- Year and Date
  2015-12-14
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H02246
[Presentation] Reconfigured Multichip-on-wafer (mCoW) Cu/oxide Hybrid Bonding Technology for Ultra-high Density 3D Integration Using Recessed Oxide, Thin Glue Adhesive, and Thin Metal Capping Layers2015
- Author(s)
  Kangwook Lee, Chisato Nagai, Ai Nakamura, H. Aizawa, H. Hashiguchi, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE 2015 International 3D Systems Integration Conference (3DIC)
- Place of Presentation
  Sendai International Center, Sendai, Japan
- Year and Date
  2015-08-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015
- Author(s)
  H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC2015
- Author(s)
  Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向2015
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第32回「センサ・マイクロマシンと応用システム」シンポジウム
- Place of Presentation
  朱鷺メッセ　新潟コンベンションセンター、新潟県、新潟市
- Year and Date
  2015-10-28
- Invited
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Deformable micro torque swimmer, 68th Annual Meeting of the Division of Fluid Dynamics2015
- Author(s)
  TAKUJI ISHIKAWA, TOMOYUKI TANAKA, TOSHIHIRO OMORI, YOSHUKE IMAI
- Organizer
  Bulletin of the American Physical Society, DFD 2015
- Place of Presentation
  Boston, USA
- Year and Date
  2015-11-23
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25000008
[Presentation] Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV2015
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications2015
- Author(s)
  Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, and Kang-Wook Lee
- Organizer
  2015 International Conference on Solid State Devices and Materials
- Place of Presentation
  Sapporo Convention Center, Sapporo, Japan
- Year and Date
  2015-09-27
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] Development of Highly-Reliable　Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges2015
- Author(s)
  Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego Hotel & Marina, San Diego, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15H01812
[Presentation] 三次元集積化におけるTSV作製プロセスがトランジスタ特性に及ぼす影響評価2014
- Author(s)
  菅原陽平, 谷川星野, 橋口日出登, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  平成26年電気学会全国大会
- Place of Presentation
  愛媛大学（松山）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Study of Fully Implantable Retinal Prosthesis with 3-D Stacked Retinal Prosthesis Chip2014
- Author(s)
  Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, Tetsu Tanaka
- Organizer
  SRP of International Solid-State Circuits Conference 2014(ISSCC2014)
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 半導体神経工学に基づくバイオメディカル集積デバイスの開発2013
- Author(s)
  田中徹
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSI とヘテロインテグレーション2013
- Author(s)
  李康旭, 福島誉史, 田中徹, 小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京工業大学, Japan
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 完全埋め込み型人工網膜のためのエッジ強調機能を有する37×37ピクセル人工網膜チップ2013
- Author(s)
  長沼秀樹, 谷卓治, 笹木悠一郎, 渡辺洋太, 木野久志, 清山浩司, 田中徹
- Organizer
  電子情報通信学会集積回路研究専門LSIとシステムのワークショップ
- Place of Presentation
  北九州国際会議場（福岡）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013
- Author(s)
  木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス（京田辺）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding2013
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center（大阪）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Ultralow Power Operation of 3-D Stacked Retinal Prosthesis Chip with Edge Enhancement Function2013
- Author(s)
  Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, and Tetsu Tanaka
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk（福岡）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  63rd Electronic Components and Technology Conference 2013
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元LSIとヘテロインテグレーション2013
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D-LSI/TSVの技術動向と実用化2013
- Author(s)
  田中徹(代理発表:木野久志)
- Organizer
  SEMI FORUM JAPAN 2013-TSV/3次元積層化技術セミナー
- Place of Presentation
  グランキューブ大阪（大阪）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor2013
- Author(s)
  K.Kiyoyama, Y.Sato, H.Hashimoto, K-W Lee, T.Fukushima, T.Tanaka, and M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2013
- Place of Presentation
  San Francisco, USA
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T. Fukushima, K-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE Electrical Components Technology Conference (ECTC)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 高次視覚情報処理機能を有する完全埋め込み型人工網膜の開発2013
- Author(s)
  田中徹
- Organizer
  第51回日本人工臓器学会ワークショップ「人工臓器におけるセンシング技術」
- Place of Presentation
  パシフィコ横浜（横浜）
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Multiple Optical Stimulation to Neuron Using Si Opto-Neural Probe with Multiple Optical Waveguides and Metal-cover for Optogenetics2013
- Author(s)
  S. Kanno, S. Lee, T. Harashima, T. Kuki, H. Kino, H. Mushiake, H. Yao, and T. Tanaka
- Organizer
  35th Annual International Conference of the IEEE EMBS
- Place of Presentation
  大阪
- Invited
- Data Source
  KAKENHI-PROJECT-221S0003
[Presentation] Analysis of Low Power Characteristics of 3-D Stacked Retinal Proshtesis Chip2013
- Author(s)
  Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, Tetsu Tanaka
- Organizer
  7th East Asian Consortium on Biomedical Engineering
- Place of Presentation
  Taipei, Taiwan
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 完全埋め込み型人工網膜のための視覚情報処理機能を有する37x37ピクセル人工網膜チップ2013
- Author(s)
  長沼秀樹, 谷卓治, 笹木悠一郎, 渡辺洋太, 木野久志, 清山浩司, 田中徹
- Organizer
  2013年包括脳夏のワークショップ
- Place of Presentation
  名古屋国際会議場（名古屋）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013
- Author(s)
  H. Kino, T. Fukushima, K. -W. Lee, M. Koyanagi, T. Tanaka
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk（福岡）
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A. Noriki, K. W. Lee, J. Bea, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Year and Date
  2012-09-26
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国
- Year and Date
  2012-04-12
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High Density Cu-TSVs and Reliability Issues2012
- Author(s)
  M.Murugesan, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
- Organizer
  the Electro Chemical Society (ESC) Meeting
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Optical Interconnection Technology for 3-D LSI and Neural Engineering2012
- Author(s)
  T. Tanaka
- Organizer
  2012 IEEE International Interconnect Technology Conference (IITC2012)
- Place of Presentation
  San Jose, USA
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  A.Noriki, K.W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] High-Endurance SPRAM for Fully Implantable Retinal Prosthesis2012
- Author(s)
  Hisashi Kino, Tetsu Tanaka
- Organizer
  18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
- Place of Presentation
  Sendai, Japan
- Year and Date
  2012-03-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C Bea, T. Tanaka, and M. Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] W/Cu TSVs for 3D-LSI with Minimum Thermo-Mechanical Stress2012
- Author(s)
  M.Murugesan, H.Hashiguchi, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-02
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of Fully Implantable Retinal Prosthesis with 3-Dimensionally Stacked LSI2012
- Author(s)
  Tetsu Tanaka
- Organizer
  18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
- Place of Presentation
  Sendai, Japan
- Year and Date
  2012-03-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Fabrication Process Development in Three Dimensional Retinal Prothesis Chip for Subretinal Stimulation2012
- Author(s)
  Yuki Ohara, Yoshitomo Watanabe, Tetsu Tanaka
- Organizer
  18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
- Place of Presentation
  Sendai, Japan
- Year and Date
  2012-03-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Novel Detachable Bonding Process with Wettability Control of Bonding Surface for Versatile Chip-Level 3D Integration2012
- Author(s)
  Y.Ohara, K.-W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  東京
- Year and Date
  2012-10-23
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] A Very Low Area ADC for 3-D Stacked CMOS Image Processing System2012
- Author(s)
  K.Kiyoyama, K.W.Lee, T.Fukushima, H.Naganuma, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  Osaka, Japan
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  第25回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  横浜国立大学
- Year and Date
  2011-03-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011
- Author(s)
  T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  第61回Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Florida, USA
- Year and Date
  2011-06-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of 5 μm Diameter Backside Cu TSV Technology for 3D LSI2011
- Author(s)
  Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Conference on Electronics Packaging 2011 (ICEP2011)
- Place of Presentation
  Nara, Japan
- Year and Date
  2011-04-14
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] シリコン貫通光配線を用いた三次元光電子集積化技術2011
- Author(s)
  乗木暁博, 李康旭, 裴志哲, 福島誉史, 田中徹, 小柳光正
- Organizer
  J PCA Show 2011/ラージエレクトロニクスショー2011/2011マイクロエレクトロニクスショー/JISSO PROTEC2011
- Place of Presentation
  東京
- Year and Date
  2011-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  電子通信学会エレクトロニクスソサイエティ大会
- Place of Presentation
  札幌(特別講演)
- Year and Date
  2011-09-14
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D LSI Technology and Reliability Issues2011
- Author(s)
  T.Tanaka, J.Bea, M.Murugesan, K.Lee, T.Fukushima, M.Koyanagi
- Organizer
  2011 Symposium on VLSI Technology
- Place of Presentation
  Kyoto, Japan(招待)
- Year and Date
  2011-06-16
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer2011
- Author(s)
  M.Murugesan, H.Nohira, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid state Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis2011
- Author(s)
  Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  台湾
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Novel Current Mode Edge Detection for High Accuracy Visual Recognition in Retinal prosthesis2011
- Author(s)
  Hideki Naganuma, Kouji Kiyoyama, Ryuta Nakazawa, Tetsu Tanaka
- Organizer
  5th East Asian Pacific Student Workshop on Nano-Biomedical Engineering
- Place of Presentation
  National University of Singapore, Singapore
- Year and Date
  2011-12-14
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA) 12^<th> International Conference in Asia
- Place of Presentation
  Taipei, Taiwan(招待講演)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術2011
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D LSI Technology and Reliability Issues2011
- Author(s)
  T. Tanaka
- Organizer
  2011 Symposium on VLSI Technology
- Place of Presentation
  リーガロイヤルホテル京都（京都府）
- Data Source
  KAKENHI-PROJECT-221S0003
[Presentation] 高集積微細デバイスにおける今後の信号伝達/配線技術:シリコン貫通光インターコネクション(TSPV)を用いた光電子三次元2011
- Author(s)
  福島誉史, 乗木暁博, 田中徹, 小柳光正
- Organizer
  2011年春季第58回応用物理学関係連合講演会
- Place of Presentation
  神奈川工科大学
- Year and Date
  2011-03-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI2011
- Author(s)
  H.Kino, M.Murugesan, K.-W.Lee, J.-C.Bea, C.Miyazaki, H.Kobayashi, H.Shimamoto, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-29
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Efficient Unidirectional Optical Coupler for Through Silicon Photonic Via in Optoelectronic 3D-LSI2011
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials
- Place of Presentation
  Nagoya
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIに用いるシリコン貫通光配線のFDTD解析2011
- Author(s)
  乗木暁博, 李康旭, Jichoel Bea, 福島誉史, 田中徹, 小柳光正
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学
- Year and Date
  2011-09-02
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光・電気刺激に対する網膜応答記録用フレキシブルケーブル電極の作製2011
- Author(s)
  木暮爾, 渡辺慶朋, 笹木悠一郎, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs2011
- Author(s)
  H.Hashiguchi, M.Murugesan, J.C.Bea, K.W.Lee, T.Fukushima, H.Kobayashi, T.Tanaka, M.Koyanagi
- Organizer
  2011 International Conference on Solid State Devices and Materials (SSDM2011)
- Place of Presentation
  Nagoya, Japan
- Year and Date
  2011-09-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 電極間クロストークを抑制した人工網膜用ピラー型刺激電極アレイの開発2011
- Author(s)
  渡辺慶朋, 木暮爾, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-08-30
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] High Density 3D LSI Technology using W/Cu Hybrid TSVs2011
- Author(s)
  M.Murugesan, H.Kino, A.Hashiguchi, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM2011)
- Place of Presentation
  WashingtonD.C, USA
- Year and Date
  2011-12-05
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] More-than-Moore技術と3次元集積化2011
- Author(s)
  小柳光正, 田中徹, 福島誉史, 李康旭
- Organizer
  センサ・マイクロマシンと応用システムシンポジウム
- Place of Presentation
  東京(招待講演)
- Year and Date
  2011-09-26
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Flexible Cable Electrode for Biosignal Recording Elicited from Optical/Electrical Stimulation in Retinal Prosthesis2011
- Author(s)
  Chikashi Kigure, Yoshitomo Watanabe, Tetsu Tanaka
- Organizer
  5th East Asian Pacific Student Workshop on Nano-Biomedical Engineering
- Place of Presentation
  National University of Singapore, Singapore
- Year and Date
  2011-12-13
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 三次元積層時の局所応力がMOSFETの特性に与える影響2011
- Author(s)
  木野久志, Murugesan Mariappan, Jichel Bea, 李康旭, 福島誉史, 小柳光正, 田中徹
- Organizer
  2011年秋季第72回応用物理学会学術講演会
- Place of Presentation
  山形大学,山形
- Year and Date
  2011-09-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011
- Author(s)
  Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop ICRA (IEEE Int.Conf.on Robotics and Automation) 2011 MEMS assembly and packaging : trends and challenges for robotics in the microscale
- Place of Presentation
  Shanghai, China(招待講演)
- Year and Date
  2011-05-09
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  Taipei (Taiwan)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM)第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems2010
- Author(s)
  K.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  218th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Las Vegas, USA(招待講演)
- Year and Date
  2010-10-13
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society(EDS)Japan Chapter 総会・2009 International Electron Devices Meeting(IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration2010
- Author(s)
  Eiji Iwata, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Electrically-Evoked Potential Evaluation of In-vivo Experiments with Implanted Retinal Prosthesis Chip2010
- Author(s)
  Tetsu Tanaka
- Organizer
  14th International Symposium of Tohoku University Global COE Programme "GlobalNano-Biomedical Engineering Education and Research Network Centre"
- Place of Presentation
  Korea Institute of Science and Technology (KIST), Seoul, Korea
- Year and Date
  2010-08-31
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] A study of Charge Retention Characteristics of Metal Nanodots Memory2010
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  第57回応用物理学関係連合講演会2010年春季
- Place of Presentation
  神奈川県平塚市東海大学
- Year and Date
  2010-03-17
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application2010
- Author(s)
  Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  China Semiconductor Technology International Conference 2010 (CSTIC2010)
- Place of Presentation
  Shanghai, China.
- Year and Date
  2010-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A. Noriki, K.-W. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010(3DIC)
- Place of Presentation
  ドイツ, ミュンヘン
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D-LSI/TSVの技術動向と新領域への展開2010
- Author(s)
  田中徹
- Organizer
  Semi Forum Japan 2010 TSV/3次元実装セミナー
- Place of Presentation
  グランキューブ大阪
- Year and Date
  2010-06-01
- Data Source
  KAKENHI-PROJECT-22246045
[Presentation] A study of Charge Retention Characteristics of Metal Nanodots Memory2010
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 小柳光正, 田中徹
- Organizer
  第57回応用物理学関係連合講演会2010年春季
- Place of Presentation
  東海大学
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010
- Author(s)
  T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D-LSI/TSVの技術動向と新領域への展開2010
- Author(s)
  田中徹, 福島誉史, 李康旭, 小柳光正
- Organizer
  Semi Forum Japan 2010 TSV/3次元実装セミナー
- Place of Presentation
  グランキューブ大阪(招待講演)
- Year and Date
  2010-06-01
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] ファインピッチ金属マイクロバンプを有するチップの自己組織化積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 小柳光正, 田中徹
- Organizer
  第71回応用物理学会学術講演会
- Place of Presentation
  長崎大学(長崎)
- Year and Date
  2010-09-15
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D積層技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE Electron Devices Society (EDS) Japan Chapter総会・2009 International Electron Devices Meeting (IEDM)報告会
- Place of Presentation
  東京
- Year and Date
  2010-01-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI2010
- Author(s)
  A.Noriki, K.-W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2010 (3DIC)
- Place of Presentation
  Munich, Germany
- Year and Date
  2010-11-17
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration2010
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2010-01-20
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリを基盤としたウェーハレベル三次元集積化技術2010
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会/電子情報通信学会シリコン材料・デバイス研究会(SDM) 第118回研究集会
- Place of Presentation
  東京
- Year and Date
  2010-01-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI2010
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Intern.Conf.on Solid State Device and Materials
- Place of Presentation
  Tokyo
- Year and Date
  2010-09-24
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding2010
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  IEEE Custom Integrated Circuits Conference (CICC)
- Place of Presentation
  San Jose, USA(招待講演)
- Year and Date
  2010-09-20
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 東北大学における三次元積層技術とヘテロインテグレーション2010
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  JPCA Show 2010 (pp.99-104)
- Place of Presentation
  アカデミックプラザ,東京ビッグサイト(招待講演)
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration2010
- Author(s)
  T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 金属マイクロバンプ接合を介した自己組織化チップ積層2010
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第57回応用物理学関係連合講演会
- Place of Presentation
  平塚
- Year and Date
  2010-03-19
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application2010
- Author(s)
  裴艶麗, 開達郎, 小島俊哉, 福島誉史, 田中徹, 小柳光正
- Organizer
  China Semiconductor Technology International Conference(CSTIC2010)
- Place of Presentation
  Shanghai, China
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference 2009 (3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] メタルナノドットメモリの電荷保持特性に関する研究2009
- Author(s)
  開達郎, 裴艶麗, 小島俊哉, 〓志哲, 木野久志, 福島誉史, 田中徹, 小柳光正
- Organizer
  第70回応用物理学関係連合講演会2009年秋季
- Place of Presentation
  富山大学
- Year and Date
  2009-09-10
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Magnetic Nano-Dots Nonvolatile Memory with Resonant Magnetic Tunneling Effect2009
- Author(s)
  JiChel Bea, M.Murugesan, C.-K.Yin, H.Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  第56回応用物理学会学術講演会 2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-01
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M. Murugesan, J.C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W.C. Jeong, H. Kino, A. Noriki, K.W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference (ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Synthesis and characterization of magnetic nano-dots for on-chip inductors2009
- Author(s)
  M. Murugesan, W. -C. Jeong, K. Kiyoyama, K. -W. Lee, J. -C. Bea, C. -K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  第56回応用物理学会学術講演会2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-02
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 3D Integration Technology and 3D Integrated Systems(Invited)2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Three-Dimensional Optoelectronic Multichip Module with Optical Interconnection(Invited)2009
- Author(s)
  Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  12th IEEE International Symposium on Microwave and Optical Technology(ISMOT-2009)
- Place of Presentation
  Indiaニューデリー
- Year and Date
  2009-12-18
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] High-Performance MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  10th Non-Volatile Memory Technology Symposium (NVMTS 2009)
- Place of Presentation
  Portland, OR, USA.
- Year and Date
  2009-10-27
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Self-Assembled 3D Chip Stacking Technology2009
- Author(s)
  T. Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society (ECS) Meeting
- Place of Presentation
  ウィーン(オーストリー)
- Year and Date
  2009-10-05
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Magnetic Nano-Dots Nonvolatile Memory with Resonant Magnetic Tunneling Effect2009
- Author(s)
  JiChel Bea, M. Murugesan, C. -K. Yin, H. Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  第56回応用物理学会学術講演会2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-01
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Super Chip Integration Technology for Three-Dimensionally Stacked Retinal Prosthesis Chips2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Smart System Integration Conference 2009
- Place of Presentation
  ブリュッセル(ベルギー)
- Year and Date
  2009-03-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  M. Koyanagi, T. Fukushima, T. Tanaka
- Organizer
  IEEE International Interconnect Technology Conference (IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride2009
- Author(s)
  Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  ISTC/CSTIC 2009
- Place of Presentation
  Shanghai, China
- Year and Date
  2009-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Three-Dimensional Integration Technology to Achieve Super Chip2009
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  SEMICON Korea
- Place of Presentation
  ソウル(韓国)
- Year and Date
  2009-01-21
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] セルフアセンブリー伝を用いた新しいヘテロインテグレーション技術(VLSI特集)(招待講演)2009
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会
- Place of Presentation
  東京
- Year and Date
  2009-07-21
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Development of a NEW Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
- Organizer
  IEEE International 3D System Integration Conference 2009(3DIC)
- Place of Presentation
  サンフランシスコ(USA)
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] A Co-Nanodots Nonvolatile Memory with High-k Blocking Oxide for Implantable Biomedical Devices2009
- Author(s)
  C.K. Yin, Y.L. Pei, T. Kojima, T. Fukushima, M. Koyanagi, T. Tanaka
- Organizer
  9th International Symposium on Nano-Biomedical Engineering
- Place of Presentation
  Sendai, Japan.
- Year and Date
  2009-03-28
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Development of a New Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch2009
- Author(s)
  Tanafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Proc.of IEEE International 3D System Integration Conference(3DIC)
- Place of Presentation
  San Francisco, USA
- Year and Date
  2009-09-30
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Synthesis and characterization of magnetic nano-dots for on-chip inductors2009
- Author(s)
  M.Murugesan, W.-C.Jeong, K.Kiyoyama, K.-W.Lee, J.-C.Bea, C.-K.Yin, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  第56回応用物理学会学術講演会 2009年春季
- Place of Presentation
  筑波大学
- Year and Date
  2009-04-02
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] セルフアセンブリー法を用いた新しいヘテロインテグレーション技術2009
- Author(s)
  福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会第115回研究集会
- Place of Presentation
  東京
- Year and Date
  2009-08-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
- Author(s)
  M.Murugesan, J.C.Bea, T.Fukushima, T.Konno, K.Kiyoyama, W.C.Jeong, H.Kino, A.Noriki, K.W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  2009 Electronics Components and Technology Conference(ECTC)
- Place of Presentation
  サンディエゴ(USA)
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly2009
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2009 IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  ボルチモア(USA)
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon(SOS)2009
- Author(s)
  K-W Lee, A.Noriki, K.Kiyoyama, S.Kanno, R.Kobayashi, W-C Jeong, J-C Bea, T.Fukushima, T.Tanaka, M.Koyanagi
- Organizer
  The IEEE International Electron Devices Meeting(IEDM)
- Place of Presentation
  Baltimore, USA
- Year and Date
  2009-12-08
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembled 3D Chip Stacking Technology(Invited)2009
- Author(s)
  Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  216th Electrochemical Society(ECS)Meeting
- Place of Presentation
  Vienna, Austria
- Year and Date
  2009-10-06
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 自己組織化による三次元LSIチップの高精度位置合わせ技術2009
- Author(s)
  岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
- Organizer
  第70回応用物理学会学術講演会
- Place of Presentation
  富山
- Year and Date
  2009-09-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] High-Performance MOSFET Nonvolatile Memory with High-Density Cobalt Nanodots Floating Gate and HfO2 High-k Blocking Dielectric2009
- Author(s)
  Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  10^<th> Non-Volatile Memory Technology Symposium(NVMTS 2009)
- Place of Presentation
  Portland, OR, USA
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module2009
- Author(s)
  A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K. -W. Lee, J. -C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  2009 International Conference on Solid State Devices and Materials
- Place of Presentation
  仙台
- Year and Date
  2009-10-07
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D Integration Technology and 3D Integrated Systems2009
- Author(s)
  小柳光正, 福島誉史, 田中徹
- Organizer
  IEEE International Interconnect Technology Conference(IITC)
- Place of Presentation
  札幌
- Year and Date
  2009-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 自己組織化ウェーハ張り合わせによる三次元集積化技術2008
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  応用物理学会シリコンテクノロジー分科会多層配線システム研究委員会(共催:電子情報通信学会、シリコン材料・デバイス研究会(SDM)
- Place of Presentation
  東京
- Year and Date
  2008-02-08
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Self-Assembly for Heterogeneous Integration with Lateral Interconnections Extending over MEMS and LSI Chips2008
- Author(s)
  Takayuki Konno, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Memory Characterization of MOS Memory Device with High Density Self-Assembled Tungsten Nanodots Floating Gate and HfO2 Blocking Dielectric2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba International Congress Center, Tsukuba, Japan.
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] MEMS-半導体横方向配線技術I:フレキシブル基板へのLSIチップのセルフアセンブリ2008
- Author(s)
  福島誉史, 今野隆行, 田中徹, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会
- Place of Presentation
  船橋
- Year and Date
  2008-03-28
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D System Integration Technology and 3D Systems2008
- Author(s)
  T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  Materials for Advanced Metallization Conference 2008 (MAM 2008)
- Place of Presentation
  Dresden(Germany)
- Year and Date
  2008-03-03
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] シリコン窒化膜中に埋め込んだタングステンナノドットフローティングゲートMOSキャパシタのメモリ特性2008
- Author(s)
  裴艶麗, 福島誉史, 田中徹, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会2008年春季
- Place of Presentation
  日本大学
- Year and Date
  2008-03-27
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Chip Self-Assembly Technique for 3D LSI Fabrication2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  3D System Integration Technology Conference (3D-SIC) 2008
- Place of Presentation
  東京
- Year and Date
  2008-05-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Memory Characterization of MOS Memory Device with High Density Self-Assembled Tungsten Nanodots Floating Gate and HfO2 Blocking Dielectric2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
- Author(s)
  T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  サンフランシスコ(米国)
- Year and Date
  2008-12-16
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] FM/I/Nano-Dot FM構造でのスピン電子の磁気トンネル効果2008
- Author(s)
  〓志哲, Murugesan Mariappan, Cheng KuanYin, 福島誉史, 田中徹, 寒川誠二, 河野省三, 佐道泰造, 宮尾正信, 名取研二, 小柳光正
- Organizer
  第55回応用物理学関係連合講演会2008春季
- Place of Presentation
  日本大学
- Year and Date
  2008-03-30
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Characterization of Metal Nanodots Nonvolatile Memory2008
- Author(s)
  Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  シリコン材料・デバイス研究会
- Place of Presentation
  東京
- Year and Date
  2008-06-10
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride2008
- Author(s)
  Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  MRS 2008 Spring Meeting
- Place of Presentation
  San Francisco, USA.
- Year and Date
  2008-03-25
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Multichip Self-Assembly Technique on Flexible Polymeric Substrate2008
- Author(s)
  T. Fukushima, T. Konno, S.Y. Ji, T. Tanaka, M. Koyanagi
- Organizer
  The 59th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  フロリダ(米国)
- Year and Date
  2008-05-30
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Tapered Through-Si Via Formation for Optical Interposer with 3D ICs and Buried Vertical-Cavity Surface-Emitting Laser / Photo Diode Chips2008
- Author(s)
  Makoto Fujiwara, Akihiro Noriki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば
- Year and Date
  2008-09-26
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] New Non-Volatile Memory with Magnetic Nano-Dots Floating Gate2008
- Author(s)
  M. Koyanagi, T. Tanaka
- Organizer
  The 3rd International Symposium on Tera-bit-level Non-volatile Memories
- Place of Presentation
  Korea
- Year and Date
  2008-08-29
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  2008 Materials Research Society (MRS) Fall Meeting
- Place of Presentation
  ボストン(米国)
- Year and Date
  2008-12-01
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] キャビティ構造を有するMEMSチップのセルフアセンブリ2008
- Author(s)
  今野隆行, 小林吏悟, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Characteristics of Magnetic Film Inductors with FePt Nano-Dots2008
- Author(s)
  W. -C. Jeong, K. Kiyoyama, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
- Organizer
  The 2008 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba
- Year and Date
  2008-09-26
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] 三次元LSIを搭載した光インターポーザのためのテーパTSVの形成2008
- Author(s)
  乗木暁博, 藤原誠, 福島誉史, 田中徹, 小柳光正
- Organizer
  第69回応用物理学会学術講演会
- Place of Presentation
  春日井
- Year and Date
  2008-09-02
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3D system integration technology and 3D systems2008
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Advanced Metallization Conference (AMC) 2008
- Place of Presentation
  サンディエゴ(米国)
- Year and Date
  2008-09-23
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 3次元実装技術2007
- Author(s)
  福島誉史, 田中徹, 小柳光正
- Organizer
  エレクトロニクス実装学会/材料技術委員会公開研究会「次世代インテリジェント実装材料」
- Place of Presentation
  東京
- Year and Date
  2007-11-29
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Chip-to-Wafer Stacking for 3D Integration with TSV2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  Tokyo
- Year and Date
  2007-11-09
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Thermal Issues of 3D ICs2007
- Author(s)
  Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
- Place of Presentation
  Albany (USA)
- Year and Date
  2007-10-11
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Investigation of FePt Nano-Dots Fabricated by Self-Assembled Nano-Dot Deposition Method Using X-ray Photoelectron Spectroscopy2007
- Author(s)
  M. Murugesan, J.C. Bea, C-K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  The 2007 International Conference on Solid State Device and Materials
- Place of Presentation
  Tsukuba, Japan
- Year and Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Fabrication of Magnetic Tunnel Junction with FePt Nanodots for Magnetic Nanodot Memory2007
- Author(s)
  Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 6th International Semiconductor Technology Conference (ISTC 2007) (Invited speech)
- Place of Presentation
  Shanghai, China.
- Year and Date
  2007-03-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot2007
- Author(s)
  Yanli Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 2007 International Conference on Solid State Devices and Materials
- Place of Presentation
  Tsukuba, Japan.
- Year and Date
  2007-09-19
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method2007
- Author(s)
  Woo-Cheol Jeong, Mungi Park, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  Pusan-Tohoku "21COE" Joint Workshop on Mechanical Science based on Nanotechnology
- Place of Presentation
  Pusan, Korea.
- Year and Date
  2007-01-08
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Self-Assembly Process for Chip-to-Wafer Three-Dimensional Integration2007
- Author(s)
  T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
- Organizer
  57th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Reno (USA)
- Year and Date
  2007-05-31
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] 金属ナノドットフローティングゲートMOSキャパシタのメモリ特性2007
- Author(s)
  裴艶麗, 福島誉史, 田中徹, 小柳光正
- Organizer
  第68回応用物理学会学術講演会2007秋
- Place of Presentation
  北海道工業大学
- Year and Date
  2007-09-06
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method2007
- Author(s)
  C.K. Yin, H. Choi, J.C. Bea, M. Murugesan, J.H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi
- Organizer
  NSTI Nanotech 2007 10th Annual
- Place of Presentation
  Santa Clara, USA.
- Year and Date
  2007-03-23
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Fundamental Microstructure and Magnetic Properties of Self-Assembled FePt Nano-Dot Film Annealed by using Magnetic Field Annealing2007
- Author(s)
  J.C. Bea, M. Murugesan, C. -K. Yin, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  The Fifth Nanotechnology Symposium, JAPAN NANO 2007
- Place of Presentation
  Tokyo, Japan.
- Year and Date
  2007-02-20
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] Evaluation of FePt nano-dots by X-ray photoelectron spectroscopy2007
- Author(s)
  M. Murugesan, J.C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
- Organizer
  第68回応用物理学会学術講演会2007秋
- Place of Presentation
  北海道工業大学
- Year and Date
  2007-09-07
- Data Source
  KAKENHI-PROJECT-18063002
[Presentation] New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique2007
- Author(s)
  Takafumi. Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  International Electron Devices Meeting (IEDM)
- Place of Presentation
  Washington DC(USA)
- Year and Date
  2007-12-12
- Data Source
  KAKENHI-PROJECT-19686022
[Presentation] Semiconductor-on-Low-K Substrate Technology2006
- Author(s)
  Tetsu, Tanaka
- Organizer
  The Electrochemical Society International Semiconductor Technology Conference (ISTC2006)
- Place of Presentation
  Shanghai, China
- Year and Date
  2006-03-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] Super Chip Integration Based on Chip-to-Wafer 3D Integration Technology2006
- Author(s)
  Tetsu, Tanaka
- Organizer
  The International Symposium on Microelectronics and Packaging (ISMP 2006)
- Place of Presentation
  Seoul, Korea
- Year and Date
  2006-10-11
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15106006
[Presentation] 三次元ヘテロ集積化技術とスーパーチップ
- Author(s)
  小柳光正,福島誉史,李康旭,田中徹
- Organizer
  スマートプロセス学会電子デバイス実装研究委員会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Tiny VCSEL Chip Self-Assembly for Advanced　Chip-to-Wafer 3D and Hetero Integration
- Author(s)
  Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Implantable electronic devices based on semiconductor neural engineering
- Author(s)
  Tetsu Tanaka
- Organizer
  The 6th IEEE International Nanoelectronics Conference 2014 (INEC2014)
- Place of Presentation
  Hokkaido University, Sapporo, Hokkaido, Japan
- Year and Date
  2014-07-28 – 2014-07-31
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 光電子集積三次元LSIのための高効率光カップラの検討
- Author(s)
  乗木暁博，李康旭，裵志哲, 福島誉史，田中徹，小柳光正
- Organizer
  2012年第73回応用物理学会秋季学術講演会
- Place of Presentation
  愛媛大学・松山大学（愛媛）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Characterization and Reliability of 3-D LSI and SiP
- Author(s)
  K-W Lee, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2013
- Place of Presentation
  Washington D.C., USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価
- Author(s)
  菅原陽平，橋口日出登，谷川星野，木野久志，福島誉史，李康旭，小柳光正，田中徹
- Organizer
  第75回応用物理学会秋季学術講演会
- Place of Presentation
  北海道大学札幌キャンパス、北海道、札幌市
- Year and Date
  2014-09-17 – 2014-09-20
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 IEEE International Electron Devices Meeting (IEDM)
- Place of Presentation
  San Francisco, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
- Author(s)
  Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
- Author(s)
  Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Implantable electronic devices based on semiconductor neural engineering
- Author(s)
  Tetsu Tanaka
- Organizer
  The 6th IEEE International Nanoelectronics Conference 2014(INEC2014)
- Place of Presentation
  北海道大学（北海道札幌）
- Year and Date
  2014-07-28 – 2014-07-31
- Invited
- Data Source
  KAKENHI-PROJECT-221S0003
[Presentation] 3D Integration and Reliability Challenges
- Author(s)
  Mitsumasa Koyanagi, Mariappan Murugesan, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka
- Organizer
  224th Electrochemical Society (ECS) Meeting
- Place of Presentation
  San Francisco, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration
- Author(s)
  H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
- Place of Presentation
  The University of Tokyo, Hongo, Tokyo, Japan
- Year and Date
  2014-07-15 – 2014-07-16
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
- Author(s)
  H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
- Organizer
  International Conference on Electronics Packaging 2013 (ICEP2013)
- Place of Presentation
  Osaka International Convention Center
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 光電子集積三次元LSIのための高効率光カップラの作製(Fabrication of Unidirectional Optical Coupler for Opto-Electronic 3-D LSI)
- Author(s)
  乗木暁博，李康旭，裵志哲，福島誉史，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly
- Author(s)
  H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K..-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
- Author(s)
  Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, and Tetsu Tanaka
- Organizer
  International Conference on Solid State Devices and Materials (SSDM2014)
- Place of Presentation
  Tsukuba International Congress Center EPOCHAL TSUKUBA, Tsukuba, Ibaraki, Japan
- Year and Date
  2014-09-08 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層
- Author(s)
  橋口日出登，福島誉史，裵　志哲，Murugesan Mariappan，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 自己組織化静電仮接合を用いたC2W三次元集積化技術(Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding)
- Author(s)
  橋口日出登，福島誉史，裵志哲，Mariappan Murugesan，木野久志，李康旭，田中徹，小柳光正
- Organizer
  2013年第60回応用物理学会春季学術講演会
- Place of Presentation
  神奈川工科大学（神奈川）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Takafumi Fukushima, Jicheol Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2013 International Conference on Solid State Materials and Devices(SSDM2013)
- Place of Presentation
  Hilton Fukuoka Sea Hawk, Fukuoka
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
- Author(s)
  T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE 62nd Electronic Components and Technology Conference
- Place of Presentation
  San Diego, CA, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Heterogeneous 3D Integration Technology and New 3D LSIs
- Author(s)
  M. Koyanagi, K-W Lee, T. Fukushima and T. Tanaka
- Organizer
  IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2012)
- Place of Presentation
  Xi’an, China
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] C2W三次元集積のための自己組織化静電仮接合の評価
- Author(s)
  橋口日出登, 福島誉史, 裵志哲, 木野久志, 李康旭, 田中徹, 小柳光正
- Organizer
  2013秋季第74 回応用物理学会秋季学術講演会
- Place of Presentation
  同志社大学京田辺キャンパス
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Electroless Cu Seed on Ru and Co Liners in High Aspect Ratio TSV
- Author(s)
  F. Inoue, H. Philipsen, M. H. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf, T. Tanaka
- Organizer
  2014 IEEE Interconnect Technology Conference (IITC2014)
- Place of Presentation
  San Jose, CA, USA
- Year and Date
  2014-05-20 – 2014-05-23
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  Seoul, Korea
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] ３次元集積化技術が拓くDiversificationの未来 - From LSI of scale to LSI of scope
- Author(s)
  田中徹
- Organizer
  第62回応用物理学会春季学術講演会 S-16シンポジウム
- Place of Presentation
  東海大学湘南キャンパス、神奈川県、平塚市
- Year and Date
  2015-03-11 – 2015-03-14
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
- Author(s)
  Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques
- Author(s)
  Takafumi Fukushima, Kang Wook Lee, Jicheol Bea, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Honolulu, Hawaii, USA
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K.-W. Lee, T.Tanaka, and M. Koyanagi
- Organizer
  The 63rd Eelectronic Components and Technology Conference
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Cu Seeding Using Electroless Deposition on Ru Liner for High Aspect Ratio Through-Si Vias
- Author(s)
  Fumihiro Inoue, Harold Philipsen, Marleen H. Van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, and Tetsu Tanaka
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Effects of Electro-less Ni Layer as Barrier/Seed　Layers for High Reliable and Low Cost Cu TSV1
- Author(s)
  K.W. Lee, C. Nagai, A. Nakamura, J.C. Bea, M. Murugesan, T. Fukushima, T. Tanaka and M. Koyanagi
- Organizer
  2014 IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  Kinsale, Cork Ireland
- Year and Date
  2014-12-01 – 2014-12-03
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 3D Hetero-Integration Technology for Innovative Convergence Systems
- Author(s)
  K-W. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi
- Organizer
  Electronics Packaging Symposium
- Place of Presentation
  Binghamton, NY, USA
- Year and Date
  2014-10-08 – 2014-10-09
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  Kyoto International Conference Center（京都）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Challenges in 3D Integration
- Author(s)
  Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, and Tetsu Tanaka
- Organizer
  223th Electrochemical Society (ECS) Meeting
- Place of Presentation
  Toronto, Canada,
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 三次元LSIとヘテロインテグレーション
- Author(s)
  李康旭,福島誉史,田中徹,小柳光正
- Organizer
  半導体・集積路技術シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 3D-IC用超高密度TSV技術の信頼性
- Author(s)
  田中徹
- Organizer
  日本学術振興会半導体界面制御技術第154委員会
- Place of Presentation
  東京大学（東京）
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 網膜下刺激完全埋め込み型人工網膜チップのチップ表層刺激電極の開発
- Author(s)
  笹木悠一郎, 鈴木拓志, 岩上卓磨, 谷卓治, 長沼秀樹, 木野久志, Jari Hyttinen, Minna Kellomaki, 田中徹
- Organizer
  第53回日本生体医工学大会
- Place of Presentation
  仙台国際センター、宮城県、仙台市
- Year and Date
  2014-06-24 – 2014-06-26
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Human prion diseases in Japan: a prospective surveillance from 1999.
- Author(s)
  Sanjo, N., Higuma, M., Hizume, M., Furukawa, F., Nakamura, Y., Kitamoto, T., Hamaguchi, T., Morikawa, F., Aoki, M., Tanaka, F., Nishizawa, M., Takeda, M., Inuzuka, T., Sato, K., Murai, H., Murayama, S., Satoh, K., Harada, M., Uyama, N., Fujita, K., Saito, N., Takumi, I., Tsukamoto, T., Yamada, M., Mizusawa, H.
- Organizer
  Asian Pacific Prion Symposium 2014 in Jeju.
- Place of Presentation
  Jeju（Korea）
- Year and Date
  2014-07-06 – 2014-07-07
- Data Source
  KAKENHI-PROJECT-221S0003
[Presentation] Self-Assembly-Based 3D Integration Technologies
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京大学（東京）
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] 表層刺激電極を有する網膜下埋植人工網膜チップモジュールの作製
- Author(s)
  後藤大輝、長沼秀樹、木野久志、田中徹
- Organizer
  第62回応用物理学会春季学術講演会
- Place of Presentation
  東海大学湘南キャンパス、神奈川県、平塚市
- Year and Date
  2015-03-11 – 2015-03-14
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響
- Author(s)
  木野久志、池ヶ谷俊介、小柳光正、田中徹
- Organizer
  第62回応用物理学会春季学術講演会 S-16シンポジウム
- Place of Presentation
  東海大学湘南キャンパス、神奈川県、平塚市
- Year and Date
  2015-03-11 – 2015-03-14
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ
- Author(s)
  伊藤有香，福島誉史，Murugesan Mariappan，裵　志哲，李　康旭，田中　徹，小柳光正
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学本郷キャンパス、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
- Author(s)
  H. Hashiguchi, T. Fukushima, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
- Organizer
  2014 International Conference on Electronics Packaging (ICEP2014)
- Place of Presentation
  Toyama International Convention Center, Toyama, Toyama, Japan
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] 集積回路の未来
- Author(s)
  田中徹
- Organizer
  第29回京都賞記念ワークショップ先端技術部門パネル討論
- Place of Presentation
  国立京都国際会館（京都）
- Invited
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Development of 3D Integration Technologies and Recent Challenges
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012: 22nd Asian　Session
- Place of Presentation
  東京大学（東京）
- Invited
- Data Source
  KAKENHI-PROJECT-21226009
[Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
- Author(s)
  H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Lake Buena Vista, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-24246060

1. FUKUSHIMA Takafumi (10374969)

# of Collaborated Projects: 15 results

# of Collaborated Products: 334 results
2. KIYOYAMA Kouji (60412722)

# of Collaborated Projects: 9 results

# of Collaborated Products: 23 results
3. TOMITA Hiroshi (40302088)

# of Collaborated Projects: 8 results

# of Collaborated Products: 2 results
4. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 8 results

# of Collaborated Products: 238 results
5. KINO Hisashi (10633406)

# of Collaborated Projects: 8 results

# of Collaborated Products: 94 results
6. SUGANO Eriko (70375210)

# of Collaborated Projects: 5 results

# of Collaborated Products: 1 results
7. BEA Jichel (40509874)

# of Collaborated Projects: 3 results

# of Collaborated Products: 14 results
8. PEI Yanli (70451622)

# of Collaborated Projects: 3 results

# of Collaborated Products: 33 results
9. HANE Kazuhiro (50164893)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
10. MIURA Hideo (90361112)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. Kimura Minoru (40118451)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. Tanji Jun (10001885)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. Takada Masahiko (00236233)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. Nakamura Katsuki (70243110)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
15. Ohtsuka Toshihisa (40401806)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. Aoki Shigeki (80222470)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
17. Takao Hidemasa (10444093)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
18. Shimoji Keigo (20348931)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
19. Goto Masami (30375844)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
20. Yoshiura Takashi (40322747)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
21. Nakata Yasuhiro (40362066)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
22. Abe Osamu (50302716)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
23. Masumoto Tomohiko (60302717)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
24. Tokumaru Aya (60507391)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
25. Matsumura Akira (90241819)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
26. Kirino Eiji (90276460)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
27. Terada Hitoshi (90277319)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
28. Sato Noriko (10322017)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
29. Kasai Kiyoto (80322056)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
30. Hashimoto Ryota (10370983)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
31. Niwa Shin-ichi (30110703)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
32. Kato Tadafumi (30214381)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
33. Suzuki Michio (40236013)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
34. Shuji Iritani (60191904)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
35. Nemoto Kiyotaka (80550152)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
36. Tomita Hiroaki (90295064)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
37. Murayama Shigeo (50183653)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
38. Akatsu Hiroyasu (00399734)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
39. Takao Masaki (50245487)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
40. Saito Yuko (60344066)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
41. Bito Haruhiko (00291964)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
42. Yoshimura Yumiko (10291907)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
43. Matsuzaki Masanori (50353438)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
44. Furuta Toshiaki (90231571)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
45. Okado Haruo (60221842)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
46. Saito Izumu (70158913)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
47. Kaibuchi Kozo (00169377)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
48. Hasegawa Masato (10251232)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
49. Aiba Atsu (20271116)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
50. Shiina Nobuyuki (30332175)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
51. Igarashi Michihiro (50193173)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
52. Tomoki Nishioka (70435105)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
53. Watanabe Masahiko (70210945)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
54. Koike Masato (80347210)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
55. Sakagami Hiroyuki (90261528)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
56. Shigemoto Ryuichi (20221294)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
57. Fukazawa Yugo (60343745)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
58. Sakimura Kenji (40162325)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
59. Mori Hisashi (00239617)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
60. Mishina Masayoshi (80144351)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
61. Kobayashi Kazuto (90211903)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
62. Yanagawa Yuchio (90202366)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
63. Uemura Tadashi (80213396)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
64. Ishihara Takeshi (10249948)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
65. Nose Akinao (30260037)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
66. Iino Yuichi (40192471)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
67. Miyakawa Tsuyoshi (10301780)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
68. Takao Keizo (80420397)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
69. Mushiake Hajime (80219849)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
70. Katayama Norihiro (20282030)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
71. Inoue Kazuhide (80124379)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
72. Okabe Shigeo (60204012)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
73. Kano Masanobu (40185963)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
74. Fujiyama Fumino (20244022)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
75. Isa Tadashi (20212805)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
76. Kageyama Ryoichiro (80224369)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
77. Fujita Ichiro (60181351)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
78. Yoshida Akira (70257187)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
79. Nishikawa Toru (00198441)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
80. Nukina Nobuyuki (10134595)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
81. Fukai Tomoki (40218871)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
82. Iwatsubo Takeshi (50223409)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
83. Yamamori Tetsuo (80260206)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
84. Okazawa Hitoshi (50261996)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
85. Tanaka Keiji (00221391)

# of Collaborated Projects: 1 results

# of Collaborated Products: 12 results
86. Kakigi Ryusuke (10145196)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
87. Tsuda Ichiro (10207384)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
88. Kitazawa Shigeru (00251231)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
89. Doya Kenji (80188846)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
90. Takahashi Ryosuke (90216771)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
91. Ikenaka Kazuhiro (00144527)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
92. Sobue Gen (20148315)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
93. Hasegawa Toshikazu (30172894)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
94. Ota Jun (50233127)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
95. Saitoe Minoru (50261839)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
96. Kadomatsu Kenji (80204519)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
97. Kida Satoshi (80301547)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
98. Manabe Toshiya (70251212)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
99. Tomita Taisuke (30292957)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
100. Iwata Atsushi (40401038)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
101. Murakami Ikuya (60396166)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
102. Tsutsui Ken-ichiro (90396466)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
103. Hanakawa Takashi (30359830)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
104. Hirai Hirokazu (70291086)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
105. Mima Tatsuya (20324618)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
106. Isomura Yoshikazu (00415077)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
107. Samejima Kazuyuki (30395131)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
108. Hoshi Eiji (50407681)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
109. Miyata Mariko (70281631)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
110. Yuzaki Michisuke (40365226)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
111. Tanaka Masaki (90301887)

# of Collaborated Projects: 1 results

# of Collaborated Products: 12 results
112. Fukata Masaki (00335027)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
113. Suzuki Kyoko (20271934)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
114. Kuba Hiroshi (10362469)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
115. Masu Masayuki (20243032)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
116. Kinoshita Makoto (30273460)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
117. Sugihara Izumi (60187656)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
118. Shirane Michiko (90398082)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
119. Yamamoto Nobuhiko (00191429)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
120. Nishijo Hisao (00189284)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
121. Nambu Atsushi (80180553)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
122. Takumi Toru (00222092)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
123. Yamashita Toshihide (10301269)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
124. Sakurai Takeshi (60251055)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
125. Tamamaki Nobuaki (20155253)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
126. Hata Yoshio (40212146)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
127. Harada Akihiro (40251441)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
128. Ozaki Norio (40281480)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
129. Sakai Katsuyuki (70376416)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
130. Kubo Yoshihiro (80211887)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
131. Nakazawa Takanobu (00447335)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
132. Tanaka Kenji (30329700)

# of Collaborated Projects: 1 results

# of Collaborated Products: 12 results
133. Takei Nobuyuki (70221372)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
134. Hitoshi Seiji (70300895)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
135. Takahiroa. Kato (70546465)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
136. Kato Fusao (20169519)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
137. Shirao Tomoaki (20171043)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
138. Taira Masato (50179397)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
139. Okano Hideyuki (60160694)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
140. Sekino Yuko (70138866)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
141. Okamoto Yasumasa (70314763)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
142. KOMATSU Hidehiko (00153669)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
143. Miyata Takaki (70311751)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
144. Takahashi Yoshiko (10183857)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
145. Nishida Shinya (20396162)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
146. Tominaga Makoto (90260041)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
147. LEE KANGWOOK (90534503)

# of Collaborated Projects: 1 results

# of Collaborated Products: 16 results
148. MURUGESAN Mariappan (10509699)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
149. KAWASE TETSUAKI (50169728)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
150. HIDAKA Hioshi (40302103)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
151. FUJII Naotaka (20392095)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
152. SAMUKAWA Seiji (30323108)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
153. YAMAGUCHI Takami (30101843)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
154. ISHIKAWA Takuji (20313728)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
155. UENO Hironori (70518240)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
156. MIZUNO Fumio (20432289)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
157. OMORI Toshihiro (10633456)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
158. MATSUKI Noriaki (90284520)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
159. SHIMOGONYA Yuji (30552575)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
160. NIX Stephanie (00756637)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
161. NUMAYAMA Keiko (30400287)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
162. IMAI Yohsuke (60431524)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
163. Nishizawa Matsuhiko (20273592)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
164. MOSSAD Ali Atif (80436097)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
165. 寺田一志 (90227520)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
166. 栗野浩之 (70282093)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
167. 沈正七 (00333849)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
168. 橋本宏之 (80589432)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
169. 遠藤俊毅 (00535370)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
170. 新妻邦泰 (10643330)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
171. 大沢伸一郎 (00813693)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
172. 中川敦寛 (10447162)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
173. 田端希多子 (80714576)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
174. 宮川宣明

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
175. WATANABE Hirohisa

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
176. NAGAI Yoshinori

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
177. IKUTANI Masashi

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
178. TSUBOI Daisuke

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
179. OZAKI Taku

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
180. 石垣診祐

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
181. 高津聖志

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
182. 岩本由美子

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
183. 阿部学

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results
184. 亀谷富由樹

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results
185. 野中隆

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results
186. 鈴木元治郎

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results
187. 田中良法

# of Collaborated Projects: 0 results

# of Collaborated Products: 2 results
188. 齋藤実

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

Tanaka Tetsu 田中 徹

TANAKA Tetsu 田中 徹

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人と同じ広視野・高機能視覚を有する三次元積層チップレット型完全埋植人工網膜の開発Principal Investigator

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Development of minimally invasive pixel-dispersive fully implantable retinal prosthesis with human-like viewing angle and information processing functionsPrincipal Investigator

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Fully implantable and optical wireless neural probe for optogenetics using upconversion nanoparticlePrincipal Investigator

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Development of Fully Implantable and Minimally Invasive Flexible Retina Prosthesis for Reconstruction of Wide Field of VisionPrincipal Investigator

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Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human visionPrincipal Investigator

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Development of fully-implanted low-power retinal prosthesis system with visual information processing functionsPrincipal Investigator

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Tanaka Tetsu 田中徹

TANAKA Tetsu 田中徹